Murata-Electronics-DLM11SN450HZ2L
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Reference Only
Spec No. JEFL243C-9116F-01
P1/10
Chip Common Mode Choke Coil
DLM11SN
□□□
HZ2
□
Murata Reference Specification
[AEC-Q200]
1.Scope
This reference specification applies to Chip Common Mode Choke Coil DLM11S Series for Automotive Electronics
based on AEC-Q200 except for Power train and Safety.
2.Part Numbering
(ex.)
DL
(1)
M
11
S
N
900
(6)
H
Z
2
L
(2) (3) (4) (5)
(7) (8) (9)
(10)
(6) Impedance (Typ. at 100MHz)
(1) Chip Common Mode Choke Coil
(2) Structure (M : Monolithic Type)
(3) Dimension (L
×
W)
(7) Circuit
H : Characteristic Impedance
100
Ω
system
(8) Features
(4) Type S: Magnetically shielded one circuit type
(9) Number of Line
(5) Category
(10) Packaging Code
L : Taping / B : Bulk
3.Rating
ESD
Rank
2:2kV
Common Mode Impedance
(at 100MHz, Under
Customer
Murata
Rated
Withstanding
Voltage
Rated
DC
Insulation
Part Number
Part Number
Voltage
Current
Resistance Resistance
Standard Testing Condition)
DLM11SN450HZ2L
DLM11SN450HZ2B
DLM11SN900HZ2L
DLM11SN900HZ2B
45
Ω±
25%
90
Ω±
25%
0.7
Ω±
25%
100M
Ω
5V(DC)
12.5V(DC) 100mA
2
min.
1.1
Ω±
25%
Operating Temperature : -55 to +125
°
C
Storage Temperature
: -55 to +125
°
C
4. Standard Testing Conditions
<
Unless otherwise specified>
<
In case of doubt>
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Temperature : Ordinary Temperature
15 to 35°C
Humidity : Ordinary Humidity
25 to 85%(RH)
Atmospheric Pressure : 86 to106kPa
5.Style and Dimensions
■
Equivalent Circuits
(1)
(4)
(2)
(3)
(2)
(3)
(1)
(Top View)
(Side View)
(4)
0.3 ± 0.1
No polarity
■
Unit Mass (Typical value)
0.004g
：
Electrode
（
In
：
mm
）
(Bottom View)
0.2 ± 0.15
1.25 ± 0.1
6.Marking
No Marking.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P2/10
7. Electrical Performance
No.
7.1
Item
Common Mode
Impedance
Specification
Meet item 3.
Test Method
Measuring Frequency : 100±1MHz
(ref.item 9.)
Measuring Equipment : KEYSIGHT 4991A or the
equivalents
(
In case of doubt in standard condition, the heat
treatment (200°C,about 10 minutes)shall be applied.
Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max.(ref.item 9.)
Measuring current : 10mA max.(ref.item 9.)
7.2
Withstanding
Voltage
Products shall not be damaged.
Meet item 3.
7.3
7.4
DC Resistance
(Rdc)
Insulation
Measuring voltage : Rated Voltage
Resistance (I.R.)
Measuring time : 1 minute max. (ref.item 9.)
8. Q200 Requirement
8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
Stress
Test Method
No.
3
High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
No damaged
Appearance
Common Mode
Impedance
Change
within
±
20%
within
±
30%
100M
Ω
min.
Rdc change
I.R.
Withstanding
Voltage
No damaged
4
Temperature Cycling
1000cycles
-55 deg C to +125 deg C
Meet Table A after testing.
Set for 24hours at room
temperature, then measured.
5
7
8
Per EIA469
No defects
Destructive
Physical Analysis
No electrical tests
Biased Humidity
Operational Life
1000hours at 85 deg C,
85%RH
Apply max rated current.
Apply 125 deg C
1000hours
Set for 24hours at room
temperature, then measured
Visual inspection
Meet Table A after testing.
(ref.item 9)
(ref.item 9)
Meet Table A after testing.
Apply rated current.
9
External Visual
No abnormalities
No defects
10 Physical
Dimension
Meet ITEM 4
（
Style and Dimensions
）
12 Resistance
to Solvents Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical
Shock
Per MIL-STD-202 Method 213 Meet Table A after testing.
Condition F:
1500g’s(14.7N)/0.5ms/
Half sine
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P3/10
AEC-Q200
Murata Specification / Deviation
Meet Table A after testing.
No.
Stress
Test Method
14 Vibration
5g’s(0.049N) for 20 minutes,
12cycles each of
3 oritentations
Test from 10-2000Hz.
12cycles each of
3 orientations
15 Resistance
Solder temperature
260C+/-5 deg C
Meet Table A after testing.
to Soldering Heat
Immersion time 10s
17 ESD
Per AEC-Q200-002
ESD Rank: Refer to Item 3. Rating.
Meet Table B after testing.
Table B
No damaged
Appearance
Rdc change
within
±
30%
18 Solderbility
19 Electrical
Per J-STD-002
Method b : Not Applicable
95% of the terminations is to be soldered.
Flux:Ethanol solution of rosin,25(wt)% includes
activator
equivalent to 0.06 to 0.10(wt)% chlorine
No defects
Measured :
Characterization
Common mode Impedance
20 Flammability
Per UL-94
Not Applicable
21 Board
Flex
Epoxy-PCB(1.6mm)
Meet Table B after testing.
Deflection 2mm(min)
60 sec minimum holding time.
22 Terminal
Strength
Per AEC-Q200-006
A force of 17.7N for 60sec
5N for 30s
No defects
30 Electrical
Transient
Per ISO-7637-2
Not Applicable
Conduction
9. Terminal to be Tested.
When measuring and supplying the voltage,the following terminal is applied.
No.
Item
Terminal to be Tested
9.1 Common
Mode
Impedance
Terminal
Terminal
9.2 Withstanding
Voltage
Insulation Resistance
Terminal
Terminal
9.3 DC
Resistance
Terminal
Terminal
Terminal
Terminal
9.4 Biased
Humidity
(Supply Terminal)
Terminal
Terminal
9.5 Operational
Life
(Supply Terminal)
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P4/10
10. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance,
residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go
Bo.
(2) Measure impedance of the fixture(shorted), Rs
Xs.
(3) Measure admittance of the specimen, Gm
Bm.
(4) Calculate corrected impedance
Z
using the formula below.
Z
= (Rx
2
+Xx
2
)
1/2
Where
Gm – Go
Rx =
－
Rs
－
Xs
(Gm-Go)
２
+ (Bm-Bo)
２
– (Bm – Bo)
Xx =
(Gm-Go)
２
+ (Bm-Bo)
２
11. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 16 except the case of being specified special condition.
12.Impedance Frequency Characteristics(Typical)
DLM11SN900HZ2
DLM11SN900HZ2
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P5/10
13. Specification of Packaging
13.1 Appearance
and Dimensions ( 8mm-wide,Plastic tape)
+0.1
-0
1.5
φ
4.0±0.1
Sprocket Hole
0.
±
.
5
0.25±0.05
Cavity
*
Dimension of the Cavity is measured
at the bottom side.
(in:mm)
4.0±0.1 2.0±0.0
5
1
.15±0.05
0.65±0.05
0.65±0.05
Direction of feed
13.2 Specification
of Taping
(1)Packing quantity(Standard quantity)
4000 pcs. / reel
Direction of feed
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3)Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point
The cover tape have no spliced point.
(5)Missing components number
Missing components number within 0.025% of the number per reel or 1 pc.,whichever is greater,and are not
continuous. The specified quantity per reel is kept.
13.3 Pull
Strength of Plastic Tape
Plastic Tape
Cover Tape
5N min.
10N min.
13.4 Peeling
off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
165 to 180 degree
F
Cover tape
Plastic tape
13.5 Dimensions of Leader-tape, Trailer and Reel
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P6/10
13.6 Marking for reel
Customer part number
,
MURATA part number, Inspection number(
∗
1), RoHS Marking(
∗
2), Quantity, etc
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O,N,D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS Marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
13.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking (
∗
2), Quantity, etc
13.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
Label
W
D
H
H
186
186
93
5
∗
Above Outer Case size is typical. It depends on a quantity of an
order.
D
W
!
14.
△
Caution
14.1 Mounting
Direction
Mount products in right direction.
Wrong direction which is 90
°
rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
Ｚ
Ｚ
right direction
14.2 Limitation
of Applications
wrong direction
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party’s life, body
or property.
(1) Aircraft equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
14.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
14.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from
deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these
environments.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P7/10
15. Notice
This product is designed for solder mounting. (reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
15.1 Flux
and Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
15.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
15.3 Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
15.4 Attention
regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［
Products direction
］
a
Products shall be location the sideways
Direction (Length : a<b) to the machanical
b
Stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
Stress Level
D *1
A
>
(2) Add slits in the board separation part.
A
>
B
(3) Keep the mounting position of the component away from the board separation surface.
A
>
C
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P8/10
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection
that occurs during the tightening of the screw. Mount the component in a position as far away
from the screw holes as possible.
Recommended
Screw Hole
Portion of
Perforation
15.5 Attention
Regarding P.C.B. Design
< The Arrangement of Products >
×
P.C.B.
○
P.C.B. shall be designed so that products are
far from the portion of perforation.
○
Product
Portion of
Perforation
×
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
○
×
P.C.B.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
Product
Hole
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Pic
k
–
u
p nozzle
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
Product
P.C.B.
< P.C.B. Separation >
Support pin
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
15.6 Attention
Regarding P.C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 1005 size or the equivalents.
15.7 Standard
Land Dimensions
0.55
(1)
(4)
(2)
(3)
*(1)(2)(3)(4)Indicates terminal number
Resist
Copper foil pattern
No pattern
1.95
(in : mm)
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P9/10
15.8 Soldering(Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(
℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s
～
60s
60s max.
90s±30s
(
s)
Time
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
245
±
3°C
Heating
above 230°C
、
60s max.
260°C
、
10s
Peak temperature
Cycle of reflow
2 times
2 times
(1) Standard printing pattern of solder paste
•
•
•
•
Standard thickness of the solder paste should be 100 to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land dimensions.
Use Sn-3.0Ag-0.5Cu solder.
0.55
0.70
0.70
(in
：
mm)
(2) Reworking with Soldering iron
•
The following conditions shall be strictly followed when using a soldering iron after
being mounted by reflow soldering.
·
Pre-heating: 150°C, 1 min
·
Tip temperature: 380°C max.
·
Soldering time : 3(+1,-0) seconds.
· Soldering iron output: 30W max.
· Tip diameter:
φ
3mm max.
· Times : 2times max.
•
Do not touch the products directly with the tip of the soldering iron.
(3) Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
U
Recommendable
Recommendable
t
1/3 T
≦ ｔ ≦
T
（
T : Chip thickness
）
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-9116F-01
P10/10
15.9 Cleaning
Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
・
Power : 20W/ l max.
・
Frequency : 28kHz to 40kHz
・
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
•
Isopropyl alcohol (IPA)
2. Aqueous agent
•
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
15.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
15.11 Operating
Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
15.12 Storage
Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
•
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to
prevent the following deterioration.
Poor solderability due to the oxidized electrode.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
16.
△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD
Mouser Electronics
Authorized Distributor
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