Murata-Electronics-NFE61PT101Z1H9L
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Reference Only
Spec. No. JENF243E-0003Q-01
P 1 / 8
Chip EMIFIL ® LC Combined Type for Large Current
NFE61PT
□□□□
1H9
□
Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL ® LC Combined Type for Large Current NFE61P Series.
2. Part Numbering
NF
E
61
PT
101
Z
1H
9
L
Product ID
Structure Dimension
Features Capacitance
Characteristics Rated
Voltage
Electrode Packaging
Code
(L
W)
(L:
T
a
ping / B: Bulk)
3. Rating
Customer
Part Number
Rated
Voltage
Withstanding
Voltage
Rated
Current Resistance
Insulation
Murata
Part Number
Capacitance
33pF ± 30%
68pF ± 30%
100pF ± 30%
180pF ± 30%
360pF ± 20%
NFE61PT330B1H9L
NFE61PT330B1H9B
NFE61PT680B1H9L
NFE61PT680B1H9B
NFE61PT101Z1H9L
NFE61PT101Z1H9B
NFE61PT181B1H9L
NFE61PT181B1H9B
NFE61PT361B1H9L
NFE61PT361B1H9B
NFE61PT681B1H9L
NFE61PT681B1H9B
NFE61PT102E1H9L
NFE61PT102E1H9B
NFE61PT472C1H9L
NFE61PT472C1H9B
1000 M
min.
50 V(DC)
125 V(DC)
2 A(DC)
680pF ± 30%
８０
1000pF ±
4700pF ±
%
２０
８０
２０
%
Operating
T
e
mperature : – 40 °C to + 85 °C
Storage
T
e
mperature : – 55 °C to + 125 °C
4. Standard Testing Condition
<Unless otherwise specified>
<In case of doubt>
T
e
mperature: Ordinary
T
e
mp. 15°C to 35°C
T
e
mperature: 20°C ± 2°C
Humidity: Ordinary Humidity
25 %(RH) to 85 %(RH)
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86kPa to 106kPa
5. Style and Dimensions
Equivalent Circuit
0.7±0.2
0.7±0.2
(3)
2.6±0.3
(2)
Output
(3)
Input
(1)
(1)
GND
(2)
(1),(3):No Polarity
1.6±0.3
6.8±0.5
■
Unit Mass (Typical value)
(in mm)
0.062g
Note : Gap and bend between ceramic capacitor(
) and ferrite bead(
1) may come out as illustrated below, however,
these are not affect the performance, mounting and reliability of the products.
0.5 max.
1
1
0.1 max.
(in mm)
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003Q-01
P 2 / 8
■
Insertion Loss Characteristics (I.L.) (Typ.)
6. Marking
No marking.
7. Electrical Performance
No. Item
Specification
T
e
st Method
T
a
ble 1
7.1 Capacitance
Meet item 3.
Capacitance
33,68,100 (pF)
180,360,680
1000 (pF)
Voltage
1 to 5 V(rms)
Frequency
1MHz±10%
1kHz±10%
1kHz±10%
1±0.2 V(rms)
4700 (pF)
0.1 max.V(rms)
7.2 Insulation
Resistance(I.R.)
7.3 Withstanding
Voltage
Meet item 3.
Voltage : 50 V(DC)
Time : 60 ± 5 seconds
Products shall not be damaged.
T
e
st Voltage : 125 V(DC)
T
e
sting Time : 1 to 5 seconds
Limit the charging current: 10mA max.
8. Mechanical Performance
No. Item
Specification
T
e
st Method
8.1 Appearance
and Meet
item 5.
Dimensions
Visual Inspection and measured with Slide
Calipers
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
8.2 Solderability
The electrodes shall be at least 75%
covered with new solder coating.
Solder
T
e
mperature : 240 ± 3 °C
Immersion Time : 3 ± 1 s
Immersion and emersion rates : 25mm / s
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150 ± 10 °C, 60 ~ 90 s
Solder : Sn-3.0Ag-0.5Cu
Solder
T
e
mperature : 270 ± 5 °C
Immersion Time : 10 ± 1 s
Immersion and emersion rates : 25mm / s
Then measured after exposure the room
condition for 4 to 48 hours.
8.3 Resistance
to
soldering heat
Meet
T
a
ble 2.
T
a
ble 2
Appearance
No damaged
33,68,100
Within
±15%
180,360
680 (pF)
1000
Cap. Change
Within
±30%
4700(pF)
I.R.
1000 M
min.
Withstanding
Voltage
No damaged
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003Q-01
P 3 / 8
No.
Item
Specification
T
e
st Method
8.4 Bending
Strength
Meet
T
a
ble 2.
T
a
ble 2
It shall be soldered on the paper-phenol
substrate. (t=1.6mm)
Pressure jig
Appearance
No damaged
33,68,100
R340
F
Within
±15%
180,360
680 (pF)
1000
Deflection
(in mm)
Cap. Change
Within
±30%
45
45
Product
4700(pF)
Deflection : 3 mm
Keeping Time : 30 seconds
9. Environment Performance
(It shall be soldered on the substrate.)
No. Item
Specification
T
e
st Method
T
e
mperature : 40 ± 2 °C
Humidity :
90 to 95 %(RH)
Time : 500 h (+ 24 h , – 0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
9.1 Humidity
Meet
T
a
ble 4.
T
a
ble 4
Appearance
No damaged
33,68,100
180,360
680 (pF)
1000
Within
±15%
T
e
mperature : 85 ± 2 °C
T
e
st Voltage :
33,68,100,180,360,680 (pF) :
9.2 Heat
Life
Cap. Change
Within
±30%
4700 (pF)
Rated Voltage
200%
: Rated Voltage
150%
I.R.
100 M
min.
1000,4700 (pF)
Time : 1000 h (+ 48h , – 0h)
Then measured after exposure in the room
condition for 4 to 48 hours.
Withstanding
Voltage
No damaged
9.3
T
e
mperature Meet
T
a
ble 2.
Cycling
1 Cycle
1step : – 55°C (+ 0°C, – 3°C) / 30±3 min
2step : Room
T
e
mperature / within 5 min
3step : +125°C (+ 3°C, – 0°C) / 30±3 min
4step : Room
T
e
mperature / within 5 min
T
o
tal of 10 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
10. Specification of Packaging
10.1. Appearance and Dimensions (12mm-wide plastic tape)
+0.1
-0
Embossed Cavity
0.3±0.1
1.5
Sprocket Hole
Dimension of the Cavity is
measured at the bottom side.
4.0±0.1
4.0±0.1
2.0±0.05
1.9±0.1
1.75±0.1
(in mm)
Direction of feed
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003Q-01
P 4 / 8
10.2. Specification of
T
a
ping
(1) Packing quantity (standard quantity)
2500 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)
Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic
T
a
pe and Cover
T
a
pe
Plastic tape
5N min.
10N min.
Cover tape
165° ~ 180°
Cover Tape
Plastic Tape
F
10.4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
Empty tape
210 min.
Label
Cover tape
13.0±0.2
60
±
1
0
21.0±0.8
Direction of feed
13±
1
0
17±1.4
180
±
0
3
(in: mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(
1) , RoHS marking(
2) , Quantity , etc
1) « Expression of Inspection No. »
□□
OOOO
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
:
Y
e
ar
/ Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O,N,D
Third, Fourth digit : Day
(3)
Serial No.
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (
2) , Quantity , etc
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003Q-01
10.8. Specification of Outer Case
P 5 / 8
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(Reel)
(mm)
D
H
W
H
186
186
93
4
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
(a) Standard land dimensions for reflow
(b) Standard land dimensions for flow
･
Side on which chips are mounted
･
Side on which chips are mounted
Small diameter thru hole
0.4
Small diameter thru hole
0.4
1.5
3.8
4.8
9.0
2.0
4.8
8.8
Resist
Copper foil pattern
No pattern
Resist
Copper foil pattern
No pattern
(in mm)
12.
!
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
(6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment
(9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Solder
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way
that the temperature difference is limited to 100°C max.
<Consideration for mounting of 2.5mm pitch>
The mounting of 2.5mm pitch should be prevented on flow soldering to avoid an excess of solder volume.
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003Q-01
P 6 / 8
13.3. Attention Regarding
P
.
C.B. Bending
The following shall be considered when designing
P
.
C.B.’s and laying out products.
(1)
P
.
C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
〔
Products direction
〕
a
Products shall be located in the sideways
b
direction (Length:a
b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on
P
.
C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully so
that products are not subject to the
C
Seam
B
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
C
B
D.
D
A
a
b
Slit
Lengh:a<b
13.4. Standard Soldering Conditions
On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, solder
temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the
electrode.
On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, preheat
and so on because de-wetting may be caused.
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
< Flow Soldering Profile >
Temp.
°C
(
)
265°C±3°C
250°C
Limit Profile
150
Heating Time
Standard Profile
Time.(s)
60s min.
Standard Profile
150°C , 60s min.
250°C , 4s ~ 6s
2 times
Limit Profile
Pre-heating
Heating
Cycle of flow
265°C ± 3°C , 5s max.
2 times
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003Q-01
< Reflow Soldering Profile >
P 7 / 8
Temp.
(°C)
260°C
245°C±3°C
220°C
230°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
Peak temperature
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
above 230°C , 60s max.
260°C , 10s
Cycle of reflow
2 times
2 times
13.5. Printing of Adhesive (Flow Soldering)
Adhesive amount shall be about 0.5mg for one position to obtain enough adhesive strength.
The adhesive position is as follows.
1.5
4.8
Adhesive
9.0
Position of adhesive
(in mm)
13.6. Solder paste printing for reflow
· Standard thickness of the solder paste should be
150
m to 200µm.
Standard printing pattern of solder paste.
· Use the solder paste printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard
land dimensions.
1.5
4.8
8.8
(in mm)
13.7. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min
Tip temperature : 350°C max.
Soldering time : 3(+1,-0) s
Soldering iron output : 30W max.
Tip diameter :
φ
3mm max.
Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
13.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and
P
.
C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
MURATA MFG. CO., LTD.
Reference Only
Spec. No. JENF243E-0003Q-01
P 8 / 8
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
13.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.10. Resin coating
It may affect on the product’s performance when using resin for coating / molding products. So please pay your
careful attention when you select resin. In prior to use, please make the reliability evaluation with the product
mounted in your application set.
13.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
13.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
·
Products should be stored in the warehouse on the following conditions.
T
e
mperature
Humidity
:
– 10 °C to + 40 °C
:
15 % to 85% relative humidity
No rapid change on temperature and humidity
·
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
·
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
! Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2)
Y
o
u are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG. CO., LTD.
