Nexperia-PUMB20-115
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Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename
Nexperia
. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
salesaddresses@nexperia.com
(email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
– © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
–
© Nexperia B.V. (year). All rights reserved
.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
understanding,
Kind regards,
Team Nexperia
PEMB20; PUMB20
PNP/PNP resistor-equipped transistors;
R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
Rev. 03 — 1 September 2009
Product data sheet
1. Product
profile
1.1 General
description
PNP/PNP resistor-equipped transistors
Table 1.
Product overview
Type number
Package
NXP
NPN/PNP
complement
NPN/NPN
complement
JEITA
–
PEMB20
PUMB20
SOT666
SOT363
PEMD20
PUMD20
PEMH20
PUMH20
SC-88
1.2 Features
I
Built-in bias resistors
I
Simplifies circuit design
I
Reduces component count
I
Reduces pick and place cost
1.3 Applications
I
Low current peripheral driver
I
Control of IC inputs
I
Replacement of general-purpose transistors in digital applications
1.4 Quick
reference data
Table 2.
Symbol
V
CEO
I
O
Quick reference data
Parameter
Conditions
Min
–
Typ
Max
−
50
Unit
V
collector-emitter voltage
output current (DC)
bias resistor 1 (input)
bias resistor ratio
open base
–
–
–
−
100
2.86
1.2
mA
k
Ω
R1
1.54
0.8
2.2
1
R2/R1
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
2. Pinning
information
Table 3.
Pinning
Pin
1
Description
Simplified outline
Symbol
GND (emitter) TR1
input (base) TR1
output (collector) TR2
GND (emitter) TR2
input (base) TR2
output (collector) TR1
6
5
4
6
5
4
2
3
R1 R2
4
TR2
5
TR1
1
2
3
R2 R1
6
001aab555
1
2
3
006aaa212
3. Ordering
information
Table 4.
Ordering information
Type number
Package
Name
–
Description
Version
SOT666
SOT363
PEMB20
PUMB20
plastic surface mounted package; 6 leads
plastic surface mounted package; 6 leads
SC-88
4. Marking
Table 5.
Marking codes
Type number
PEMB20
Marking code
[1]
6G
PUMB20
B9*
[1] *
= -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
2 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
5. Limiting
values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
V
CBO
V
CEO
V
EBO
V
I
collector-base voltage
open emitter
open base
–
–
–
−
50
−
50
−
10
V
V
V
collector-emitter voltage
emitter-base voltage
input voltage
open collector
positive
–
–
–
–
+10
V
negative
−
12
V
I
O
output current (DC)
peak collector current
total power dissipation
SOT363
−
100
−
100
mA
mA
I
CM
P
tot
T
amb
≤
25
°
C
[1]
–
200
mW
mW
°
C
[1][2]
SOT666
–
200
T
stg
storage temperature
junction temperature
ambient temperature
−
65
–
+150
150
T
j
°
C
T
amb
−
65
+150
°
C
Per device
P
tot
total power dissipation
SOT363
T
amb
≤
25
°
C
[1]
–
–
300
300
mW
mW
[1][2]
SOT666
[1] Device
mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2] Reflow
soldering is the only recommended soldering method.
6. Thermal
characteristics
Table 7.
Symbol
Per transistor
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
R
th(j-a)
thermal resistance from
T
amb
≤
25
°
C
junction to ambient
[1]
SOT363
–
–
–
–
625
625
K/W
K/W
[1] [2]
SOT666
Per device
R
th(j-a)
thermal resistance from
junction to ambient
T
amb
≤
25
°
C
[1]
SOT363
SOT666
–
–
–
–
416
416
K/W
K/W
[1] [2]
[1] Device
mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2] Reflow
soldering is the only recommended soldering method.
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
3 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
7. Characteristics
Table 8.
Characteristics
T
amb
= 25
°
C unless otherwise specified
Symbol Parameter
Conditions
Per transistor
I
CBO
Min
Typ
Max
Unit
collector-base cut-off
V
CB
=
−
50 V; I
E
= 0 A
–
–
−
100
nA
current
I
CEO
collector-emitter
cut-off current
V
CE
=
−
30 V; I
B
= 0 A
–
–
–
–
−
1
µ
A
µ
A
V
CE
=
−
30 V; I
B
= 0 A;
T
j
= 150
°
C
−
50
I
EBO
emitter-base cut-off
current
V
EB
=
−
5 V; I
C
= 0 A
–
–
−
2
mA
mV
h
FE
DC current gain
V
CE
=
−
5 V; I
C
=
−
20 mA
I
C
=
−
10 mA; I
B
=
−
0.5 mA
30
–
–
–
–
V
CEsat
collector-emitter
−
150
saturation voltage
V
I(off)
V
I(on)
R1
off-state input voltage
V
CE
=
−
5 V; I
C
=
−
1 mA
on-state input voltage
V
CE
=
−
0.3 V; I
C
=
−
20 mA
bias resistor 1 (input)
–
−
1.2
−
1.6
2.2
1
−
0.5
–
V
−
2
1.54
0.8
–
V
2.86
1.2
3
k
Ω
R2/R1
C
c
bias resistor ratio
collector capacitance
V
CB
=
−
10 V; I
E
= i
e
= 0 A;
–
pF
f = 1 MHz
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
4 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
006aaa192
006aaa193
3
3
10
−
10
h
FE
V
CEsat
(mV)
(1)
(2)
(3)
2
10
(1) (2) (3)
2
−
10
10
1
−
10
−
10
−
1
2
2
−
1
−
10
−
10
−
1
−
10
−
10
I
(mA)
I (mA)
C
C
V
CE
=
−
5 V
I
C
/I
B
= 20
(1) T
amb
= 100
°
C
(2) T
amb
= 25
°
C
(3) T
amb
=
−
40
°
C
(1) T
amb
= 100
°
C
(2) T
amb
= 25
°
C
(3) T
amb
=
−
40
°
C
Fig 1.
DC current gain as a function of collector
current; typical values
Fig 2.
Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa194
006aaa195
2
−
10
−
10
V
I(on)
(V)
V
I(off)
(V)
−
10
(1)
(2)
(3)
−
1
(1) (2)
−
1
−
1
(3)
−
1
−
10
−
10
−
1
2
−
2
−
1
−
10
−
1
−
10
−
10
−
10
−
10
−
1
−
10
I
(mA)
I (mA)
C
C
V
CE
=
−
0.3 V
V
CE
=
−
5 V
(1) T
amb
=
−
40
°
C
(2) T
amb
= 25
°
C
(3) T
amb
= 100
°
C
(1) T
amb
=
−
40
°
C
(2) T
amb
= 25
°
C
(3) T
amb
= 100
°
C
Fig 3.
On-state input voltage as a function of
collector current; typical values
Fig 4.
Off-state input voltage as a function of
collector current; typical values
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
5 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
8. Package
outline
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M
B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
Fig 5.
Package outline SOT363 (SC-88)
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
6 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
Plastic surface-mounted package; 6 leads
SOT666
D
A
E
X
Y
S
S
H
E
6
5
4
pin 1 index
A
c
1
2
3
e
1
b
p
w
M
A
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
b
c
D
E
e
e
H
L
w
y
A
p
p
1
E
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.7
1.5
0.3
0.1
mm
1.0
0.5
0.1
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT666
Fig 6.
Package outline SOT666
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
7 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
9. Packing
information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
Package
Description
Packing quantity
3000
–
4000
10000
–
PEMB20
PUMB20
PUMB20
SOT666
SOT363
SOT363
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-115
[2]
[3]
-115
-125
–
–
-135
-165
[1] For
further information and the availability of packing methods, see
Section 12
.
[2] T1:
normal taping
[3] T2:
reverse taping
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
8 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
10. Revision history
Table 10.
Revision history
Document ID
Release date
20090901
Data sheet status
Change notice
Supersedes
PEMB20_PUMB20_3
Modifications:
Product data sheet
–
PEMB20_PUMB20_2
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
•
Figure 5 “Package outline SOT363 (SC-88)”
: updated
•
Figure 6 “Package outline SOT666”
: updated
PEMB20_PUMB20_2
PUMB20_1
20050221
Product data sheet
–
PUMB20_1
–
20031003
Product specification
–
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
9 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
11. Legal information
11.1 Data
sheet status
Document status
[1][2]
Product status
[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet
Qualification
Product [short] data sheet
Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
11.2 Definitions
Draft —
The document is a draft version onl
y
.
T
he content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications —
Applications that are described herein for any of these
products are for illustrative purposes onl
y
.
N
XP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values —
Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliabilit
y
.
Short data sheet —
A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale —
NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General —
Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license —
Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes —
NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control —
This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data —
The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use —
NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, militar
y
,
a
ircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injur
y
,
d
eath or severe property or environmental
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
PEMB20_PUMB20_3
© NXP B.
V
.
2
009. All rights reserved.
Product data sheet
Rev. 03 — 1 September 2009
10 of 11
PEMB20; PUMB20
NXP Semiconductors
PNP/PNP resistor-equipped transistors; R1 = 2.2 k
Ω
, R2 = 2.2 k
Ω
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
1
General description. . . . . . . . . . . . . . . . . . . . . .
1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
Applications .
. . . . . . . . . . . . . . . . . . . . . . . . . .
1
Quick reference data. . . . . . . . . . . . . . . . . . . . .
1
1.1
1.2
1.3
1.4
2
Pinning informatio
n
. . . . . . . . . . . . . . . . . . . . . .
2
Ordering informatio
n
. . . . . . . . . . . . . . . . . . . . .
2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
3
Thermal characteristics. . . . . . . . . . . . . . . . . . .
3
Characteristic
s
. . . . . . . . . . . . . . . . . . . . . . . . . .
4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
6
Packing information. . . . . . . . . . . . . . . . . . . . . .
8
Revision histor
y
. . . . . . . . . . . . . . . . . . . . . . . . .
9
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . .
10
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
10
Definition
s
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
0
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
T
r
ademark
s
. . . . . . . . . . . . . . . . . . . . . . . . . . .
1
0
11.1
11.2
11.3
11.4
12
13
Contact informatio
n
. . . . . . . . . . . . . . . . . . . . .
10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.
V
.
2
009.
All rights reserved.
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 September 2009
Document identifier: PEMB20_PUMB20_3
