Nexperia-BST82-235

Part #Nexperia-BST82-235
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Nexperia-BST82-235
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. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS  
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on  
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BST82  
N-channel enhancement mode field-effect transistor  
Rev. 03 — 26 July 2000  
Product specification  
1. Description  
N-channel enhancement mode field-effect transistor in a plastic package using  
T
r
enchMOS™

1

technolog
y
.  
Product availability:  
BST82 in SOT23.  
2. Features  
■
T
r
enchMOS™ technology  
■
Very fast switching  
■
Logic level compatible  
■
Subminiature surface mount package.  
3. Applications  
■
Relay driver  
■
High speed line driver  
■
Logic level translator.  
c
c
4. Pinning
 
information  
Table 1:
 
Pinning – SOT23, simplified outline and symbol  
Pin  
1
Description  
gate (g)  
Simplified outline  
Symbol  
3
d
2
source (s)  
drain (d)  
3
g
03ab44  
03ab30  
s
1
2
SOT23  
N-channel MOSFET  
1.
T
r
enchMOS
 
is a trademark of Royal Philips Electronics.  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
5. Quick
 
reference data  
Table 2:
 
Quick reference data  
Symbol Parameter  
Conditions  
Typ  
−
Max  
100  
190  
0.83  
150  
10  
Unit  
V
V

DS  

I

D  

drain-source voltage (DC)  
drain current (DC)  
T

j

= 25 to 150
°
C  
T

sp

= 25
°
C; V

GS

= 5 V  
T

sp

= 25
°
C  
−
mA  
W
P

tot  

T

j  

total power dissipation  
junction temperature  
−
−
°
C  
Ω
R

DSon  

drain-source on-state resistance  
V

GS

= 5 V; I

D

= 150 mA  
5
6. Limiting
 
values  
Table 3:
 
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Min  
−
Max  
100  
100  
±
20  
190  
120  
0.8  
Unit  
V
V

DS  

V

DGR  

V

GS  

I

D  

drain-source voltage (DC)  
T

j

= 25 to 150
°
C  
drain-gate voltage (DC)  
gate-source voltage (DC)  
drain current (DC)  
T

j

= 25 to 150
°
C; R

GS

= 20 k
Ω  
−
V
−
V
T

sp

= 25
°
C; V

GS

= 5 V;
Figure 2
and
3  
T

sp

= 100
°
C; V

GS

= 5 V;
Figure 2  
−
mA  
mA  
A
−
I

DM  

peak drain current  
T

sp

= 25
°
C; pulsed; t

p

≤
10
µ
s;  
−
Figure 3  
P

tot  

T

stg  

T

j  

total power dissipation  
storage temperature  
T

sp

= 25
°
C;
Figure 1  
−
0.83  
W
−
65  
−
65  
+150  
+150  
°
C  
°
C  
operating junction temperature  
Source-drain diode  
I

S  

source (diode forward) current (DC)  
peak source (diode forward) current  
T

sp

= 25
°
C  
−
−
190  
0.8  
mA  
A
I

SM  

T

sp

= 25
°
C; pulsed; t

p

≤
10
µ
s  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
2 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
03aa17  
03aa25  
120  
120  
P
der  
(%)  
100  
I
der  
(%)  
100  
80  
60  
40  
20  
0
80  
60  
40  
20  
0
0
25  
50  
75  
100 125 150 175  
o
0
25  
50  
75  
100 125 150 175  
o
T
( C)  
sp  
T
( C)  
sp  
V

GS

≥
5 V  
P

tot  

P

der  

=
×
100
%
 
———————-  
P
I

D  

°
tot
(
25
C
)  
I

der  

=
×
100
%  
——————  
I
°
D
(
25
C
)  
Fig 1.
 
Normalized total power dissipation as a  
function of solder point temperature.  
Fig 2.
 
Normalized continuous drain current as a  
function of solder point temperature.  
03aa60  
1
t
= 10
µ
s  
p
R
= V
 
/ I  
DS  
DSon  
D
I
D
(A)  
100
µ
s  
-1  
10  
1 ms  
10 ms  
100 ms  
D.C.  
t
p
P
δ
=
-2  
T
10  
t
t
p
T
o
T
V
= 25
 
C  
sp  
-3  
10  
2
3
10  
1
10  
10  
(V)  
DS  
T

sp

= 25
°
C; I

DM

is single pulse.  
Fig 3.
 
Safe operating area; continuous and peak drain currents as a function of drain-source voltage.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
3 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
7. Thermal
 
characteristics  
Table 4:
 
Thermal characteristics  
Symbol  
Parameter  
Conditions  
Value  
Unit  
R

th(j-sp)  

thermal resistance from junction to solder  
point  
mounted on a metal clad substrate;  
Figure 4  
150  
K/W  
R

th(j-a)  

thermal resistance from junction to ambient  
mounted on a printed circuit board;  
minimum footprint  
350  
K/W  
7.1 Transient
 
thermal impedance  
03aa57  
3
10  
Z
th(j-sp)  
(K/W)  
δ
= 0.5  
0.2  
2
10  
0.1  
10  
0.05  
0.02  
t
p
P
δ
=  
T
single pulse  
1
t
t
p
T
0.1  
-5  
-4  
-3  
10  
-2  
10  
-1  
10  
10  
10  
1
10  
t
(s)  
p
Mounted on a metal substrate.  
Fig 4.
 
Transient thermal impedance from junction to solder point as a function of  
pulse duration.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
4 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
8. Characteristics  
Table 5:
 
Characteristics  
T

j

= 25
°
C unless otherwise specified  
Symbol  
Static characteristics  
V

(BR)DSS

drain-source breakdown  
voltage  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
I

D

= 10
µ
A; V

GS

= 0 V  
T

j

= 25
°
C  
100  
89  
130  
−
−
V
V
T

j

=
−
55
°
C  
−
V

GS(th)  

gate-source threshold voltage
 
I

D

= 1 mA; V

DS

= V

GS  

Figure 9  
;
T

j

= 25
°
C  
T

j

= 150
°
C  
T

j

=
−
55
°
C  
1
2
−
−
−
V
V
V
0.6  
−
−
3.5  
I

DSS  

drain-source leakage current
 
V

DS

= 60 V; V

GS

= 0 V  
T

j

= 25
°
C  
T

j

= 150
°
C  
−
−
−
0.01  
−
1.0  
10  
µ
A  
µ
A  
nA  
I

GSS  

gate-source leakage current
 
V

GS

=
±
20 V; V

DS

= 0 V  
10  
100  
R

DSon  

drain-source on-state  
resistance  
V

GS

= 5 V; I

D

= 150 mA;  
Figure 7
and
8  
T

j

= 25
°
C  
−
−
5
10  
23  
Ω
Ω
T

j

= 150
°
C  
−
Dynamic characteristics  
g

fs  

forward transconductance  
V

DS

= 5 V; I

D

= 175 mA;  
Figure 11  
−
350  
−
mS  
C

iss  

C

oss  

C

rss  

t

on  

input capacitance  
output capacitance  
reverse transfer capacitance  
turn-on time  
V

GS

= 0 V; V

DS

= 10 V;  
f = 1 MHz;
Figure 12  
−
−
−
−
−
25  
8.5  
5
40  
15  
10  
10  
15  
pF  
pF  
pF  
ns  
ns  
V

DD

= 50 V; R

D

= 250
Ω
;  
V

GS

= 10 V; R

G

= 50
Ω
;  
R

GS

= 50
Ω  
3
t

off  

turn-off time  
12  
Source-drain diode  
V

SD  

source-drain (diode forward)
 
I

S

= 300 mA; V

GS

= 0 V;  
−
0.95  
1.5  
V
voltage  
Figure 13  
t

rr  

reverse recovery time  
recovered charge  
I

S

= 300 mA;  
dI

S

/dt =
−
100 A/
µ
s;  
V

GS

= 0 V; V

DS

= 25 V  
−
−
30  
30  
−
−
ns  
Q

r  

nC  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
5 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
03aa63  
= 10V  
03aa65  
0.5  
I
0.7  
I
o
D
D
T =
 
25  
C
V
GS  
j
V
> I
 
X R  
D
0.45  
DS  
DSon  
(A)  
(A)  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
5 V  
0.4  
0.35  
0.3  
o
T =
 
25  
C
j
4 V  
0.25  
0.2  
o
C
150  
3.5 V  
3 V  
0.15  
0.1  
0.05  
0
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
(V)  
2
0
1
2
3
4
5
6
7
8
V
V
(V)  
GS  
DS  
T

j

= 25
°
C  
T

j

= 25
°
C and 150
°
C; V

DS

>
I

D

×
R

DSon  

Fig 5.
 
Output characteristics: drain current as a  
function of drain-source voltage; typical values.  
Fig 6.
 
Transfer characteristics: drain current as a  
function of gate-source voltage; typical values.  
03aa29  
03aa64  
3
12  
a
o
T =
 
25 C  
2.8  
3 V  
3.5V  
j
R
11  
10  
9
DSon  
(
Ω
)  
2.6  
2.4  
2.2  
2
4 V  
8
1.8  
1.6  
1.4  
1.2  
1
7
6
5 V  
5
4
V
= 10V  
GS  
0.8  
0.6  
0.4  
0.2  
0
3
2
1
0
-60  
-20  
20  
60  
100  
140  
180  
0
0.1  
0.2  
0.3  
0.4  
(A)  
0.5  
o
T ( C)  
I
D
j
T

j

= 25
°
C  
R

DSon  

a
=  
—————————  
R

DSon
(
25
C
)  

°
Fig 7.
 
Drain-source on-state resistance as a function  
of drain current; typical values.  
Fig 8.
 
Normalized drain-source on-state resistance  
factor as a function of junction temperature.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
6 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
03aa34  
03aa37  
3
-1  
10  
I
V
D
GS(th)  
(V)
2.5  
(A)  
-2  
10  
typ  
2
min  
typ  
-3  
-4  
-5  
-6  
10  
10  
10  
10  
1.5  
min  
1
0.5  
0
-60  
-20  
20  
60  
100  
140  
180  
0
0.5  
1
1.5  
2
2.5  
3
o
T ( C)  
V
(V)  
j
GS  
I

D

= 1 mA; V

DS

= V

GS  

T

j

= 25
°
C; V

DS

= 5 V  
Fig 9.
 
Gate-source threshold voltage as a function of  
junction temperature.  
Fig 10. Sub-threshold drain current as a function of  
gate-source voltage.  
03aa66  
03aa68  
0.5  
2
10  
g
fs  
0.45  
0.4  
V
> I
 
X R  
DSon  
(S)  
DS  
D
C
, C  
,
iss oss  
o
T =
 
25  
C
C
(pF)  
10  
j
rss  
C
iss  
0.35  
0.3  
0.25  
0.2  
o
150  
C
C
oss  
0.15  
0.1  
0.05  
0
C
rss  
1
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
(A)  
0.7  
-1  
2
10  
10  
1
10  
V
(V)  
I
DS  
D
T

j

= 25
°
C and 150
°
C; V

DS

>
I

D

×
R

DSon  

V

GS

= 0 V; f = 1 MHz  
Fig 11. Forward transconductance as a function of  
drain current; typical values.  
Fig 12. Input, output and reverse transfer capacitances  
as a function of drain-source voltage; typical  
values.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
7 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
03aa67  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
I
S
V
= 0 V  
(A)  
GS  
o
150  
C
o
T =
 
25  
C
j
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
V
(V)  
SD  
T

j

= 25
°
C and 150
°
C; V

GS

= 0 V  
Fig 13. Source (diode forward) current as a function of source-drain (diode forward)  
voltage; typical values.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
8 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
9. Package
 
outline  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w
M  
B
1
L
p
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
p
c
D
E
e
e
H
L
Q
v
w
A
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
97-02-28  
99-09-13  
SOT23  
TO-236AB  
Fig 14. SOT23.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
9 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
10. Revision history  
Table 6:
 
Revision history  
Rev Date  
CPCN  
Description  
03 20000726 HZG303  
Product specification; third version; supersedes BST82_CNV_2 of 970623.  
Converted from VDMOS (Nijmegen) to
T
r
enchMOS™ technology (Hazel Grove).  
Product specification; second version.  
02 19970623  
01 19901031  
–
–
Product specification; initial version.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
10 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
11. Data sheet status  
[1]  
Datasheet status  
Product status
 
Definition  
Development  
Objective specification  
This data sheet contains the design target or goal specifications for product development. Specification may  
change in any manner without notice.  
Preliminary specification
 
Qualification  
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to make changes at any time without notice in order to improve design and  
supply the best possible product.  
Product specification  
Production  
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any  
time without notice in order to improve design and supply the best possible product.  
[1]  
Please consult the most recently issued data sheet before initiating or completing a design.  
12. Definitions  
13. Disclaimers  
Short-form specification
 
—
The data in  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
a
short-form specification is  
Life support —
These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injur
y
.
P
hilips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition
 
—
Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC
 
60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliabilit
y
.  
Right to make changes —
Philips Semiconductors reserves the right to  
make changes, without notice, in the products, including circuits, standard  
cells, and/or software, described or contained herein in order to improve  
design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
licence or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products  
are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Application information
 
—
Applications that are described herein for any  
of these products are for illustrative purposes onl
y
.
P
hilips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
9397 750 07223  
© Philips Electronics N.
V
.
2
000 All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
11 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
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O. Box 218, 5600 MD EINDHOVEN,  
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(SCA70)  
9397 750 07223  
© Philips Electronics N.
V
.
2
000. All rights reserved.  
Product specification  
Rev. 03 — 26 July 2000  
12 of 13  

BST82  
N-channel enhancement mode field-effect transistor  
Philips Semiconductors  
Contents  
1
Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
Applications
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
Pinning informatio
n
. . . . . . . . . . . . . . . . . . . . . .
 
1  
Quick reference data
. . . . . . . . . . . . . . . . . . . . .
 
2  
Limiting values
. . . . . . . . . . . . . . . . . . . . . . . . . .
 
2  
Thermal characteristics
. . . . . . . . . . . . . . . . . . .
 
4  
Transient thermal impedance . . . . . . . . . . . . . .
 
4  
Characteristic
s
. . . . . . . . . . . . . . . . . . . . . . . . . .
 
5  
Package outline
. . . . . . . . . . . . . . . . . . . . . . . . .
 
9  
Revision histor
y
. . . . . . . . . . . . . . . . . . . . . . . .
 
10  
Data sheet status
. . . . . . . . . . . . . . . . . . . . . . .
 
11  
Definitions
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
11  
Disclaimers
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
11  
2
3
4
5
6
7
7.1  
8
9
10  
11  
12  
13  
© Philips Electronics N.V. 2000.  
Printed in The Netherlands  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or  
contract, is believed to be accurate and reliable and may be changed without notice. No  
liability will be accepted by the publisher for any consequence of its use. Publication  
thereof does not convey nor imply any license under patent- or other industrial or  
intellectual property rights.  
Date of release: 26 July 2000  
Document order number: 9397 750 07223