Nexperia-PMBTA42-235

Part #Nexperia-PMBTA42-235
Download 
Nexperia-PMBTA42-235
Important notice  
Dear Customer,  
On 7 February 2017 the former NXP Standard Product business became a new company with the  
tradename
Nexperia
. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS  
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable  
application markets  
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use  
the references to Nexperia, as shown below.  
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on  
the version, as shown below:  
– © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights  
reserved  
Should be replaced with:  
–
© Nexperia B.V. (year). All rights reserved
.  
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail  
or telephone (details via

). Thank you for your cooperation and  
understanding,  
Kind regards,  
Team Nexperia  

PMBTA42  
300
V
,
1
00 mA NPN high-voltage transistor  
Rev. 05 — 12 December 2008  
Product data sheet  
1. Product
 
profile  
1.1 General
 
description  
NPN high-voltage transistor in a small SOT23 (TO-236AB) Surface-Mounted  
Device (SMD) plastic package.  
PNP complement: PMBTA92.  
1.2 Features  
„
High voltage (max. 300 V)  
1.3 Applications  
„
T
e
lephony and professional communication equipment  
1.4 Quick
 
reference data  
Table 1.  
Symbol  
V

CEO  

I

C  

Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
collector-emitter voltage  
collector current  
open base  
–
–
–
–
300  
100  
V
mA  
h

FE  

DC current gain  
V

CE

= 10 V  
I

C

= 1 mA  
I

C

= 10 mA  
I

C

= 30 mA  
25  
40  
40  
–
–
–
–
–
–
2. Pinning
 
information  
Table 2.  
Pinning  
Pin  
1
Description  
base  
Simplified outline  
Graphic symbol  
3
3
2
emitter  
3
collector  
1
1
2
2
sym021  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
3. Ordering
 
information  
Table 3.  
Ordering information  
Type number

[1]

Package  
Name  
Description  
Version  
PMBTA42  
–
plastic surface-mounted package; 3 leads  
SOT23  
PMBTA42/DG  
[1] /DG:
 
halogen-free  
4. Marking  
Table 4.  
Marking codes  
Type number

[1]  

Marking code

[2]  

PMBTA42  
*1D  
*BV  
PMBTA42/DG  
[1] /DG:
 
halogen-free  
[2] *
 
= -: made in Hong Kong  
* = p: made in Hong Kong  
* = t: made in Malaysia  
* = W: made in China  
5. Limiting
 
values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
V

CBO  

V

CEO  

V

EBO  

I

C  

Parameter  
Conditions  
open emitter  
open base  
Min  
Max  
300  
300  
6
Unit  
V
collector-base voltage  
collector-emitter voltage  
emitter-base voltage  
collector current  
–
–
–
–
–
V
open collector  
V
100  
200  
mA  
mA  
I

CM  

peak collector current  
single pulse;  
t

p

≤
1 ms  
I

BM  

peak base current  
single pulse;  
–
100  
mA  
t

p

≤
1 ms  
[1]  
P

tot  

T

j  

total power dissipation  
junction temperature  
ambient temperature  
storage temperature  
T

amb

≤
25
°
C  
–
250  
mW  
°
C  
–
150  
T

amb  

T

stg  

−
65  
−
65  
+150  
+150  
°
C  
°
C  
[1] Device
 
mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
PMB
T
A42_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 12 December 2008  
2 of 9  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
6. Thermal
 
characteristics  
Table 6.  
Symbol  
R

th(j-a)  

Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
500 K/W  
[1]  
thermal resistance from  
junction to ambient  
in free air  
–
–
[1] Device
 
mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
7. Characteristics  
Table 7.  
Characteristics  
T

amb

= 25
°
C unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
I

CBO  

collector-base cut-off  
current  
V

CB

= 200 V; I

E

= 0 A  
–
–
100  
nA  
I

EBO  

h

FE  

emitter-base cut-off  
current  
V

EB

= 6 V; I

C

= 0 A  
–
–
100  
nA  
DC current gain  
V

CE

= 10 V  
I

C

= 1 mA  
25  
40  
40  
–
–
–
–
–
–
I

C

= 10 mA  
–
I

C

= 30 mA  
–
V

CEsat  

V

BEsat  

C

re  

collector-emitter  
saturation voltage  
I

C

= 20 mA; I

B

= 2 mA  
500  
mV  
mV  
pF  
base-emitter saturation
 
I

C

= 20 mA; I

B

= 2 mA  
voltage  
–
–
–
–
900  
feedback capacitance
 
V

CB

= 20 V; I

C

= i

c

= 0 A;  
f = 1 MHz  
–
3
–
f

T  

transition frequency  
V

CE

= 20 V; I

C

= 10 mA;  
f = 100 MHz  
50  
MHz  
PMB
T
A42_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 12 December 2008  
3 of 9  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
8. Package
 
outline  
Plastic surface-mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w
M  
B
1
L
p
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
04-11-04  
06-03-16  
SOT23  
TO-236AB  
Fig 1.
 
Package outline SOT23 (TO-236AB)  
PMB
T
A42_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 12 December 2008  
4 of 9  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
9. Packing
 
information  
Table 8.  
Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.

[1]  

Type number
 
Package Description  
Packing quantity  
3000  
10000  
PMBTA42  
SOT23  
4 mm pitch, 8 mm tape and reel  
-215  
-235  
PMBTA42/DG  
[1] For
 
further information and the availability of packing methods, see
Section 13
.  
[2] /DG:
 
halogen-free  
10. Soldering  
3.3  
2.9  
1.9  
solder lands  
solder resist  
2
3
1.7  
solder paste  
occupied area  
0.6  
0.7  
(3
×
)  
(3
×
)  
Dimensions in mm  
0.5  
(3
×
)  
0.6  
(3
×
)  
1
sot023_fr  
Fig 2.
 
Reflow soldering footprint SOT23 (TO-236AB)  
PMB
T
A42_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 12 December 2008  
5 of 9  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
2.2  
1.2  
(2
×
)  
1.4  
(2
×
)  
solder lands  
solder resist  
2.6  
4.6  
occupied area  
Dimensions in mm  
1.4  
preferred transport direction during soldering  
2.8  
4.5  
sot023_fw  
Fig 3.
 
Wave soldering footprint SOT23 (TO-236AB)  
PMB
T
A42_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 12 December 2008  
6 of 9  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
11. Revision
 
history  
Table 9.  
Revision history  
Document ID  
PMBTA42_5  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20081212  
Product data sheet  
–
PMBTA42_4  
•
The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
•
Legal texts have been adapted to the new company name where appropriate.  
•
Type number PMBTA42/DG added  
•
T
a
ble 4 “Marking codes”
: enhanced  
•
Section 12 “Legal information”
: updated  
PMBTA42_4  
PMBTA42_3  
20040122  
Product specification  
–
–
PMBTA42_3  
19990422  
Product specification  
PMBTA42_43_CNV_2  
PMB
T
A42_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 12 December 2008  
7 of 9  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
12. Legal information  
12.1 Data
 
sheet status  
Document status

[1][2]  

Product status

[3]  

Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet
 
Qualification  
Product [short] data sheet
 
Production  
[1]  
[2]  
[3]  
Please consult the most recently issued

or completing a design.  
The term ‘short data sheet’ is explained in

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL

.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
12.2 Definitions  
Draft —
The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications —
Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values —
Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet —
A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Te

XP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at

, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
12.3 Disclaimers  
General —
Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license —
Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Right to make changes —
NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Quick reference data —
The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Suitability for use —
NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
12.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
13. Contact information  
For more information, please visit:

For sales office addresses, please send an email to:

PMB
T
A42_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 12 December 2008  
8 of 9  

PMBTA42  
NXP Semiconductors  
300 V, 100 mA NPN high-voltage transistor  
14. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
1.1  
1.2  
1.3  
1.4  
General description
 
. . . . . . . . . . . . . . . . . . . . .
 
1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
Applications .
 
. . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
Quick reference data
 
. . . . . . . . . . . . . . . . . . . .
 
1  
2
Pinning informatio
n
. . . . . . . . . . . . . . . . . . . . . .
 
1  
Ordering informatio
n
. . . . . . . . . . . . . . . . . . . . .
 
2  
Markin
g
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
 
2  
Thermal characteristics
 
. . . . . . . . . . . . . . . . . .
 
3  
Characteristic
s
. . . . . . . . . . . . . . . . . . . . . . . . . .
 
3  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
 
4  
Packing information
 
. . . . . . . . . . . . . . . . . . . . .
 
5  
Soldering .
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
5  
Revision histor
y
. . . . . . . . . . . . . . . . . . . . . . . . .
 
7  
3
4
5
6
7
8
9
10  
11  
12  
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
 
8  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
 
8  
Definition
s
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
8  
Disclaimer
s
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
8  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
8  
12.1  
12.2  
12.3  
12.4  
13  
14  
Contact informatio
n
. . . . . . . . . . . . . . . . . . . . . .
 
8  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
9  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.
V
.
 
2
008.  
All rights reserved.  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 12 December 2008  
Document identifier: PMBTA42_5