Murata-Electronics-DLW5BTZ501TQ2L
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Reference Only
Spec. No. JEFL243C-9108D-01
P 1/10
Wire Wound Chip Common Mode Choke Coil
DLW5BT
Z
□□□
TQ2
□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW5BTZ_TQ Series for
Automotive Electronics based on AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex.)
DL
W
5B
T
Z
102
T
Q
2
L
(1)
(2) (3)
(4)
(5)
(6) (7)
(8) (9) (10)
(6) Impedance (Typ. at 100MHz)
(7) Circuit
(8) Features
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L
×
W)
(4) Type
(9) Number of Line
(10) Packaging Code
L : Taping (
φ
180mm/reel)
K : Taping (
φ
330mm/reel)
B : Bulk
(5) Category
3.Rating
Impedance
at 10MHz,
Under Standard
T
e
sting Conditions
(
Ω
min.)
Impedance
at 100MHz,
Under Standard
T
e
sting Conditions
(
Ω
T
yp.)
DC
Resistance
(Rdc)
Rated
Withstanding
Rated
Insulation
Resistance
Rank
(M
Ω
min.)
2.2
kV
ESD
Customer
Part Number
MURATA
Part Number
Voltage
V(DC)
Voltage
V(DC)
Current
(A)
(
Ω
max.)
DLW5BT
Z
101TQ2L
DLW5BT
Z
101TQ2K
DLW5BT
Z
101TQ2B
DLW5BT
Z
251TQ2L
DLW5BT
Z
251TQ2K
DLW5BT
Z
251TQ2B
DLW5BT
Z
501TQ2L
DLW5BT
Z
501TQ2K
DLW5BT
Z
501TQ2B
DLW5BT
Z
102TQ2L
DLW5BT
Z
102TQ2K
DLW5BT
Z
102TQ2B
DLW5BT
Z
142TQ2L
DLW5BT
Z
142TQ2K
DLW5BT
Z
142TQ2B
10
20
100
250
4
3
0.013
0.020
0.027
0.034
0.056
30
500
2.5
2
50
125
10
2
60
1000
1400
100
1.5
·
Operating Temperature :
– 40 °C to + 105 °C
·
Storage Temperature :
– 40 °C to + 105 °C
4. Standard Testing Conditions
< Unless otherwise specified >
< In case of doubt >
Temperature : Ordinary Temp. 15 ºC to 35 °C
Humidity : Ordinary Humidity
25 %(RH) to 85 %(RH)
Temperature : 20 °C ± 2 °C
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86 kPa to 106 kPa
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 2/10
5. Style and Dimensions
0.5±0.3
(TOP)
3.0±0.5
■
Unit Mass (Typical value)
0.5
min.
3.6±0.3
0.21g
(L)5.0±0.3
(W)5.0±0.3
①
②
Equivalent Circuites
■
①
②
M
arking
:
:
Electrode
④
③
（
in: mm
）
③
④
1.3
±0.3
1.3
±0.3
No polarity
0.9
±0.3
6. Marking
Top of the tape
・
Tape
Sprocket Hole
marking
DLW5BT
7. Electrical Performance
No.
7.1
Item
Specifications
Meet item 3.
Test Method
Impedance
(|Z|) (at 10MHz)
Measuring Equipment : KEYSIGHT 4191A or the
equivalents.
Measuring Frequency : 10MHz
(ref. Item 9.)
7.2
7.3
7.4
Insulation
Resistance
(I.R.)
Measuring Equipment : R8340A or the equivalents.
Measuring voltage : Rated Voltage
Time : within 60 s
(ref. Item 9.)
DC Resistance
(Rdc)
Measuring Current : 100 mA max.
(ref. Item 9.)
(In case of doubt in the above mentioned standard
condition,measure by 4 terminal method.)
Test Voltage :
2.5 times for Rated Voltage
Time :
1 to 5 seconds
Withstanding
Voltage
Products shall not be damaged.
Charge Current : 1 mA max.
(ref. Item 9.)
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 3/10
8. Q200 Requirement
7-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
No.
3
Stress
Test Method
High
1000hours at 105 deg C
Meet Table A after testing.
Temperature
Exposure
Set for 24hours at room temperature,
Table A
then measured.
Appearance
No damaged.
within ± 20%
Impedance
change
(at 10MHz)
I.R.
10M
Ω
min.
Withstanding
Voltage
No damaged.
4
Temperature Cycling
1000cycles
Meet Table A after testing.
-40 deg C to +105 deg C
Set for 24hours at room temperature,
then measured.
5
7
Destructive
Physical Analysis
Per EIA469
Not Applicable
No electrical tests
Biased Humidity
1000hours at 85 deg C, 85%RH
Apply max rated voltage and current.
Meet Table A after testing.
Apply rated voltage.
(ref.item 9)
(ref.item 9)
8
Operational Life
Apply 105 deg C
Meet Table A after testing.
Apply rated current.
1000hours
Set for 24hours at room temperature,
then measured
9
External Visual
Visual inspection
No abnormalities
No defects
10 Physical
Dimension
Meet ITEM 5
（
Style and Dimensions
）
12 Resistance
to
Solvents
Per MIL-STD-202 Method 215
Not Applicable
13 Mechanical
Shock
Per MIL-STD-202 Method 213
Conditon F:
Meet Table A after testing.
1500g’s(14.7N)/0.5ms/
Half sine
14 Vibration
5g’s(0.049N) for 20 minutes, 12cycles
Meet Table A after testing.
each of 3 oritentations
Test from 10-2000Hz.
12cycles each of 3 orientations
15 Resistance
No-heating
Pre-heating
：
150 to 180C / 90
±
30s
to Soldering Heat
Solder temperature
260C+/-5 deg C
Immersion time 10s
Per AEC-Q200-002
Meet Table A after testing.
17 ESD
Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating.
Method b : Not Applicable
18 Solderbility
Per J-STD-002
90% of the terminations is to be soldered.
(
except partly-exposed wire)
Flux:Ethanol solution of rosin,25(wt)% includes activator
equivalent to 0.06 to 0.10(wt)% chlorine
No defects
19 Electrical
Measured :
Impedance
Characterization
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 4/10
AEC-Q200
Murata Specification / Deviation
No.
Stress
Test Method
20 Flammability
21 Board
Flex
Per UL-94
Not Applicable
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60 sec minimum holding time
Per AEC-Q200-006
A force of 17.7N
Meet Table A after testing.
30 sec minimum holding time
22 Terminal
Strength
No defects
for 60sec
30 Electrical
Transient
Per ISO-7637-2
Not Applicable
Conduction
9. Terminal to be Tested
When measuring and
supplying
the voltage, the following terminal is applied.
Item Terminal
to be Tested
No.
9.1
9.2
9.3
9.4
9.5
9.6
Impedance (|Z|)
(Measurement Terminal)
DC Resistance (Rdc)
(Measurement Terminal)
Insulation Resistance (I.R.)
(Measurement Terminal)
Withstanding Voltage
(Measurement Terminal)
Biased Humidity
(Supply Terminal)
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Operational Life
(Supply Terminal)
10. Impedance Frequency Characteristics (Typical)
11. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 14 except the case of being specified special condition.
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 5/10
12. Specification of Packaging
12.1. Appearance and Dimensions
0.1
4.0±0.1
2.0±0.05
1.5
＋
φ
0
－
0.4±0.05
*Dimension of the Cavity is measured
at the bottom side.
5.5±0.1
2.7±0.1
8.0±0.1
Direction of feed
(in mm)
12.2. Specification of Taping
(1) Packing quantity (Standard quantity)
φ
180 mm reel : 700 pcs. / reel
φ
330 mm reel :2500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous.The specified quantity per reel is kept.
12.3. Pull Strength of Plastic Tape
Plastic Tape
Cover Tape
5 N min.
10 N min.
165 to 180 degree
12.4. Peeling off force of Cover Tape
F
Cover tape
Plastic tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
12.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (
φ
180mm reel) »
Trailer
Leader
2.0±0.5
160 min.
210 min.
Cover tape
190 min.
Empty Tape
Label
13.0±0.2
21.0±0.8
φ
φ
1
60±
φ
0
1
0
13±
Direction of feed
17±1.4
0
3
180±
φ
(in mm)
« Packaging Code : K (
φ
330mm reel) »
Trailer
2.0±0.5
Leader
160 min.
190 min.
Empty Tape
210 min.
Cover tape
Label
13.0±0.5
φ
φ
50 min.
2.0±0.5
φ
21.0±0.8
Direction of feed
φ
330±2.0
(in mm)
14±1.5
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 6/10
12.6 Marking for reel
Customer part number
,
MURATA part number, Inspection number(
∗
1), RoHS marking(
∗
2), Quantity, etc
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O,N,D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
12.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (
∗
2), Quantity, etc
12.8 Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel
Quantity in
Outer Case
(Reel)
Reel
W
D
H
Label
186
340
186
340
93
85
φ
180mm
φ
330mm
4
4
H
D
W
∗
Above Outer Case size is typical. It depends on a quantity of an order.
!
13.
13.1. Mounting Direction
Mount products in right direction.
△
Caution
Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames
or other serious trouble.
Z
Z
right direction
wrong direction
13.2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability requirements
to the applications listed in the above.
13.3 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
13.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 7/10
14.Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
14.1. Flux and Solder
Use rosin-based flux
,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
Flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
14.2. Assembling
< Exclusive use of Reflow soldering >
Flow soldering may cause deterioration in insulation resistance.
So,reflow soldering shall be applied for this product.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C max. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.
14.3. Cleaning Conditions
Do not clean after soldering. If cleaning, please contact us.
14.4. Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
14.5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［
Products direction
］
a
Products shall be location the sideways
b
direction (Length:a
<
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 8/10
(2)
Component
s location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting
Component
s Near Screw Holes
When a
component
is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the
component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
Portion of
Perforation
14.6. Attention Regarding P.C.B. Design
< The Arrangement of Products >
×
•P.C.B. shall be designed so that products are
far from the portion of perforation.
P.C.B.
○
•The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case
of P.C.B. separation.
○
Product
Portion of
Perforation
×
•Products shall not be arranged on the
line of a series of holes when there
are big holes in P.C.B.
○
×
P.C.B.
(Because the stress concentrate on the
line of holes.)
Product
Hole
< Products Placing >
•Support pins shall be set under P.C.B.
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B..
Pic
k
–
u
p nozzle
Product
< P.C.B. Separation >
P.C.B.
•P.C.B. shall not be separated with hand.
Support pin
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 9/10
14.7. Standard Land Dimensions
②
①
indicates terminal number
*
①②③④
.
Resist
Copper foil pattern
No pattern
③
④
0.9
2.9
5.5
(in mm)
14.8. Reflow Soldering
(1) Standard printing pattern of solder paste
・
Standard thickness of
solder paste
should be 150 to 200µm.
Solderability is subject to reflow condition
and thermal conductivity.
Please make sure that your product has been evaluated
in view of your specifications with our product being
mounted to your product.
・
Use the solder paste printing pattern of the
right pattern.
0.9
2.9
5.5
(in mm)
・
For the resist and copper foil pattern,
use standard land dimensions.
・
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃
230℃
250±3℃
220℃
Limit Profile
180
150
Standard Profile
30～60s
60s max.
90s±30s
Time（ｓ）
Standard Profile
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
250
±
3°C
Limit Profile
Pre-heating
Heating
above 230°C
、
60s max.
260°C, 10s
Peak temperature
Cycle of reflow
2 times
2 times
MURATA MFG CO., LTD.
Reference Only
Spec. No. JEFL243C-9108D-01
P 10/10
14.9. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being mounted
by reflow soldering.
·
Pre-heating: 150°C, 1 min
· Soldering iron output: 30W max.
·
Tip temperature: 350°C max.
· Tip diameter:
φ
3mm max.
·
Soldering time : 3(+1,-0) seconds.
· Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
14.10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
14.11. Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
14.12. Operating Environment
Do not use this product under the following environmental conditions,on deterioration of the performance,
such as inslation resistance may result from the use.
(1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent,may splash on the products.
14.13. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·
Products should be stored in the warehouse on the following conditions.
Temperature
Humidity
:
:
-10 °C to +40 °C
15 % to
85% relative humidity
No rapid change on temperature and humidity.
·
Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderabirity due to the oxidized electrode.
·
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·
Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
15
.
△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD.
