Murata-Electronics-NFZ2MSD101SZ10L
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NFZ2MSD
□□□
SZ10L REFERENCE SPECIFICATION
Spec No.JETE243A-9103B-01
P 1/9
CHIP NOISE FILTER
Murata Standard Specification
【
AEC-Q200
】
1. Scope
This reference specification applies to NFZ2MSD_SZ10L, Chip Noise Filter for Automotive Electronic based
on AEC-Q200.
（
except for Power train and Safety
）
2.Part Numbering
(ex)
NF
Z
2M
SD
101
S
Z
1
0
L
Numbers Special
Product
ID
Typical
Impedance
Structure Dimension Characteristics
(L×W)
Performance Category Of
Circuit
Speci-
fication
Packaging
L:
Φ
180Taping
at 100MHz
(T)
3.Rating
Operating Temperature Range
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
Storage Temperature Range.
-40 to +85°C
-40 to +125°C
-40 to +85°C
20V
Withstand voltage
Impedance
at 10MH
ｚ
Impedance
at 100MH
ｚ
DC Resistance
Max
ESD
Rank
１
A:0.5kV
*1 Rated Current
Customer
Part Number
Murata
Part Number
(
Ω
)
Tolerance
Typ (
Ω
)
100
(m
Ω
)
18
（
A
）
5.2
NFZ2MSD101SZ10L
NFZ2MSD181SZ10L
NFZ2MSD301SZ10L
NFZ2MSD501SZ10L
NFZ2MSD102SZ10L
9
１
A
１
A
１
A
１
A
１
A
15
21
29
46
180
22
4.0
±30%
300
26
3.8
500
32
3.2
1000
46
2.5
*1: When applied Rated current to the Products, self temperature rise shall be limited to 40
℃
max.
4. Testing Conditions (Standard atmospheric conditions)
<Unless otherwise specified>
<In case of doubt>
Temperature
Humidity
Temperature :
Ordinary Temperature (15 to 35°C)
: 20 ± 2°C
: 60 to 70 %(RH)
Humidity
: Ordinary Humidity (25 to 85 %(RH))
Atmospheric Pressure
: 86 to 106 kPa
5.Appearance and Dimensions
※
no marking
(in mm)
■
Unit Mass (Typical value)
0.0188g
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
P 2/9
6. Electrical Performance
No.
No.
Item
Specification
Measuring Equipment:
KEYSIGHT 4287A or equivalent
(0.5V)
Measuring Frequency: 10MHz
Measuring Equipment: Digital multi meter
6.1 Impedance
Meet item 3.
6.2 DC
Resistance
7. Q200 Requirement
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
Stress
Test Method
No.
3
High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours
at room temperature,
then measured.
Meet Table A after testing.
Table A
Appearance No
damage
Impedance
Change
Within ±30%
(at 10MHz)
4
Temperature Cycling
1000cycles
-40 deg C to +125 deg C
Set for 24hours
at room temperature,
then measured.
Not Applicable
5
7
Destructive
Physical Analysis
Per EIA469
No electrical tests
Biased Humidity
1000hours at 85 deg C, 85%RH
Meet Table A after testing.
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
P 3/9
Murata Specification / Deviation
Meet Table A after testing.
AEC-Q200
Stress
Test Method
No.
8
Operational Life
Apply 125 deg C 1000hours
Set for 24hours at
The operating temperature should be 85 deg C.
room temperature,
then measured
9
External Visual
Visual inspection
No abnormalities
No defects
10 Physical
Dimension Meet
ITEM 5
（
Appearance and Dimensions
）
12 Resistance
to Solvents
Per MIL-STD-202 Method 215
Not Applicable
13 Mechanical
Shock
Per MIL-STD-202 Method 213
Condition C
Meet Table A after testing.
100g’s(0.98N)/6ms/Half sine
14 Vibration
5g’s(0.049N) for 20 minutes,
12cycles each of 3 oritentations
Test from 10-2000Hz.
15 Resistance
Solder temperature
250+5/-5 deg C
Immersion time 30
±
5s
Pre-heating: above 183 deg C, 90 to120s
Meet Table A after testing.
to Soldering Heat
Meet Table A after testing.
ESD Rank: Meet Item 3 (Rating)
17 ESD
Per AEC-Q200-002
Per J-STD-002
18 Solderability
Method b : Not Applicable
90% of the terminations is to be soldered.
19 Electrical
Measured : Impedance
Per UL-94
No defects
Characterization
20 Flammability
21 Board
Flex
Not Applicable
Epoxy-PCB(1.6mm)
Meet Table A after testing.
Deflection 2mm(min)
60s minimum holding time
22 Terminal
Strength
Per AEC-Q200-006
Per ISO-7637-2
No defects
30 Electrical
Transient
Not Applicable
Conduction
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
P 4/9
8. Specification of Packaging
8.1 Appearance and Dimensions of plastic tape
A
B
P0
P1
P2
T1
T2
W
±0.1
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.2
1.85
2.25
φ1.5
φ1.0
1.75
3.5
4.0
4.0
＋0.1
– 0
＋0.1
– 0
D0
D1
E
2.0
0.25
1.3
±0.1
F
±0.05
8.0
Unreeling direction
(in mm)
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
8.3 Pull Strength
Embossed carrier tape
9.8N min.
5N min.
Cover tape
8.4 Peeling off force of cover tape
Speed of Peeling off
300mm/min
165 to 180 degree
F
Cover tape
Plastic tape
0.1 to 0.7N
(minimum value is typical)
Peeling off force
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
8.6 Marking for reel
P 5/9
Customer part number, MURATA part number, Inspection number(
∗
1), RoHS marking(
∗
2), Quantity etc
･･･
∗
1) <Expression of Inspection No.>
□
□
OOOO
×××
(1)
(2)
(3
)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit
: Day
(3) Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking
(
∗
2) ,Quantity, etc
･･･
8.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W
D
H
Label
200
185
67
5
H
Above Outer Case size is typical. It depends on a quantity of an order.
D
W
9.
Caution
9.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party’s life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment ( trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment
(9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
9.2 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
This product employs a core with low insulation resistance, Pay strict attention when use it.
a) Do
not make any through holes and copper pattern under the coil except a copper pattern to the electrode.
b) Design/mount
any components not to contact this product.
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
P 6/9
10.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to “position shift” in soldering process.
(in mm)
10.2 Flux, Solder
・
Use rosin-based flux.
Flux
・
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・
Don’t use water-soluble flux.
・
Use Sn-3.0Ag-0.5Cu solder
・
Standard thickness of solder paste : 100
μ
m to 150
μ
m
Solder
Other flux (except
（
above) Please contact us for details, then use.
10.3 soldering conditions (Reflow)
・
Pre-heating should be in such a way that the temperature difference between solder and product surface is
limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・
Standard soldering profile profile is as follows.
Standard Profile
Pre-heating
Heating
150
℃～
180
℃ 、
90s±30s
above 230
℃ 、
20s
～
40s
Peak
temperature
250
℃
+5/-0
℃
Cycle of reflow
2 times
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
10.4 Solder Volume
P 7/9
・
Solder shall be used not to be exceeded the upper limits as shown below.
・
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
T
：
thickness of electrode
10.5 Product’s location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［
Products direction
］
a
Products shall be located in the sideways
b
direction to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D
∗
1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
Perforation
∗
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
B
D
A
Slit
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10.6 Resin coating
The Impedance value may change and/or it may affect on the product’s performance due to high cure-stress
of resin to be used for coating/molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
10.7 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40
℃
when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
10.8 Caution for use
There is possibility that the Impedance value change due to magnetism. Don‘t use a magnet or a pair of tweezers
with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
10.9 Magnetic Saturation
P 8/9
When the excessive current over rated current is applied, the Impedance value may change due to magnetism.
10.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting
to the substrate when cropping the substrate, inserting and removing a connector from the substrate or
tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・
Products should be stored in the warehouse on the following conditions.
Temperature
：
-10°C to 40°C
Humidity
：
15% to 85% relative humidity
No rapid change on temperature and humidity
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of
electrode, resulting in poor solderability.
・
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・
Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
10.12 Derating
Max. current (DC, AC) as function of
product
temperature (derating curve)
I
OP
I
R
:
:
Loaded Current
Rated Current
Product Temperature [
℃
]
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-9103B-01
P 9/9
11
．
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
