Nexperia-BSS123-215

Part #Nexperia-BSS123-215
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Nexperia-BSS123-215
Important notice  
Dear Customer,  
On 7 February 2017 the former NXP Standard Product business became a new company with the  
tradename
Nexperia
. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS  
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable  
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on  
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– © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights  
reserved  
Should be replaced with:  
–
© Nexperia B.V. (year). All rights reserved
.  
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail  
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Kind regards,  
Team Nexperia  

Philips Semiconductors  
Product specification  
N-channel TrenchMOS
 
transistor  
Logic level FET  
BSS123  
FEATURES  
SYMBOL  
QUICK REFERENCE DATA  
d
•
’Trench’
technology  
• Extremely fast switching  
• Logic level compatible  
• Subminiature surface mounting  
package  
V

DSS

= 100 V  
I

D

= 150 mA  
g
R

DS(ON)

≤
6
Ω
(V

GS

= 10 V)  
s
GENERAL DESCRIPTION  
PINNING  
SOT23  
N-channel enhancement mode  
field-effect transistor in a plastic  
PIN  
DESCRIPTION  
3
envelope  
using  
’
trench
’  
1
2
3
gate  
technology.  
Top view  
source  
drain  
Applications:-  
• Relay driver  
• High-speed line driver  
• Telephone ringer  
1
2
The BSS123 is supplied in the  
SOT23 subminiature surface  
mounting package.  
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
V

DSS  

V

DGR  

V

GS  

I

D  

I

DM  

P

D  

Drain-source voltage  
Drain-gate voltage  
T

j

= 25 ˚C to 150˚C  
T

j

= 25 ˚C to 150˚C; R

GS

= 20 k
Ω
 
–
–
–
–
–
–
100  
100  
±
20  
150  
600  
0.25  
150  
V
V
V
mA  
mA  
W
Gate-source voltage  
Continuous drain current  
Pulsed drain current  
Total power dissipation  
Operating junction and  
storage temperature  
T

a

= 25 ˚C  
T

a

= 25 ˚C  
T

a

= 25 ˚C  
T

j

, T

stg  

– 55  
˚C  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP.  
MAX.  
UNIT  
R

th j-a  

Thermal resistance junction
 
surface mounted on FR4 board  
to ambient  
500  
–
K/W  
August 2000  
1
Rev 1.000  

Philips Semiconductors  
Product specification  
N-channel TrenchMOS
 
transistor  
Logic level FET  
BSS123  
ELECTRICAL CHARACTERISTICS  
T

j

= 25˚C
 
unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP.
 
MAX. UNIT  
V

(BR)DSS  

Drain-source breakdown  
voltage  
V

GS

= 0 V; I

D

= 10
µ
A  
100  
130  
–
V
V

GS(TO)  

R

DS(ON)  

Gate threshold voltage  
Drain-source on-state  
resistance  
V

DS

= V

GS

; I

D

= 1 mA  
V

GS

= 10 V; I

D

= 120 mA  
1
–
2
3.5  
2.8  
6
V
Ω
g

fs  

Forward transconductance  
V

DS

= 25 V; I

D

= 120 mA  
V

DS

= 60 V; V

GS

= 0 V  
–
–
350  
10  
–
mS  
nA  
I

DSS  

Zero gate voltage drain  
current  
100  
I

GSS  

t

on  

Gate source leakage current
 
V

GS

=
±
20 V; V

DS

= 0 V  
–
–
10  
3
100  
10  
nA  
ns  
Turn-on time  
V

DD

= 50 V; R

D

= 250
Ω
; V

GS

= 10 V;  
R

G

= 50
Ω
; Resistive load  
t

off  

Turn-off time  
–
12  
20  
ns  
C

iss  

C

oss  

C

rss  

Input capacitance  
Output capacitance  
Feedback capacitance  
V

GS

= 0 V; V

DS

= 25 V; f = 1 MHz  
–
–
–
23  
6
4
40  
25  
10  
pF  
pF  
pF  
August 2000  
2
Rev 1.000  

Philips Semiconductors  
Product specification  
N-channel TrenchMOS
 
transistor  
Logic level FET  
BSS123  
MECHANICAL DATA  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w
M  
B
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT23  
Fig.1. SOT23
 
surface mounting package.  
Notes  
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static  
discharge during transport or handling.  
2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.  
3. Epoxy meets UL94 V0 at 1/8″.  
August 2000  
3
Rev 1.000  

Philips Semiconductors  
Product specification  
N-channel TrenchMOS
 
transistor  
Logic level FET  
BSS123  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification
 
This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134).
 
Stress above one  
or more of the limiting values may cause permanent damage to the device.
 
These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied.
 
Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 2000  
All rights are reserved.
 
Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice.
 
No liability will be accepted by the publisher for any  
consequence of its use.
 
Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury.
 
Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
August 2000  
4
Rev 1.000