Murata-Electronics-NFZ32BW151HN10L
| Part # | Murata-Electronics-NFZ32BW151HN10L |
Download  | Murata-Electronics-NFZ32BW151HN10L |
Reference Only
CHIP NOISE FILTER
NFZ32BW
□□□
HN10L REFERENCE
SPECIFICATION
SpecNo.JENF243J-0004B-01
P1/8
1.Scope
This reference specification applies to NFZ32BW_HN10L Series, Chip Noise Filter.
2.Part Numbering
(ex)
NF
Z
32
BW
3R6
H
N
1
0
L
Product ID
Structure Dimension Features Impedance Performance Category Numbers Other Packaging
(L×W) of
Circuit L:Taping
3.Rating
・
Operating Temperature Range.
(Ambient temperature; Self-temperature rise is not included)
-40 to +105°C
(Product temperature; Self- temperature rise is included)
・
Storage Temperature Range.
-40 to +125°C
-40 to +125°C
∗
1 Rated Current(mA)
Impedance at 1MHz
DC Resistance
∗
2 Ambient
∗
3 Ambient
temperature
105
℃
Customer Part Number
MURATA Part Number
temperature
(
Ω
)
Tolerance
(
Ω
)
Tolerance
85
℃
NFZ32BW3R6HN10L
NFZ32BW7R4HN10L
NFZ32BW9R0HN10L
NFZ32BW150HN10L
NFZ32BW210HN10L
NFZ32BW320HN10L
NFZ32BW420HN10L
NFZ32BW700HN10L
NFZ32BW111HN10L
NFZ32BW151HN10L
NFZ32BW221HN10L
NFZ32BW291HN10L
NFZ32BW451HN10L
NFZ32BW621HN10L
NFZ32BW881HN10L
3.6
7.4
9.0
15
0.030
0.045
0.057
0.076
0.12
0.18
0.24
0.38
0.57
0.81
1.15
1.78
2.28
2.70
4.38
2550
2050
1750
1600
1200
1000
850
1600
1320
1010
970
670
530
510
380
320
240
190
140
120
110
80
21
32
42
70
±30%
±20%
700
110
150
220
290
450
620
880
520
450
390
310
275
250
200
∗
1: As for the rated current, rated current derated as figure.1 depending on the operating temperature.
∗
2: When applied rated current to the Products, temperature rise caused by self heating will be 40°C or less.
∗
3: When applied rated current to the Products, temperature rise caused by self heating will be 20°C or less.
Fugure. 1
Rated
Current
at 85
℃
Rated
Current
at 105
℃
105
85
Operating Temperature
(
Ambien
t
t
emperature
)[
℃
]
MURATA MFG.CO., LTD
Reference Only
SpecNo.JENF243J-0004B-01
P2/8
4. Testing Conditions
《
Unless otherwise specified
》
Temperature :
Ordinary Temperature (15 to 35°C)
Humidity :
Ordinary Humidity (25 to 85 %(RH))
《
In case of doubt
》
Temperature
Humidity
: 20 ± 2°C
: 60 to 70%(RH)
Atmospheric Pressure
: 86 to 106 kPa
5.Appearance and Dimensions
2.7±0.2
2.5±0.2
2.5±0.2
3.2±0.3
■
Unit Mass
（
Typical value
）
。
※
No marking.
0.044
ｇ
(in mm)
0.9±0.3 1
0.9±0.3
6.Electrical Performance
No.
Item
Specification
Test Method
6.1 Impedance
Impedance shall meet item 3.
Measuring Equipment :
KEYSIGHT 4192A
or equivalent
Measuring Frequency: 1MHz
6.2 DC
Resistance
DC Resistance shall meet item 3.
Measuring Equipment: Digital multi meter
7.Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear
Test
Chip Noise Filter shall not be
damaged.
Substrate: Glass-epoxy substrate
Force: 10N
Hold Duration: 5±1s
Ｆ
Substrate
7.2 Bending
Test
Substrate: Glass-epoxy substrate
(100×40×1.0mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5s
Pressure jig
R230
F
Deflection
45
45
Product
(in mm)
7.3
Vibration
Chip Noise Filter shall not be
damaged.
Oscillation Frequency : 10 to 2000 to 10Hz for 20 min
Total amplitude : 1.5 mm or Acceleration amplitude
98 m/s
2
whichever is smaller.
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6 hours)
MURATA MFG.CO., LTD
Reference Only
Test Method
SpecNo.JENF243J-0004B-01
No. Item
P3/8
Specification
7.4 Solderability
The wetting area of the electrode shall
Flux: Ethanol solution of rosin,25(wt)%
be at least 90% covered with new
solder coating.
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance
to
Soldering Heat
Appearance: No damage
Impedance Change: within ± 10%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No.
Item
Specification
Test Method
Temperature: 105±2°C
Time:
1000 h (+48h , -0h)
8.1 Heat
Resistance
8.2 Cold
Resistance
8.3 Humidity
Appearance: No damage
Impedance Change: within ± 10%
DC Resistance Change: within ± 10%
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: -40±2°C
Time:
1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time:
1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 min
2 step: Ordinary temp. / 10 to 15 min
3 step: +105±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
Lea
d
–
i
n/out wire
※
φ
1.5
-0
(
)
0.2
Dimension of the Cavity is measured
at the bottom side.
(in mm)
4.0±0.1
2.0±0.05
4.0±0.1
1.7±0.2
2.9±0.2
Direction of feed
MURATA MFG.CO., LTD
Reference Only
SpecNo.JENF243J-0004B-01
P4/8
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
10N min.
5N min.
Cover tape
9.4 Peeling off force of cover tape
165 to 180 degree
F
Speed of Peeling off
300mm/min
0.2 to 0.7N
(minimum value is typical)
Cover tape
Peeling off force
Plastic tape
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer 160
min.
2.0±0.5
:
Leader
190 min
Empty tape
210 min
Label
Cover tape
φ
13.0±0.2
1
φ
60±
1
0
φ
21.0±0.8
Direction of feed
9±
0
13±1.4
0
180
±
3
(in mm)
φ
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(
∗
1), RoHS marking(
∗
2), Quantity etc
･･･
∗
1) <Expression of Inspection No.>
□
□
OOOO
×××
(1)
(2)
(3
)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit
: Day
(3) Serial No.
∗
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
∗
2) ,Quantity, etc
･･･
MURATA MFG.CO., LTD
Reference Only
SpecNo.JENF243J-0004B-01
P5/8
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
Label
W
D
H
H
186
186
93
5
∗
Above Outer Case size is typical. It depends on a quantity
of an order.
D
W
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land pattern for flow and reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to “position shift” in soldering process.
(Reflow)
Land
(Flow)
Chip Noise Filter
0.8
Chip Noise Filter
Solder Resist
La
n
d
2.5
S
o
lder Resist
1.3
2.2
4.8
(in mm)
(in mm)
(Distance between the products for Flow)
(in mm)
11.2 Flux, Solder
・
Use rosin-based flux.
Flux
・
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・
Don’t use water-soluble flux.
・
Use Sn-3.0Ag-0.5Cu solder
・
Standard thickness of solder paste : 100
μ
m to 150
μ
m
Solder
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JENF243J-0004B-01
P6/8
11.3 Flow soldering conditions / Reflow soldering conditions
・
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
(1) Flow soldering profile
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
150
℃
、
60s min.
250
℃
、
4s
～
6s
265
℃
±3
℃
、
5s
Cycle of flow
2 times
1 time
(2)Reflow soldering profile
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max
90s±30s
Time(s)
Standard Profile
Limit Profile
Pre-heating
150
～
180°C
、
90s±30s
Heating
above 220°C
、
30s
～
60s above
230°C
、
60s max.
Peak temperature
Cycle of reflow
245±3°C
2 times
260°C,10s
2 times
MURATA MFG.CO., LTD
Reference Only
SpecNo.JENF243J-0004B-01
P7/8
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ
3mm max.
3 (+1,-0)s
2 times
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
Note
：
Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
・
Solder shall be used not to be exceeded the upper limits as shown below.
・
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Uppre Limit
Recommendable
1/3T
≦
t
≦
T
(T: Lower flange thickness)
Ｔ
t
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［
Products direction
］
a
b
Products shall be located in the sideways
direction (Length: a
<
b) to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
C
B
Seam
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
>
C
>
B
≅
D.
D
A
a
b
Slit
<
Length:a b
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
1. Alternative cleaner
・
Isopropyl alcohol (IPA)
2. Aqueous agent
・
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JENF243J-0004B-01
P8/8
11.8 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,
or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine
by hydrolysis under some operating condition may cause corrosion of wire, leading to open circuit. So, please
pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on
your board.
11.9 Caution for use
・
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched
to the winding portion to prevent the breaking of wire.
・
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting
to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.11 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don’t keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・
Products should not be stored on bulk packaging condition to prevent the chipping of the core and
the breaking of winding wire caused by the collision between the products.
・
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering
MURATA MFG.CO., LTD
