Murata-Electronics-NFW31SP307X1E4L

Reference Only  

Spec. No. JENF243E-0009J-01  

P1/ 10  

Chip EMIFIL for Signal Line  

NFW31SP

□□□

X1E4L  

Reference Specification  

1. Scope  

This reference specification applies to Chip EMIFIL for signal line NFW31S series.  

2. Part Numbering  

NF  

W

31  

SP  

106  

X

1E  

4

L

Product ID

 

Structure Dimension Features  

Cut-off  

Frequency  

Characteristics Rated  

Voltage  

Electrode Packaging

 

Code  

[L:

T

a

ping]  

(L

×

W)  

3. Rating  

3-1. Common Rating  

Rated Voltage  

25 V(DC)  

Withstanding Voltage  

Rated Current  

62.5 V(DC)  

200 mA  

Insulation Resistance  

Line Impedance  

1000 M

Ω

min.  

50

Ω  

3-2. Individual Rating  

∗

6dB max.  

Insertion Loss

 

(dB min.)  

100 150 200 300  

MHz MHz MHz MHz MHz MHz MHz MHz MHz GHz  

Customer  

Part Number  

MURATA  

Part Number  

10  

20  

50  

400  

500  

1

NFW31SP106X1E4L  

NFW31SP206X1E4L  

NFW31SP506X1E4L  

NFW31SP107X1E4L  

NFW31SP157X1E4L  

NFW31SP207X1E4L  

NFW31SP307X1E4L  

NFW31SP407X1E4L  

NFW31SP507X1E4L  

∗

–

–

–

–

–

–

–

–

5

∗

–

25  

5

∗

–

25  

25  

10  

∗

–

–

–

–

∗

–

–

–

–

25  

25  

30  

5

–

–

–

–

30  

30  

30  

20  

30  

10  

5

30  

30  

30  

30  

30  

30  

15  

10  

10  

–

–

–

–

–

–

–

–

–

10  

–

20  

–

–

–

–

∗

–

–

–

–

∗

–

–

–

–

–

–

∗

–

–

–

–

–

–

–

∗

•

Operating

T

e

mperature : -40 to +85 °C  

•

Storage

T

e

mperature : -55 to +85 °C  

4. Standard Testing Condition  

< Unless otherwise specified >  

<In case of doubt >  

T

e

mperature: Ordinary

T

e

mp 15 °C to 35 °C  

Humidity: Ordinary Humidity

 

25 %(RH) to 85 %(RH)  

T

e

mperature: 20 °C ± 2 °C  

Humidity: 60 %(RH) to 70 %(RH)  

Atmospheric pressure: 86 kPa to 106kPa  

5. Style and Dimensions  

■

Equivalent Circuit  

1.6±0.2  

2.3±0.2  

(1)  

(3)  

3.2±0.3  

(2)  

1.6±0.2  

(2)  

(1)  

(3)  

(1) Input (Output)

T

e

rminal  

(2) Ground

T

e

rminal  

(3) Output (Input)

T

e

rminal  

• No polarity.  

: Electrode  

■

Unit Mass(Typical value)  

0.7±0.3  

0.7±0.3  

(in mm)  

0.030g  

0.65±0.2  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

P2/ 10  

■

Insertion Loss Characteristics (I.L.) (Typ.)

 

(50

Ω

system)  

6. Marking  

No Marking  

7. Electrical Performance  

No. Item  

7.1 Insulation  

Resistance(I.R.)  

Specification  

Meet item 3.  

T

e

st Method  

DC rated voltage : 25 V  

(Between input (or output) terminal and ground  

terminal.)  

The charge time : 60 ± 5 seconds  

(Through the protect resistance of 1M

Ω)  

DC rated voltage : 62.5 V  

(Between input (or output) terminal  

and ground terminal.)  

T

e

sting Time : 1 to 5 seconds  

7.2 Withstanding  

Voltage  

No damage.  

Meet item 3.  

Limit the charging current: 10 mA max.  

Measured by the following circuit (Fig 1.

T

a

ble 1)  

7.3 Insertion

 

Loss  

Characteristics  

(I.L.)  

NETWORK ANALYZER  

)

OUTPUT(50  

Ω

R-

I

NPUT(50  

Ω

)

Ω

T-

I

NPUT(50

 

)  

∗

1

∗

1

∗

1

∗

1

(1)  

(2)  

∗

1 Connect to terminals  

of network analyzer  

T2  

T1  

Fig.1  

Network Analyzer:MS620J(ANRITSU) or the equivalent  

·

Table 1  

Cable, Connector and  

Measuring Condition  

Line  

Impedance  

Impedance of Cable : 50

Ω  

Impedance of connector : 50

Ω  

50

Ω  

·

I.L. shall be measured after  

connecting signal terminals T1,  

T2 to (1), (2) in Fig.1 respectively.  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

P3/ 10  

8. Mechanical Performance  

No.  

Item  

Specification  

T

e

st Method  

Visual Inspection and measured with Slide Calipers.  

8.1 Appearance

 

and  

Dimensions  

Meet item 5.  

8.2 Bonding  

Strength  

Products shall be no failure after

 

It shall be soldered on the substrate.  

tested.  

Applying Force(F) : 4.9 N  

Applying Time: 5 ± 1 s  

Pattern  

Products  

Products  

F

1.0  

0.6  

2.2  

Substrate  

(in mm)  

8.3 Solderability  

The electrodes shall be at least 90%

 

Flux : Ethanol solution of rosin,25 (wt)%  

covered with new solder coating.  

Pre-heat : 150 ± 10 °C, 60 to 90 s  

Solder : Sn-3.0Ag-0.5Cu  

Solder

T

e

mperature : 240 ± 3 °C  

Immersion Time : 3 ± 1 s  

Immersion and emersion rates : 25 mm / s  

8.4 Resistance

 

to  

soldering heat  

Meet

T

a

ble 2.  

Table 2  

Flux: Ethanol solution of rosin, 25(wt)%  

Pre-heat: 150 ± 10 °C, 60 to 90 s  

Solder: Sn-3.0Ag-0.5Cu  

Appearance  

Withstanding  

Voltage  

I.R.  

No damage.  

No damage.  

Solder

T

e

mperature: 270 ± 5 °C  

Immersion Time: 10 ± 1 seconds  

Immersion and emersion rates : 25 mm / s  

Then measured after exposure in the room  

condition for 4 to 48 hours.  

Meet item 3.  

I.L.  

Initial values : Then measured after heat treatment  

(150°C (+0°C,-10°C), 1 hour) and exposure in  

the room condition for 4 to 48 hours.  

It shall be soldered on the Glass-epoxy substrate.  

(100

×

40

×

1.6 (mm))  

8.5 Bending  

Strength  

Products shall be no failure after  

tested.  

Pressure jig  

R340  

F

Deflection  

Product  

45  

Deflection : 2.0 mm  

45  

(in mm)  

(for NFW31SP106/206 : 1.0 mm)  

Keeping Time : 10 seconds  

Speed of Applying Force : 1.0 mm / s  

8.6 Vibration  

Meet table 3.  

Table 3  

It shall be soldered on the substrate.  

Oscillation Frequency : 10 to 55 to 10Hz for  

1 minute  

Appearance  

Withstanding  

Voltage  

I.R.  

No damage  

No damage  

Double Amplitude : 1.5 mm  

T

e

sting Time : A period of 2 hours in each of 3  

Mutually perpendicular directions.  

(

T

o

tal 6 hours)  

100M

Ω

min.  

Meet item 3.  

I.L.  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

P4/ 10  

9. Environmental Performance

(It shall be soldered on the substrate.)  

No. Item

 

Specification  

Meet table 3.  

T

e

st Method  

9.1

T

e

mperature  

Cycle  

1 Cycle:  

1 step :  

°C (+ 0°C, – 3°C) / 30 minutes  

– 40  

2 step : Room

T

e

mperature / within 5 minutes  

3 step :

 

/ 30 minutes  

+85 °C (+ 3°C, – 0°C)  

4 step : Room

T

e

mperature / within 5 minutes  

T

o

tal of 10 cycles  

Then measured after exposure in the room condition  

for 4 to 48 hours.  

Initial values: Then measured after heat treatment  

(150°C (+0°C,-10°C), 1 hour) and exposure in the  

room condition for 4 to 48 hours.  

T

e

mperature : 40 ± 2 °C  

9.2 Humidity  

Humidity : 90 to 95 %(RH)  

Time : 1000 h (+ 48h , – 0h)  

Then measured after exposure in the room condition  

for 4 to 48 hours.  

9.3 Heat  

Resistance  

T

e

mperature : 85 ± 2 °C  

Time : 1000 h (+ 48h , – 0h)  

Then measured after exposure in the room condition  

for 4 to 48 hours.  

9.4 Cold  

Resistance  

T

e

mperature : -55 ± 2 °C  

Time : 500 h (+ 24h , – 0h)  

Then measured after exposure in the room condition  

for 4 to 48 hours.  

9.5 Humidity

 

Load  

T

e

mperature : 40 ± 2 °C  

Humidity : 90 to 95 %(RH)  

T

e

st Voltage : Rated Voltage  

Time : 500 h (+ 24h , – 0h)  

Then measured after exposure in the room condition  

for 4 to 48 hours.  

9.6 Heat

 

Life  

T

e

mperature : 85 ± 3 °C  

T

e

st Voltage : Rated Voltage

×

200%  

Time : 1000 h (+ 48h , – 0h)  

Charge Current: 10mA max.  

Then measured after exposure in the room condition  

for 4 to 48 hours.  

10. Specification of Packaging  

10.1. Appearance and Dimensions (8mm-wide plastic tape)  

+0.1  

1.5  

-0  

φ

0.2±0.1  

Dimension of the Cavity is  

measured at the bottom side.  

4.0±0.1  

4.0±0.1  

2.0±0.05  

1.9±0.2  

2.0±0.1  

Direction of feed  

(in mm)  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

10.2. Specification of

T

a

ping  

P5/ 10  

(1) Packing quantity (standard quantity)  

2000 pcs. / reel  

(2) Packing Method  

Products shall be packaged in the each embossed cavity of plastic tape and sealed with cover tape.  

(3) Sprocket Hole  

The sprocket holes are to the right as the tape is pulled toward the user.  

(4) Spliced point  

The cover tape has no spliced point  

(5) Missing components number  

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and  

are not continuous. The specified quantity per reel is kept.  

10.3. Pull Strength of Plastic

T

a

pe and Cover

T

a

pe  

Plastic

T

a

pe  

Cover

T

a

pe  

5N min.  

10N min.  

165 to 180 degree  

F

Cover tape  

Plastic tape  

10.4. Peeling off force of cover tape  

0.2 to 0.7N(minimum value is typical.)  

∗

Speed of peeling off : 300mm / minute  

10.5. Dimensions of Leader-tape , Trailer and Reel  

There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.  

Leader  

Trailer  

160 min.  

2.0±0.5  

190 min.  

210 min.  

Label  

Empty tape

 

Top tape  

φ

13.0±0.2  

φ

60±

1

0  

9±

1

0  

13±1.4  

φ

21.0±0.8  

Direction of feed  

φ

180

±

0

3  

(in: mm)  

10.6. Marking for reel  

Customer part number , MURATA part number , Inspection number(

∗

1) , RoHS marking(

∗

2) , Quantity , etc  

∗

1) « Expression of Inspection No. »  

□□

OOOO

×××  

(1)  

(2)  

(3)  

(1)

Factory Code  

(2)

Date  

First digit  

:

Y

e

ar

 

/ Last digit of year  

Second digit  

: Month / Jan. to Sep.

→

1 to 9, Oct. to Dec.

→

O, N, D  

Third, Fourth digit : Day  

(3)

Serial No.  

∗

2) « Expression of RoHS marking »  

ROHS – Y (

△

)  

(1) (2)  

(1)

RoHS regulation conformity parts.  

(2)

MURATA classification number  

10.7. Marking for Outside package (corrugated paper box)  

Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,  

RoHS marking (

∗

2) , Quantity , etc  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

10.8. Specification of Outer Case  

P6/ 10  

Outer Case Dimensions  

Label  

Standard Reel Quantity in Outer Case  

(Reel)  

(mm)  

H

W

D

H

186  

186  

93  

5

D

∗

Above Outer Case size is typical. It depends on a quantity of an order.  

W

11. Standard Land Dimensions  

The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.  

Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged  

according to the figure to reinforce the ground-pattern.  

(a) Standard land dimensions  

φ

Small diameter thru hole (

 

0.4)  

・

Side on which chips are mounted  

Resist  

0.6  

1.2  

2.2  

4.2  

Copper foil pattern  

No pattern  

(in mm)  

12.  

!

Caution  

Limitation of Applications  

Please contact us before using our products for the applications listed below which require especially high reliability for  

the prevention of defects which might directly cause damage to the third party’s life, body or property.  

(1)Aircraft equipment  

(2)Aerospace equipment  

(3)Undersea equipment

 

(4)Power plant control equipment  

(5)Medical equipment

 

(6)Transportation equipment (automobiles, trains, ships, etc.) (7)Traffic signal equipment  

(8)Disaster prevention / crime prevention equipment

 

(9)Data-processing equipment  

(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above  

13. Notice  

This product is designed for solder mounting.  

Please consult us in advance for applying other mounting method such as conductive adhesive.  

13.1. Flux and Solder  

Flux  

Use rosin-based flux, but not highly acidic flux (with chlorine content  

exceeding 0.2(wt) %).  

Do not use water-soluble flux.  

Solder  

Use Sn-3.0Ag-0.5Cu solder  

13.2. Note for Assembling  

< Thermal Shock >  

Pre-heating should be in such a way that the temperature difference between solder and products surface  

is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the  

temperature difference is limited to 100 °C max.  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

P7/ 10  

13.3. Attention Regarding

P

.

C.B. Bending  

The following shall be considered when designing

P

.

C.B.’s and laying out products.  

(1)

P

.

C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.  

〔

Products direction

〕  

a

Products shall be located in the sideways direction  

b

(Length: a < b) to the mechanical stress.  

Poor example  

〈

〉

Good example  

〈

〉

(2) Components location on

P

.

C.B. separation.  

It is effective to implement the following measures, to reduce stress in separating the board.  

It is best to implement all of the following three measures; however, implement as many measures as possible  

to reduce stress.  

Contents of Measures  

Stress Level  

(1) Turn the mounting direction of the component parallel to the board separation surface.  

(2) Add slits in the board separation part.  

A

A

A

>

>

>

D *1  

B

(3) Keep the mounting position of the component away from the board separation surface.  

C

C

Perforation  

B

*1 A > D is valid when stress is added vertically to the perforation as with  

Hand Separation.  

If a Cutting Disc is used, stress will be diagonal to the PCB,  

therefore A > D is invalid.  

D

A

Slit  

(3) Mounting Components Near Screw Holes  

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during  

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.  

Screw Hole  

Recommended  

13.4. Attention Regarding

P

.

C.B. Design  

< The Arrangement of Products >  

•

P

.

C.B. shall be designed so that products are  

far from the portion of perforation.  

•The portion of perforation shall be designed  

as narrow as possible, and shall be designed  

so as not to be applied the stress in the case  

of

P

.

C.B. separation.  

○

×

P.C.B.  

•Products shall not be arranged on the line of a series of holes  

when there are big holes in

P

.

C.B..  

(Because the stress concentrate on the line of holes.)  

Product  

Hole  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

< Products Placing >  

P8/ 10  

Pic

k

–

u

p nozzle  

•Support pins shall be set under

P

.

C.B. to prevent causing a warp to  

P

.

C.B. during placing the products on the other side of

P

.

C.B.  

<

P

.

C.B. Separation >  

•

P

.

C.B. shall not be separated with hand.  

P

.

C.B. shall be separated with the fixture so as not to cause

P

.

C.B. bending.  

P.C.B.  

Support pin  

13.5. Standard Soldering Conditions  

On flow soldering (e.g. double wave soldering), use the product in consideration of the conditions of solder, and  

solder temperature and immersion time (melting time) because longer soldering time may cause the corrosion of  

the electrode.  

On dipping soldering, use the product in consideration of the conditions of solder, solder temperature, flux, and  

preheat and so on because de-wetting may be caused.  

Standard soldering profile and the limit soldering profile is as follows.  

The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of  

product quality.  

< Flow Soldering Profile >  

Temp.  

°C  

(

)  

265°C±3°C  

250°C  

Limit Profile  

150  

Heating Time  

Standard Profile  

Time.(s)  

60s min.  

Standard Profile  

150°C , 60s min.  

250°C , 4s ~ 6s  

2 times  

Limit Profile  

Pre-heating  

Heating  

Cycle of flow  

265°C ± 3°C, 5s max.  

1 time  

< Reflow Soldering Profile >  

Temp.  

(°C)  

260°C  

230°C  

245°C±3°C  

220°C  

Limit Profile  

180  

150  

30s 60s  

～

Standard Profile  

60s max.  

90s±30s  

Time.(s)  

Standard Profile  

Limit Profile  

Pre-heating  

Heating  

Peak temperature  

Cycle of reflow  

150°C ~ 180°C , 90s ± 30s  

above 220°C , 30s ~ 60s  

245°C ± 3°C  

above 230°C , 60s max.  

260°C , 10s  

1 time  

2 times  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

P9/ 10  

13.6. Printing of Adhesive (Flow Soldering)  

Adhesive amount shall be about 0.2 mg per chip to obtain enough adhesive strength.  

The adhesive position is as follows.  

Adhesive  

Position of adhesive  

13.7. Solder paste printing for reflow  

・

Standard thickness of solder paste should be  

150 to 200 µm.  

<Standard printing pattern of solder paste. >  

・

Use the solder paste printing pattern of the right pattern.  

・

For the resist and copper foil pattern, use standard  

land dimensions.  

0.6  

2.2  

4.2  

(in mm)  

13.8. Reworking with Soldering iron  

The following conditions shall be strictly followed when using a soldering iron.  

•

Pre-heating : 150°C, 1 min  

•

Tip temperature : 350°C max.  

•

Soldering time : 3(+1,-0) s  

•

Soldering iron output : 30W max.  

•

Tip diameter :

 

φ

3mm max.  

•

Times : 2times max.  

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on  

the ceramic material due to the thermal shock.  

13.9. Cleaning Conditions  

Products shall be cleaned on the following conditions.  

(1) Cleaning temperature shall be limited to 60 °C max. (40°C max. for IPA.)  

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at  

the mounted products and

P

.

C.B..  

Power: 20W / l max.  

(3) Cleaner  

1. Cleaner  

Frequency: 28kHz ~ 40kHz  

Time: 5 minutes max.  

·

Isopropyl alcohol (IPA)  

2. Aqueous agent  

·

PINE ALPHA ST-100S  

(4) There shall be no residual flux and residual cleaner after cleaning.  

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to  

remove the cleaner.  

(5) Other cleaning  

Please contact us.  

13.10. Operating Environment  

Do not use this product under the following environmental conditions, on deterioration of the performance, such as  

insulation resistance may result from the use.  

(1) in the corrodible atmosphere (acidic gases , alkaline gases, chlorine, sulfur gases, organic gases and etc.)  

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.  

13.11. Resin coating  

In case of coating/molding products the products with the resin, an open circuit issue may occur by mechanical  

stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some  

impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause  

corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case  

of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is  

observed by evaluating products mounted on your board.  

MURATA MFG. CO., LTD.  

Reference Only  

Spec. No. JENF243E-0009J-01  

13.12. Caution for use  

P10/ 10  

Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched  

to the winding portion to prevent the breaking of wire.  

Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.  

13.13. Handling of a substrate  

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the  

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to  

the substrate.  

Excessive mechanical stress may cause cracking in the product.  

Bending  

Twisting  

13.14. Storage condition  

(1) Storage period  

Use the products within 12 months after delivered.  

Solderability should be checked if this period is exceeded.  

(2) Storage environment condition  

· Products should be stored in the warehouse on the following conditions.  

T

e

mperature: -10 ~ +40°C  

Humidity: 15 ~ 85% relative humidity  

No rapid change on temperature and humidity  

· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of  

electrode, resulting in poor solderability.  

· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.  

· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.  

· Products should be stored under the airtight packaged condition.  

(3) Delivery  

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.  

14.  

! Notes  

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted  

to your product.  

(2)

Y

o

u are requested not to use our product deviating from the reference specifications.  

(3)The contents of this reference specification are subject to change without advance notice. Please approve our  

product specifications or transact the approval sheet for product specifications before ordering.  

MURATA MFG. CO., LTD.