Murata-Electronics-NFZ03SG162SN10D
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Reference Only
Spec.No.JENF243J-0016B-01
P1/7
CHIP NOISE FILTER
NFZ03SG
□□□
SN10
□
REFERENCE SPECIFICATION
1.Scope
This reference specification applies to Chip Ferrite Bead NFZ03SG Series.
2.Part Numbering
(ex)
NF
Z
03
SG
331
S
N
1
0
D
Product ID
Structure Dimension
Characteristics Typical
Impedance Performance
Category Numbers special Packaging
(L
×
W)
at 900MHz
of
Circuit
speci-
fication *
D:Taping
B: BULK
0
：Ｈ
ighImpedance
3.Rating
Impedance (
Ω
)
(Under Standard
DC Resistance
(
Ω
)
Rated
Current
(mA)
Customer
Part Number
MURATA
Part Number
Testing Condition)
at 900MHz
at 1.7GHz
Typ.
Typ.
Min.
Typ.
0.46
Max.
0.55
NFZ03SG331SN10D
NFZ03SG331SN10B
NFZ03SG501SN10D
NFZ03SG501SN10B
NFZ03SG671SN10D
NFZ03SG671SN10B
NFZ03SG102SN10D
NFZ03SG102SN10B
NFZ03SG162SN10D
NFZ03SG162SN10B
330
500
200
400
600
305
275
250
210
180
300
400
600
960
0.56
0.69
1.00
1.30
0.68
0.85
1.20
1.60
670
800
1000
1600
900
1200
■
Operating Temperature : -55°C to +125°C
■
Storage Temperature : -55°C to +125°C
4.Style and Dimensions
0.6±0.03
0.3±0.03
■
Equivalent Circuit
0.15±0.05
Resistance element becomes
dominant at high frequencies.
(
)
: Electrode
■
Unit Mass(Typical value)
(in mm)
0.300mg
5.Marking
No marking.
6.Standard Testing Conditions
<
Unless otherwise specified
>
Temperature : Ordinary Temp. (15 °C to 35 °C )
<
In case of doubt
>
Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No.
Item
Specification
Meet item 3.
Test Method
Measuring Frequency : 900MHz,
1.7GHz
±
1MHz
7-1-1 Impedance
Measuring Equipment : KEYSIGHT 4991A
or the equivalent
Test Fixture : KEYSIGHT 16192A /16197Aor their equivalents
Measuring Equipment : Digital multi meter
7-1-2 DC
Resistance
*Except resistance
of the Substrate and Wire
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243J-0016B-01
P2/7
7-2.Mechanical Performance
No.
Item
Specification
Test Method
7-2-1 Bonding
Strength
Products shall not be damaged
after tested as test method.
It shall be soldered on the substrate.
Applying Force(F) : 2N
Applying Time : 5s
7-2-2 Bending
Strenght
It shall be soldered on the Glass-epoxy substrate.
Substrate : 100mm
×
40mm
×
0.8mm
Deflection : 2.0mm
Speed of Applying Force : 1.0mm/s
Keeping Time : 20s
Pressure jig
F
R230
Deflection
(in mm)
Product
45
45
7-2-3 Vibration
Appearance: No damage
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20min
Total amplitude 3.0mm or Acceleration
amplitude 196 m / s
2
whichever is smaller.
Testing Time:A period of 2h in each of
3 mutually perpendicular directions.(Total 6h)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 60s
7-2-4 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245°C±3°C
Immersion Time : 3s
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Test Method
7-3-1 Heat
Life
Meet Table 1.
Temperature : 125°C±2°C
Table 1
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
Appearance No
damage
Impedance
Change
condition for 4 to 48 h.
Within ±30%
(at 900MHz)
7-3-2 Cold
Resistance
Temperature : -55°C±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
7-3-3 Humidity
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room
condition for 4 to 48 h.
7-3-4 Temperature
Cycle
1 cycle :
1 step : -55
°
C(+0
°
C,-3
°
C) /30min(+3min,-0min)
2 step : Ordinary temp. / 3 min max.
3 step : +125
°
C(+3
°
C,-0
°
C) / 30min(+3min,-0min)
4 step : Ordinary temp. / 3 min max.
Total of 100 cycles
Then measured after exposure in the room
condition for 4 to 48 h.
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243J-0016B-01
P3/7
8.Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide paper tape)
2.0±0.05
+
0
.1
2.0±0.05
4
.
0±0.1
φ
1
.
5
-0
0
.
55max.
0.36
(Typ.)
Direction of Feed
(in mm)
(1) Taping
Products shall be packaged in the each embossed cavity of 8mm-wide, 2mm-pitch and plastic tape
continuously and sealed by cover tape.
(2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point : The cover tape has no spliced point.
(4) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Cover tape
5N min
165 to 180 degree
(2)Peeling off force of Cover tape
0.1N to 0.5N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
F
Cover tape
Plastic tape
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel : 15000 pcs. / reel
(2)There shall be leader-tape(cover tape only and empty tape ) and trailer- tape(empty tape) as follows.
(3)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(
∗
1), RoHS marking(
∗
2), Quantity, etc)
∗
1) « Expression of Inspection No. »
□□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date
First digit
: Year
/ Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(4)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
∗
2), Quantity, etc)
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243J-0016B-01
P4/7
(5)Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
Empty tape
Cover tape
210 min.
φ
13.0±0.2
φ
6
0
+1
–
0
Direction of feed
φ
21.0±0.8
+1
-0
9.0
13.0±1.4
+0
φ
180
-3
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Label
Standard Reel Quantity
in Outer Case (Reel)
H
W
D
H
D
186
186
93
5
W
∗
Above Outer Case size is typical. It depends on a quantity of an order.
9.
！
Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(7) Traffic signal equipment
(8) Transportation equipment (vehicles, trains, ships, etc.)
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
•
Standard land dimensions (Reflow soldering)
Chip Ferrite Bead
a
b
c
c
0.25
0.80
0.30
Solder Resist
Pattern
( in mm)
a
b
10-2.Soldering Conditions
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100
µ
m to 150
μ
m
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243J-0016B-01
(2) Soldering conditions
P5/7
•
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150
℃
max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100
℃
max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
•
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(
℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
above 230°C
、
60s max.
260°C,10s
Peak temperature
245
±
3°C
Cycle of reflow
2 times
2 times
10-3.Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-4.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
direction (Length:a
<
b) to the mechanical
stress.
b
Poor example
〈
〉
Good example
〈
〉
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243J-0016B-01
P6/7
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting
Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-5.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-6.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/
max. Frequency:28kHz
to 40kHz
Time:5 min max.
(3)Cleaner
1.Alternative cleaner
·
Isopropyl alcohol (IPA)
2.Aqueous agent
·
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
When products are coated with resin, please contact us in advance.
10-9. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO.,LTD.
Reference Only
Spec.No.JENF243J-0016B-01
P7/7
10-10.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
•
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
•
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
•
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
•
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
•
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD.
