Nexperia-BSS138BKVL
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BSS138BK
60
V
,
3
60 mA N-channel Trench MOSFET
Rev. 1 — 4 August 2011
Product data sheet
1. Product
profile
1.1 General
description
N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23
(TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET
technology.
1.2 Features
and benefits
Logic-level compatible
Very fast switching
ESD protection up to 1.5 kV
AEC-Q101 qualified
Trench MOSFET technology
1.3 Applications
Relay driver
Low-side loadswitch
Switching circuits
High-speed line driver
1.4 Quick
reference data
Table 1.
Symbol
V
DS
Quick reference data
Parameter
Conditions
Min Typ Max
Unit
drain-source voltage
gate-source voltage
drain current
T
j
= 25 °C
–
–
–
–
60
20
V
V
V
GS
-20
–
[1]
I
D
V
GS
= 10 V; T
amb
= 25 °C
360 mA
Static characteristics
R
DSon
drain-source on-state
resistance
V
GS
= 10 V; I
D
= 350 mA;
T
j
= 25 °C
–
1
1.6
Ω
[1] Device
mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
2. Pinning
information
Table 2.
Pinning information
Symbol Description
Pin
1
Simplified outline
Graphic symbol
G
S
D
gate
D
3
2
source
drain
3
G
1
2
SOT23 (TO-236AB)
S
017aaa255
3. Ordering
information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
SOT23
BSS138BK
TO-236AB
plastic surface-mounted package; 3 leads
4. Marking
Table 4.
Marking codes
Type number
BSS138BK
Marking code
[1]
%SB
[1] %
= placeholder for manufacturing site code.
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
2 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
5. Limiting
values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
Parameter
Conditions
Min
Max
60
Unit
V
drain-source voltage
gate-source voltage
drain current
T
j
= 25 °C
–
V
GS
-20
20
V
[1]
[1]
I
D
V
GS
= 10 V; T
amb
= 25 °C
V
GS
= 10 V; T
amb
= 100 °C
T
amb
= 25 °C; single pulse; t
p
≤
10 µs
T
amb
= 25 °C
–
360
230
1.2
mA
mA
A
–
I
DM
P
tot
peak drain current
–
[2]
[1]
total power dissipation
–
350
420
1140
150
150
150
mW
mW
mW
°C
–
T
sp
= 25 °C
–
T
j
junction temperature
ambient temperature
storage temperature
-55
-55
-65
T
amb
T
stg
°C
°C
Source-drain diode
[1]
[3]
I
S
source current
T
amb
= 25 °C
–
–
360
mA
V
ESD maximum rating
V
ESD
electrostatic discharge voltage
HBM
1500
[1] Device
mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
[2] Device
mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[3] Measured
between all pins.
001aao121
001aao122
120
120
P
I
der
(%)
der
(%)
80
80
40
0
40
0
-75
-25
25
75
125
175
-75
-25
25
75
125
175
T (°C)
j
T (°C)
j
Fig 1.
Normalized total power dissipation as a
function of junction temperature
Fig 2.
Normalized continuous drain current as a
function of junction temperature
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
3 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
aaa-000157
10
I
D
(A)
1
(1)
(2)
-1
10
(3)
(4)
-2
10
10
(5)
-3
10
-1
2
1
10
10
V
(V)
DS
I
DM
is a single pulse
(1) t
p
= 1 ms
(2) t
p
= 10 ms
(3) t
p
= 100 ms
(4) DC; T
sp
= 25 °C
(5) DC; T
amb
= 25 °C; 1 cm
2
drain mounting pad
Fig 3.
Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source
voltage
6. Thermal
characteristics
Table 6.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
310
260
–
Max
370
300
115
Unit
K/W
K/W
K/W
[1]
[2]
thermal resistance from junction to ambient
in free air
–
–
–
R
th(j-sp)
thermal resistance from junction to solder
point
[1] Device
mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device
mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
4 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
017aaa015
3
10
duty cycle = 1
0.75
Z
th(j-a)
(K/W)
0.5
0.33
0.2
2
10
0.25
0.1
0
0.05
0.02
0.01
10
1
10
−
3
−
2
−
1
2
3
10
10
1
10
10
10
t
(s)
p
FR4 PCB, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
017aaa016
3
10
Z
th(j-a)
duty cycle = 1
0.75
(K/W)
0.5
2
0.33
0.2
10
0.25
0.1
0.05
0.02
0.01
0
10
1
10
−
3
−
2
−
1
2
3
10
10
1
10
10
10
t
(s)
p
FR4 PCB, mounting pad for drain 1 cm
2
Fig 5.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
5 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
7. Characteristics
Table 7.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V
(BR)DSS
drain-source
breakdown voltage
I
D
= 250 µA; V
GS
= 0 V; T
j
= 25 °C
60
–
–
V
V
V
GSth
gate-source threshold
I
D
= 250 µA; V
DS
= V
GS
; T
j
= 25 °C
voltage
0.48
1.1
1.6
I
DSS
drain leakage current
V
DS
= 60 V; V
GS
= 0 V; T
j
= 25 °C
V
DS
= 60 V; V
GS
= 0 V; T
j
= 150 °C
V
GS
= 20 V; V
DS
= 0 V; T
j
= 25 °C
V
GS
= -20 V; V
DS
= 0 V; T
j
= 25 °C
V
GS
= 10 V; V
DS
= 0 V; T
j
= 25 °C
V
GS
= -10 V; V
DS
= 0 V; T
j
= 25 °C
V
GS
= 10 V; I
D
= 350 mA; T
j
= 25 °C
V
GS
= 10 V; I
D
= 350 mA; T
j
= 150 °C
V
GS
= 4.5 V; I
D
= 200 mA; T
j
= 25 °C
V
GS
= 2.5 V; I
D
= 10 mA; T
j
= 25 °C
V
DS
= 10 V; I
D
= 200 mA; T
j
= 25 °C
–
–
–
–
–
–
–
–
–
–
–
–
1
µA
µA
µA
µA
µA
µA
Ω
–
10
10
10
1
I
GSS
R
DSon
g
fs
gate leakage current
–
–
–
–
1
drain-source on-state
resistance
1
1.6
3.2
2.2
6.5
–
2
Ω
1.1
1.4
700
Ω
Ω
forward
mS
transconductance
Dynamic characteristics
Q
G(tot)
Q
GS
Q
GD
C
iss
total gate charge
V
DS
= 30 V; I
D
= 300 mA; V
GS
= 4.5 V;
T
j
= 25 °C
–
–
–
–
–
–
0.6
0.1
0.2
42
7
0.7
nC
nC
nC
pF
pF
pF
gate-source charge
gate-drain charge
input capacitance
output capacitance
–
–
V
DS
= 10 V; f = 1 MHz; V
GS
= 0 V;
T
j
= 25 °C
56
–
C
oss
C
rss
reverse transfer
capacitance
4
–
t
d(on)
t
r
t
d(off)
t
f
turn-on delay time
rise time
V
DS
= 40 V; R
L
= 250
Ω
; V
GS
= 10 V;
R
G(ext)
= 6
Ω
; T
j
= 25 °C
–
–
–
–
5
10
–
ns
ns
ns
ns
5
turn-off delay time
fall time
38
20
76
–
Source-drain diode
V
SD
source-drain voltage
I
S
= 300 mA; V
GS
= 0 V; T
j
= 25 °C
0.47
0.8
1.2
V
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
6 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
aaa-000158
aaa-000159
-3
-4
-5
-6
0.4
10
D
2 V
10 V
2.5 V
I
D
(A)
I
(A)
0.3
10
(1)
(2)
(3)
1.75 V
1.5 V
0.2
0.1
0
10
10
V
= 1.25 V
GS
0
1
2
3
4
0
0.5
1.0
1.5
2.0
V
(V)
V
(V)
GS
DS
T
j
= 25 °C
T
j
= 25 °C; V
DS
= 5 V
(1) minimum values
(2) typical values
(3) maximum values
Fig 6.
Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 7.
Sub-threshold drain current as a function of
gate-source voltage
aaa-000160
aaa-000161
6
6
R
R
DS(on)
(Ω)
DS(on)
(Ω)
(1)
4
2
0
4
2
0
(2)
(3)
(1)
(2)
(4)
(5)
(6)
0
0.1
0.2
0.3
0.4
0
2
4
6
8
10
(V)
I
(A)
V
GS
D
T
j
= 25 °C
I
D
= 300 mA
(1) T
j
= 150 °C
(2) T
j
= 25 °C
(1) V
GS
= 1.5 V
(2) V
GS
= 1.75 V
(3) V
GS
= 2.0 V
(4) V
GS
= 2.25 V
(5) V
GS
= 4.5 V
(6) V
GS
= 10 V
Fig 8.
Drain-source on-state resistance as a function
of drain current; typical values
Fig 9.
Drain-source on-state resistance as a function
of gate-source voltage; typical values
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
7 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
aaa-000162
aaa-000163
0.6
2
1.5
1
a
(1)
(2)
I
D
(A)
0.4
0.2
0
0.5
(2)
(1)
0
0
1.0
2.0
3.0
-60
0
60
120
180
V
(V)
T =
(°C)
j
GS
V
DS
> I
D
x R
DSon
(1) T
j
= 25 °C
(2) T
j
= 150 °C
Fig 10.
Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 11.
Normalized drain-source on-state resistance as
a function of junction temperature; typical
values
aaa-000164
aaa-000165
2
2
10
V
GS(th)
(V)
(1)
C
1.5
1
(pF)
(2)
(1)
10
(3)
(2)
(3)
0.5
0
1
-1
2
-60
0
60
120
180
10
1
10
10
T (°C)
V
(V)
DS
j
I
D
= 0.25 mA; V
DS
= V
GS
(1) maximum values
(2) typical values
f = 1 MHz; V
GS
= 0 V
(1) C
iss
(2) C
oss
(3) minimum values
(3) C
rss
Fig 12.
Gate-source threshold voltage as a function of
junction temperature
Fig 13.
Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
8 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
aaa-000166
10
V
DS
V
GS
(V)
I
8
6
4
2
0
D
V
GS(pl)
V
V
GS(th)
GS
Q
Q
GS1
GS2
Q
Q
GD
GS
Q
G(tot)
003aaa508
0
0.2
0.4
0.6
0.8
1.0
1.2
(nC)
1.4
Q
G
I
D
= 0.3 A; V
DS
= 30 V; T
amb
= 25 °C
Fig 14.
Gate-source voltage as a function of gate
charge; typical values
Fig 15.
Gate charge waveform definitions
aaa-000167
0.4
I
S
(A)
0.3
(1)
(2)
0.2
0.1
0
0
0.4
0.8
1.2
V
(V)
SD
V
GS
= 0 V
(1) T
j
= 150 °C
(2) T
j
= 25 °C
Fig 16.
Source current as a function of source-drain voltage; typical values
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
9 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
8. Test
information
t
t
1
2
P
duty cycle
δ
=
t
2
t
1
t
006aaa812
Fig 17.
Duty cycle definition
8.1 Quality
information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard
Q101 – Stress test qualification for discrete semiconductors
, and is
suitable for use in automotive applications.
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
10 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
9. Package
outline
Plastic surface-mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w
M
B
1
L
p
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
JEITA
04-11-04
06-03-16
SOT23
TO-236AB
Fig 18.
Package outline SOT23 (TO-236AB)
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
11 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
10. Soldering
3.3
2.9
1.9
solder lands
solder resist
2
3
1.7
solder paste
occupied area
0.6
0.7
(3
×
)
(3
×
)
Dimensions in mm
0.5
(3
×
)
0.6
(3
×
)
1
sot023_fr
Fig 19.
Reflow soldering footprint for SOT23 (TO-236AB)
2.2
1.2
(2
×
)
1.4
(2
×
)
solder lands
solder resist
2.6
4.6
occupied area
Dimensions in mm
1.4
preferred transport direction during soldering
2.8
4.5
sot023_fw
Fig 20.
Wave soldering footprint for SOT23 (TO-236AB)
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
12 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
11. Revision
history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BSS138BK v.1
20110804
Product data sheet
–
–
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
13 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
12. Legal information
12.1 Data
sheet status
Document status
[1] [2]
Product status
[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet
Qualification
Product [short] data sheet
Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
Right to make changes
— Nexperia reserves the right to make
12.2 Definitions
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Preview
— The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
Nexperia does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Suitability for use
— Nexperia products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of a Nexperia product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Nexperia accepts no liability for inclusion and/or use of
Nexperia products in such equipment or applications and
Draft
— The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data
— The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Short data sheet
— A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications
— Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Product specification
— The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Nexperia and its customer, unless Nexperia and
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the Nexperia
product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the Nexperia product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability
— Information in this document is believed to
be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
Nexperia does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the
customer’s applications and products using Nexperia
products in order to avoid a default of the applications and
In no event shall Nexperia be liable for any indirect, incidental,
punitive, special or consequential damages (including – without limitation – lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
the products or of the application or use by customer’s third party
customer(s). Nexperia does not accept any liability in this respect.
Limiting values
— Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Notwithstanding any damages that customer might incur for any reason
whatsoever,
Nexperia’s
aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the
Terms and conditions of commercial sale
of Nexperia.
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
14 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
Terms and conditions of commercial sale
— Nexperia
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
products are sold subject to the general terms and conditions of commercial
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. Nexperia hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of Nexperia products by customer.
No offer to sell or license
— Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control
— This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
13. Contact information
BSS138BK
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet
Rev. 1 — 4 August 2011
15 of 16
BSS138BK
Nexperia
60
V
,
3
60 mA N-channel Trench MOSFET
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
1.2
1.3
1.4
General description
. . . . . . . . . . . . . . . . . . . . . .1
Features and benefit
s
. . . . . . . . . . . . . . . . . . . . .1
Applications .
. . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data
. . . . . . . . . . . . . . . . . . . . .1
2
Pinning informatio
n
. . . . . . . . . . . . . . . . . . . . . . .2
Ordering informatio
n
. . . . . . . . . . . . . . . . . . . . . .2
Markin
g
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics
. . . . . . . . . . . . . . . . . . .4
Characteristic
s
. . . . . . . . . . . . . . . . . . . . . . . . . . .6
Test informatio
n
. . . . . . . . . . . . . . . . . . . . . . . . .
1
0
Quality information . . . . . . . . . . . . . . . . . . . . . .10
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
.
1
1
Soldering .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Revision histor
y
. . . . . . . . . . . . . . . . . . . . . . . . .13
3
4
5
6
7
8
8.1
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . .14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .14
Definition
s
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Disclaimer
s
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .15
12.1
12.2
12.3
12.4
13
Contact information. . . . . . . . . . . . . . . . . . . . . .15
©
Nexperia B.V. 2017. All rights reserved
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release:
04 August 2011
