Murata-Electronics-BLM41PG471SZ1L
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Reference Only
Chip Ferrite Bead BLM41
□□□□□
SZ1L
Spec. No. JENF243A-9116C-01
P.1/9
Murata Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM41_SZ Series based on
AEC-Q200 except for
Power train and Safety.
2. Part Numbering
(ex.)
BL
M
41
(3)
PG
(4)
600
(5)
S
Z
1
L
(1)
(2)
(6) (7) (8) (9)
(1)Product ID
(2)Type
(4)Characteristics
(5)Typical Impedance at 100MHz
(8)Numbers of Circuit
(7)Category (for Automotive Electronics)
(3)Dimension (L×
Ｗ
) (6)Performance
(9)Packaging (L: Taping)
3. Rating
Impedance (
Ω
)
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
Rated Current
(
Ω
) max.
(mA) (
*
1)
Customer
Part Number
MURATA
Part Number
ESD Rank
2:2kV
Initial
Values
Values After
at
85℃
at
125℃
Typical
Testing
*1
6000
*1
3500
*1
3500
*1
2000
*1
*1
3700
*1
2450
*1
2100
*1
1350
*1
BLM41PG600SZ1L
BLM41PG750SZ1L
BLM41PG181SZ1L
BLM41PG471SZ1L
BLM41PG102SZ1L
30 min.
45 min.
60
75
0.009 0.018
0.015
0.02
0.05
0.09
0.03
0.04
0.10
0.18
180±25
％
470±25%
1000±25%
180
470
1000
2
1500
1000
•
Operating Temperature: -55°C to +125°C
•
Storage Temperature: -55°C to +125°C
(*1)
Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15
°
C to 35
°
C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
<
In case of doubt
>
Temperature : 20
°
C
±
2
°
C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
85℃
Describe the Rated current as x[A]
in case of more than 1A.
(*2) In case of Rated current is more than
*1
,
Rated Current is derated as right figure
depending on the operating temperature.
125℃
0
85
125
Operating Temperature (°C)
4. Style and Dimensions
4.5±0.2
1.6±0.2
■
Equivalent Circuit
0.7±0.3
Resistance element becomes
dominant at high frequencies.
(
)
: Electrode
(in mm)
■
Unit Mass (Typical value)
0.050g
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
P.2/9
5. Marking
No marking.
6. Specifications
6-1. Electrical Performance
No.
Specification
Test Method
Measuring Frequency : 100MHz±1MHz
Impedance
Meet item 3.
7-1-1
Measuring Equipment : Agilent 4291A or the equivalent
Test Fixture : Agilent 16192A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC
Resistance
Meet item 3.
6-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
No.
3
Stress
Test Method
High
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Temperature
Exposure
Appearance No
damage
Impedance
Change
Within ±30%
(at 100MHz)
DC
Resistance
Meet item 3.
4
Temperature Cycling
1000cycles
-55 deg C to +125 deg C
Meet Table A after testing.
Set for 24hours at room
temperature, then measured.
5
7
Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
Biased Humidity
Operational Life
1000hours at 85 deg C,
85%RH
Apply max rated current.
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table A after testing.
Meet Table A after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
8
9
External Visual
Visual inspection
No abnormalities
No defects
10 Physical
Dimension
Meet ITEM 4
（
Style and Dimensions
）
12 Resistance
to Solvents Per MIL-STD-202
Method 215
No defects
13 Mechanical
Shock
Per MIL-STD-202 Method 213
Meet Table A after testing.
1500g’s(14.7N)/0.5ms/
Half sine
14 Vibration
5g’s (0.049N) for 20 minutes,
Meet Table A after testing.
12cycles each of 3 orientations
Test from 10-2000Hz.
12cycles each of 3 orientations
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
AEC-Q200
P.3/9
Murata Specification / Deviation
No.
Stress
Test Method
15 Resistance
Solder temperature
260C+/-5 deg C
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table A after testing.
to Soldering Heat
Immersion time 10s
16 Thermal
Shock
1000cycles
Meet Table A after testing.
(-55C to +125C)
Max transfer time, 20s
Per AEC-Q200-002
17 ESD
Meet Table A after testing.
Meet Item 3 (Rating)
18 Solderability
Per J-STD-002
Method B : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization
20 Flammability
Measured : Impedance
Per UL-94
No defects
Not Applicable
21 Board
Flex
Epoxy-PCB (1.6mm)
Deflection 2mm (min)
Per AEC-Q200-006
A force of 17.7N
for 60sec
Meet Table A after testing.
22 Terminal
Strength
No defects
30 Electrical
Transient
Per ISO-7637-2
Not Applicable
Conduction
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
P.4/9
7. Specification of Packaging
7-1. Appearance and Dimensions
(12mm-wide plastic tape)
2.0±0.05
4.0±0.1 4.0±0.1
1.75±0.1
0.3±0.1
1.5
+0.1
φ
-0
1.9±0.1
1.
5
+0.3
Direction of feed
φ
(in mm)
–
0
*
Dimension of the Cavity is measured at the bottom side.
(1) Taping
Products shall be packaged in the each embossed cavity of 12mm-wide, 4mm-pitch and plastic tape
continuously and sealed by cover tape.
(2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point.
(4) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
7-2. Tape Strength
(1) Pull Strength
Plastic tape
Cover tape
5N min.
10N min.
165 to 180 degree
(2) Peeling off force of Cover tape
0.2N to 0.7N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
F
Cover tape
Plastic tape
7
-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel : 2500 pcs. / reel
(2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows.
(3) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1), RoHS marking (
∗
2), Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(4) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(
∗
2), Quantity, etc)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
P.5/9
(5) Dimensions of reel and taping (leader-tape, trailer-tape)
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
Empty tape
210 min.
Cover tape
13.0±0.2
φ
6
0
+1
φ
–
0
Direction of feed
21.0±0.8
φ
+1
-0
13.0
17.0±1.4
180
+0
φ
-3
(in mm)
7
-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity in Outer Case
(Reel)
H
W
D
H
186
186
93
3
D
∗
Above Outer Case size is typical. It depends on a quantity of an
order.
W
8.
！
Caution
8-1. Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropreate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or
property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains,ships,etc.)
(9)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
P.6/9
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
•
Standard land dimensions (Flow and Reflow soldering)
Chip Ferrite Bead
Land pad thickness and
Rated
Current
(A)
1.5/2
3.5
dimension a
35µm
1.2
18µm
1.2
70µm
1.2
2.4
1.2
1.2
ａ
6
6.4
3.3
1.65
1.2
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
Solder Resist
3.0
6.0
ﾟ
Pattern
•
Land dimensions on Flow soldering for 2.5mm pitch mounting
Chip Ferrite Bead
*Taking land pad thickness and rated current
into account.
a
b
c
d
e
3.0
6.0
1.2
1.8
1.5
(in mm)
e
e
a
b
c
*The pattern shall be designed to above drawing to
prevent causing the solder bridge when products
are mounted by 2.5mm pitch flow soldering.
d
c
Solder Resist
Pattern
e
e
a
b
d
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
P.7/9
9-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%.)
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 200
μ
m
(2) Soldering conditions
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
(3) soldering profile
□
Flow soldering profile
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
150
℃、
60s min.
250
℃、
4
～
6s
2 times
265
℃±
3
℃
、
5s max.
Cycle of flow
2 times
□
Reflow soldering profile
Temp.
(
℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
Heating
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Peak temperature
Cycle of reflow
245
±
3°C
260°C,10s
2 times
2 times
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
P.8/9
9-3. Reworking with soldering iron
•
Pre-heating: 150°C, 1 min
•
Soldering iron output: 80W max.
•
Tip diameter:
φ
3mm max.
•
Times : 2times max.
•
Tip temperature: 350°C max.
•
Soldering time : 3(+1,-0) seconds.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length: a
<
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation.
C
Products (A, B, C, D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
>
C
>
B
≅
D.
B
Seam
D
A
a
b
Slit
<
Length:a b
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9116C-01
P.9/9
9-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/
λ
max. Frequency:28kHz
to 40kHz
Time:5 min max.
(3) Cleaner
1.Alternative cleaner
•
Isopropyl alcohol (IPA)
2.Aqueous agent
•
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
Mouser Electronics
Authorized Distributor
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