Murata-Electronics-NFZ2MSD131SN10L
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Reference Only
Spec No.JETE243A-0045A-01
P 1/8
CHIP NOISE FILTER
NFZ2MSD
□□□
SN10L SPECIFICATION
REFERENCE SPECIFICATION
1. Scope
This reference specification applies to NFZ2MSD
□□□
SN10L, Chip Noise Filter.
2.Part Numbering
(ex)
NF
Z
2M
SD
100
S
N
1
0
L
Numbers Special
Product
ID
Typical
Impedance
Structure Dimension Characteristics
(L×W)
Performance Category Of
Circuit
Speci-
fication
Packaging
L:
Φ
180Taping
at 10MHz
(T)
3.Rating
・
Operating Temperature Range
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
・
Storage Temperature Range.
-40 to +85°C
-40 to +125°C
-40 to +85°C
20V DC
・
Absolute maximum voltage
Impedance
at 10MH
ｚ
DC Resistance
*1 Rated Current
Customer
Part Number
Murata
Part Number
Max
(
Ω
)
10
Tolerance
(m
Ω
)
20
（
A
）
5.2
NFZ2MSD100SN10L
NFZ2MSD150SN10L
NFZ2MSD200SN10L
NFZ2MSD300SN10L
NFZ2MSD600SN10L
NFZ2MSD900SN10L
NFZ2MSD131SN10L
15
23
4.4
20
28
3.9
30
±30%
33
3.7
60
54
2.7
90
95
2.0
130
144
1.5
*1: When applied Rated current to the Products, self temperature rise shall be limited to 40
℃
max.
4. Testing Conditions (Standard atmospheric conditions)
<Unless otherwise specified>
<In case of doubt>
Temperature
Humidity
Temperature :
Ordinary Temperature (15 to 35°C)
: 20 ± 2°C
: 60 to 70 %(RH)
Humidity
: Ordinary Humidity (25 to 85 %(RH))
Atmospheric Pressure
: 86 to 106 kPa
5.Appearance and Dimensions
※
no marking
(in mm)
■
Unit Mass (Typical value)
0.0188g
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-0045A-01
P 2/8
6. Electrical Performance
No.
No.
Item
Specification
Measuring Equipment:
KEYSIGHT 4287A or equivalent (0.5V)
Measuring Frequency: 10MHz
Measuring Equipment: Digital multi meter
6.1 Impedance
Meet item 3.
6.2 DC
Resistance
7. Mechanical Perdormance
No.
Item
Specification
Test Method
7.1 Shear
Test
Chip
Noise Filter
shall not be damaged.
It shall be soldered on the substrate.
Applying Force(F) : 10N
Hold Duration: 5s
7.2 Bending
Test
Chip
Noise Filter
shall not be damaged.
Substrate: Glass-epoxy substrate
(100×40×1.0mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 20s
(in mm)
7.3 Vibration
Chip
Noise Filter
shall not be damaged.
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz for 20
minutes
Total amplitude : 1.5 mm or Acceleration amplitude
98m/s
2
whichever is smaller.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
7.4 Solderability
The wetting area of the electrode shall be
Flux:Ethanol solution of rosin,25(wt)%
at least 90% covered with new solder
coating.
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating:150±10°C / 60 to 90s
Solder Temperature:245±5°C
Immersion Time:3 s
7.5 Resistance
to Appearance:No
damage
Reflow soldering method
Soldering
Heat
Impedance Change : within ±30%
Flux: Ethanol solution of rosin,25(wt)%
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150~180°C / 90±30s
Solder Temperature: 230°C min / 30±10s
Peak Temperature: 250+5/-0°C
Reflow times: 2 times max
Test board shall be 0.8 mm thick. Base material shall
be glass epoxy resin.
Then measured after exposure Standard atmospheric
conditions for 1~2 hours.
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-0045A-01
P 3/8
8.Environmental Performance (It shall be soldered on the substrate.)
No.
Item
Specification
Test Method
8.1 Heat
Appearance:No damage
Temperature: 125±2°C
Resistance
Impedance Change : within ±30%
Time: 1000h (
±
12h)
Then measured after exposure Standard atmospheric
conditions for 1~2 hours.
8.2 Cold
Temperature: -40±2°C
Resistance
Time: 1000h (
±
12h)
Then measured after exposure Standard atmospheric
conditions for 1~2 hours.
8.3 Humidity
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000h (
±
12h)
Then measured after exposure Standard atmospheric
conditions for 1~2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 min
2 step: Ordinary temp. / 3min max.
3 step: +125±2°C / 30±3 min
4 step: Ordinary temp. / 3min max.
Total of 100 cycles
Then measured after exposure Standard atmospheric
conditions for 1~2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
A
P0
P1
P2
T1
T2
W
±0.1
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.2
1.85
2.25
φ1.5
φ1.0
1.75
3.5
4.0
4.0
B
D0
D1
E
＋0.1
– 0
＋0.1
– 0
2.0
0.25
1.3
±0.1
F
±0.05
8.0
Unreeling direction
(in mm)
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
9.8N min.
5N min.
Cover tape
9.4 Peeling off force of cover tape
Speed of Peeling off
300mm/min
165 to 180 degree
F
Cover tape
Plastic tape
0.1 to 0.7N
(minimum value is typical)
Peeling off force
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-0045A-01
P 4/8
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(
1), RoHS marking(
2), Quantity etc
･･･
1) <Expression of Inspection No.>
□
□
OOOO
(3
)
(1)
(2)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O, N, D
Third, Fourth digit
: Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (
ᇞ
)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking
(
2) ,Quantity, etc
･･･
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W
D
H
Label
200
185
67
5
H
Above Outer Case size is typical. It depends on a quantity of an order.
D
W
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-0045A-01
P 5/8
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party’s life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (
vehicles,
trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment
(9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
This product employs a core with low insulation resistance, Pay strict attention when use it.
a) Do
not make any through holes and copper pattern under the coil except a copper pattern to the electrode.
b) Design/mount
any components not to contact this product.
11.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to “position shift” in soldering process.
(in mm)
11.2 Flux, Solder
・
Use rosin-based flux.
Flux
・
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・
Don’t use water-soluble flux.
・
Use Sn-3.0Ag-0.5Cu solder
・
Standard thickness of solder paste : 100
μ
m to 150
μ
m
Solder
Other flux (except
（
above) Please contact us for details, then use.
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-0045A-01
P 6/8
11.3 soldering conditions (Reflow)
・
Pre-heating should be in such a way that the temperature difference between solder and product surface is
limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・
Standard soldering profile profile is as follows.
Standard Profile
Pre-heating
Heating
150
℃～
180
℃ 、
90s±30s
above 230
℃ 、
20s
～
40s
Peak
temperature
250
℃
+5/-0
℃
Cycle of reflow
2 times
11.4 Solder Volume
・
Solder shall be used not to be exceeded the upper limits as shown below.
・
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T
≦
t
≦
T
t
T
：
thickness of electrode
11.5 Product’s location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［
Products direction
］
a
Products shall be located in the sideways
b
direction to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-0045A-01
P 7/8
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D
1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Perforation
B
D
A
Slit
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
11.6 Resin coating
The Impedance value may change and/or it may affect on the product’s performance due to high cure-stress
of resin to be used for coating/molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.7 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40
℃
when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
11.8 Caution for use
There is possibility that the Impedance value change due to magnetism. Don‘t use a magnet or a pair of tweezers
with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)
11.9 Magnetic Saturation
When the excessive current over rated current is applied, the Impedance value may change due to magnetism.
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting
to the substrate when cropping the substrate, inserting and removing a connector from the substrate or
tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD
Reference Only
Spec No.JETE243A-0045A-01
P 8/8
11.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・
Products should be stored in the warehouse on the following conditions.
Temperature
：
-10°C to 40°C
Humidity
：
15% to 85% relative humidity
No rapid change on temperature and humidity
Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of
electrode, resulting in poor solderability.
・
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・
Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
11.12 Derating
Max. current (DC, AC) as function of product temperature (derating curve)
I
OP
I
R
:
:
Loaded Current
Rated Current
Product Temperature [
℃
]
12
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
