NH-NSH045N100P5

Part #NH-NSH045N100P5
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NH-NSH045N100P5
Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
100  
Volts  
120  
Ampers  
VOLTAGE:  
FEATURES  
PDFN5*6  
Marking and Polarity  
CURRENT
:  
Advanced trench MOSFET technology  
Low RDS(ON)  
·
·
·
·
·
·
FFY
W
W  
LLWWK  
Ultra Low Gate Charge  
RoHS Compliant  
NSH045N100  
100% UIS and RG Tested  
High Power and current handing capability  
P5  
TYPICAL APPLICATIONS  
PD Charger V-BUS  
·
SMPS 2nd Synchronous Rectifier  
·
MB/VGA Vcore  
·
BLDC Motor driver  
·
POL application  
·
Remark:  
PRODUCT SUMMARY  
NH=niuhang trademark;  
①
.  
②
.  
B

VDSS

,Min. at Max. Tj  
100  
120  
4.5  
90  
V
A
FF=Product line code,According to actual changes  
Y
W
W
=
Data code,According to actual changes  
LL
W
W
F
=Inernal code,According to actual changes  
NSH045N100P5=Modle.  
I

D  

R

DS(ON)

,Max. at Vgs=10V  
Qg,Typ.  
mΩ  
nC  
③
.  
Absolute Maximum Ratings (Ratings at 25
℃
ambient temperature unless otherwise specified )  
Test Conditions  
Symbol  
V

DS  

Ratings  
100  
Parameter  
Unit  
Drain-Source Voltage  
V
V

GS  

±20  
Gate-Source Voltage  
V
120  
Ta=25
℃  
I

D  

Continuous Drain Current (Note 1)  
A
77  
Ta=100
℃  
I

DM  

P

D  

480  
Drain Current-Pulsed
 
(Note 1)  
Maximum Power Dissipation  
Power Dissipation Derating Factor above 25
℃  
Derating Factor  
A
227  
Ta=25
℃  
W
91  
Ta=100
℃  
D

F  

T

J  

1.82  
W/
℃  
℃
-55  
-55  
to  
to  
150  
150  
Junction Temperature  
T

STD  

I

AS  

Storage temperature range  
Avalanche Current,Single pulse  
℃
L=  
mH  
32  
0.5  
A
L=0.5mH,IAS=38A, VDD=50V,  
E

AS  

256  
Single Pulse Avalanche Energy  
mJ  
RG=25Ω, Starting TJ =25
℃  
Thermal Characteristcs (Ratings at 25
℃
ambient temperature unless otherwise specified )  
Parameter  
Symbol  
Max  
62  
Unit  
℃
/W  
℃
/W  
R

θJA  

Thermal Resistance Junction to Ambient  
Thermal Resistance Junction-Case  
R

θJC  

0.55  
(Note 2)  
Notes:  
1. Repetitive
 
Rating : Pulse width limited by maximum junction temperature  
The value of R

θJA

is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25° C.  
The value in any given application depends on the user’s specific board design.This transistor is sensitive to electrostatic discharge and  
should be handled with care.  
2
Data:2014/10/20  
Rev.:A/1  
Page: 1 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
Electrical Characteristcs
(Ratings at 25
℃
ambient temperature unless otherwise specified )  
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static off Characteristics  
BV

DSS  

I

DSS  

VGS=0V,ID=250uA  
VDS=80V,VGS=0V  
VGS=±20V,VDS=0V  
V
Drain-Source Breakdown Voltage  
Drain-Source Leakage Current  
Gate-Body Leakage Current  
Static on Characteristics  
100  
–
–
1
uA  
nA  
–
–
0.05  
±10  
I

GSS  

±100  
V

GS(TH)  

R

DS(ON)  

g

FS  

VGS=VDS,ID=250uA  
VGS=10V,ID=50A  
VDS=5V,ID=50A  
V
mΩ  
S
Gate Threshold Voltage  
2.0  
3.0  
3.6  
50  
4.0  
4.5  
–
Drain-Source On Resistance  
–
–
Forward Transconductance  
Dynamic Characteristics  
C

iss  

C

oss  

C

rss  

pF  
pF  
pF  
Input Capacitance  
–
–
–
6772  
952  
33  
–
–
–
VDS=50V,VGS=0V,  
f=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Paramters  
t

d(on)  

t

r  

t

d(off)  

t

f  

ns  
ns  
ns  
ns  
Ω
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Rise Time  
Gate Resistance  
–
–
–
–
–
–
–
–
28  
32  
–
–
–
–
–
–
–
–
VGS=10V, VDD=50V,  
RG_ext=3.0Ω  
48  
27  
R

g  

VDS=0V,VGS=0V,f=1.0MHz  
2.0  
90  
Q

g  

nC  
nC  
nc  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VGS=10V, VDS=50V,  
ID=20A, f=1MHz  
Q

gs  

Q

gd  

28.0  
19.0  
Drain-Source Diode Characteristics and Maximum Ratings  
I

SD  

A
A
Max. Diode Forward Cuurent  
–
–
–
–
–
–
–
120  
480  
1.3  
–
I

SM  

Max. Pulsed Forward Cuurent  
V

SD  

VGS=0V,IS=50A  
V
Diode Forward Voltage  
0.89  
80  
t

rr  

ns  
μC  
Reverse Recovery Time  
IF=50A,di/dt=100A/us  
Q

rr  

Reverse Recovery Charge  
190  
–
Data:2014/10/20  
Rev.:A/1  
Page: 2 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
Typical Characteristics Curves  
200  
150  
100  
50  
200  
150  
100  
50  
250us Pluse Test  
1.250us Pluse Test  
2.Vds=20V  
0
0
0
10  
20  
30  
40  
2
4
6
8
10  
VGS=4.5V  
VGS=8V  
VGS=5V  
VGS=10V  
25℃  
150℃  
VDS-Drain-to-Source Voltage (V)  
VGS-Gate-to-Source Voltage(V)  
Fig.1-Output Characteritsics  
Fig.2- Transfer Characteritsics  
10  
8
40  
Pluse Duration=10us  
Duty cycle=0.5% Max.  
Tj=25
℃
 
Tj=25
℃
 
30  
20  
10  
0
6
4
2
20  
60  
100  
140  
180  
0
3
6
9
12  
15  
ID=50A  
VGS=10V  
IDS-Drain-to–Source Current(A)  
Fig.3- On Resistance vs. Drain Current  
VGS-Gate-to-Source Voltage(V)  
Fig.4- On Resistance vs. Gate Source Voltage  
2.5  
1.5  
0.5  
1.2  
1.1  
1
0.9  
0.8  
-50  
0
50  
100  
150  
-50 -25  
0
25 50 75 100
 
125 150  
VGS=10V,ID=50A  
VGS=0V,ID=250uA  
TJ,Junction Temperature(
℃
)  
Fig.5-On Resistance vs. Junction Temperature  
TJ-Junction Temperature(
℃
)  
Fig.6- Breakdown Voltage vs. Junction Temperature  
Data:2014/10/20  
Rev.:A/1  
Page: 3 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
Typical Characteristics Curves  
250  
225  
200  
175  
150  
125  
100  
75  
120  
100  
80  
60  
40  
20  
0
50  
25  
0
25  
50  
75  
100  
125  
150  
0
0
25  
50  
75  
100  
125  
150  
TC-Case Temperature(
℃
)  
TC-Case Temperature(
℃
)  
Fig.7-Maximum Continuous Drain Current vs. Case Temperature  
Fig.8-Maximum Power Dissipation vs. Case Temperature  
1000  
100  
10  
10  
8
6
4
1
2
0.1  
500  
700  
Tj=25℃  
900  
Tj=125℃  
0
0
10 20 30 40 50 60 70 80 90  
VGS=10V, VDS=50V,…  
VSD-Source-to-Drain Voltage(mV)  
QG(nC)  
Fig.9- Source-Drain Diode Forward Voltage  
Fig.10-Gate Charge Waveform  
1000  
100  
10  
1
10000  
1000  
100  
10  
OPERATION IN THIS  
AREA MAY BE LIMITED  
BY RDS(ON) TJ=MAX  
0
RATED TC=25
℃
Single  
1
VGS=0V  
0
0.1  
0.1  
1
10  
100  
0.1  
1
10  
100  
Coss=Cds+Cgd  
Ciss=Cgs+Cgd  
Crss=Cgd  
10us  
10ms  
100us  
DC  
1ms  
VDS-Drain-Source Voltage(V)  
Fig.11- Gate-Source Voltage-VGS(V)  
VDS-Drain-Source Voltage(V)  
Fig.12-Maximum Safe Operating Area(SOA)  
Data:2014/10/20  
Rev.:A/1  
Page: 4 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
Typical Characteristics Curves  
10  
1
0.1  
T

J,PK

=T

C

+P

DM

*Z

TH-JC

*R

TH-JC  

R

TH-JC

=4.5
℃
/W  
T

C

=25
℃  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
D=0.68  
D=0.54  
D=0.38  
D=0.05  
D=0.02  
D=0.01  
Single Pulse  
t,Pulse Width(Sec.)  
Fig.13- Normalized Transient Thermal Impedance vs.Pulse Width  
Data:2014/10/20  
Rev.:A/1  
Page: 5 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
Test Circuit & Waveform  
Fig.12-Gate Charge Test Circuit & Waveform  
Fig.13- Resistive Switching Test Circuit & Waveform  
Fig.14- EAS Test Circuit & Waveform  
Data:2014/10/20  
Rev.:A/1  
Page: 6 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
OUTLINE DRAWINGS  
PDFN5*6  
OUTLINE DIMENSIONS  
Milimeters  
Dim.  
Inches  
Typ.  
Min.  
Typ.  
4.900  
5.750  
6.000  
1.000  
1.270  
0.300  
–
Max.  
Min.  
Max.  
A
B
C
D
E
F
4.800  
5.000  
0.189  
0.193  
0.226  
0.236  
0.039  
0.050  
0.012  
–
0.197  
5.650  
5.850  
0.222  
0.230  
5.900  
6.100  
0.232  
0.240  
0.900  
1.100  
0.035  
0.043  
–
–
–
–
0.250  
0.350  
0.010  
0.014  
G
H
J
–
0.150  
–
0.006  
0.100  
0.130  
0.254  
R0.1  
4.000  
3.450  
1.350  
0.550  
0.1  
0.160  
0.004  
0.005  
0.010  
R0.0039  
0.157  
0.136  
0.053  
0.022  
0.004  
0.006  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
K
L
M
N
P
R
OUTLINE DRAWINGS  
PDFN5*6  
RECOMMENDED LAYOUT DIMENSIONS  
Milimeters  
Typ.  
Inches  
Typ.  
Dim.  
Min.  
Max.  
Min.  
Max.  
A
B
C
D
E
F
–
–
–
–
–
–
–
–
–
–
6.600  
4.320  
1.270  
0.700  
2.200  
3.300  
4.500  
1.270  
0.600  
4.400  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.260  
0.170  
0.050  
0.028  
0.087  
0.130  
0.177  
0.050  
0.024  
0.173  
–
–
–
–
–
–
–
–
–
–
G
L
M
N
PACKING INFORMATION  
PDFN5*6  
Package  
Method  
Reel Size  
(mm)  
Quantity  
(pcs/reel)  
Inner Box Size  
L×W×H(mm)  
Quantity  
(pcs/Inner Box)  
Outer Carton Size  
L×W×H(mm)  
Quantity  
(pcs/carton)  
Tape Reel  
Φ340  
5000  
340×340×50  
10000  
360×360×260  
50000  
Data:2014/10/20  
Rev.:A/1  
Page: 7 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
Recommended wave soldering condition  
Product  
Peak Temperature  
260 +0/-5 °C  
Soldering Time  
Pb-free devices  
5 +1/-1 seconds  
Recommended temperature profile for IR reflow  
Profile feature  
Sn-Pb eutectic Assembly  
Pb-free Assembly  
3°C/second max.  
Average ramp-up rate  
(Tsmax to Tp)  
3°C/second max.  
Preheat  
−
T
e
mperature Min(TS min)  
−
T
e
mperature Max(TS max)  
−Time(ts min to ts max)  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
Time maintained above:  
−
T
e
mperature (TL)  
− Time (tL)  
183°C  
60-150 seconds  
217°C  
60-150 seconds  
Peak Temperature(TP)  
240 +0/-5 °C  
260 +0/-5 °C  
Time within 5°C of actual peak  
temperature(tp)  
10-40 seconds  
20-40 seconds  
Ramp down rate  
6°C/second max.  
6 minutes max.  
6°C/second max.  
8 minutes max.  
Time 25 °C to peak temperature  
Note : All temperatures refer to topside of the package, measured on the package body surface.  
Data:2014/10/20  
Rev.:A/1  
Page: 8 of 9  

Niu Hang  
Electronic Co. Ltd  
Specification  
For Approval  
NSH045N100P5  
N-channel 100V Enhancement Mode Power MOSFET  
Disclaimer  
Reproducing and modifying informatiom of the document is prohibited without permission  
from niuhang Electronics co., LTD  
●
●
Niuhang Electronics co., LTD. reserves the rights to make changes of the content herein  
the document anytime without notification.  
Niuhang Electronics co., LTD. disclaims any and all liability arising out of the application or  
use of any product including damages incidentally and consequentially occurred.  
●
Niuhang Electronics co., LTD. does not assume any and all implied warranties,  
including warranties of fitness for particular purpose,non-infringement and merchantability.  
●
●
Applications shown on the herein document are examples of standard use and operation.  
Customers are responsible in comprehending the suitable use in particular applications.  
Niuhang Electronics co., LTD.makes no representation or warranty that such applications will  
be suitable for the specified use without further testing or modification.  
The products shown herein are not designed and authorized for equipments requiring high  
level of reliability or relating to human life and for any applications concerning life-saving or  
life-sustaining,such as medical instruments.transportation equipment,aerospae machinery  
et cetera.Customers usin or selling these products for use in such applications do so at their  
own rish and agree to fully indemnify Niuhang Electronics co., LTD.for any damages resulting  
resulting from such improper use or sale.  
●
●
When the appearance of the product and chip size does not change, in order to product  
the customer.  
quality, change the internal structure and the production process Niuhang can not notify  
Data:2014/10/20  
Rev.:A/1  
Page: 9 of 9