Murata-Electronics-DLP2ADA900HL4L
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Reference Only
Spec No.JEFL243E-0010E-01
P1/9
Chip Common Mode Choke Coil Arrays
DLP2ADA
□□□
HL4
□
1.Scope
Reference Specification
This reference specification applies to Chip Common Mode Choke Coil Arrays
DLP2ADA Series.
2.Part Numbering
(ex.)
DL
P
2A
D
Ａ
(5)
900
(6)
H
L
4
L
(1)
(2) (3) (4)
(7) (8) (9)
(10)
(6) Impedance (Typ. at 100MHz)
(1) Chip Common Mode Choke Coil
(2) Structure (P : Film Type)
(3) Dimension (L
×
W)
(7) Circuit
(H : Characteristic Impedance
100
Ω
system)
(8) Features
(4) Type
(9) Number of Line
(5) Category: A:High Cut off Frequency 6~8GHz(Typ.)
(10) Packaging Code
L : Taping / B : Bulk
DC
3.Rating
Common Mode Impedance
(at 100MHz, Under
Customer
Murata
Rated
Withstanding Rated
Insulation
Part Number
Part Number
Voltage Voltage
Current
Resistance Resistance
Standard Testing Condition)
DLP2ADA350HL4L
DLP2ADA350HL4B
DLP2ADA670HL4L
DLP2ADA670HL4B
DLP2ADA900HL4L
DLP2ADA900HL4B
150mA
35
Ω±
20%
67
Ω±
20%
90
Ω±
20%
0.8
Ω±
25%
100M
Ω
1.0
Ω±
25%
min.
5V(DC) 12.5V(DC)
130mA
120mA
1.4
Ω±
25%
Operating Temperature : -40 to +85
°
C
Storage Temperature
: -40 to +85
°
C
4. Standard Testing Conditions
<
Unless otherwise specified>
<
In case of doubt>
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Temperature : Ordinary Temperature
15 to 35°C
Humidity : Ordinary Humidity
25 to 85%(RH)
Atmospheric Pressure : 86 to106kPa
5.Style and Dimensions
0.5±0.1
0.25±0.1
■
Equivalent Circuits
(4)
(3)
(2)
(1)
0.82±0.1
0.25±0.15
(2)
(6)
(1)
(5)
(3)
(7)
(4)
(8)
1.0±0.1
(6)
No polarity.
(8)
(5)
(7)
Electrode
□：
2.0±0.1
■
Unit Mass(Typical value)
(in mm)
0.009g
6.Marking
No Marking.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P2/9
7. Electrical Performance
No.
7.1
Item
Specification
Meet item 3.
Test Method
Common Mode
Impedance
Measuring Frequency : 100±1MHz
(ref.item 10.)
Measuring Equipment :
KEYSIGHT
4291A or the
equivalents
(
In case of doubt in standard condition, the heat
treatment (200°C,about 10 minutes)shall be applied.
Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max.(ref.item 10.)
Measuring current : 80mA max.(ref.item 10.)
7.2
7.3
Withstanding
Voltage
Products shall not be damaged.
Meet item 3.
DC Resistance
(Rdc)
Rdc
Rdc
Rdc
Rdc
7.4
Insulation
Measuring voltage : Rated Voltage
Resistance (I.R.)
Measuring time : 1 minute max. (ref.item 10.)
8.Mechanical Performance
No.
Item
Specification
Test Method
8.1
Appearance and
Meet item 5.
Dimensions
Visual Inspection and measured with Slide Calipers.
8.2
8.3
Solderability
The electrodes shall be at least
95% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±3°C
Immersion Time : 3±1 seconds
Immersion and emersion rates : 25 mm / s
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±1 seconds
Immersion and emersion rates : 25 mm / s
Then measured arter exposure in the room condition
for 4 to 48 hours.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 10 times
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz for 20
minutes
Resistance to
Soldering Heat
Meet Table 1.
Table 1
Appearance
Common Mode
Impedance
Change
No damaged
within
±
20%
100M
Ω
min.
within
±
30%
I.R.
8.4
8.5
Drop
DC Resistance
Change
Vibration
Total amplitude : 1.5 mm or Acceleration amplitude
196 m/s
2
whichever is smaller.
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions.
Substrate : (t =1.0 mm).
8.6
Bending
Strength
Meet Table 2.
Table 2
Deflection : 2 mm
Speed of Applying Force : 0.5 mm / s
Keeping time : 30 seconds
Appearance
DC Resistance
Change
No damaged
within
±
30%
Pressure jig
R230
F
Deflection
Product
45
45
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P3/9
9.Environmental Performance
(Products shall be
soldered
on the glass-epoxy substrate)
No.
9.1
Item
Specification
Meet Table 1.
Test Method
Heat Shock
1 Cycle
Step 1
-40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2
+85(+3°C,-0°C) / 30(+3,-0) min
Total of 200 cycles.
Then measured after exposure in the room condition
for 4 to 48 hours.
9.2
9.3
Humidity
Heat life
Temperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
(ref. Item 10.)
9.4
Cold Resistance
Temperature : -40± 2°C
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and
supplying
the voltage,the following terminal is applied.
No.
10.1 Common
Mode
Impedance
Item
Terminal to be Tested
Terminmal
Terminmal
(Measurement Terminal)
Terminmal
Terminmal
10.2 Withstanding
Voltage
(Measurement Terminal)
Insulation Resistance
(Measurement Terminal)
Heat Life
Terminmal
Terminmal
Terminmal
Terminmal
(Supply Terminal)
10.3 DC
Resistance
(Measurement Terminal)
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance,
residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go
Bo.
(2) Measure impedance of the fixture(shorted), Rs
Xs.
(3) Measure admittance of the specimen, Gm
Bm.
(4) Calculate corrected impedance
Z
using the formula below.
Z
= (Rx
2
+Xx
2
)
1/2
Where
Gm-Go
Rx =
– Rs
– Xs
(Gm-Go)
2
+ (Bm-Bo)
2
-(Bm- Bo)
Xx =
(Gm-Go)
2
+ (Bm-Bo)
2
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 16 except the case of being specified special condition.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P4/9
13.Impedance Frequency Characteristics(Typical)
Common mode Impedance
DLP2ADA900HL4
DLP2ADA670HL4
DLP2ADA350HL4
DLP2ADA900HL4
DLP2ADA670HL4
DLP2ADA350HL4
Differential mode Impedance
0
-5
Sdd
DLP2ADA350HL4
DLP2ADA670HL4
DLP2ADA900HL4
-10
-15
-20
-25
-30
Scc
DLP2ADA350HL4
DLP2ADA670HL4
DLP2ADA900HL4
1
10
100
Frequency[MHz]
1000
10000
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P5/9
14. Specification of Packaging
14.1 Appearance
and Dimensions ( 8mm-wide,Plastic tape)
+0.1
4.0±0.1
0.25±0.05
φ
1.5
–
0
Sprocket Hole
Cavity
*
Dimension of the Cavity is measured
at the bottom side.
(in:mm)
1.2±0.1
2.0±0.05
14.2 Specification
of Taping
0.98±0.05
4.0±0.1
Direction of feed
(1)Packing quantity(Standard quantity)
3000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3)Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point
The cover tape have no spliced point.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
14.3 Pull
Strength of Plastic Tape
Plastic Tape
5N min.
Cover Tape
14.4 Peeling
off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
10N min.
165 to 180 degree
F
Cover tape
Plastic tape
Leader
14.5 Dimensions
of Leader-tape, Trailer and Reel
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Label
Empty tape
Top tape
13.0±0.2
φ
60±
1
φ
0
21.0±0.8
φ
Direction of feed
9±
1
0
13±1.4
180
±
0
φ
3
(in:mm)
14.6 Marking for reel
Customer part number
,
MURATA part number, Inspection number(
∗
1), RoHS
Marking
(
∗
2), Quantity, etc
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O,N,D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS
Marking
»
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P6/9
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS
Marking
(
∗
2), Quantity, etc
14.8 Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(Reel)
(mm)
H
W
D
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an order.
W
!
15.
△
Caution
15.1 Mounting
Direction
Mount products in right direction.
Wrong direction which is 90
°
rotated from right direction
causes not only open or short circuit but also
flames or other serious trouble.
Z
Z
right direction
wrong direction
15.2 Limitation
of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party’s life, body
or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
16. Notice
This product is designed for solder mounting.(reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux
and Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
16.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
16.3 Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention
when you select
resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4 Attention
regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［
Products direction
］
a
Products shall be location the sideways
Direction (Length : a<b) to the machanical
b
Stress.
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P7/9
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduc
e stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
B
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
D
A
If a Cutting Disc is used, stress will be diagonal to the PCB,
therefore A > D is invalid.
Sl
it
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
Portion of
Perforation
16.5 Attention
Regarding P.C.B. Design
×
P.C.B.
○
< The Arrangement of Products >
P.C.B. shall be designed so that products are
○
Product
far from the portion of perforation.
Portion of
Perforation
×
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
○
×
P.C.B.
Product
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
Hole
(Because the stress concentrate on the
line of holes.)
Pic
k
–
u
p nozzle
< Products Placing >
Product
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
P.C.B.
Support pin
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.6 Standard
Land Dimensions
1.75
Resist
Copper foil pattern
No pattern
Products
0.5 pitch
0.25
(in mm)
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P8/9
16.7 Standard Soldering Condition (Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(
℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s
～
60s
60s max.
90s±30s
(
s)
Time
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
245
±
3°C
Heating
above 230°C
、
60s max.
260°C
、
10s
Peak temperature
Cycle of reflow
2 times
2 times
0.25
(1) Standard
printing pattern of solder paste
•
Standard thickness of the solder paste should be 100 to 150µm.
•
Use the solder paste printing pattern of the right pattern.
•
For the resist and copper foil pattern, use standard land dimensions.
•
Use Sn/Pb = 60/40 Solder for pattern printing.
0.55
0.4
•
Use Sn-3.0Ag-0.5Cu solder.
0.55
(in mm)
0.5
(2) Reworking with Soldering iron
•
The following conditions shall be strictly followed when using a soldering iron after
being mounted by reflow soldering.
·
Pre-heating: 150°C, 1 min
· Soldering iron output: 30W max.
·
Tip temperature: 380°C max.
· Tip diameter:
φ
3mm max.
·
Soldering time : 3(+1,-0) seconds.
· Times : 2times max.
•
Do not touch the products directly with the tip of the soldering iron.
(3) Solder Volume
Solder shall be used not to be
exceeded
the upper limits as shown below.
Upper Limit
Recommendable
Upper Limit
Recommendable
t
1/3 T
≦
ｔ
≦
T
（
T : Chip thickness
）
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO.,LTD
Reference Only
Spec No.JEFL243E-0010E-01
P9/9
16.8 Cleaning
Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
・
Power : 20W/ l max.
・
Frequency : 28kHz to 40kHz
・
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
•
Isopropyl alcohol (IPA)
2. Aqueous agent
•
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
16.9 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
16.10 Operating
Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.11 Storage
Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
•
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to
prevent the following deterioration.
Poor solderability due to the oxidized electrode.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
17.
△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)
Y
o
u are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD
