NXP-Semicon-BFU590QX

Part #NXP-Semicon-BFU590QX
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NXP-Semicon-BFU590QX
ꢁ
BFU590Q  
ꢀ
7
2
6
NPN wideband silicon RF transistor  
Rev. 1 — 28 April 2014  
Product data sheet  
1. Product
 
profile  
1.1 General
 
description  
NPN silicon microwave transistor for high speed, medium power applications in a plastic,  
3-pin SOT89 package.  
The BFU590Q is part of the BFU5 family of transistors, suitable for small signal to medium  
power applications up to 2 GHz.  
1.2 Features
 
and benefits  
Medium power, high linearity, high breakdown voltage RF transistor  
AEC-Q101 qualified  
Maximum stable gain 11 dB at 900 MHz  
P

L(1dB)

22 dBm at 900 MHz  
8 GHz f

T

silicon technology  
1.3 Applications  
Automotive applications  
Broadband amplifiers  
Medium power amplifiers (500 mW at a frequency of 433 MHz or 866 MHz)  
Large signal amplifiers for ISM applications  
1.4 Quick
 
reference data  
Table 1.  
Quick reference data  
T

amb

= 25
C unless otherwise specified  
Symbol Parameter  
Conditions  
open emitter  
open base  
Min Typ
 
Max Unit  
V

CB  

V

CE  

collector-base voltage  
collector-emitter voltage  
–
–
24  
12  
24  
2
V
V
V
V
–
–
shorted base  
open collector  
–
–
V

EB  

I

C  

emitter-base voltage  
collector current  
–
–
–
80  
–
200 mA  
2000 mW  
130  
[1]  
P

tot  

h

FE  

C

c  

total power dissipation  
DC current gain  
T

sp

90
C  
–
I

C

= 80 mA; V

CE

= 8 V  
V

CB

= 8 V; f = 1 MHz  
I

C

= 80 mA; V

CE

= 8 V; f = 900 MHz  
60  
–
95  
2.0  
8.0  
collector capacitance  
transition frequency  
–
–
pF  
f

T  

–
GHz  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
Table 1.  
Quick reference data
…continued  
T

amb

= 25
C unless otherwise specified  
Symbol Parameter  
Conditions  
Min Typ
 
Max Unit  
[2]  
G

p(max)  

P

L(1dB)  

maximum power gain  
I

C

= 80 mA; V

CE

= 8 V; f = 900 MHz  
–
–
11  
22  
–
–
dB  
output power at 1 dB gain  
compression  
I

C

= 80 mA; V

CE

= 8 V; Z

S

= Z

L

= 50
;  
f = 900 MHz  
dBm  
[1] T

sp

is the temperature at the solder point of the collector lead.  
[2] If
 
K > 1 then G

p(max)

is the maximum power gain. If K
1 then G

p(max)

= MS
G
.  
2. Pinning
 
information  
Table 2.  
Discrete pinning  
Description  
emitter  
Pin  
1
Simplified outline  
Graphic symbol  
ꢁ
2
collector  
ꢀ
3
base  
ꢂ
ꢀ
ꢁ
ꢂ
DDDꢀꢁꢂꢂꢃꢄꢁ  
3. Ordering
 
information  
Table 3.  
Type number
 
Package  
Name Description  
Ordering information  
Version  
SOT89  
–
BFU590Q  
OM7965  
–
–
plastic surface-mounted package; exposed die pad with good heat transfer; 3 leads  
Customer evaluation kit for BFU580Q and BFU590Q

[1]  

[1] The
 
customer evaluation kit contains the following:  
a) Unpopulated
 
RF amplifier Printed-Circuit Board (PCB)  
b) Unpopulated
 
RF amplifier Printed-Circuit Board (PCB) with emitter degeneration  
c) Four
 
SMA connectors for fitting unpopulated Printed-Circuit Board (PCB)  
d) BFU580Q
 
and BFU590Q samples  
e) USB
 
stick with data sheets, application notes, models, S-parameter and noise files  
4. Marking  
Table 4.  
Marking  
Type number  
Marking  
BFU590Q  
S59  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
2 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
5. Design
 
support  
Table 5.  
Available design support  
Download from the BFU590Q product information page on

.  
Support item  
Available  
yes  
Remarks  
Device models for Agilent EEsof EDA ADS  
SPICE model  
Based on Mextram device model.  
yes  
Based on Gummel-Poon device  
model.  
S-parameters  
yes  
yes  
yes  
yes  
Customer evaluation kit  
Solder pattern  
See
Section 3
and
Section 10
.  
Application notes  
See
Section 10.1
and
Section 10.2
.  
6. Limiting
 
values  
Table 6.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
open emitter  
open base  
Min Max  
Unit  
V
V

CB  

V

CE  

collector-base voltage  
–
–
–
–
–
30  
16  
30  
3
collector-emitter voltage  
V
shorted base  
open collector  
V
V

EB  

I

C  

emitter-base voltage  
collector current  
V
300  
mA  
T

stg  

V

ESD  

storage temperature  
electrostatic discharge voltage  
65 +150
C  
Human Body Model (HBM) According to JEDEC  
standard 22-A114E  
–
250  
V
Charged Device Model (CDM) According to  
JEDEC standard 22-C101B  
–
2  
kV  
7. Recommended
 
operating conditions  
Table 7.  
Symbol  
V

CB  

Characteristics  
Parameter  
Conditions  
open emitter  
open base  
Min Typ Max  
Unit  
V
collector-base voltage  
collector-emitter voltage  
–
–
–
–
–
–
–
–
–
24  
V

CE  

–
12  
V
shorted base  
open collector  
–
24  
V
V

EB  

I

C  

emitter-base voltage  
collector current  
–
2
V
–
200  
20  
mA  
dBm  
C  
mW  
P

i  

input power  
Z

S

= 50
  
–
T

j  

junction temperature  
total power dissipation  
40  
+150  
2000  
[1]  
P

tot  

T

sp

90
C  
–
[1] T

sp

is the temperature at the solder point of the collector lead.  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
3 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
8. Thermal
 
characteristics  
Table 8.  
Thermal characteristics  
Symbol Parameter  
Conditions  
Typ Unit  
[1]  
R

th(j-sp)  

thermal resistance from junction to solder point  
30  
K/W  
[1] T

sp

is the temperature at the solder point of the collector lead.  
T

sp

has the following relation to the ambient temperature T

amb  

T

sp

= T

amb

+ P
R

th(sp-a)  

:
With P being the power dissipation and R

th(sp-a)

being the thermal resistance between the solder point and  
ambient. R

th(sp-a)

is determined by the heat transfer properties in the application.  
The heat transfer properties are set by the application board materials, the board layout and the  
environment e.g. housing.  
DDDꢀꢁꢂꢅꢆꢇꢈ  
ꢁꢈꢃꢃ  
3
3  
WRW  
ꢊP:ꢋ  
ꢁꢃꢃꢃ  
ꢂꢄꢃꢃ  
ꢂꢁꢃꢃ  
ꢇꢃꢃ  
ꢈꢃꢃ  
ꢃ
ꢃ
ꢀꢃ  
ꢄꢃ  
ꢅꢃ  
ꢂꢁꢃ  
ꢂꢆꢃ  
ꢂꢇꢃ  
7
VS  
ꢉꢊƒ&ꢋ  
Fig 1.
 
Power derating curve  
9. Characteristics  
Table 9.  
Characteristics  
T

amb

= 25
C unless otherwise specified  
Symbol Parameter  
Conditions  
Min Typ
 
Max Unit  
V

(BR)CBO

collector-base breakdown voltage  
V

(BR)CEO

collector-emitter breakdown voltage  
I

C

= 100 nA; I

E

= 0 mA  
I

C

= 150 nA; I

B

= 0 mA  
24  
12  
–
–
–
–
V
V
–
I

C  

collector current  
80  
<1  
200 mA  
I

CBO  

h

FE  

C

e  

C

re  

C

c  

collector-base cut-off current  
DC current gain  
I

E

= 0 mA; V

CB

= 8 V  
I

C

= 80 mA; V

CE

= 8 V  
V

EB

= 0.5 V; f = 1 MHz  
V

CE

= 8 V; f = 1 MHz  
V

CB

= 8 V; f = 1 MHz  
–
–
nA  
60 95  
130  
emitter capacitance  
feedback capacitance  
collector capacitance  
transition frequency  
–
–
–
–
3.6  
1.3  
2
–
–
–
–
pF  
pF  
pF  
f

T  

I

C

= 50 mA; V

CE

= 8 V; f = 900 MHz  
8.0  
GHz  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
4 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
Table 9.  
Characteristics
…continued  
T

amb

= 25
C unless otherwise specified  
Symbol Parameter  
Conditions  
Min Typ
 
Max Unit  
[1]  
G

p(max)  

maximum power gain  
f = 433 MHz; V

CE

= 8 V  
I

C

= 10 mA  
–
–
–
17  
–
dB  
dB  
dB  
I

C

= 50 mA  
17.5 –  
17.5 –  
I

C

= 80 mA  
[1]  
[1]  
f = 900 MHz; V

CE

= 8 V  
I

C

= 10 mA  
–
–
–
11  
11  
11  
–
–
–
dB  
dB  
dB  
I

C

= 50 mA  
I

C

= 80 mA  
f = 1800 MHz; V

CE

= 8 V  
I

C

= 10 mA  
–
–
–
6
–
–
–
dB  
dB  
dB  
I

C

= 50 mA  
6.5  
6.5  
I

C

= 80 mA  
s

21

2  

insertion power gain  
f = 433 MHz; V

CE

= 8 V  
I

C

= 10 mA  
–
–
–
14.5 –  
dB  
dB  
dB  
I

C

= 50 mA  
16  
16  
–
–
I

C

= 80 mA  
f = 900 MHz; V

CE

= 8 V  
I

C

= 10 mA  
–
–
–
9
–
–
–
dB  
dB  
dB  
I

C

= 50 mA  
10  
10  
I

C

= 80 mA  
f = 1800 MHz; V

CE

= 8 V  
I

C

= 10 mA  
–
–
–
3.5  
4.5  
4.5  
–
–
–
dB  
dB  
dB  
I

C

= 50 mA  
I

C

= 80 mA  
P

L(1dB)  

output power at 1 dB gain compression
 
f = 433 MHz; V

CE

= 8 V; Z

S

= Z

L

= 50
  
I

C

= 50 mA  
–
–
20.5 –  
dBm  
dBm  
I

C

= 80 mA  
23  
–
f = 900 MHz; V

CE

= 8 V; Z

S

= Z

L

= 50
  
I

C

= 50 mA  
–
–
20  
22  
–
–
dBm  
dBm  
I

C

= 80 mA  
f = 1800 MHz; V

CE

= 8 V; Z

S

= Z

L

= 50
  
I

C

= 50 mA  
I

C

= 80 mA  
–
–
19.5 –  
22  
dBm  
dBm  
–
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
5 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
Table 9.  
Characteristics
…continued  
T

amb

= 25
C unless otherwise specified  
Symbol Parameter  
Conditions  
Min Typ
 
Max Unit  
IP3

o  

output third-order intercept point  
f

1

= 433 MHz; f

2

= 434 MHz; V

CE

= 8 V;  
Z

S

= Z

L

= 50
  
I

C

= 50 mA  
I

C

= 80 mA  
–
–
30  
–
dBm  
dBm  
32.5 –  
f

1

= 900 MHz; f

2

= 901 MHz; V

CE

= 8 V;  
Z

S

= Z

L

= 50
  
I

C

= 50 mA  
I

C

= 80 mA  
–
–
29.5 –  
31.5 –  
dBm  
dBm  
f

1

= 1800 MHz; f

2

= 1801 MHz;  
V

CE

= 8 V; Z

S

= Z

L

= 50
  
I

C

= 50 mA  
I

C

= 80 mA  
–
–
29  
–
dBm  
dBm  
31.5 –  
[1] If
 
K > 1 then G

p(max)

is the maximum power gain. If K
1 then G

p(max)

= MS
G
.  
9.1 Graphs  
DDDꢀꢁꢂꢂꢄꢉꢅ  
ꢀꢄ  
,
&
ꢊP$ꢋ  
ꢊꢌꢋ  
ꢊꢄꢋ  
ꢊꢆꢋ  
ꢊꢈꢋ  
ꢊꢀꢋ  
ꢀꢃ  
ꢁꢈ  
ꢂꢇ  
ꢂꢁ  
ꢄ
ꢊꢁꢋ  
ꢊꢂꢋ  
ꢃ
ꢃ
ꢂ
ꢁ
ꢀ
ꢈ
ꢆ
ꢄ
ꢌ
ꢇ
9
ꢉꢊ9ꢋ  
&(  
T

amb

= 25
C.  
(1) I

B

= 25
A  
(2)  
I

B

= 75
A  
(3) I

B

= 125
A  
(4) I

B

= 175
A  
(5)  
I

B

= 225
A  
(6) I

B

= 275
A  
(7) I

B

= 325
A  
Fig 2.
 
Collector current as a function of collector-emitter voltage; typical values  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
6 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
DDDꢀꢁꢂꢅꢆꢇꢄ  
DDDꢀꢁꢂꢅꢆꢇꢇ  
ꢂꢆꢃ  
)(  
ꢂꢆꢃ  
K
)(  
K
ꢊꢀꢋ  
ꢂꢁꢆ  
ꢂꢁꢆ  
ꢂꢃꢃ  
ꢌꢆ  
ꢆꢃ  
ꢁꢆ  
ꢃ
ꢊꢁꢋ  
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢊꢂꢋ  
ꢂꢃꢃ  
ꢌꢆ  
ꢆꢃ  
ꢁꢆ  
ꢃ
ꢃ
ꢆ
ꢂꢃ  
ꢂꢆ  
ꢁꢃ  
ꢁꢆ  
ꢀꢃ  
ꢃ
ꢁꢃ  
ꢈꢃ  
ꢄꢃ  
ꢇꢃ  
ꢂꢃꢃ  
,
&
ꢉꢊP$ꢋ  
,
&
ꢉꢊP$ꢋ  
T

amb

= 25
C.  
V

CE

= 8 V.  
(1) V

CE

= 3.0 V  
(2) V

CE

= 8.0 V  
(1) T

amb

=
40
C  
(2) T

amb

= +25
C  
(3)  
T

amb

= +125
C  
Fig 3.
 
DC current gain as a function of collector  
current; typical values  
Fig 4.
 
DC current gain as a function of collector  
current; typical values  
DDDꢀꢁꢂꢂꢄꢉꢆ  
DDDꢀꢁꢂꢂꢄꢉꢉ  
ꢂꢃ  
,
,
%
ꢊP$ꢋ  
&
ꢊP$ꢋ  
ꢂꢃ  
ꢎꢂ  
ꢎꢂ  
ꢎꢀ  
ꢎꢆ  
ꢎꢌ  
ꢂꢃ  
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢂꢃ  
ꢂꢃ  
ꢂꢃ  
ꢂꢃ  
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢎꢀ  
ꢂꢃ  
ꢎꢆ  
ꢃꢍꢆ  
ꢂꢃ  
ꢃꢍꢄ  
ꢃꢍꢌ  
ꢃꢍꢇ  
ꢃꢍꢅ  
ꢉꢊ9ꢋ  
ꢂꢍꢃ  
ꢃꢍꢆ  
ꢃꢍꢄ  
ꢃꢍꢌ  
ꢃꢍꢇ  
ꢃꢍꢅ  
9 ꢉꢊ9ꢋ  
%(  
ꢂꢍꢃ  
9
%(  
T

amb

= 25
C.  
(1) V

CE

= 3.0 V  
(2)

CE

= 8.0 V  
T

amb

= 25
C.  
(1) V

CE

= 3.0 V  
(2)

CE

= 8.0 V  
V
V
Fig 5.
 
Collector current as a function of base-emitter  
voltage; typical values  
Fig 6.
 
Base current as a function of base-emitter  
voltage; typical values  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
7 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
DDDꢀꢁꢂꢅꢉꢁꢁ  
DDDꢀꢁꢂꢂꢄꢉꢃ  
ꢎꢀ  
ꢂꢃ  
%5  
ꢊ$ꢋ  
ꢁꢍꢆ  
ꢁ
,
&
F
ꢊS)ꢋ  
ꢎꢈ  
ꢎꢆ  
ꢎꢄ  
ꢎꢌ  
ꢎꢇ  
ꢂꢃ  
ꢂꢃ  
ꢂꢃ  
ꢂꢃ  
ꢂꢃ  
ꢂꢍꢆ  
ꢂ
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢊꢀꢋ  
ꢃꢍꢆ  
ꢃ
ꢂ
ꢂꢍꢈ  
ꢂꢍꢇ  
ꢁꢍꢁ  
ꢁꢍꢄ  
ꢉꢊ9ꢋ  
ꢀ
ꢃ
ꢁ
ꢈ
ꢄ
ꢇ
ꢂꢃ  
ꢂꢁ  
9
9
ꢉꢊ9ꢋ  
(%  
&%  
V

CE

= 3 V.  
I

C

= 0 mA; f = 1 MHz; T

amb

= 25
C.  
(1) T

amb

=
40
C  
(2) T

amb

= +25
C  
(3)  
T

amb

= +125
C  
Fig 7.
 
Reverse base current as a function of  
emitter-base voltage; typical values  
Fig 8.
 
Collector capacitance as a function of  
collector-base voltage; typical values  
DDDꢀꢁꢂꢂꢄꢉꢊ  
ꢂꢃ  
I
7
ꢊ*+]ꢋ  
ꢇ
ꢄ
ꢈ
ꢁ
ꢃ
ꢊꢈꢋ  
ꢊꢀꢋ  
ꢊꢁꢋ  
ꢊꢂꢋ  
ꢃ
ꢁꢃ  
ꢈꢃ  
ꢄꢃ  
ꢇꢃ  
ꢂꢃꢃ  
,
&
ꢉꢊP$ꢋ  
T

amb

= 25
C.  
(1) V

CE

= 3.3 V  
(2)  
V

CE

= 5.0 V  
(3) V

CE

= 8.0 V  
(4) V

CE

= 12.0 V  
Fig 9.
 
Transition frequency as a function of collector current; typical values  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
8 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
DDDꢀꢁꢂꢂꢄꢉꢈ  
DDDꢀꢁꢂꢂꢄꢉꢄ  
ꢈꢃ  
*
ꢈꢃ  
ꢀꢃ  
ꢁꢃ  
ꢂꢃ  
ꢃ
*
ꢊG%ꢋ  
ꢊG%ꢋ  
ꢀꢃ  
ꢁꢃ  
06*  
06*  
ꢂꢃ  
*
SꢊPD[ꢋ  
ꢁꢃꢃꢃ  
*
SꢊPD[ꢋ  
ꢁ
ꢁ
_
_
V
V  
ꢁꢂ  
_
_
_
V
V
_  
ꢁꢂ  
ꢃ
ꢃ
ꢆꢃꢃ  
ꢂꢃꢃꢃ  
ꢂꢆꢃꢃ  
ꢁꢃꢃꢃ  
ꢁꢆꢃꢃ  
Iꢉꢊ0+]ꢋ  
ꢀꢃꢃꢃ  
ꢃ
ꢆꢃꢃ  
ꢂꢃꢃꢃ  
ꢂꢆꢃꢃ  
ꢁꢆꢃꢃ  
ꢀꢃꢃꢃ  
Iꢉꢊ0+]ꢋ  
I

C

= 50 mA; V

CE

= 8 V; T

amb

= 25
C.  
I

C

= 80 mA; V

CE

= 8 V; T

amb

= 25
C.  
Fig 10.
 
Gain as a function of frequency; typical values
 
Fig 11.
 
Gain as a function of frequency; typical values  
DDDꢀꢁꢂꢂꢄꢉꢇ  
DDDꢀꢁꢂꢂꢄꢃꢁ  
ꢁꢃ  
ꢂꢄ  
ꢂꢁ  
ꢇ
ꢁꢆ  
ꢁ
_
_
V
V  
_
*
SꢊPD[ꢋ  
ꢊꢂꢋ  
ꢁꢂ  
ꢊG%ꢋ  
ꢊG%ꢋ  
ꢁꢃ  
ꢂꢆ  
ꢂꢃ  
ꢆ
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢊꢁꢋ  
ꢊꢀꢋ  
ꢊꢈꢋ  
ꢊꢀꢋ  
ꢊꢈꢋ  
ꢊꢆꢋ  
ꢊꢆꢋ  
ꢈ
ꢃ
ꢃ
ꢃ
ꢁꢆ  
ꢆꢃ  
ꢌꢆ  
ꢂꢃꢃ  
ꢂꢁꢆ  
ꢂꢆꢃ  
ꢃ
ꢁꢆ  
ꢆꢃ  
ꢌꢆ  
ꢂꢃꢃ  
ꢂꢁꢆ  
ꢂꢆꢃ  
,
&
ꢉꢊP$ꢋ  
,
&
ꢉꢊP$ꢋ  
V

CE

= 8 V; T

amb

= 25
C.  
V

CE

= 8 V; T

amb

= 25
C.  
(1) f
 
= 300 MHz  
(2) f
 
= 433 MHz  
(3) f
 
= 800 MHz  
(4) f
 
= 900 MHz  
(5) f
 
= 1800 MHz  
If K >1 then G

p(max)

= maximum power gain. If K < 1 then  
G

p(max)

= MS
G
.  
(1) f
 
= 300 MHz  
(2) f
 
= 433 MHz  
(3) f
 
= 800 MHz  
(4) f
 
= 900 MHz  
(5) f
 
= 1800 MHz  
Fig 12.
 
Insertion power gain as a function of collector  
current; typical values  
Fig 13.
 
Maximum power gain as a function of collector  
current; typical values  
BFU590Q  
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Product data sheet  
Rev. 1 — 28 April 2014  
9 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
DDDꢀꢁꢂꢂꢄꢃꢂ  
DDDꢀꢁꢂꢂꢄꢃꢅ  
ꢁꢃ  
ꢁ
ꢁꢆ  
*
SꢊPD[ꢋ  
ꢊG%ꢋ  
_
_
V
V  
_
ꢊꢂꢋ  
ꢁꢂ  
ꢊG%ꢋ  
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢂꢄ  
ꢂꢁ  
ꢇ
ꢁꢃ  
ꢂꢆ  
ꢂꢃ  
ꢆ
ꢊꢁꢋ  
ꢊꢀꢋ  
ꢊꢈꢋ  
ꢊꢀꢋ  
ꢊꢈꢋ  
ꢊꢆꢋ  
ꢊꢆꢋ  
ꢈ
ꢃ
ꢃ
ꢃ
ꢁ
ꢈ
ꢄ
ꢇ
ꢂꢃ  
ꢂꢁ  
ꢂꢈ  
ꢃ
ꢁ
ꢈ
ꢄ
ꢇ
ꢂꢃ  
ꢂꢁ  
ꢂꢈ  
9
ꢉꢊ9ꢋ  
9
ꢉꢊ9ꢋ  
&(  
&(  
I

C

= 50 mA; T

amb

= 25
C.  
I

C

= 80 mA; T

amb

= 25
C.  
(1) f
 
= 300 MHz  
(2) f
 
= 433 MHz  
(3) f
 
= 800 MHz  
(4) f
 
= 900 MHz  
(5) f
 
= 1800 MHz  
If K >1 then G

p(max)

= maximum power gain. If K < 1 then  
G

p(max)

= MS
G
.  
(1) f
 
= 300 MHz  
(2) f
 
= 433 MHz  
(3) f
 
= 800 MHz  
(4) f
 
= 900 MHz  
(5) f
 
= 1800 MHz  
Fig 14.
 
Insertion power gain as a function of  
collector-emitter voltage; typical values  
Fig 15.
 
Maximum power gain as a function of  
collector-emitter voltage; typical values  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
10 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
ꢂ
ꢃꢍꢆ  
ꢁ
ꢃꢍꢁ  
ꢆ
ꢂꢃ  
ꢃꢍꢁ  
ꢃꢍꢆ  
ꢊꢂꢋ  
ꢂ
ꢁ
ꢆ
ꢂꢃ  
’
ꢃꢍꢃ  
ꢊꢁꢋ  
ꢎꢂꢃ  
ꢎꢆ  
ꢎꢃꢍꢁ  
ꢎꢁ  
ꢎꢃꢍꢆ  
ꢎꢂ  
DDDꢀꢁꢂꢂꢄꢃꢆ  
V

CE

= 8 V; 40 MHz
f
3 GHz.  
(1) I

C

= 50 mA  
(2)

C

= 80 mA  
I
Fig 16.
 
Input reflection coefficient (s

11

); typical values  
ꢂ
ꢃꢍꢆ  
ꢁ
ꢃꢍꢁ  
ꢆ
ꢂꢃ  
ꢃꢍꢁ  
ꢃꢍꢆ  
ꢂ
ꢁ
ꢆ
ꢂꢃ  
’
ꢃꢍꢃ  
ꢎꢂꢃ  
ꢎꢆ  
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢎꢃꢍꢁ  
ꢎꢁ  
ꢎꢃꢍꢆ  
ꢎꢂ  
DDDꢀꢁꢂꢂꢄꢃꢉ  
V

CE

= 8 V; 40 MHz
f
3 GHz.  
(1) I

C

= 50 mA  
(2) I

C

= 80 mA  
Fig 17.
 
Output reflection coefficient (s

22

); typical values  
BFU590Q  
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© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
11 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
DDDꢀꢁꢂꢂꢄꢃꢃ  
DDDꢀꢁꢂꢂꢄꢃꢊ  
ꢈꢃ  
ꢁꢆ  
,
,
3
3
ꢀ
ꢀ  
3
3  
/ꢊꢂG%ꢋ  
R
ꢊG%Pꢋ  
ꢊG%Pꢋ  
ꢁꢃ  
ꢀꢃ  
ꢂꢆ  
ꢂꢃ  
ꢆ
ꢁꢃ  
ꢂꢃ  
ꢃ
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢊꢀꢋ  
ꢊꢀꢋ  
ꢃ
ꢃ
ꢁꢃ  
ꢈꢃ  
ꢄꢃ  
ꢇꢃ  
ꢂꢃꢃ  
ꢂꢁꢃ  
ꢃ
ꢁꢃ  
ꢈꢃ  
ꢄꢃ  
ꢇꢃ  
ꢂꢃꢃ  
ꢂꢁꢃ  
,
&
ꢉꢊP$ꢋ  
,
&
ꢉꢊP$ꢋ  
V

CE

= 8 V; T

amb

= 25
C.  
V

CE

= 8 V; T

amb

= 25
C.  
(1) f

1

= 433 MHz; f

2

= 434 MHz  
(2) f

1

= 900 MHz; f

2

= 901 MHz  
(1) f
 
= 433 MHz  
(2) f
 
= 900 MHz  
(3) f
 
= 1800 MHz  
(3) f

1

= 1800 MHz; f

2

= 1801 MHz  
Fig 18.
 
Output third-order intercept point as a function  
of collector current; typical values  
Fig 19.
 
Output power at 1 dB gain compression as a  
function of collector current; typical values  
DDDꢀꢁꢂꢂꢄꢃꢈ  
DDDꢀꢁꢂꢂꢄꢃꢄ  
ꢈꢃ  
ꢁꢆ  
,
,
3
3
ꢀ
ꢀ  
3
3  
/ꢊꢂG%ꢋ  
R
ꢊG%Pꢋ  
ꢊG%Pꢋ  
ꢊꢂꢋ  
ꢁꢃ  
ꢊꢂꢋ  
ꢊꢁꢋ  
ꢊꢁꢋ  
ꢊꢀꢋ  
ꢀꢃ  
ꢊꢀꢋ  
ꢂꢆ  
ꢂꢃ  
ꢆ
ꢁꢃ  
ꢂꢃ  
ꢃ
ꢃ
ꢃ
ꢁ
ꢈ
ꢄ
ꢇ
ꢂꢃ  
ꢂꢁ  
ꢂꢈ  
ꢃ
ꢁ
ꢈ
ꢄ
ꢇ
ꢂꢃ  
ꢂꢁ  
ꢂꢈ  
9
ꢉꢊ9ꢋ  
9
ꢉꢊ9ꢋ  
&(  
&(  
I

C

= 80 mA; T

amb

= 25
C.  
I

C

= 80 mA; T

amb

= 25
C.  
(1) f

1

= 433 MHz; f

2

= 434 MHz  
(2) f

1

= 900 MHz; f

2

= 901 MHz  
(3) f

1

= 1800 MHz; f

2

= 1801 MHz  
(1) f
 
= 433 MHz  
(2) f
 
= 900 MHz  
(3) f
 
= 1800 MHz  
Fig 20.
 
Output third-order intercept point as a function  
of collector-emitter voltage; typical values  
Fig 21.
 
Output power at 1 dB gain compression as a  
function of collector-emitter voltage;  
typical values  
BFU590Q  
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Product data sheet  
Rev. 1 — 28 April 2014  
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BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
10. Application information  
More information about the following application example can be found in the application  
notes. See
Section 5 “Design support”
.  
The following application example can be implemented using the evaluation kit. See  
Section 3 “Ordering information”
for the order type number.  
The following application example can be simulated using the simulation package. See  
Section 5 “Design support”
.  
10.1 Application
 
example: 433 MHz PA  
More detailed information of the application example can be found in the application note:  
AN11504.  
9
ꢉꢃꢍꢌꢇꢉ9  
%%  
9
ꢉꢇꢉ9  
&&  
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ꢂꢃꢃꢉS)  
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ꢈꢌꢃꢉQ+  
ꢂꢃꢃꢉS)  
ꢈꢌꢃꢉQ+  
ꢄꢇꢉQ+  
ꢂꢃꢃꢉS)  
ꢂꢆꢉQ+  
5)ꢉRXWSXW  
ꢊ60$ꢋ  
ꢂꢃꢃꢉS)  
ꢆꢍꢄꢉQ+  
5)ꢉLQSXW  
ꢊ60$ꢋ  
’87  
ꢂꢃꢉS)  
ꢃꢍꢄꢇꢉS)  
DDDꢀꢁꢂꢅꢄꢊꢇ  
Fig 22.
 
Schematic 433 MHz power amplifier  
Remark: fine tuning of components maybe required depending on PCB parasitics.  
Table 10.
 
Application performance data at 433 MHz  
I

CC

= 100 mA; V

CC

= 8 V  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
s

21

2  

s

11

2  

P

L(1dB)  

C  

insertion power gain  
–
–
–
–
15  
7  
26  
60  
–
–
–
–
dB  
input return loss  
dB  
output power at 1 dB gain compression  
collector efficiency  
dBm  
%
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
13 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
10.2 Application
 
example: 866 MHz PA  
More detailed information of the application example can be found in the application note:  
AN11502.  
9
ꢉꢃꢍꢌꢇꢉ9  
%%  
9
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&&  
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ꢁꢁꢉQ)  
ꢂꢃꢃꢉS)  
ꢂꢃꢉȍ  
ꢈꢌꢃꢉQ+  
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ꢈꢌꢃꢉQ+  
ꢂꢇꢉQ+  
ꢂꢃꢃꢉS)  
ꢄꢍꢇꢉQ+  
5)ꢉRXWSXW  
ꢊ60$ꢋ  
ꢂꢃꢃꢉS)  
ꢂꢍꢆꢉQ+  
5)ꢉLQSXW  
ꢊ60$ꢋ  
’87  
ꢀꢍꢀꢉS)  
DDDꢀꢁꢂꢅꢄꢈꢁ  
Fig 23.
 
Schematic 866 MHz power amplifier  
Remark: fine tuning of components maybe required depending on PCB parasitics.  
Table 11.
 
Application performance data at 866 MHz  
I

CC

= 100 mA; V

CC

= 8 V  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
s

21

2  

s

11

2  

P

L(1dB)  

C  

insertion power gain  
–
–
–
–
10  
–
–
–
–
dB  
input return loss  
12  
27  
dB  
output power at 1 dB gain compression  
collector efficiency  
dBm  
%
55  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
14 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
11. Package
 
outline  
3ODVWLFꢂVXUIDFHꢅPRXQWHGꢂSDFNDJHꢆꢂH[SRVHGꢂGLHꢂSDGꢂIRUꢂJRRGꢂKHDWꢂWUDQVIHUꢆꢂꢇꢂOHDGV  
627ꢀꢁ  
%
$
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E
Sꢀ  
(
+
(
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E
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Z
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Sꢂ  
H
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H
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‘,0(16,216ꢂꢃPPꢂDUHꢂWKHꢂRULJLQDOꢂGLPHQVLRQVꢄ  
81,7  
$
E
E
E
F
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(
H
H
+
/
S
Z
Sꢈ  
Sꢉ  
Sꢇ  
ꢈ
(
ꢂꢍꢄꢉ  
ꢂꢍꢈ  
ꢃꢍꢈꢇꢉ ꢃꢍꢆꢀꢉ  
ꢃꢍꢀꢆ ꢃꢍꢈꢃ  
ꢂꢍꢇꢉ  
ꢂꢍꢈ  
ꢃꢍꢈꢈꢉ  
ꢃꢍꢁꢀ  
ꢈꢍꢄꢉ  
ꢈꢍꢈ  
ꢁꢍꢄꢉ  
ꢁꢍꢈ  
ꢈꢍꢁꢆꢉ  
ꢀꢍꢌꢆ  
ꢂꢍꢁꢉ  
ꢃꢍꢇ  
PP  
ꢀꢍꢃ  
ꢂꢍꢆ  
ꢃꢍꢂꢀ  
ꢂ5()(5(1&(6  
(8523($1ꢂ  
352-(&7,21  
287/,1(ꢂ  
9(56,21  
,668(ꢂ’$7(  
ꢂ,(&  
ꢂ-(‘(&  
ꢂ-(,7$  
6&ꢎꢄꢁ  
ꢃꢄꢎꢃꢀꢎꢂꢄꢉ  
ꢃꢄꢎꢃꢇꢎꢁꢅ  
ꢉ627ꢇꢅ  
72ꢎꢁꢈꢀ  
Fig 24.
 
Package outline SOT89  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
15 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
12. Handling information  
CAUTION  
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling  
electrostatic sensitive devices.  
Such precautions are described in the
ANSI/ESD S20.20
,
IEC/ST 61340-5
,
JESD625-A
or  
equivalent standards.  
13. Abbreviations  
Table 12.
 
Abbreviations  
Acronym  
AEC  
ISM  
Description  
Automotive Electronics Council  
Industrial, Scientific and Medical  
Low-Noise Amplifier  
LNA  
MSG  
NPN  
PA  
Maximum Stable Gain  
Negative-Positive-Negative  
Power Amplifier  
SMA  
SubMiniature version A  
14. Revision history  
Table 13.
 
Revision history  
Document ID  
Release date  
20140428  
Data sheet status  
Change notice  
Supersedes  
BFU590Q v.1  
Product data sheet  
–
–
BFU590Q  
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Product data sheet  
Rev. 1 — 28 April 2014  
16 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
15. Legal information  
15.1 Data
 
sheet status  
Document status

[1][2]  

Product status

[3]  

Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet
 
Qualification  
Product [short] data sheet
 
Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL

.  
Suitability for use in automotive applications —
This NXP  
15.2 Definitions  
Semiconductors product has been qualified for use in automotive  
applications. Unless otherwise agreed in writing, the product is not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft —
The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet —
A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications —
Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification —
The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limited warranty and liability —
Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values —
Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including – without limitation – lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the
T
e
rms and conditions of commercial sale
of NXP Semiconductors.  
Terms and conditions of commercial sale —
NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at

, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Right to make changes —
NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
17 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
No offer to sell or license —
Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Translations —
A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
Export control —
This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Quick reference data —
The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
16. Contact information  
For more information, please visit:

For sales office addresses, please send an email to:

BFU590Q  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 1 — 28 April 2014  
18 of 19  

BFU590Q  
NXP Semiconductors  
NPN wideband silicon RF transistor  
17. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
1.1  
1.2  
1.3  
1.4  
General description
 
. . . . . . . . . . . . . . . . . . . . .
 
1  
Features and benefit
s
. . . . . . . . . . . . . . . . . . . .
 
1  
Applications .
 
. . . . . . . . . . . . . . . . . . . . . . . . . .
 
1  
Quick reference data
 
. . . . . . . . . . . . . . . . . . . .
 
1  
2
Pinning informatio
n
. . . . . . . . . . . . . . . . . . . . . .
 
2  
Ordering informatio
n
. . . . . . . . . . . . . . . . . . . . .
 
2  
Markin
g
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
2  
Design support
 
. . . . . . . . . . . . . . . . . . . . . . . . .
 
3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
 
3  
Recommended operating conditions. . . . . . . .
 
3  
Thermal characteristics
 
. . . . . . . . . . . . . . . . . .
 
4  
Characteristic
s
. . . . . . . . . . . . . . . . . . . . . . . . . .
 
4  
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
6  
3
4
5
6
7
8
9
9.1  
10  
10.1  
10.2  
Application information. . . . . . . . . . . . . . . . . .
 
13  
Application example: 433 MHz PA . . . . . . . . .
 
13  
Application example: 866 MHz PA . . . . . . . . .
 
14  
11  
12  
13  
14  
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
 
15  
Handling information. . . . . . . . . . . . . . . . . . . .
 
16  
Abbreviation
s
. . . . . . . . . . . . . . . . . . . . . . . . . .
 
1
6  
Revision histor
y
. . . . . . . . . . . . . . . . . . . . . . . .
 
1
6  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . .
 
17  
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
 
17  
Definition
s
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1
7  
Disclaimer
s
. . . . . . . . . . . . . . . . . . . . . . . . . . .
 
1
7  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
 
18  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . .
 
18  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
19  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP Semiconductors N.V.
 
2014.  
All rights reserved.  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 28 April 2014  
Document identifier: BFU590Q