Murata-Electronics-NFG0QHB542HS2D
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Reference Only
Spec No. JEFL243D-0012-01
P1/11
Common Mode Noise Filter
NFG0QHB
☐☐☐
HS2
□
Reference Specification
1. Scope
This reference specification applies to Common Mode Noise Filter NFG0QHB
□□□
HS2
□
Series for differential
signal interface in Electronics.
2. Part Numbering
(Ex.)
NF
G
0Q
HB
242
H
S
2
D
Product Type Dimension
Application
*Resonant Performance Category
Number
frequency of
line
Packaging
D: taping
*B: bulk
ID
(L × W)
and
characteristic
*Resonant frequency (MHz)
The first and second figures are significant digits, and the third figure expresses the number of zeros
that follow the two figures.
*B: Bulk packing is also available.
3. Part Number and Rating
Operating temperature range
Storage temperature range
-40°C to +85°C
-40°C to +85°C
Common Mode
Impedance
(
Ω
)
at 100MHz
Typ.
Withstanding
Voltage
Rated
Voltage
(VDC)
Rated
Current
(mA)
DC
Insulation
Resistance Resistance
Customer
Part Number
MURATA
Part Number
(VDC)
(
Ω
)
(M
Ω
min.)
NFG0QHB242HS2D
NFG0QHB372HS2D
NFG0QHB542HS2D
15
9
5
5
5
12.5
12.5
12.5
100
100
100
2.5±25%
1.9±25%
1.3±25%
100
100
100
5
Common Mode
Insertion Loss Characteristic
(dB) Typ.
Cut off Frequency
MURATA
Part Number
(GHz)
Typ.
2.4
3.7
5.4
GHz
GHz
GHz
NFG0QHB242HS2D
NFG0QHB372HS2D
NFG0QHB542HS2D
33
–
–
30
–
–
–
8
11
18
–
27
4. Testing Conditions
Unless otherwise specified
T
e
mperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
T
e
mperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P2/11
5.Style and Dimensions
■
Equivalent Circuits
■
Unit Mass(Typical value)
0.0003g
6. Marking
No marking.
7. Electrical Performance
No.
7.1
Item
Specification
T
e
st Method
Measuring Frequency : 100±1MHz
Measuring Equipment : KEYSIGHT4991A or the equivalents
(In case of doubt in standard condition, the heat
treatment(200°C, about 10 minutes)shall be applied.
(ref.item 16.)
Common Mode
Meet item 3.
Impedance
Withstanding
Voltage
Products shall not be damaged.
T
e
st Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 s
7.2
Charge Current : 1 mA max.
(ref.item 16.)
DC Resistance
Meet item 3.
Meet item 3.
Measuring current : 20mA max.
(ref.item 16.)
Measuring voltage : Rated Voltage
Measuring time : 3 s max.
7.3
7.4
Insulation
Resistance
(ref.item 16.)
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P3/11
8.Mechanical Performance
No.
Item
Specification
T
e
st Method
8.1 Bonding
Strength Products
shall not be damaged
after tested as test method.
It shall be soldered on the 6 Layer substrate (t0.8mm).
Applying Force: 2N
Applying Time : 5s
Bending Strenght
8.2
Products shall not be damaged
after tested as test method.
It shall be soldered on the 6 Layer substrate (t0.8mm).
T
e
st substrate: glass-epoxy substrate (100 mm × 40 mm ×
0.8 mm)
Speed of Applying Force : 1.0mm/s
Deflection : 2mm
Pressure jig
Keeping Time : 20s
R230
F
Deflection
Product
45
45
Appearance: No damage
8.3 Vibration
It shall be soldered on the 6 Layer substrate (t0.8mm).
Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20min
T
o
tal amplitude 3.0mm or Acceleration
amplitude 196 m/s2 whichever is smaller.
T
e
sting Time : A period of 2h in each of 3 mutually
perpendicular directions.(
T
o
tal 6h)
The electrodes shall be at least 95%
covered with new solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 60s
8.4 Solderability
Solder : Sn-3.0Ag-0.5Cu
Solder
T
e
mperature : 245°C±3°C
Immersion Time : 3s
9.Environmental Performance
It shall be soldered on the 6 Layer substrate (t0.8mm).
T
e
st shall be done using
P
.
C.B., Flux, Solder and Soldering condition which are specified in item 12 except the case
of being specified special condition.
No.
Item
Specification
T
e
st Method
T
e
mperature : 85°C±2°C
9.1 Heat
Life
Meet
T
a
ble 1.
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
(ref.item 16.)
T
e
mperature : -40°C±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
T
e
mperature : 40°C±2°C
T
a
ble 1
Appearance
Common Mode
Impedance
Change
No damaged
Within
±
20%
9.2 Cold
Resistance
9.3 Humidity
100M
Ω
min.
Within
±
30%
I.R.
DC Resistance
Change
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
T
e
mperature
Cycle
1 cycle :
9.4
1 step : -40
°
C(+0
°
C,-3
°
C) /30min(+3min,-0min)
2 step : Ordinary temp. / 3 min max.
3 step : +85
°
C(+3
°
C,-0
°
C) / 30min(+3min,-0min)
4 step : Ordinary temp. / 3 min max.
T
o
tal of 100 cycles
Then measured after exposure in the room
condition for 4 to 48 h.
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P4/11
10.Specification of Packaging
10.1 Appearance
and Dimensions ( 8mm-wide, 2mm pitch paper tape)
10.2 Taping specifications
Packing quantity
15000 pcs/reel
(Standard quantity)
Packing method
The products are placed in embossed cavities of a base tape and sealed by a cover tape.
Feed hole position
The feed holes on the base tape are on the right side when the cover tape is pulled toward the
user.
Joint
Number of missing
Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater,
products and
are not continuous. The specified quantity per reel is kept.
The base tape and the cover tape are seamless.
10.3 Break down force of tape
Break down force of cover tape
5 N min.
10.4 Peeling off force of cover tape
Speed of peeling off
300 mm/min
Peeling off force
0.1 N to 0.7 N (The lower limit is for typical value.)
Cover tape
F
165 to
180
°
゜
Base tape
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
10.5 Dimensions of leader section, trailer section and reel
P5/11
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape. (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.:
(1) Factory code
□□
(1)
○○○○
(2)
(2) Date
First digit: year/last digit of year
(3)
Second digit: month/Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking:
(1) RoHS regulation conformity
ROHS-
Y
(
)
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
Standard reel quantity
(mm)
Label
in outer box (reel)
W
D
H
H
186
186
93
5
D
* Above outer box size is typical. It depends on a
quantity of an order.
W
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P6/11
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Disaster/crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
11.2 Precautions on rating
Do not use over the rated temperature range, rated voltage, or rated current.
If used beyond the rating, serious defects such as wire breakage and burnout may occur.
11.3 Mounting Direction
Mount products in right direction.
Wrong direction which is 90
°
rotated from right direction causes not only open or short circuit but also flames or other
serious trouble.
Ｚ
Ｚ
right direction
wrong direction
12. Precautions for Use
This product is designed for solder mounting. (reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 80
μ
m
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P7/11
100°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C
max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(
℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.
(
s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
Above 220°C/30 s to 60 s
245°C±3°C
150°C to 180°C/90 s±30 s
Above 230°C/60 s max.
260°C/10 s
Heating
Peak temperature
Number of reflow cycles
2 times
2 times
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
150°C/approx. 1 min
380°C max.
Pre-heating
Tip temperature of soldering iron
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
30 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
Number of reworking operations
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal
shock.
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure
of mechanical or electrical performance.
12.6 Product’s location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P8/11
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
Poor example
〈
〉
Good example
〈
〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to
reduce stress.
Contents of measures
Stress level
A > D
*1
A > B
(1) Turn the mounting direction of the component parallel to the
board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the
substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
When cleaning this product, observe the following conditions:
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P9/11
40°C max.
(2) During ultrasonic cleaning, under some cleaning conditions, the resonation of PCB should be caused by its vibration.
Be sure to do the test cleaning with actual cleaning equipment before production and confirm that product does not be
damaged by cleaning.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor
solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moistureproof coating)
Coating/molding the product with resin may change electrical characteristics.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of conductor, leading to wire breakage.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Mounting Conditions
・
Please check the mounting condition before using.
・
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products
may lead to pick up errors, misalignment, or damage to the product.
12.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P10/11
13.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243D-0012-01
P11/11
14. Appendix
<Measurement method>
al
MURATA MFG.CO., LTD
