Nexperia-BCV49-135
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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BCV29; BCV49
NPN Darlington transistors
Product data sheet
2004 Dec 06
Supersedes data of 1999 Apr 08
NXP Semiconductors
Product data sheet
NPN Darlington transistors
BCV29; BCV49
FEATURES
PINNING
•
High current (max. 500 mA)
•
Low voltage (max. 60 V)
PIN
1
DESCRIPTION
emitter
collector
base
•
High DC current gain (min. 20000).
2
3
APPLICATIONS
•
Preamplifier input applications.
3
2
DESCRIPTION
NPN small-signal Darlington transistor in a surface mount
SOT89 plastic package. PNP complements: BCV28 and
BCV48.
TR1
TR2
1
MARKING
3
2
1
sym087
TYPE NUMBER
BCV29
MARKING CODE
EF
Fig.1 Simplified
outline (SOT89) and symbol.
BCV49
EG
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
SOT89
BCV29
BCV49
SC-62
plastic surface mounted package; collector pad for good heat
transfer; 3 leads
2004 Dec 06
2
NXP Semiconductors
Product data sheet
NPN Darlington transistors
BCV29; BCV49
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
collector-base voltage
CONDITIONS
open emitter
MIN.
MAX.
UNIT
V
CBO
BCV29
−
−
40
V
V
BCV49
80
V
CES
collector-emitter voltage
BCV29
V
BE
= 0 V
−
−
−
−
−
−
−
30
V
V
V
BCV49
60
V
EBO
I
C
emitter-base voltage
collector current (DC)
peak collector current
peak base current
total power dissipation
storage temperature
junction temperature
ambient temperature
open collector
10
500
1
mA
A
I
CM
I
BM
P
tot
T
stg
T
j
200
1.3
+150
150
+150
mA
W
T
amb
≤
25
°
C; note 1
−
65
−
°
C
°
C
°
C
T
amb
−
65
Note
1. Device
mounted on a printed-circuit board, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
THERMAL CHARACTERISTICS
SYMBOL
R
th(j-a)
PARAMETER
CONDITIONS
note 1
VALUE
96
UNIT
K/W
K/W
thermal resistance from junction to ambient
thermal resistance from junction to soldering point
R
th(j-s)
16
Note
1. Device
mounted on a printed-circuit board, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
2004 Dec 06
3
NXP Semiconductors
Product data sheet
NPN Darlington transistors
BCV29; BCV49
CHARACTERISTICS
T
amb
= 25
°
C unless otherwise specified.
SYMBOL
I
CBO
PARAMETER
CONDITIONS
MIN. TYP.
MAX. UNIT
collector-base cut-off current
BCV29
I
E
= 0 A; V
CB
= 30 V
−
−
−
−
−
−
100
100
100
nA
nA
nA
BCV49
I
E
= 0 A; V
CB
= 60 V
I
C
= 0 A; V
EB
= 10 V
V
CE
= 5 V; see Fig.2
I
C
= 1 mA
I
EBO
h
FE
emitter-base cut-off current
DC current gain
BCV29
4000
−
−
−
−
−
−
−
−
I
C
= 10 mA
10000
20000
4000
I
C
= 100 mA
I
C
= 500 mA
DC current gain
BCV49
V
CE
= 5 V; see Fig.2
I
C
= 1 mA
2000
4000
10000
2000
−
−
−
I
C
= 10 mA
−
−
I
C
= 100 mA
−
−
I
C
= 500 mA
−
−
V
CEsat
V
BEsat
V
BEon
f
T
collector-emitter saturation voltage
I
C
= 100 mA; I
B
= 0.1 mA
−
1
V
base-emitter saturation voltage
base-emitter on-state voltage
transition frequency
I
C
= 100 mA; I
B
= 0.1 mA
I
C
= 10 mA; V
CE
= 5 V
−
−
1.5
1.4
−
V
−
−
V
I
C
= 30 mA; V
CE
= 5 V; f = 100 MHz
−
220
MHz
2004 Dec 06
4
NXP Semiconductors
Product data sheet
NPN Darlington transistors
BCV29; BCV49
MGD837
80000
h
FE
60000
40000
20000
0
10
−
1
2
3
1
10
10
10
I
(mA)
C
V
CE
= 2 V.
Fig.2 DC
current gain; typical values.
2004 Dec 06
5
NXP Semiconductors
Product data sheet
NPN Darlington transistors
BCV29; BCV49
PACKAGE OUTLINE
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads
SOT89
B
A
D
b
p3
E
H
E
L
p
1
2
3
c
b
p2
w
M
b
p1
e
1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b
b
c
D
E
e
e
H
E
L
p
w
p1
p2
p3
1
1.6
1.4
0.48
0.35
0.53
0.40
1.8
1.4
0.44
0.23
4.6
4.4
2.6
2.4
4.25
3.75
1.2
0.8
mm
3.0
1.5
0.13
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
JEITA
04-08-03
06-03-16
SOT89
TO-243
SC-62
2004 Dec 06
6
NXP Semiconductors
Product data sheet
NPN Darlington transistors
BCV29; BCV49
DATA SHEET STATUS
DOCUMENT
STATUS
(1)
PRODUCT
STATUS
(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please
consult the most recently issued document before initiating or completing a design.
2. The
product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General
⎯
Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes
⎯
NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
No offer to sell or license
⎯
Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use
⎯
NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Export control
⎯
This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data
⎯
The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications
⎯
Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values
⎯
Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2004 Dec 06
7
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/06/pp8
Date of release: 2004 Dec 06
Document order number:
9397 750 13863
