Murata-Electronics-DLW44SM242SK2L
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Reference Only
Spec No. JEFL243C-0040D-01
P 1/10
Wire Wound Chip Common Mode Choke Coil
DLW44SM
□
□□
SK2 Reference
Specification
□
1. Scope
This reference specification applies to Wire Wound Chip Common Mode Choke Coil
DLW44SM Series.
2. Part Numbering
(ex.)
DL
W
44
S
M
101
S
K
2
L
(1) (2) (3)
(4) (5)
(6) (7)
(8) (9) (10)
(6) Impedance Typical impedance value at 100MHz or peak frequency in case
of less than 100MHz.
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L
×
W)
(4) Magnetically Shielded One Circuit Type
(5) Category(M : Laser Marking Type)
(7) Circuit
(8) Features
(9) Number of Line
(10) Packaging Code
L : Taping (
φ
180mm/reel) / K : Taping (
φ
330mm/reel)
B : Bulk
3.Rating
Impedance
at 10MHz,
Impedance
at 100MHz,
Under Standard
*
DC
Rated
Resistance
Current
(Rdc)
(A) (
Ω±
40%)
Rated
Withstanding
Insulation
Resistance
(M
Ω
min.)
Customer
Part Number
MURATA
Part Number
Under Standard
T
e
siting Conditions
T
e
siting Conditions
V(DC)
Voltage
Voltage
V(DC)
(
Ω
)
(
Ω
T
yp.)
DLW44SM101SK2L
DLW44SM101SK2K
DLW44SM101SK2B
DLW44SM251SK2L
DLW44SM251SK2K
DLW44SM251SK2B
DLW44SM401SK2L
10.0
±
40%
100
3.1
2.6
2.1
1.9
1.5
1.4
1.1
0.016
0.024
24.0±40%
250
400
DLW44SM401SK2K 37.5
±
40%
DLW44SM401SK2B
0.030
0.040
0.060
0.075
0.120
DLW44SM851SK2L
DLW44SM851SK2K
DLW44SM851SK2B
DLW44SM172SK2L
DLW44SM172SK2K
DLW44SM172SK2B
DLW44SM242SK2L
DLW44SM242SK2K
DLW44SM242SK2B
DLW44SM302SK2L
DLW44SM302SK2K
DLW44SM302SK2B
65
±
40%
100
±
40%
140
±
40%
180
±
40%
850
60
150
10
1700
2400
2200
*Rated Current is derated as below figure depending on the operating temperature.
ꞏ
Operating Temperature :
– 40 °C to + 105 °C
ꞏ
Storage Temperature :
– 40 °C to + 105 °C
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 2/10
4. Standard Testing Conditions
< Unless otherwise specified >
< In case of doubt >
Temperature : 20 °C ± 2 °C
Temperature : Ordinary Temp. 15 ºC to 35 °C
Humidity : Ordinary Humidity
25 %(RH) to 85 %(RH)
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86 kPa to 106 kPa
5. Style and Dimensions
(TOP)
■
Unit Mass (Typical value)
0.086g
■
Equivalent Circuits
①
②
(BOTTOM)
(in mm)
③
④
Electrode
No polarity
6. Marking
Top of the tape
・
Tape
Sprocket Hole
marking
DLW44SM
7. Electrical Performance
No.
7.1
Item
Specifications
Test Method
Measuring Equipment : KEYSIGHT 4191A or the equivalents.
Measuring Frequency : 10MHz
(ref. Item 10.)
Impedance
(|Z|) (at 10MHz)
Insulation
Resistance
(I.R.)
Meet item 3.
7.2
7.3
7.4
Measuring Equipment : R8340A or the equivalents.
Test Voltage : 2times for Rated Voltage
Time : within 60 s
(ref. Item 10.)
(ref. Item 10.)
DC Resistance
(Rdc)
Measuring Current : 100 mA max.
(In case of doubt in the above mentioned standard
condition,measure by 4 terminal method.)
Voltage : 150 V(DC)
Withstanding
Voltage
Products shall not be damaged.
Time : 60 s
Charge Current : 1 mA max.
(ref. Item 10.)
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 3/10
8. Mechanical Performance
No.
Item
Specifications
Meet item 5.
Test Method
8.1 Appearance
and
Dimensions
Visual Inspection and measured with Slide
Calipers.
Pressure jig
8.2 Bonding
Strength No
evidence of chipping,breakage.
Applying Force (F) : 10N
Applying Time : 5±1s
F
and
No evidence of coming off
glass-epoxy substrate.
Substrate
Test board fixture
Core Strength
Product
8.3 Body
strength
No evidence of chipping,breakage.
Applying Force (F) : 10N
Applying Time : 5±1s
F
Nozzle
Product
Test board fixture
Substrate
8.4 Bending
Strength
Meet Table 1.
Table 1
Substrate : Glass-epoxy (t=1.6mm)
Deflection : 2mm
Speed of Applying Force : 0.5 mm/s
Appearance
Impedance
change
No damaged.
within ± 20%
Keeping Time : 30 s
Pressure jig
R340
F
(at 10MHz)
I.R.
Deflection
(in mm)
10M
Ω
min.
Withstanding
Voltage
No damaged.
45
45
Product
8.5 Vibration
Products shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 min.
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of
3 mutually perpendicular
directions(Total 6 hours).
8.6 Drop
Products shall be dropped concrete or steel board.
Method : free fall
Height : 0.75m
The Number of Times : 3Times
Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
8.7 Solderability
The electrodes shall be at least
90% covered with new solder
coating.
Solder Temperature : 245±5°C
Immersion Time : 4±1s
Immersion and Immersion rates : 25mm/s
Stainless tweezers
Product
8.8 Resistance
to
Soldering heat
Meet Table 1.
Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5°C
Immersion Time : 5±1s
Immersion and Immersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 4/10
9. Enviromental Performance
(Product shall be soldered on the glass-epoxy substrate (t=1.6mm).)
No.
Item
Specifications
Meet Table 1.
Test Method
9.1 Temperature
Cycle
1 cycle
1 step : -40 °C (+0, -3)°C / 30min (+ 3,- 0) min
2 step : Ordinary temp. / 3 min max.
3 step : +105 °C (+3, -0)°C / 30min (+ 3,- 0) min
4 step : Ordinary temp. / 3 min max.
T
o
tal of 100 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
9.2 Humidity
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
Temperature : 60 ± 2 °C
9.3 Humidity
Load
Humidity : 90 to 95 %(RH)
Test Voltage : Rated Voltage
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
Temperature : 105 ± 2 °C
Test Voltage : Rated Voltage
Time : 1000 h (+48 h , -0 h)
(ref. Item 10.)
9.4 Heat
life
Then measured after exposure in the room
condition for 4 to 48 hours.
(ref. Item 10.)
Temperature : – 40 ± 2 °C
9.5 Cold
Resistance
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
(ref. Item 10.)
10. Terminal to be Tested
When measuring and
supplying
the voltage, the following terminal is applied.
Item Terminal
to be Tested
No.
10.1
10.2
10.3
10.4
Impedance (|Z|)
(Measurement Terminal)
DC Resistance (Rdc)
(Measurement Terminal)
Insulation Resistance (I.R.)
(Measurement Terminal)
Withstanding Voltage
Terminal
Terminal
Terminal
(Measurement Terminal)
Humidity Load (Supply Terminal)
Heat Life (Supply Terminal)
10.5
10.6
11. Impedance Frequency Characteristics (Typical)
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 5/10
12. Specification of Packaging
12.1 Appearance and Dimensions
12.2 Specification of Taping
(1) Packing quantity (Standard quantity)
φ
180 mm reel : 1000 pcs. / reel
φ
330 mm reel : 3500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
and are not continuous.The specified quantity per reel is kept.
12.3 Pull Strength of Plastic Tape
Plastic Tape
Cover Tape
5 N min.
10 N min.
165 to 180 degree
12.4 Peeling off force of Cover Tape
F
Cover tape
Plastic tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
12.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (
φ
180mm reel) »
Trailer
160 min.
Leader
2.0±0.5
210 min.
Cover tape
190 min.
Empty Tape
Label
13.0±0.2
21.0±0.8
1
60±
0
1
0
13±
Direction of feed
17±1.4
0
3
180±
(in mm)
« Packaging Code : K (
φ
330mm reel) »
Trailer
Leader
2.0±0.5
160 min.
190 min.
Empty Tape
210 min.
Cover tape
Label
13.0±0.5
50 min.
21.0±0.8
2.0±0.5
14±1.5
Direction of feed
330±2.0
(in mm)
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 6/10
12.6 Marking for reel
Customer part number
,
MURATA part number, Inspection number(
1), RoHS Marking(
2), Quantity, etc
1) « Expression of Inspection No. »
□□
OOOO
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O,N,D
Third, Fourth digit : Day
(3)
Serial No.
2) « Expression of RoHS Marking»
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
12.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking(
2), Quantity, etc
12.8 Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel
Quantity in
Outer Case
(Reel)
Reel
Label
W
D
H
H
186
340
186
340
93
85
φ
180mm
φ
330mm
4
4
D
W
Above Outer Case size is typical. It depends on a quantity of an order.
!
13.
13.1 Mounting Direction
Mount products in right direction.
△
Caution
Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames
or other serious trouble.
Z
Z
right direction
wrong direction
13.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property.
(1)Aircraft equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
(6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment
(9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
14. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
14.1 Flux and Solder
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
Flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 7/10
14.2 Assembling
< Exclusive use of Reflow soldering >
Flow soldering may cause deterioration in insulation resistance.
So,reflow soldering shall be applied for this product.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C max. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.
14.3 Cleaning Conditions
Do not clean after soldering. If cleaning, please contact us.
14.4 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please
pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
14.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［
Products direction
］
a
Products shall be location the sideways
b
direction (Length:a
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore
A > D is invalid.
Slit
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 8/10
Portion of
Perforation
14.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
×
•P.C.B. shall be designed so that products are
far from the portion of perforation.
P.C.B.
○
•The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case
of P.C.B. separation.
○
Product
Portion of
Perforation
×
•Products shall not be arranged on the
line of a series of holes when there
are big holes in P.C.B.
○
×
P.C.B.
(Because the stress concentrate on the
line of holes.)
Product
Hole
< Products Placing >
•Support pins shall be set under P.C.B.
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B..
Pic
k
–
u
p nozzle
Product
< P.C.B. Separation >
P.C.B.
•P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
Support pin
14.7 Standard Land Dimensions
②
①
*
①
②③④
indicates terminal number.
ꢀꢀꢀꢀ
Resist
Copper foil pattern
ꢀꢀꢀꢀ
ꢀꢀꢀꢀ
No pattern
(in mm)
③
④
0.8
2.5
5.6
14.8 Reflow Soldering
(1) Standard printing pattern of solder paste
・
Standard thickness of
solder paste
should be 150 to 200µm.
Solderability is subject to reflow condition
and thermal conductivity.
Please make sure that your product has been evaluated
in view of your specifications with our product being
mounted to your product.
・
Use the solder paste printing pattern of the
right pattern.
0.8
2.5
(in mm)
5.6
・
For the resist and copper foil pattern,
use standard land dimensions.
・
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
(2) Soldering Conditions
P 9/10
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(°C)
260°C
230°C
250±3°C
220°C
Limit Profile
180
150
Standard Profile
30
～
60s
60s max.
90s±30s
Time(s)
Standard Profile
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
250
±
3°C
Limit Profile
Pre-heating
Heating
above 230°C
、
60s max.
260°C, 10s
Peak temperature
Cycle of reflow
2 times
2 times
14.9 Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being mounted
by reflow soldering.
·
Pre-heating: 150°C, 1 min
·
Tip temperature: 350°C max.
ꞏ
Soldering iron output: 30W max.
ꞏ
Tip diameter:
φ
3mm max.
·
Soldering time : 3(+1,-0) seconds.
ꞏ
Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
14.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or
tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
14.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
14.12 Operating Environment
Do not use this product under the following environmental conditions,on deterioration of the performance,
such as inslation resistance may result from the use.
(1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent,may splash on the products.
MURATA MFG CO., LTD.
Reference Only
Spec No. JEFL243C-0040D-01
P 10/10
14.13 Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
ꞏ
Products should be stored in the warehouse on the following conditions.
Temperature
Humidity
:
:
-10 °C to +40 °C
15 % to 85% relative humidity
No rapid change on temperature and humidity.
ꞏ
Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderabirity due to the oxidized electrode.
ꞏ
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
ꞏ
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
ꞏ
Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
15.
△
Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD.
