Murata-Electronics-NFL18SP207X1A3D
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Reference Only
Spec. No. JENF243D-0003K-01
P1/ 8
Chip EMIFIL LC Combined Monolithic
NFL18SP
□□□
X1A3 Reference
Specification
□
1.
Scope
This reference specification applies to Chip EMIFIL LC Combined Monolithic Type NFL18SP Series.
2.
Part Numbering
NF
L
18
(L
×
W)
SP
157
X
1A
3
D
Product ID
Structure Dimension Features Cut-off
Frequency Characteristics Rated
Voltage Electrode Packaging
Code
(D :
T
a
ping / B : Bulk)
3. Rating
Customer
DC
Insulation
Cut-off
Frequency
[MHz]
Inductance
(L)
Rated
Voltage Current
[V(DC)] [mA(DC)]
Rated Withstanding
MURATA
Part Number
Capacitance
[pF]
Resistance Resistance
[
Ω
max.] [M
Ω
min.]
Voltage
[V(DC)]
Part Number
[nH]
NFL18SP157X1A3D
NFL18SP157X1A3B
NFL18SP207X1A3D
NFL18SP207X1A3B
NFL18SP307X1A3D
NFL18SP307X1A3B
NFL18SP507X1A3D
NFL18SP507X1A3B
150
200
300
500
34±20% 100±20%
24±20%
19±20%
11±20%
80±20%
60±20%
38±20%
3.0
1000
10
100
30
2.0
•
Operating
T
e
mperature : -55°C to +125°C (Includes self-heating.)
•
Storage
T
e
mperature
: -55°C to +125°C
4. Standard Testing Condition
< Unless otherwise specified >
< In case of doubt >
T
e
mperature : Ordinary
T
e
mp. / 15 °C to 35 °C
Humidity : Ordinary Humidity / 25 %(RH) to 85 %(RH)
T
e
mperature : 20 °C ± 2 °C
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86 kPa to 106 kPa
5. Style and Dimensions
0.4±0.1 0.3±0.1
■
Equivalent Circuits
0.3±0.1
0.8±0.1
Out put
(3)
Input
(1)
0.2min.
1.6±0.1
(2)
0.15±0.1
GND
(2)
No Polarity
※
(1)
(3)
:Electrode
(in mm)
■
Unit Mass (Typical value)
0.004g
(1)
(3)
(2)
0.15±0.1
■
Insertion Loss Characteristics (I.L.) (Typ.)
(50
Ω
system)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0003K-01
P2/ 8
6. Marking
No marking
7. Electrical Performance
No.
Item
Specification
T
e
st Method
7.1 Capacitance
(Cap.)
7.2 Inductance
(L)
7.3 DC
Resistance
(Rdc)
Meet item 3.
·
Frequency : 1±0.1MHz
·
Voltage : 1±0.2V(rms)
·
Frequency : 10±1MHz
·
Voltage : 1±0.2V(rms)
Measured with 10mA max.
Measured between terminal (1)-(3). (ref. Item5)
7.4 Insulation
Resistance(I.R.)
7.5 Withstanding
Voltage
·
Voltage : Rated Voltage
·
Time : 1 minutes max.
·
T
e
st Voltage : 30V(DC)
·
Time : 1 to 5 s
Products shall not be damaged.
Specification
·
Charge Current : 50 mA max.
8. Mechanical Performance
No.
Item
T
e
st Method
8.1 Appearance
and Meet
item 5.
Dimensions
Visual Inspection and measured with Slide
Calipers.
8.2 Solderability
Electrodes shall be at least 90%
covered with new solder coating.
·
Flux : Ethanol solution of rosin, 25(wt)%
·
Pre-heat : 150 ± 10°C, 60 to 90s
·
Solder : Sn-3.0Ag-0.5Cu
·
Solder
T
e
mperature : 240 ± 3°C
·
Immersion Time : 3±1 s
·
Immersion and emersion rates : 25mm / s
·
Flux : Ethanol solution of rosin, 25(wt)%
·
Pre-heat : 150 ± 10°C, 60 to 90s
·
Solder : Sn-3.0Ag-0.5Cu
·
Solder
T
e
mperature : 270 ± 5°C
·
Immersion Time : 10 ± 1 s
8.3 Resistance
to
soldering heat
Meet
T
a
ble 1.
T
a
ble 1
Appearance
Cap. Change
L Change
I.R.
No damaged
within ± 5%
within ± 5%
meet item 3
·
Immersion and emersion rates : 25mm / s
8.4 Bending
Strength
Meet
T
a
ble 2.
Table 2
It shall be soldered on the glass-epoxy substrate
(t = 1.0mm).
·
Deflection : 2.0 mm
·
Keeping Time : 30 s
Appearance
Cap. Change
No damaged
within ± 5%
Pressure jig
R230
F
Deflection
Product
45
45
(in mm)
8.5 Drop
Products shall be no failure after
tested.
It shall be dropped on concrete or steel board.
·
Method : Free fall
·
Height : 1m
·
Attitude from which the product is dropped
: 3 directions
·
The Number of Time : 3 times for each direction
(
T
o
tal 9 times)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0003K-01
No. Item
P3/ 8
Specification
T
e
st Method
8.6 Bonding
Strength
The electrodes shall be no failure after
It shall be soldered on the glass-epoxy substrate.
tested.
·
Applying Force (F) : 9.8 N
·
Applying Time : 30 s
0.5
1.2
0.4
1.6
(in mm)
8.7 Vibration
Meet
T
a
ble 1.
It shall be soldered on the glass-epoxy substrate.
·
Oscillation Frequency : 10 to 2000 to 10Hz for
20 minutes.
·
T
o
tal amplitude 1.5 mm or Acceleration amplitude
200m/s
2
whichever is smaller.
·
Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (
T
o
tal 6 hours)
9. Environment Performance
It shall be soldered on the glass-epoxy substrate.
No.
Item
Specification
Meet
T
a
ble 1.
T
e
st Method
9.1
T
e
mperature
Cycling
·
1 Cycle
1 step: -55 ±
0
3
°C / 30 ±
3
0
minutes
2 step: Room
T
e
mperature / 3 minutes within.
3 step: +125 ±
3
0
°C / 30 ±
3
0
minutes
4 step: Room
T
e
mperature / 3 minutes within.
·
T
o
tal of 10 cycles
·
Then measured after exposure in the room
condition for 24±2 hours.
9.2 Humidity
9.3 Heat
Life
·
T
e
mperature : 40 ± 2 °C
·
Humidity : 90 to 95%(RH)
·
Time : 500±
24
0
hours
·
Then measured after exposure in the room
condition for 24±2 hours.
·
T
e
mperature : 125 ± 2 °C
·
T
e
st Voltage : Rated Voltage
×
200%
·
Charge Current : 50 mA max.
·
Time : 1000 ±
48
0
hours
·
Then measured after exposure in the room
condition for 24±2 hours.
10. Specification of Packaging
10.1. Appearance and Dimensions (8mm-wide paper tape)
1.5±
0.1
φ
4.0±0.1
0
Sporocket Hole
2.0
±
0.05
4.0±0.1
2.0±0.1
0.9max.
1.05±0.1
Direction of feed
(in mm)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0003K-01
10.2. Specification of
T
a
ping
P4/ 8
(1) Packing quantity (standard quantity)
4000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and
T
o
p tape
The base tape and top tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not
continuous. The specified quantity per reel is kept.
10.3. Pull Strength of
T
o
p
T
a
pe and Bottom
T
a
pe
T
o
p tape
Bottom tape
5N min.
10.4. Peeling off force of top tape
Top tape
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
165 to 180 degree
Bottom tape
F
Base tape
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape
Top tape
13.0±0.2
φ
60
±
1
φ
0
21.0±0.8
φ
Direction of feed
9±
1
0
13±1.4
180
±
0
φ
3
(in mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(
∗
1) , RoHS marking(
∗
2) , Quantity , etc
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
Second digit
Third, Fourth digit : Day
:
Y
e
ar
/ Last digit of year
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (
∗
2) , Quantity , etc
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0003K-01
10.8. Specification of Outer Case
P5/ 8
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(Reel)
Label
(mm)
W
D
H
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an order.
W
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
< Standard land dimensions for reflow >
Small diameter thru hole
0.2 0.3
φ
～
•
Side on which chips are mounted
Resist
0.4
1.0
2.0
Copper foil pattern
No pattern
(in mm)
12.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0003K-01
P6/ 8
13.3. Attention Regarding
P
.
C.B. Bending
The following shall be considered when designing
P
.
C.B.’s and laying out products.
(1)
P
.
C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
Products shall be located in the sideways
b
direction (Length:a
b) to the mechanical stress.
<
Poor example
Good example
〉
〈
〉 〈
(2)
Components location on
P
.
C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
Stress Level
A
A
A
>
>
>
D *1
B
C
(3) Keep the mounting position of the component away from the board separation surface.
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.If a Cutting Disc is used, stress will be
diagonal to the PCB, therefore A > D is invalid.
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
13.4. Pre-heating
T
e
mperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
13.5. Reflow Soldering
1) Soldering paste printing for reflow
·
Standard thickness of solder paste: 100µm to 150µm.
·
Use the solder paste printing pattern of the right pattern.
·
For the resist and copper foil pattern, use standard land
dimensions.
•
Standard printing pattern of solder paste.
0.4
1.0
(in mm)
2.0
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0003K-01
2) Soldering Conditions
P7/ 8
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Temp.
(°C)
260°C
245°C±3°C
230°C
220°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
above 230°C , 60s max.
260°C , 10s
2 times
2 times
13.6. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
•
Pre-heating : 150°C, 1 min
•
Tip temperature : 350°C max.
•
Soldering time : 3(+1,-0) s
•
Soldering iron output : 30W max.
•
Tip diameter :
φ
3mm max.
•
Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
13.7. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T
≤
t
≤
T(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
13.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and
P
.
C.B.
Power: 20W / l max.
Frequency: 28kHz to 40kHz
Time: 5 minutes max.
(3) Cleaner
1. Cleaner
·
Isopropyl alcohol (IPA)
2. Aqueous agent
·
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243D-0003K-01
13.9. Operating Environment
P8/ 8
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
13.10. Resin coating
The capacitance and inductance value may change and/or it may affect on the product’s performance due to high cure-
stress of resin to be used for coating / molding products. So please pay your careful attention you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
13.11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
13.12. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be storage in the warehouse on the following conditions.
T
e
mperature: -10 to +40°C
Humidity: 15to 85% relative humidity
No rapid change on temperature and humidity
· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
!
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)
Y
o
u are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
