NIKO-Semicon-P06P03LCG

Part #NIKO-Semicon-P06P03LCG
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NIKO-Semicon-P06P03LCG
P06P03LCG  
P-Channel Enhancement Mode MOSFET  
PRODUCT SUMMARY  
R

DS(ON)  

I

D  

V

(BR)DSS  

45m
Ω
@V

GS

= -10V  
-30V  
-3.5A  
SOT-89  
ABSOLUTE MAXIMUM RATINGS (T

A

= 25 °C Unless Otherwise Noted)  
PARAMETERS/TEST CONDITIONS  
Drain-Source Voltage  
SYMBOL  
V

DS  

LIMITS  
-30  
UNITS  
V
V

GS  

Gate-Source Voltage  
±20  
-3.5  
-2.8  
-20  
T

A

= 25 °C  
T

A

= 70 °C  
I

D  

Continuous Drain Current  
A
Pulsed Drain Current

1  

Avalanche Current  
Avalanche Energy  
I

DM  

I

AS  

-19  
E

AS  

L = 0.1mH  
T

A

= 25 °C  
T

A

= 70 °C  
18  
mJ  
W
0.78  
0.5  
P

D  

Power Dissipation  
T

J

, T

STG  

Operating Junction & Storage Temperature Range  
-55 to 150  
°C  
THERMAL RESISTANCE RATINGS  
THERMAL RESISTANCE  
SYMBOL  
TYPICAL  
MAXIMUM  
UNITS  
R

q
JC  

R

q
JA  

Junction-to-Case  
18  
°C / W  
Junction-to-Ambient  
160  

1

Pulse width limited by maximum junction temperature.  

2

Duty cycle
1%.  
Ver 1.0  
1
2012/4/12  

P06P03LCG  
P-Channel Enhancement Mode MOSFET  
ELECTRICAL CHARACTERISTICS (T

J

= 25 °C, Unless Otherwise Noted)  
LIMITS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
UNIT  
MIN  
TYP MAX  
STATIC  
V

(BR)DSS  

V

GS(th)  

I

GSS  

V

GS

= 0V, I

D

= -250
m
A  
V

DS

= V

GS

, I

D

= -250
m
A  
V

DS

= 0V, V

GS

= ±20V  
V

DS

= -24V, V

GS

= 0V  
V

DS

= -20V, V

GS

= 0V , T

J

= 125 °C  
V

DS

= -10V, V

GS

= -10V  
V

GS

= -4.5V, I

D

= -3A  
V

GS

= -10V, I

D

= -3.5A  
V

DS

= -10V, I

D

= -3.5A  
DYNAMIC  
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
Gate-Body Leakage  
-30  
-1  
V
nA  
m
A  
A
-1.5  
-3  
±100  
-1  
I

DSS  

I

D(ON)  

R

DS(ON)  

g

fs  

Zero Gate Voltage Drain Current  
-10  
On-State Drain Current

1  

Drain-Source On-State  
Resistance

1  

-20  
56  
42  
16  
75  
45  
m
Ω  
S
Forward Transconductance

1  

C

iss  

C

oss  

C

rss  

R

g  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
666  
163  
114  
6
V

GS

= 0V, V

DS

= -15V, f = 1MHz  
V

GS

= 0V, V

DS

= 0V, f = 1MHz  
pF  
Ω
Total Gate Charge

2  

Gate-Source Charge

2  

Gate-Drain Charge

2  

Turn-On Delay Time

2  

Rise Time

2  

Q

g  

13  
V

DS

= 0.5V

(BR)DSS

, V

GS

= -10V,  
I

D

= -3.5A  
Q

gs  

Q

gd  

t

d(on)  

t

r  

nC  
2.1  
2.6  
5.7  
10  
V

DS

= -15V,  
nS  
Turn-Off Delay Time

2  

Fall Time

2  

I

D

@
-3.5A, V

GS

= -10V, R

GS

= 6
Ω
 
t

d(off)  

t

f  

18  
5
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (T

J

= 25 °C)  
I

S  

Continuous Current  
Forward Voltage

1  

-1  
A
V
V

SD  

t

rr  

I

F

= -1A, V

GS

= 0V  
-1.2  
Reverse Recovery Time  
15.5  
7.9  
nS  
nC  
IF = -3.5A, dlF/dt = 100A /
m
S  
Q

rr  

Reverse Recovery Charge  

1

Pulse test : Pulse Width
300
m
sec, Duty Cycle
2
%
.  

2

Independent of operating temperature.  
Ver 1.0  
2
2012/4/12  

P06P03LCG  
P-Channel Enhancement Mode MOSFET  
Ver 1.0  
3
2012/4/12  

P06P03LCG  
P-Channel Enhancement Mode MOSFET  
Ver 1.0  
4
2012/4/12  

P06P03LCG  
P-Channel Enhancement Mode MOSFET  
Ver 1.0  
5
2012/4/12