Murata-Electronics-DLW31SN601SQ2L
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Reference Only
Spec No. JEFL243C-0002T-01
P 1/9
Wire Wound Chip Common Mode Choke Coil
DLW31SN
□□□
SQ2
□
Reference Specification
1. Scope
This reference specification applies to Chip Common Mode Choke Coil DLW31SN Series.
2. Part Numbering
(ex.)
DL
(1)
W
31
S
N
222
(6) (7)
(8) (9)
(10)
(6) Impedance (Typ. at 100MHz)
S
Q
2
L
(2) (3)
(4) (5)
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L
W)
(4) Type
(7) Circuit
(8) Features
(9) Number of Line
(5) Category
(10) Packaging Code
L : Taping / B : Bulk
3. Rating
Customer
Part Number
Murata
Part Number
Common Mode Impedance
(at 100MHz, Under
Rated
Withstanding
Voltage
Rated
DC
Insulation
Voltage
Current Resistance
Resistance
Standard Testing Condition)
V(DC)
V(DC)
(mA)
(
max.)
(M
min.)
(
± 25%)
DLW31SN222SQ2L
DLW31SN222SQ2B
DLW31SN102SQ2L
DLW31SN102SQ2B
DLW31SN601SQ2L
DLW31SN601SQ2B
DLW31SN261SQ2L
DLW31SN261SQ2B
DLW31SN161SQ2L
DLW31SN161SQ2B
DLW31SN900SQ2L
DLW31SN900SQ2B
2200
1000
200
230
260
310
340
370
1.2
1.0
0.8
0.5
0.4
0.3
600
50
125
10
260
160
90
Operating Temperature : -40 to +85
°
C
4. Standard Testing Condition
Storage Temperature
: -40 to +85
°
C
<
Unless otherwise specified>
<
In case of doubt>
Temperature : Ordinary Temperature
15 to 35°C
Temperature : 20 ± 2°C
Humidity : Ordinary Humidity 25 to 85%(RH)
Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
5. Style and Dimensions
■
Equivalent Circuits
(2)
(3)
(1)
(4)
(0.6)
(0.6)
No polarity
1.6±0.2
3.2±0.2
■
Unit Mass (Typical value)
0.039g
(1)
(4)
(2)
(3)
Electrode
( ): Reference value
(in mm)
6. Marking
No Marking.
MURATA MFG.CO.,LTD
Reference Only
Test Method
Spec No. JEFL243C-0002T-01
P 2/9
7. Electrical Performance
No.
7.1
Item
Specification
Common Mode
Impedance (Zc)
Withstanding
Voltage
Meet item 3.
Measuring Equipment : Agilent 4291A or the equivalent
Measuring Frequency :100±1MHz(ref.item 10,11)
Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
7.2
7.3
7.4
Products shall not be
damaged.
Charge Current : 1 mA max.
(ref.item 10)
Measuring current : 100mA max.
(ref.item 10)
(
In case of doubt in the above mentioned standard
condition, measure by 4 terminal method.)
Measuring voltage : Rated Voltage
DC Resistance
(Rdc)
Meet item 3.
Insulation
Resistance (I.R.)
Measuring time : 1 minute max. (ref.item 10)
8. Mechanical Performance
No.
Item
Specification
Test Method
8.1 Appearance
and Meet
item 5.
Dimensions
Visual Inspection and measured with
Slide Calipers.
8.2 Bonding
Strength
No evidence of coming off
substrate.
Products shall not be mechanical
damaged.
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 5±1 seconds
Pressure
Substrate
Product
Test board fixture
8.3 Bending
Strength
Meet Table 1.
Table 1
It shall be soldered on the Glass-epoxy substrate
Deflection : 2mm
(t=1.0mm)
Keeping time : 30 seconds
Speed of Applying Force : 0.5mm/s
Pressure jig
Appearance
Common Mode
Impedance
Change
No damaged
R230
F
within
±
20%
Deflection
Product
45
45
10M
Ω
min.
I.R.
Withstanding
Voltage
8.4 Drop
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75 cm
No damaged
The Number of Times : 3 times
8.5 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions.
(Total 6 hours)
8.6 Solderability
The electrodes shall be at least
90% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)% includes
activator equivalent to 0.06 to 0.10(wt)% chlorine
Pre-Heating : 80 to 120°C 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±3°C
Immersion Time : 4±1 s
Immersion and emersion rates : 25mm / s
Stainless tweezers
Please hold product
except these part.
8.7 Resistance
to
Soldering Heat
Meet Table 1.
Flux : Ethanol solution of rosin,25(wt)% includes
activator equipment to 0.06 to 0.10(wt)% chlorine
Pre-Heating : 80 to 120°C ,1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 260±5°C
Immersion Time : 5±0.5 seconds
Immersion and emersion rates : 25mm / s
Then measured after exposure in the room condition
for 4 to 48 hours.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-0002T-01
P 3/9
9. Environmental Performance
(Products shall be soldered on the substrate.)
No.
9.1
Item
Temperature
Cycle
Specification
Meet Table 1.
Test Method
1 Cycle
Step 1
-40°C(+0°C,-3°C) / 30±3 min
Step 2
Ordinary Temp. / 10 to 15 minutes
Step 3
+85°C(+3°C,-0°C) / 30±3 min
Step 4
Ordinary Temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the
room condition for 4 to 48 hours
9.2
9.3
9.4
Humidity
Temperature : 40±2°C
Humidity : 90~95%(RH)
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Heat life
Temperature : 85±2°C
Applying Voltage : 2times for Rated Voltage
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Temperature : -40± 2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Cold Resistance
10. Terminal to be Tested.
When measuring and suppling the voltage,the following terminal is applied.
No. Item
Terminal to be Tested
10.1 Common
Mode Impedance
(Measurement Terminal)
Terminal
Terminal
10.2 Withstanding
Voltage
(Measurement Terminal)
Terminal
Terminal
Terminal
DC Resistance
10.3
Terminal
(Measurement Terminal)
Terminal
Terminal
10.4 Insulation
Resistance
(Measurement Terminal)
Terminal
Terminal
10.5 Heat
Life(Supply Terminal)
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance,
residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go
Bo.
(2) Measure impedance of the fixture(shorted), Rs
Xs.
(3) Measure admittance of the specimen, Gm
Bm.
(4) Calculate corrected impedance
Z
using the formula below.
Z
= (Rx
2
+Xx
2
)
1/2
Where
Gm-GO
(Gm-Go)
2
+ (Bm-Bo)
2
Rx =
– Rs
– Xs
-(Bm- Bo)
(Gm-Go)
2
+ (Bm-Bo)
2
Xx =
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except
the case of being specified special condition.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-0002T-01
P 4/9
13. Impedance Frequency Characteristics(Typical)
10000
Common Mode
DLW31SN222SQ2
DLW31SN102SQ2
DLW31SN601SQ2
DLW31SN261SQ2
DLW31SN161SQ2
1000
DLW31SN900SQ2
100
DLW31SN222SQ2
DLW31SN102SQ2
DLW31SN601SQ2
DLW31SN261SQ2
DLW31SN161SQ2
10
DLW31SN900SQ2
Differential Mode
1000
1
1
10
100
f (MHz)
14. Specification of Packaging
14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)
Sprocket Hole
1.5±
0
0
.1
2.0±0.05
4.0±0.1
0.3±0.05
*Dimension of the Cavity is measured
at the bottom side.
2.1±0.1
4.0±0.1
2.0±0.1
Cavity
(in mm)
Direction of feed
14.2 Specification of Taping
(1)Packing quantity(Standard quantity)
2000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape have no spliced point.
(4) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc.,whichever is greater,and are not
continuous.The specified quantity per reel is kept.
14.3 Pull Strength of Plastic Tape
Plastic Tape
5N min.
Cover Tape
14.4 Peeling off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm / min
10N min.
165 to 180 degree
F
Cover tape
Plastic tape
Leader
14.5 Dimensions of Leader-tape, Trailer and Reel
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Label
Empty tape
Top tape
13.0±0.2
60±
1
0
21.0±0.8
Direction of feed
9±
1
0
13±1.4
(in:mm)
180
±
0
3
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-0002T-01
P 5/9
14.6 Marking for reel
Customer part number
,
MURATA part number, Inspection number(
1), RoHS
Marking
(
2), Quantity, etc
1) « Expression of Inspection No. »
□□
OOOO
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O,N,D
Second digit
Third, Fourth digit : Day
(3)
Serial No.
2) « Expression of RoHS
Marking
»
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS
Marking
(
2), Quantity, etc
14.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity in Outer Case
Label
(mm)
(Reel)
W
D
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
!
15.
△
Caution
15.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90
°
rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
Ｚ
Ｚ
right direction
15.2 Limitation of Applications
wrong direction
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party’s life,body
or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
16. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
16.2 Assembling
<Exclusive use of Reflow soldering>
Products can only be soldered with reflow.
Flow soldering may cause deterioration in insulation resistance.
So,reflow soldering shall be applied for this product.
16.3 Claening Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and
characteristics of products by detaching. If cleaning,please contact us.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-0002T-01
P 6/9
16.4 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,
please pay your careful attention when you select resin in case of coating/molding the products with the
resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products
mounted on your board.
16.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［
Products direction
］
a
Products shall be location the sideways
b
Direction (Length : a<b) to the mechanical
Stress.
Poor example
〈
〉
Good example
〈
〉
(2)Products location on P.C.B. separation
C
B
Seam
Products(A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
C
B
D.
D
A
a
b
Slit
Length:a b
Portion of
Perforation
16.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
×
P.C.B. shall be designed so that products are
far from the portion of perforation.
P.C.B.
○
○
Product
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Portion of
Perforation
×
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
○
×
P.C.B.
Product
(Because the stress concentrate on the
line of holes.)
Hole
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
Pic
k
–
u
p nozzle
Product
< P.C.B. Separation >
P.C.B.
P.C.B. shall not be separated with hand.
Support pin
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-0002T-01
P 7/9
16.7 Standard Land Dimensions (Reflow)
2
1.6
Resist
Copper foil pattern
No Pattern
3.7
(in mm)
1
If the pattern is made with wider than 1.6mm. It will result to let component turn around,
because melting speed is different. In the worst case, short circuit between lines may be occured.
2 If the pattern is made with wider than 1.6mm, the strength of bending will be reduced.
3 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
16.8 Standard Soldering Condition
1.Reflow Soldering
(1) Standard printing pattern of solder paste
Standerd thickness of the solder paste should be 100 to 150 µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard
land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
Spread of soldering paste between lines may cause
short circuit of lines.
1.6
(in mm)
3.7
(2) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C,
in preheating. When components are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration
in insulation resistance.
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃/10s
230℃
245±3℃
220℃
Limit Profile
180
150
Standard Profile
30～60s
60s max.
90s±30s
Time（ｓ）
Standard Profile
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
245
±
3°C
Limit Profile
Pre-heating
Heating
above 230°C
、
60s max.
260°C
、
10s
Peak temperature
Cycle of reflow
2 times
2 times
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-0002T-01
P 8/9
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
·
Pre-heating: 150°C, 1 min
·
Tip temperature: 350°C max.
·
Soldering time : 3(+1,-0) seconds.
· Soldering iron output: 30W max.
· Tip diameter:
φ
3mm max.
· Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
3. Solder Volume
Solder shall be used not to be
exceeded
the upper limits as shown below.
Upper limit
Recommendable
ｔ
T
1/3T t T
(T:Thickness of electrode)
≦≦
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
16.9 Caution for use
･
When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
･
Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
of the core.
tweezer
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
16.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
16.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.13 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·
Products should be stored in the warehouse on the following conditions.
Temperature
：
.-10 ~ +40°C
Humidity
：
15 to 85% relative humidity
No rapid change on temperature and humidity.
·
Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderability due to the oxidized electrode.
·
Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
·
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·
Products shoud not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243C-0002T-01
P 9/9
!
17
.
△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD
