Murata-Electronics-NFZ15SG462SN10D
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Reference Only
Spec No.
JENF243J-0010A-01
P1/9
CHIP NOISE FILTER
NFZ15SG
□□□
SN1
□
D REFERENCE SPECIFICATION
1. Scope
This reference specification applies to NFZ15SG Series, Chip Noise Filter.
2. Part Numbering
(ex)
NF
Z
１５
ＳＧ
101
S
N
1
0
D
Product ID
Structure Dimension
Characteristics Typical
Impedance Performance
Category Numbers special Packaging
(L
×
W)
at 900MHz
of
Circuit
speci- D:
T
a
ping
fication *
B: BULK
1
：
LowRdc
0
：Ｈ
ighImpedance
*B: Bulk packing also available
3. Rating
・
Operating
T
e
mperature Range
・
Storage
T
e
mperature Range
– 40°C to + 85°C
– 40°C to + 85°C
Impedance
DC Resistance
(
Ω
)
Rated Current *1
(A)
Customer
Part Number
MURATA
Part Number
at900MHz(
Ω
) at1.7GHz(
Ω
)
Typ.
Max.
Typ.
Min.
Typ.
NFZ15SG101SN11D
NFZ15SG151SN11D
NFZ15SG331SN11D
NFZ15SG771SN10D
NFZ15SG152SN10D
NFZ15SG262SN10D
NFZ15SG462SN10D
100
70
160
0.07
0.09
0.20
0.35
0.55
0.80
1.25
0.10
0.12
0.30
0.50
0.80
1.00
1.65
1.10
1.00
0.65
0.50
0.40
0.35
0.27
150
100
250
330
230
540
770
530
900
1500
2600
4600
1000
1800
2800
1200
1450
1800
*1: When applied Rated current to the Products, self temperature rise shall be limited to 40
℃
max.
4. Testing Conditions
《
Unless otherwise specified
》
T
e
mperature : Ordinary
T
e
mperature / 15°C to 35°C
Humidity :
Ordinary Humidity
/ 25%(RH) to 85%(RH)
《
In case of doubt
》
T
e
mperature :
20°C ± 2°C
Humidity :
60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106kPa
5. Appearance and Dimensions
■
Equivalent Circuit
Resistance element becomes
dominant at high frequencies.
(
)
■
Unit Mass (Typical value)
0.001g
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
P2/9
6. Electrical Performance
No.
Item
Specification
Impedance shall meet item 3.
T
e
st Method
Measuring Equipment:
KEYSIGHT 4991A or equivalent
(50mV)
Measuring Frequency: 900MHz / 1.7GHz
6.1 Impedance
6.2 DC
Resistance
DC Resistance shall meet item 3.
Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
terminal2
SW
b
DC resistance shall be measured after putting chip
noise filter between the terminal 2 under the condition
of opening between a and b.
Every measurement the terminal 1 shall be shorted
between a and b when changing noise filter.
*Except resistance
of the Substrate and Wire
7. Mechanical Performance
No.
Item
Specification
Chip noise filter shall not be damaged
Applied Direction
T
e
st Method
7.1 Shear
T
e
st
CHIP NOISE FILTER
after tested as follows.
F
Substrate
Force: 5N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
Substrate: Glass-epoxy substrate
7.2 Bending
T
e
st
(100mm
×
40mm
×
0.8mm)
Solder: Reflow
Pressure jig
F
R230
Deflection
(in mm)
Product
45
45
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
7.3 Vibration
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
T
o
tal amplitude 3.0 mm or Acceleration
amplitude 245m/s
2
whichever is smaller.
T
e
sting Time:
A period of 2h in each of 3 mutually
perpendicular directions. (
T
o
tal 6h)
7.4 Drop
It shall be dropped on concrete or steel board.
Height : 1m
T
o
tal of 9 cycles
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
No. Item
P3/9
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
T
e
st Method
7.5 Solderability
Flux: Ethanol solution of rosin 25(wt)%
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder
T
e
mperature: 240°C±5°C
Immersion Time: 3s±1s
7.6 Resistance
to
Soldering Heat
Appearance: No damage
Impedance Change: within ±30%
Pre-Heating: 150°C±10°C / 60s to 90s
Solder: Sn-3.0Ag-0.5Cu
Solder
T
e
mperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 48h±4h.
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
T
e
st Method
T
e
mperature: 85°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 48h±4h.
8.1 Heat
Resistance
8.2 Cold
Resistance
8.3 Humidity
Appearance: No damage
Impedance Change: within ±30%
T
e
mperature: -40°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 48h±4h.
T
e
mperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 48h±4h.
8.4
T
e
mperature
Cycle
1 cycle:
1 step: -40°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: 85°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
T
o
tal of 100cycles
Then measured after exposure in the room
condition for 48h±4h.
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
P4/9
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
(8mm-wide)
2.0±0.05
4.0±0.1
2.0±0.05
1.
5
+0.1
φ
-0
0.8max.
0.65(Typ.)
(in mm)
Direction of Feed
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs / reel
(2) Packing Method
Products shall be packed in the cavity of
base tape continuously
and sealed by top tape
And bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Ｔ
he base tape and top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Ｔ
op tape
5N min.
Ｂ
ottom tape
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm / min
Plastic tape: 0.1N to 0.6N
(minimum value is typical)
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
P5/9
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Ｔop tape
Label
Empty tape
Cover tape
φ
13.0±0.2
φ
60
±
1
0
9±
1
0
13±1.4
φ
21.0±0.8
Direction of feed
φ
180
±
0
3
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (
∗
1), RoHS marking (
∗
2),
Quantity etc
･･･
∗
1) <Expression of Inspection No.>
□□
OOOO
×××
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
:
Y
e
ar
/ Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
(3)
Serial No.
∗
2) <Expression of RoHS marking >
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
∗
2), Quantity, etc
･･･
9.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
(mm)
D
Label
W
H
H
186
186
93
5
D
∗
Above Outer Case size is typical. It depends on a quantity of an order
W
10.
！
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party’s life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment
(9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
P6/9
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Ch
err
e
ad
Chip Noise Filter
0.5
Solder Resist
Pattern
0.4
1.2
～
1.4
(in mm)
11.2 Flux, Solder
・
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・
Use Sn-3.0Ag-0.5Cu solder.
・
Standard thickness of solder paste: 100
μ
m to 200
μ
m.
11.3 Reflow soldering conditions
・
Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Soldering Profile for Lead Free solder
Temp.
(
℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s
～60
s
60s max.
90s±30s
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
150°C
～
180°C, 90s
±
30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s
～
60s
245°C
±
3°C
above 230°C, 60s max.
260°C, 10s
2 times
2 times
11.4 Reworking with soldering iron
Pre-heating: 150°C, 1 min
Soldering iron output: 80W max.
Tip temperature: 350°C max.
Tip diameter:
φ
3mm max.
Soldering time : 3(+1,-0) seconds.
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
P7/9
11.5 Solder Volume
・
Solder shall be used not to be exceeded the upper limits as shown below.
・
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
T
：
thickness of electrode
11.6 Product’s location
The following shall be considered when designing and laying out
P
.
C.B.’s.
(1)
P
.
C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［
Products direction
］
a
b
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on
P
.
C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
A > D
*1
A > B
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A > C
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
P8/9
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and
P
.
C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The impedance value may change and/or it may affect on the product’s performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you
select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the impedance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip noise filters are handled. (The tip of the tweezers should be molded with
resin or pottery.)
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD
Reference Only
Spec No.
JENF243J-0010A-01
P9/9
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・
Products should be stored in the warehouse on the following conditions.
T
e
mperature
：
-10°C to 40°C
Humidity
：
15% to 85% relative humidity
No rapid change on temperature and humidity
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
・
Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
・
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・
Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12.
! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)
Y
o
u are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
