Murata-Electronics-NFZ32BW9R8HZ11L
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Reference Only
Spec No.JENF243J-9102A-01
P1/8
CHIP NOISE FILTER
NFZ32BW
□□□
HZ11
□
Murata Standard Reference Specification
【
AEC-Q200
】
1.Scope
This reference specification applies to Chip Noise Filter NFZ32BW_HZ11 series for Automotive Electronics based on
AEC-Q200 except for Power train and Safety.
2.Part Numbering
(ex)
NF
Z
32
BW
3R6
H
Z
1
1
L
Numbers
Product ID
Structure Dimension
Features
Impedance Performance Category
Other Packaging
L:Taping
of Circuit
(L×W)
3.Rating
Operating Temperature Range
(Ambient temperature; Self-temperature rise is not included)
-40 to +105°C
(Product temperature; Self- temperature rise is included)
-40 to +125°C
Storage Temperature Range.
-40 to +
125°C
Impedance
at 1MHz
*1 Rated Current(mA)
DC Resistance
Customer
MURATA
ESD
5A: 8kV
Part Number
Part Number
*2
*3
Ambient
temperature
85°C
Ambient
temperature
105°C
(
Ω
)
Tolerance
(
Ω
)
Tolerance
NFZ32BW3R3HZ11L
NFZ32BW6R8HZ11L
NFZ32BW8R4HZ11L
0.024
0.036
0.048
2900
2500
2400
1490
1380
1360
3.3
6.8
8.4
9.8
NFZ32BW9R8HZ11L
NFZ32BW120HZ11L
NFZ32BW190HZ11L
NFZ32BW210HZ11L
NFZ32BW310HZ11L
NFZ32BW520HZ11L
NFZ32BW650HZ11L
NFZ32BW101HZ11L
NFZ32BW151HZ11L
0.053
0.064
0.089
0.100
0.155
0.220
0.295
0.475
0.685
2100
1850
1800
1550
1200
1100
900
1110
910
900
800
610
550
450
330
270
12
19
±30%
±20%
5A
21
31
52
65
100
150
900
700
*1: As for the rated current, rated current derated as figure.1 depending on the operating temperature.
*2: When applied rated current to the Products, temperature rise caused by self heating will be 40°C or less.
*3: When applied rated current to the Products, temperature rise caused by self heating will be 20°C or less.
Rated
Current
Fugure. 1
a
t
8
5
℃
Rated
Current
a
t
1
05
℃
105
85
Operating Temperature
(
Ambien
t
t
emperature
)[
℃
]
MURATA MFG.CO., LTD
Reference Onl
Spec No.JENF243J-9102A-01
4. Testing Conditions
P2/8
《
Unless otherwise specified
》
《
In case of doubt
》
Temperature : Ordinary Temperature (15 to 35°C)
Temperature :
20 ± 2°C
Humidity
: Ordinary Humidity
(25 to 85 %(RH)
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
5.Appearance and Dimensions
2.7±0.2
2.5±0.2
2.5±0.2
3.2±0.3
。
※
No marking.
■
Unit Mass
（
Typical value
）
0.044
ｇ
(in mm)
0.9±0.3 1
0.9±0.3
6.Electrical Performance
No.
Item
Specification
Impedance shall meet item 3.
Test Method
6.1 Impedance
Measuring Equipment :
KEYSIGHT
4192A or equivalent
Measuring Frequency: 1MHz
6.2 DC
Resistance
DC Resistance shall meet item 3.
Measuring Equipment: Digital multi meter
7. AEC-Q200 Requirement
7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
Meet Table A after testing.
No
Stress
Test Method
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
3
High
Temperature
Exposure
Table A
Appearance
No damage
Within ±10%
Within ±10%
Impedance(at 1MHz)
DC Resistance
Change
4
Temperature Cycling
1000cycles
-40 deg C to + 105deg C
Meet Table A after testing.
Set for 24hours at room
temperature,then measured.
7
8
Biased Humidity
Operational Life
1000hours at 85 deg C, 85%RH
unpowered.
Meet Table A after testing.
Meet Table A after testing.
Apply Rated Current 85 deg C
1000 hours
Set for 24hours at room
temperature, then measured
9
External Visual
Visual inspection
No abnormalities
No defects
10 Physical
Dimension
Meet ITEM 5
（
Style and Dimensions
）
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
MURATA MFG.CO., LTD
Reference Onl
Spec No.JENF243J-9102A-01
P3/8
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
13 Mechanical
Shock
Per MIL-STD-202
Method 213
Condition C
100g’s/6ms/Half sine
5g’s for 20 minutes,
12cycles eah of 3 orientations
Test from 10-2000Hz.
Meet Table A after testing.
Meet Table A after testing.
14 Vibration
15 Resistance
to Soldering Heat
No-heating
Pre-heating: 150 to 180C /90
±
30s
Meet Table A after testing.
Solder temperature
260C+/-5 deg C
Immersion time 10s
17 ESD
Per AEC-Q200-002
Per J-STD-002
ESD Rank: Refer to Item 3. Rating
No defects
18 Solderbility
Method b : Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Characterization
20 Flammability
Measured : Inductance
Per UL-94
No defects
Not Applicable
21 Board
Flex
Epoxy-PCB(1.6mm)
Holding time: 5s
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22 Terminal
Strength
Per AEC-Q200-006
No defect
A force of 17.7N for 60s
8.
Specification of Packaging
8.1 Appearance and Dimensions of plastic tape
1.5
+0.1
Lea
d
–
i
n/out wire
※
-0
Dimension of the Cavity is measured
0.2
(
)
at the bottom side.
(in mm)
4.0±0.1
2.0±0.05
4.0±0.1
1.7±0.2
2.9±0.2
Direction of feed
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
MURATA MFG.CO., LTD
Reference Only
Spec No.JENF243J-9102A-01
P4/8
8.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
8.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
300mm/min
0.2 to 0.7N
(minimum value is typical)
Peeling off force
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer
2.0±0.5
:
160 min.
Leader
190 min
Empty tape
210 min
Label
Cover tape
13.0±0.2
1
60±
1
0
21.0±0.8
Direction of feed
9±
0
13±1.4
0
3
(in mm)
180
±
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number(
1) , RoHS marking (
2), Quantity etc
･･･
1) « Expression of Inspection No. »
□□
OOOO
(1)
(2)
(3)
(1)
Factory Code
(2)
Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
1 to 9, Oct. to Dec.
O, N, D
Third, Fourth digit : Day
(3)
Serial No.
2) « Expression of RoHS marking »
ROHS – Y (
△
)
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (
2) ,Quantity, etc
･･･
8.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer
Case (Reel)
Label
H
W
D
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
MURATA MFG.CO., LTD
Reference Onl
Spec No.JENF243J-9102A-01
P5/8
9
.
Caution
9
.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment
(9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
9.2 Caution(Rating)
Do not exceed maximum rated current of the product.
Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
10
. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
10
.1 Land pattern designing
Recommended land pattern for flow and reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to “position shift” in soldering process.
(Reflow)
Land
(Flow)
0.8
Chip Noise Filter
Chip Noise Filter
Solder Resist
Land
2.5
S
o
lder Resist
1.3
2.2
4.8
(in mm)
(in mm)
(Distance between the products for Flow)
(in mm)
10
.2 Flux, Solder
・
Use rosin-based flux.
Flux
・
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・
Don’t use water-soluble flux.
・
Use Sn-3.0Ag-0.5Cu solder
・
Standard thickness of solder paste : 100
μ
m to 150
μ
m
Solder
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
Reference Only
Spec No.JENF243J-9102A-01
P6/8
10
.3 Flow soldering conditions / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
(1)Flow soldering profile
Temp.
(
℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.
(
s)
Standard Profile
Limit Profile
Pre-heating
Heating
150
℃、
60s min.
250
℃、
4s
～
6s
265
℃
±3
℃、
5s
Cycle of flow
2 times
1 time
(2)Reflow soldering profile
Temp.
(℃)
260℃
230℃
245℃±3℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max
90s±30s
Time(s)
Standard Profile
150
～
180°C
、
90s
±
30s
above 220°C
、
30s
～
60s
245
±
3°C
Limit Profile
Pre-heating
Heating
above 230°C
、
60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
MURATA MFG.CO., LTD
Reference Onl
Spec No.JENF243J-9102A-01
P7/8
10
.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ
3mm max.
3 (+1,-0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
2 times
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
10
.5 Solder Volume
･
Solder shall be used not to be exceeded the upper limits as shown below.
･
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Uppre Limit
Recommendable
1/3T
≦
t
≦
T
Ｔ
t
(T: Lower flange thickness)
10
.6 Product’s location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［
Products direction
］
Electrode
Products shall be located in the sideways
direction (Length:a
stress.
b) to the mechanical
(Good example
)
(2) Components location on P.C.B. separation.
Poor example
）
Electrode
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
A
>
D
1
B
A
>
(3) Keep the mounting position of the component away from the board separation surface.
A
>
C
C
Seam
B
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Electrode
D
A
Slit
Electrode
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD
Reference Only
Spec No.JENF243J-9102A-01
P8/8
10
.7 Cleaning
Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
10
.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating
resin, please make sure no reliability issue is observed by evaluating products mounted on your board.
10
.9 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40°C when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
10
.10 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
10
.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10
.12 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don’t keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
11.
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
Mouser Electronics
Authorized Distributor
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