NXP-Semicon-PN7161A1EV-C100K
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PN7160_PN7161
Near Field Communication (NFC) controller
Rev. 3.9 — 8 March 2023
Product data sheet
1 Introduction
This data sheet describes the PN7160 and PN7161 NFC controllers with NCI interface and integrated firmware.
The PN7161 support all features of PN7160 plus “Enhanced Contactless Polling” (ECP) by Apple (see Ref.
[13]
). Please note, that the ECP feature is available after formal authorization only.
In the following document PN7160 refers to PN7160 and PN7161, otherwise stated.
This data sheet requires additional documents for functional chip description and design in. Refer to the
references listed in this document for full list of documentation provided by NX
P
.
NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
2 General
description
PN7160 is an NFC controller designed for integration in mobile devices and devices compliant with NFC
standards (NFC Forum, NCI).
PN7160 is designed based on experience from previous NXP NFC device generation to ease the integration of
NFC technology in mobile devices by providing:
•
A low PCB footprint and a reduced external Bill of Material
•
An optimized architecture for low-power consumption in different modes (Standby, low-power polling loop)
•
A highly efficient integrated power management unit allowing direct supply from an extended battery supply
range (2.8 V to 5.5 V).
•
Support of an external DC-to-DC like NXP PCA941xA (with x = 0, 1 and 2), to provide more output power.
PN7160 embeds a new generation RF contactless front-end, supporting various transmission modes according
to NFCIP-1 (see Ref.
[9]
) and NFCIP-2 (see Ref.
[11]
), ISO/IEC14443 (see Ref.
[3]
) , ISO/IEC 15693 (see Ref.
[10]
), MIFARE and FeliCa specifications. This new contactless front-end design brings a major performance
step-up with on one hand a higher sensitivity and on the other hand the capability to work in active load
modulation communication enabling the support of small antenna form factor. It also allows to provide a higher
output power by supplying the transmitter output stage from 2.7 V to 5.25
V
.
•
Enhanced Dynamic LMA (DLMA) to optimize and to enhance load modulation amplitude depending on
external field strength. It allows higher range communication distance in card mode.
•
Independent LMA phase adjustment by step of 5° for type A, B and F
•
Dynamic power control which allows to make use of the maximum power in reader mode without exceeding
the maximum power allowed by the standard in 0 distance.
•
Card mode receiver sensitivity of 20 mV
(p-p)
•
Support of single ended receiver
•
1.3 W output transmitter power
Supported transmission modes are listed in
Figure 1
. For contactless card functionality, the PN7160 can act
autonomously if previously configured by the host in such a manner. PICC functionality can be supported
without host being turned on.
NFC FORUM
NFC-IP MODES
READER
(PCD – VCD)
CARD
(PICC)
READER FOR NFC FORUM
TAGS 1 TO 5
ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
T4T – ISO/IEC 14443 A
T4T – ISO/IEC 14443 B
P2P ACTIVE
106 TO 424 kbps
INITIATOR AND TARGET
MIFARE 1K / 4K
MIFARE DESFire
P2P PASSIVE
106 TO 424 kbps
INITIATOR AND TARGET
(1)
Sony FeliCa
aaa-042748
1. According
to ISO/IEC 18092 (Ecma 340) standard.
Figure 1.ꢀPN7160 transmission modes
PN7160_PN7161
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Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
3 Features
and benefits
•
Highly integrated demodulator and decoder
•
Buffered output drivers to connect an antenna with minimum number of external components
•
Integrated RF level detector
•
Integrated Polling Loop for automatic device discovery
•
RF protocols supported
–
ISO/IEC 14443A, ISO/IEC 14443B PICC mode
–
ISO/IEC 14443A, ISO/IEC 14443B PCD mode designed according to NFC Forum digital protocol T4T
–
FeliCa PCD mode
–
MIFARE PCD encryption mechanism (MIFARE 1K/4K)
–
NFC Forum-compliant embedded T4T for NDEF short record
•
Supported host interfaces
•
Flexible clock supply concept to facilitate PN7160 integration
–
Internal oscillator for 27.12 MHz crystal connection
–
Integrated PLL unit to make use of device reference clock and facilitate PN7160 integration
•
Integrated power management unit
–
Direct connection to a battery (2.5 V to 5.5 V voltage supply range)
–
Support different low-power states configuration: Hard Power-Down state and Standby state activated by
firmware
–
Autonomous mode when host is shut down
•
Automatic wake-up via RF field, internal timer, and host interfaces
•
Integrated non-volatile memory to store data and executable code for customization
–
Anti tearing support to recover from tearing events
•
Standards compliance
–
NCI 2.0
PN7160_PN7161
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Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
4 Applications
•
Mobile devices
•
Portable equipment (personal digital assistants, tablet, notebook, wearable)
•
Consumer devices
•
Smart home gateways
PN7160_PN7161
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Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
5 Quick
reference data
Table 1.ꢀQuick reference data
Symbol
Parameter
Conditions
Min
Typ
Max Unit
V
BAT
battery supply voltage
Card Emulation and Passive
T
a
rget;
V
SS
= 0 V
2.5
–
5.5
5.5
5.8
5.8
V
V
V
V
Reader, Active Initiator and Active
T
a
rget; V
SS
= 0 V
2.8
2.8
2.5
–
–
–
V
DD(UP)
V
DD(UP)
input supply voltage
Reader, Active Initiator and Active
T
a
rget; V
SS
= 0 V
All other cases except Hard Power
Down state; V
SS
= 0 V
V
DD(PAD)
V
DD(PAD)
supply voltage
battery supply current
supply voltage for host interface; V
SS
= 0 V
1.65
3.0
–
1.8
1.95
3.6
16
V
3.3
V
I
BAT
in Hard Power Down state; V
BAT
3.6 V; T = 25 °C
=
10.5
μA
in Standby state; V
BAT
= 3.6 V
enhanced RF detector
–
–
–
32
52
36
–
μA
μA
μA
low sensitivity RF detector
21
in low-power polling loop; V
BAT
= 3.6
V; T = 25 °C; loop time = 500 ms
100
continuous total current consumption
in PCD mode at V
BAT
= 3.6 V
–
–
290
mA
I
th(Ilim)
P
tot
current limit threshold
total power dissipation
current limiter on transmitter
270
–
300
–
330
620
mA
PCD mode at typical V
DD(TX)
= 5.25
V,
V
DD(UP)
= 5.8 V and V
BAT
= 3.6
V; includes power from V
BAT
and
V
DD(UP)
mW
T
amb
ambient operating temperature
JEDEC PCB-0.5
-30
–
+85
°C
[1] V
SS
represents V
SS(PAD)
and V
SS(TX)
.
[2] When
V
DD(UP)
is below 2.8 V the TXLDO can be in follower mode (see
Section 11.4.3
), there will be no more V
DD(UP)
noise rejection. Any noise below 848
kbit/s will affect the performance.
[3] External
clock on NFC_CLK_XTAL1 must be LOW.
[4] This
is considering an antenna tuned to sink maximum 250 mA continuous current from the transmitter. The antenna shall be tuned to never exceed this
250 mA maximum current.
PN7160_PN7161
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ll rights reserved.
Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
6 Firmware
versions
6.1 Version
12.50.09
Changes in this version:
•
NDEF write from NFC supported, when the device is in Autonomous NDEF mode.
•
ECP supported in EMVCo profile (PN7161 only).
•
Optimized card removal procedure when ECP is enabled (PN7161 only).
•
Added PRBS support for ISO/IEC 15693.
•
This version is not available on hardware, only as firmware update file
6.2 Version
12.50.06
Changes in this version:
•
Changes to support NFC Forum CR12.
•
Added helper command to configure the Dynamic Power Control (DPC)
•
This version is not available on hardware, only as firmware update file
6.3 Version
12.50.05
Initial version
Production samples will have 12.50.05 firmware.
PN7160_PN7161
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V
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ll rights reserved.
Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
7 Ordering
information
Table 2.ꢀOrdering information
Type number
Package
Name
Description
Version
VFBGA64
plastic very thin fine-pitch ball grid array package;
64 balls
SOT1860-1
SOT618-1
SOT1860-1
SOT618-1
HVQFN40
VFBGA64
HVQFN40
plastic thermal enhanced very thin quad flat
package; no leads; 40 terminals
plastic very thin fine-pitch ball grid array package;
64 balls
plastic thermal enhanced very thin quad flat
package; no leads; 40 terminals
[1] x:
A = I
2
C-bus interface; B = SPI-bus interface.
[2] y:
correspond to firmware variant.
[3] zz:
correspond to package variant. HN = HVQFN40 package; EV = VFBGA64 package.
PN7160 is available in different configurations:
Table 3.ꢀProduct variants PN7160
Part number
Control
Package
Packing
MOQ
Marking
12NC
interface /
firmware
version
PN7160A1EV/ I
2
C / 12.50.05
C100
PN7160A1EV/ I
2
C / 12.50.05
C100
PN7160A1HN/ I
2
C / 12.50.05
C100
PN7160A1HN/ I
2
C / 12.50.05
C100
VFBGA64
VFBGA64
HVQFN40
HVQFN40
VFBGA64
VFBGA64
HVQFN40
HVQFN40
Reel
4500
2450
4000
490
71601
71601
71601
71601
71602
71602
71602
71602
9354 166 64518
9354 166 64557
9354 166 65518
9354 166 65551
9354 237 43518
9354 237 43557
9354 237 44518
9354 237 44551
5-Tray
Reel
1-Tray
Reel
PN7160B1EV/ SPI
/ 12.50.05
C100
4500
2450
4000
490
PN7160B1EV/ SPI
/12.50.05
C100
5-Tray
Reel
PN7160B1HN/ SPI
/12.50.05
C100
PN7160B1HN/ SPI
/ 12.50.05
C100
1-Tray
PN7160_PN7161
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Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Table 4.ꢀProduct variants PN7161
Part number
Control
Package
Packing
MOQ
Marking
12NC
interface/firmwar
version
PN7161A1EV/ I
2
C / 12.50.05
C100
PN7161A1EV/ I
2
C / 12.50.05
C100
PN7161A1HN/ I
2
C / 12.50.05
C100
PN7161A1HN/ I
2
C / 12.50.05
C100
VFBGA64
VFBGA64
HVQFN40
HVQFN40
VFBGA64
VFBGA64
HVQFN40
HVQFN40
Reel
4500
2450
4000
490
71611
71611
71611
71611
71612
71612
71612
71612
9354 237 58518
9354 237 58557
9354 237 59518
9354 237 59551
9354 237 61518
9354 237 61557
9354 237 62518
9354 237 62551
5-Tray
Reel
1-Tray
Reel
PN7161B1EV/ SPI
/ 12.50.05
C100
4500
2450
4000
490
PN7161B1EV/ SPI
/ 12.50.05
C100
5-Tray
Reel
PN7161B1HN/ SPI
/ 12.50.05
C100
PN7161B1HN/ SPI
/ 12.50.05
C100
1-Tray
PN7160_PN7161
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V
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Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
8 Marking
8.1 Marking
VFBGA64
aaa-007526
Figure 2.ꢀPN7160 package marking (top view)
Table 5.ꢀMarking code
Line number
Line 1
Marking code
product version identification
diffusion batch sequence number + assembly lot ID
Line 2
Line 3
manufacturing code including:
•
diffusion center code:
–
S: Power chip (PTCT)
•
assembly center code:
–
S: ATKH
•
RoHS compliancy indicator:
–
D: Dark Green; fully compliant RoHS and no halogen and antimony
•
manufacturing year and week, 3 digits:
–
Y: year
–
WW: week code
•
product life cycle status code:
–
X: means not qualified product
–
nothing means released product
PN7160_PN7161
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Product data sheet
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NXP Semiconductors
8.2 Marking
HVQFN40
PN7160_PN7161
Near Field Communication (NFC) controller
terminal 1
index area
A : 7
B1 : 6
B2 : 6
C : 8
0
5
aaa-043477
Figure 3.ꢀPN7160 Package marking HVQFN40 (top view)
Table 6.ꢀMarking codes
Type number
Marking code
Line A
7 characters used: product version identification
Line B1 + Line B2
Diffusion Bath ID (9 digits) + space + assembly ID number (2
digits)
Line C
8 characters used: manufacturing code
including:
•
diffusion center code:
–
S: Power chip (PTCT)
•
assembly center code:
–
S: ATKH
•
RoHS compliancy indicator:
–
D: Dark Green; fully compliant RoHS
and no halogen and antimony
•
manufacturing year and week, 3 digits:
–
YY: year
–
WW: week code
•
product life cycle status code:
–
X: means not qualified product
–
nothing means released product
PN7160_PN7161
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V
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ll rights reserved.
Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
9 Block
diagram
CLESS
CLESS UART
HOST INTERFACE
INTERFACE UNIT
2
SPI-bus I
C-bus
RF DETECT
DEMOD
DRIVER
PLL
SENSOR
ADC
RX CODEC
TX CODEC
SIGNAL
PROCESSING
TxCtrl
BG
ARM
DATA
CORTEX M0
MEMORY
SRAM
8 kBytes
VMID
EEPROM
4 kBytes
MEMORY
CONTROL
AHB to APB
CODE
MEMORY
POWER
MANAGEMENT UNIT
MISCELLANEOUS
CLOCK MANAGEMENT UNIT
OSCILL
A
TOR OSCILLATOR
ROM
128 kBytes
TEMPERATURE
SENSOR
TIMERS
5.25 V
TXLDO
370 kHz
40 MHz
EEPROM
28 kBytes
FRACN
PLL
QUARTZ
OSCILL
A
TOR
CRC
1.8 V
COPROCESSOR
DSLDO
RANDOM
NUMBER
GENERATOR
aaa-04
1
1
81
Figure 4.ꢀPN7160 block diagram
PN7160_PN7161
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Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
10 Pinning
information
10.1 Pinning
H
G
F
terminal 1
index area
2
I C_ADR0/SPI_NSS
DWL_REQ
1
2
3
4
5
6
7
8
9
30 NFC_CLK_XTA
L
1
29 X
T
A
L2
E
D
C
B
A
2
I C_ADR1/SPI_MOSI
28
27
26
25
V
V
V
V
BAT
V
SS(PAD)
DD
2
I C_SDA/SPI_MISO
DD(A)
DD(HF)
NFCC
V
DD(PAD)
2
I C_SCL/SPI_SCK
IRQ
24 ANT2
23 ANT1
ball A1
index area
1
2
3
4
5
6
7
8
V
22
V
DD_IN2
V
SS(A)
SS
aaa-027834
VEN 10
21 TX1
Figure 5.ꢀPN7160 pinning VFBGA64 (bottom view)
T
r
ansparent top view
aaa-04
1
144
Figure 6.ꢀPN7160 pinning HVQFN40
Table 7.ꢀPN7160 pin description
Symbol
Pin
Pin
Refer
Description
HVQFN40
VFBGA64
I
2
C_ADR0/SPI_NSS
DWL_REQ
I
2
C_ADR1/SPI_MOSI
1
2
3
4
C3
D3
D1
C1
I/O
I
V
DD(PAD)
Host interface pin 1
V
DD(PAD)
Firmware download control pin
V
DD(PAD)
Host interface pin 2
I/O
G
V
SS(PAD)
n/a
Pad ground. Must be connected to
ground.
I
2
C_SDA/SPI_MISO
V
DD(PAD)
I
2
C_SCL/SPI_SCK
5
E1
D2
E2
E3
G3
H1
I/O
P
V
DD(PAD)
Host interface pin 3
n/a Pad
supply voltage
6
7
I/O
O
V
DD(PAD)
Host interface pin 4
IRQ
8
V
DD(PAD)
Interrupt request output
V
SS(A)
9
G
n/a
Analog ground supply voltage
VEN
10
I
V
BAT
Reset pin. Set the device in Hard Power
Down.
i.c.
11
12
–
–
–
–
Internally Connected.
T
o
b
e left open.
V
BAT2
P
n/a
Battery supply voltage. Must be
connected to V
BAT
. VFBGA package:
internally connected.
V
DD(UP)
V
DD(TX)
RXN
13
14
15
H3
G7
H6
P
P
I
n/a
TXLDO input supply voltage
Transmitter supply voltage
Negative receiver input
n/a
V
DD(A)
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Table 7.ꢀPN7160 pin description
…continued
Symbol
Pin
Pin
Refer
Description
HVQFN40
VFBGA64
RXP
16
17
18
H5
H4
–
I
V
DD(A)
n/a
Positive receiver input
V
DD(VMID)
TVDD_IN
P
P
Receiver reference input supply voltage
n/a
Must be connected to V
DD(TX)
and
TVDD_IN2. VFBGA package: internally
connected.
TX2
19
20
H7
H8
O
G
V
DD(TX)
n/a
Antenna driver output
V
SS(TX)
Contactless transmitter ground. Must be
connected to ground.
TX1
21
22
G8
–
O
P
V
DD(TX)
Antenna driver output
TVDD_IN2
Must be connected to V
DD(TX)
and
TVDD_IN. VFBGA package: internally
connected.
ANT1
ANT2
V
DD(HF)
V
DD(A)
23
24
25
26
F7
E7
D6
D7
P
P
P
P
n/a
n/a
n/a
n/a
Antenna connection for wake-up
Antenna connection for wake-up
Monitor rectifier output voltage
Analog supply voltage. Connect to
V
DD(D)
.
V
DD
27
28
–
Must be connected to AVDD and DVDD.
VFBGA package: internally connected.
V
BAT
E8
P
n/a
Battery supply voltage. Must be
connected to V
BAT2
Oscillator output
PLL input
.
XTAL2
29
30
31
D8
C8
C7
O
I
V
DD(D)
V
DD(D)
n/a
NFC_CLK_XTAL1
V
DD(D)
P
Digital supply voltage for decoupling.
Must be connected to V
DD
and V
DD(A)
.
n.c.
32
33
34
35
36
37
–
n.c.
–
n.c.
–
n.c.
–
n.c.
–
DCDC_EN
A2
O
V
DD(PAD)
External DC-DC enable request on
V
DD(PAD)
i.c.
38
B2
A1
B1
–
To
b
e left open.
WKUP_REQ
CLK_REQ
V
SS
39
I
V
DD(PAD)
Wake-up request when in standby
V
DD(PAD)
Clock request pin
40
O
G
Center Pad
n/a
Pad ground. Must be connected to
ground.
i.c.
i.c.
–
–
A3
A4
To
b
e left open.
Must be connected to ground.
PN7160_PN7161
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Product data sheet
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Table 7.ꢀPN7160 pin description
…continued
Symbol
Pin
Pin
Refer
Description
HVQFN40
VFBGA64
i.c.
–
–
–
–
–
–
–
–
–
–
–
–
–
–
A5
A6
A7
A8
B3
B4
B5
B6
B7
B8
C2
C4
C5
C6
To
b
e left open.
To
b
e left open.
Must be connected to ground.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
i.c.
i.c.
i.c.
i.c.
n.c.
n.c.
i.c.
i.c.
i.c.
i.c.
n.c.
n.c.
V
SS(D)
G
n/a
Digital ground supply voltage. Must be
connected to ground.
n.c.
–
–
–
–
–
–
–
–
–
–
–
–
D4
D5
E4
E5
E6
F1
F2
F3
F4
F5
F6
F8
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
To
b
e left open.
n.c.
n.c.
n.c.
n.c.
i.c.
i.c.
i.c.
n.c.
n.c.
n.c.
TX_PWR_REQ
O
V
DD(D)
External TX power supply request on
V
DD(D)
i.c.
–
–
–
–
–
–
G1
G2
G4
G5
G6
H2
Must be connected to ground.
To
b
e left open.
i.c.
n.c.
To
b
e left open.
V
SS(A)
V
SS(A)
i.c.
G
G
n/a
n/a
Analog ground supply voltage
Analog ground supply voltage
To
b
e left open.
[1] P
= power supply; G = ground; I = input; O = output; I/O = input/output
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
11 Functional
description
PN7160 can be connected on a host controller through different physical interfaces (I
2
C-bus and SPI-bus). The
logical interface towards the host controller is NCI-compliant Ref.
[2]
with additional command set for NXP-
specific product features. This IC is fully user controllable by the firmware interface described in Ref.
[6]
.
Moreover, PN7160 provides flexible and integrated power management unit in order to preserve energy
supporting Power Off mode.
APPLICATION
PROCESSOR
Host interface
EXTERNAL SUPPLIES
NFCC
AND CLOCK
ANTENNA
M
A
TCHING
aaa-041132
Figure 7.ꢀPN7160 connection in mobile system
11.1 System
modes
11.1.1 System
power modes
4 power modes are specified: Full power mode, Autonomous mode, Low-power mode and Power Off mode.
Table 8.ꢀSystem power modes description
System power mode
Full power mode
Description
The battery supply (V
BAT
) as well as the pad supply (V
DD(PAD)
) are available
Autonomous mode
The battery supply (V
BAT
) as well as the pad supply (V
DD(PAD)
) are available. Via a SW
command the host sets the NFC controller in autonomous mode (AutoMode bit is set). In
that power mode, the NFC controller will not send any command or signal over V
DD(PAD)
connected pins.
In case of reset via VEN pin the AutoMode bit value is kept unchanged.
This mode is useful to present an NDEF message in Card Emulation mode although the
main system is shut down.
Low-power mode
Power Off mode
The battery supply (V
BAT
) is available but the pad supply (V
DD(PAD)
) is not available. No
host communication is available.
The system is not supplied from any source or the system is kept Hard Power Down
(HPD)
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PN7160_PN7161
Near Field Communication (NFC) controller
AutoMode = 1
Autonomous mode
Full power mode
= Off]
AutoMode = 0
[V
[V
= Off]
DD(PAD)
DD(PAD)
[V
= On]
DD(PAD)
[V
DD(PAD)
= On]
[V
= On && V
= On
DD(PAD)
B
A
T
Low-power mode
VEN = On]
[V
= Off || VEN = Off]
BAT
[V
= On && V
DD(PAD)
= Off
B
A
T
VEN = On]
[V
= Off || VEN = Off]
BAT
[V
= Off || VEN = Off]
(1)
BAT
Power Off mode
[AutoMode = 1
&& VEN = On]
[VEN = Off]
aaa-022797
1. When
V
BAT
goes OF
F
,
A
utoMode = 0.
Figure 8.ꢀSystem power mode diagram
T
a
ble 9
summarizes the system power mode of the PN7160 depending on the status of the external supplies
available in the system:
Table 9.ꢀSystem power modes configuration
V
BAT
Off
V
DD(PAD)
VEN
X
AutoMode bit
Power mode
X
X
X
0
Power Off mode
Power Off mode
Full power mode
Autonomous mode
Low-power mode
On
X
Off
On
On
On
On
On
On
Off
On
1
On
X
Depending on power modes, some application states are limited:
Table 10.ꢀSystem power modes description
System power mode
Allowed communication modes
not applicable
Power Off mode
Low-power mode
Autonomous mode
Card Emulation only
Full power mode
Reader/Writer, Card Emulation, P2P modes
11.1.2 PN7160
power states
Next to system power modes defined by the status of the power supplies, the power states include the logical
status of the system. Thus extend the power modes.
3 power states are specified: Hard Power Down (HPD), Standby, Active.
Table 11.ꢀPN7160 power states
Power state name
Description
Hard Power Down
The PN7160 is supplied by V
BAT
within its operating range and PN7160 is kept in Hard Power
Down (VEN voltage is kept low by host or SW programming) to have the minimum power
consumption. The system mode is in Power Off.
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PN7160_PN7161
Near Field Communication (NFC) controller
Table 11.ꢀPN7160 power states
…continued
Power state name
Description
Standby
The PN7160 is supplied by V
BAT
within its operating range, VEN voltage is high (by host or SW
programming) and minimum part of PN7160 is kept supplied to enable configured wake-up
sources which allow to switch to Active state; RF field, Host interface (if V
DD(PAD)
is high). The
system mode is Low-power mode or Full power mode.
Active
The PN7160 is supplied by V
BAT
within its operating range, VEN voltage is high (by host or SW
programming), V
DD(PAD)
is high and the PN7160 internal blocks are supplied. 3 sub-modes are
defined: Idle, Listener and Poller. The system mode is Full power mode.
At application level, the PN7160 will continuously switch between different states to optimize the current
consumption (polling loop mode). Refer to
T
a
ble 1
for targeted current consumption in here described states.
The PN7160 is designed to allow the host controller to have full control over its functional states.
11.1.2.1 Hard
Power Down (HPD) state
The Hard Power Down state is entered when V
DD(PAD)
and V
BAT
are high by setting VEN voltage < 0.4
V
.
A
s
these signals are under host control, the PN7160 has no influence on entering or exiting this state.
11.1.2.2 Standby
state
Active state is PN7160’s default state after boot sequence in order to allow a quick configuration of PN7160. It is
recommended to change the default state to Standby state after first boot in order to save power. PN7160 can
switch to Standby state autonomously (if configured by host). This state is independent of the V
DD(PAD)
value.
In this state, PN7160 most blocks including CPU are disconnected from power supply. Number of wake-up
sources exist to put PN7160 into Active state (all host-related wake-up events imply that V
DD(PAD)
is available):
•
Host interface wake-up event (I
2
C-bus, SPI-bus)
•
Host interface wake-up via WKUP_REQ pin
•
Antenna RF level detector
•
Internal timer event when using polling loop (370 kHz Low-power oscillator is enabled)
If wake-up event occurs, PN7160 will switch to Active state. Any further operation depends on software
configuration and/or wake-up source.
11.1.2.3 Active
state
Within the Active state, the system is acting as an NFC device. The device can be in 3 different power states:
Idle, Listener and Poller.
Table 12.ꢀFunctional modes in active state
Functional modes
Description
Idle
the PN7160 is active and host interface communication is on going. The RF interface is not
activated. If Standby state is de-activated PN7160 stays in Idle mode even when no host
communication.
Listener
Poller
the PN7160 is active and is listening to external device. The RF interface is activated.
the PN7160 is active and is in Poller mode. It polls external device. The RF interface is
activated.
PN7160_PN7161
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Poller mode
PN7160_PN7161
Near Field Communication (NFC) controller
In this mode, PN7160 is acting as Reader/Writer or NFC Initiator, searching for or communicating with passive
tags or NFC target. Once RF communication has ended, PN7160 will switch to Idle mode or Standby state to
save energy. Poller mode shall be used with 2.8 V < V
BAT
< 5.5 V and VEN voltage > 1.1
V
.
P
oller mode shall
Listener mode
In this mode, PN7160 is acting as a card or as an NFC
T
a
rget. Listener mode shall be used with 2.8 V < V
BAT
< 5.5 V and VEN voltage > 1.1
V
.
O
nce RF communication has ended, PN7160 will switch to Idle mode or
Standby state to save energy.
11.1.2.4 Polling
loop
The polling loop will sequentially set PN7160 in different power states (Active or Standby). All RF technologies
supported by PN7160 can be independently enabled within this polling loop.
There are 2 main phases in the polling loop:
•
Listening phase. The PN7160 can be in Standby power state or Idle mode (called pause in
Figure 9
; no
communication is on-going) or Listener mode (called Emulation in
Figure 9
; card / target communication is
started)
•
Polling phase. The PN7160 is in Poller mode
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
Listening phase
Emulation
Pause
Type A
Type B
Type F
@424
Type F
@212
ISO15693
Polling phase
aaa-016741
Figure 9.ꢀPolling loop: all phases enabled
In Listening phase when no RF field PN7160 is in Standby state if enabled (otherwise it is Idle mode) and is in
Listener mode (Emulation) when RF field is detected. When in Polling phase, PN7160 goes to Poller mode.
To
f
urther decrease the power consumption when running the polling loop, PN7160 features a low-power RF
polling. When PN7160 is in Polling phase instead of sending regularly RF command PN7160 senses with
a short RF field duration if there is any NFC
T
a
rget or card/tag present. If yes, then it goes back to standard
polling loop. With 500 ms (configurable duration, see Ref.
[6]
) listening phase duration, the average power
consumption is around 100 μA depending on RF matching conditions.
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Listening phase
Emulation
Pause
Polling phase
aaa-016743
Figure 10.ꢀPolling loop: low-power RF polling
PN7160 provides the support of the following host interfaces:
•
I
2
C-bus
T
a
rget Interface, up to 3.4 MBaud
•
SPI-bus
T
a
rget Interface, up to 7 MBaud
Only one host interface can be active at a time, as the pins are shared for all interfaces.
The selection between interfaces is fused during IC manufacturing so that different ordering numbers for the
I
2
C-bus and SPI-bus version are in place.
The host interfaces are woken-up in the following way:
•
wake-up with WKUP_REQ input pin
•
I
2
C-bus: wake-up on I
2
C-bus address
•
SPI-bus: transition of NSS serial
•
data received on RX line
2
Updated the terms “Master/Slave” to “Controller/
T
a
rget” to align with the recommendation of the NXP – I2C standards organization.
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PN7160_PN7161
Near Field Communication (NFC) controller
To
e
nable and ensure data flow control between PN7160 and host controller, additionally a dedicated interrupt
The I
2
C-bus interface implements a target I
2
C-bus interface with integrated shift register, shift timing generation
and target address recognition.
I
2
C-bus Standard mode (100 kHz SCL), Fast mode (400 kHz SCL) and High-speed mode (3.4 MHz SCL) are
supported.
The main hardware characteristics of the I
2
C-bus module are:
•
Support target I
2
C-bus
•
Standard, Fast and High-speed modes supported
•
Wake-up of PN7160 on its address only
•
Serial clock synchronization can be used by PN7160 as a handshake mechanism to suspend and resume
serial transfer (clock stretching)
The I
2
C-bus interface module meets the I
2
C-bus specification Ref.
[4]
except General call, 10 bit addressing
and Fast mode Plus (Fm+).
11.2.1.1 I
2
C-bus configuration
The I
2
C-bus interface shares four pins with SPI-bus interface also supported by PN7160. When I
2
C-bus is
Table 13.ꢀFunctionality for I
2
C-bus interface
Pin name
HIF1
Functionality
I
2
C-bus address 0
I
2
C-bus address 1
I
2
C-bus data line
I
2
C-bus clock line
HIF2
[1] HIF3
and HIF4 are not fail-safe and V
DD(pad)
shall always be available when using the SCL and SDA lines connected to these pins.
PN7160 supports 7-bit addressing mode. Selection of the I
2
C-bus address is done by 2-pin configurations on
top of a fixed binary header: 0, 1, 0, 1, 0, HIF2, HIF1, R/W.
Table 14.ꢀI
2
C-bus interface addressing
HIF2
HIF1
I
2
C-bus address
(R/W = 0, write)
I
2
C-bus address
(R/W = 1, read)
0
0
1
1
0
1
0
1
0x50
0x52
0x54
0x56
0x51
0x53
0x55
0x57
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PN7160_PN7161
Near Field Communication (NFC) controller
11.2.2.1 Features
•
Synchronous, Serial, Full-Duplex communication, 7 MHz maximum
•
T
a
rget mode
In order to select SPI-bus interface for host communication, some EEPROM settings are programmed during
production.
The selection between interfaces is fused during IC manufacturing so that different ordering numbers for the
SPI-bus version.
Table 15.ꢀSPI-bus configuration
Connection
CPHA switch: Clock PHAse: defines the sampling edge of MOSI data
•
CPHA = 0: data are sampled on MOSI on the odd clock edges of SCK after NSS goes low
CPOL switch: Clock POLarity
•
IFSEL1 = 0: the clock is idle low and the first valid edge of SCK will be a rising one
The SPI-bus interface shares 4 pins with the I
2
C-bus interface. During production of the device, the interface
is fixed to SPI or I²C and cannot be changed later. The functionality of the interface pins in SPI configuration is
Table 16.ꢀFunctionality for SPI-bus interface
Pin name
HIF1
Functionality
NSS (Not
T
a
rget Select)
MOSI (Controller Out
T
a
rget In)
MISO (Controller In
T
a
rget Out)
SCK (Serial Clock)
HIF2
HIF3
HIF4
When a controller device transmits data to PN7160 (target device) via the MOSI line, PN7160 responds by
sending data to the controller device via the controllers MISO line. This implies full-duplex transmission with
both data out and data in synchronized with the same clock signal.
PN7160 starts sampling when receiving a logic low at pin NSS and the clock at input pin SCK. Thus, PN7160 is
synchronized with the controller. Data from the controller is received serially at the target MOSI line and loads
the 8-bit shift register. After the 8-bit shift register is loaded, its data is transferred to the read buffer. During a
write cycle, data is written into the shift register, then PN7160 waits for a clock train from the controller to shift
the data out on the targets MISO line.
•
Controller In
T
a
rget Out (MISO)
The MISO line is configured as an input in a controller device and as an output in a target device. It is used to
transfer data from the target to the controller, with the most significant bit sent first. The MISO line of a target
device should be placed in the high impedance state if the target is not selected.
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PN7160_PN7161
Near Field Communication (NFC) controller
•
Controller Out
T
a
rget In (MOSI)
The MOSI line is configured as an output in a controller device and as an input in a target device. It is used to
transfer data from the controller to a target, with the Most Significant Bit (MSB) sent first.
•
Serial Clock (SCK)
The serial clock is used to synchronize data movement both in and out of the device through its MOSI and
MISO lines. The controller and target devices are capable of exchanging a byte of information during a
sequence of eight clock cycles. Since the controller device generates SCK, this line becomes an input on a
target device and an output at the controller device.
•
Not
T
a
rget Select (NSS)
The target select input line is used to select a target device. It has to be low prior to data transactions and
must stay low of the duration of the transaction. The NSS line on controller side must be tied high.
Both controller and target devices must operate with the same timing. The controller device always places data
on the MOSI line a half cycle before the clock edge SCK, in order for the target device to latch the data.
11.3 PN7160
clock concept
There are 4 different clock sources in PN7160:
•
27.12 MHz clock coming either/or from:
–
Internal oscillator for 27.12 MHz crystal connection on NFC_CLK_XTAL1 and XTAL2 pins
–
External reference clock on pin NFC_CLK_XTAL1. It is internally forwarded to an integrated PLL which
includes a 1 GHz VCO.
•
13.56 MHz RF clock recovered from RF field
•
Low-power oscillator 40 MHz
•
Low-power oscillator 370 kHz
11.3.1 27.12
MHz quartz oscillator
When enabled, the 27.12 MHz quartz oscillator applied to PN7160 is the time reference for the RF front end
when PN7160 is behaving in Reader mode or NFCIP-1 Initiator.
Therefore stability of the clock frequency is an important factor for reliable operation. It is recommended to
NFCC
NFC_CLK_XTAL1
X
T
AL2
crystal
27.12 MHz
c
c
aaa-041133
Figure 11.ꢀ27.12 MHz crystal oscillator connection
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
Table 17.ꢀCrystal requirements
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
f
xtal
crystal frequency
ISO/IEC, FCC and FeliCa
global compliancy
–
27.12
–
MHz
Δf
xtal
ESR
C
L
crystal frequency accuracy
equivalent series resistance
load capacitance
full operating range
-50
–
+50
100
–
ppm
Ω
–
–
–
50
10
–
pF
P
xtal
crystal power dissipation
100
μW
[1] This
requirement is according to FCC regulations (± 100 ppm) and FeliCa global (± 50 ppm) requirements.
T
o
m
eet only ISO/IEC 14443 and ISO/IEC
18092, then ± 14 kHz apply which is equivalent to ± 516 ppm.
11.3.2 Integrated
PLL to make use of external clock
When enabled, the PLL is designed to generate a low noise 27.12 MHz from an input clock 19.2 MHz, 26 MHz,
32 MHz, 38.4 MHz and 48 MHz.
The 27.12 MHz of the PLL is used as the time reference for the RF front end.
The input clock on NFC_CLK_XTAL1 shall comply with the.following phase noise requirements for the following
input frequency: 19.2 MHz, 26 MHz, 32 MHz, 38.4 MHz and 48 MHz:
dBc/Hz
-20dBc/decade
input reference
noise floor
-140 dBc/Hz
Hz
input reference noise corner
50 kHz
aaa-026327
Figure 12.ꢀInput reference phase noise characteristics
This phase noise is equivalent to an RMS jitter of 6.23 ps from 10 Hz to 1 MHz. For configuration of input
frequency, refer to Ref.
[10]
. There are 7 pre programmed and validated frequencies for the PLL: 19.2 MHz, 26
MHz, 32 MHz, 38.4 MHz and 48 MHz.
Table 18.ꢀPLL input requirements
Coupling: single-ended, AC coupling;
Symbol
Parameter
Conditions
Min
Typ
19.2
26
Max
Unit
MHz
MHz
MHz
MHz
MHz
f
clk
clock frequency
ISO/IEC, FCC and FeliCa global
compliancy
–
–
–
–
–
–
–
–
–
–
32
38.4
48
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PN7160_PN7161
Near Field Communication (NFC) controller
Table 18.ꢀPLL input requirements
…continued
Coupling: single-ended, AC coupling;
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
f
i(ref)acc
reference input frequency
accuracy
full operating range; frequencies
typical values: 19.2 MHz, 26 MHz,
32 MHz, 38.4 MHz and 48 MHz
-20
–
+20
ppm
φ
n
phase noise
input noise floor at 50 kHz
-140
–
–
dB/Hz
Sinusoidal shape
V
i(p-p)
V
i(clk)
peak-to-peak input voltage
clock input voltage
0.2
0
–
–
1.8
1.8
V
V
Square shape
V
i(clk)
clock input voltage
0
–
1.8
V
[1] This
requirement is according to FCC regulations (± 100 ppm) and FeliCa global (± 50 ppm) requirements.
T
o
m
eet only ISO/IEC 14443 and ISO/IEC
18092, then ± 7 kHz apply which is equivalent to ± 516 ppm.
[2] Overshoot
and undershoot shall not exceed 10%.
11.3.3 Low-power
40 MHz ± 2.5 % oscillator
Low-power 40 MHz ± 2.5 % oscillator is used as system clock of the system.
Output clock 40 MHz is used by default to clock the system.
11.3.4 Low-power
370 kHz oscillator
A Low Frequency Oscillator (LFO) is implemented to drive a counter (WUC) waking-up PN7160 from Standby
state. This allows implementation of low-power reader polling loop at application level.
Moreover, this 370 kHz is used as the reference clock for write access to EEPROM memory.
11.4 Power
concept
11.4.1 PMU
functional description
The Power Management Unit of PN7160 generates internal supplies required by PN7160 out of V
BAT
and
V
DD(UP)
input supply voltages:
•
V
DDA
: analog output supply voltage. It must be connected to V
DDD
.
•
V
DDD
: digital input supply voltage. It is internally connected to the output of the DSLDO V
DD
.
•
V
DD(TX)
: output supply voltage for the transmitter. It is internally connected to the transmitter input supply
voltage
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PN7160_PN7161
Near Field Communication (NFC) controller
V
V
V
DDA
BAT
DDD
V
DD
V
V
DD(UP)
DD(TX)
TXLDO
DSLDO
TVDD_IN
BANDGAP
DIE
NFCC
aaa-041134
Figure 13.ꢀPMU functional diagram
11.4.2 DSLDO:
Dual Supply LDO
The input pin of the DSLDO regulator is V
BAT
.
The output of this regulator (V
DD
) is internally connected to supply the internal digital blocks which are on V
DDD
.
It must be externally de-coupled and V
DDD
must be connected to V
DDA
.
11.4.3 TXLDO
Transmitter voltage is generated by internal LDO (V
DD(TX)
).
This TXLDO allows a maximum continuous current load up to 250 mA in order to support ISO/IEC 14443 and
NFC Forum standard compliant operations.
The Low Drop Out regulator has been designed to reject the noise which could interfere with the RF
communication.
Table 19.ꢀTXLDO
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
DD(TXLDO)
drop TXLDO supply
voltage
V
DD(UP)
= 5.3 V; Transmitter current =
250 mA
–
–
0.3
V
(drop)
The regulator has been designed to work in 2 modes:
11.4.3.1 Configuration
1: the battery voltage is directly used to generate the RF field
The input supply of the regulator is directly the V
BAT
voltage which is connected to V
DD(UP)
the input of the
TXLDO.
The output is called V
DD(TX)
.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
V
V
DD(UP)
BATTERY
V
BAT
NFCC
DD(TX)
aaa-041135
Figure 14.ꢀV
DD(UP)
= V
BAT
The V
DD(TX)
value is programmable and shall be chosen according to the minimum targeted VBAT value for
which reader and card modes shall work: VTHRESHOLD.
The TXLDO output voltage is then given by:
Figure 15
shows V
DD(TX)
offset disabled behavior for both cases of V
DD(TX)
programmed for 3.0
V
,
3
.3 V or 3.6
V.
5.0 V
3.6 V
V
~ 1 Ω * load
DD(TXLDO)(drop)
3.3 V
3.0 V
2.8 V
4.5 V
3.6 V
3.3 V
3.0 V
2.8 V
aaa-025682
Figure 15.ꢀV
DD(TX)
behavior when supplied from V
BAT
In Standby state, whatever V
THRESHOLD
value is configured, V
DD(TX)
is regulated at 2.5
V
.
Figure 16
shows the case where the PN7160 is in standby state.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
V
BAT
2.5 V
2.5 V
aaa-009463
Figure 16.ꢀV
DD(TX)
behavior when PN7160 is in Standby state
11.4.3.2 Configuration
2: an extra external voltage is used to generate the RF field
TXLDO has also the possibility to generate V
DD(TX)
up to 5.25 V in case the supply of this regulator is an
external supply.
V
DD(UP)
EXTERNAL 5 V
BATTERY
V
BAT
NFCC
V
DD(TX)
aaa-041136
Figure 17.ꢀV
DD(UP)
up to 5.8
V
,
V
BAT
up to 5.5 V
The TXLDO output voltage is then given by:
V
5.5 V
DD(UP)
4.75 V
4.5 V
V
DD(TX)
V
~ 1 Ω * load
DD(TXLDO)(drop)
aaa-025683
Figure 18.ꢀV
DD(TX)
behavior when PN7160 is supply using external supply on V
DD(UP)
PN7160_PN7161
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Near Field Communication (NFC) controller
In Standby state, whatever V
THRESHOLD
is configured, V
DD(TX)
is regulated at 2.5 V as illustrated by
Figure 16
.
11.4.3.3 TXLDO
limiter
The TXLDO includes a current limiter to avoid too high current within TX1 and TX2.
The current limiter block compares an image of the TXLDO output current to a reference, when the reference is
reached the output current gets limited.
The limiting current is 300 mA ± 30 mA, above the specified maximum current allowed for RF operation (250
mA).
11.4.3.4 TXLDO:
configuration
Table 20.ꢀConfigurations using TXLDO
PN7160 power state
TXLDO config.
configuration 1
configuration 2
Mode
V
DD(TX)
Active mode
Full-power
Full-power
2.7 V/3 V/3.3 V/3.6 V/3.9 V/4.2 V/4.5 V/4.7
Standby
configuration 1 and
configuration 2
Low-power
Power-off
2.5 V
Hard-Power down
configuration 1 and
configuration 2
High impedance
[1] For
proper operation, the V
DD(TX)
voltage value set shall be below the V
DD(UP)
– 0.3 V value. The maximum V
DD(UP)
value is 5.8 V in configuration 2. In
configuration 1, the voltage is given by the battery then the higher voltages might not be usable.
When using an external DC-to-DC with pass-through functionality, the signal TX_PWR_REQ is used for control
purpose. The DC-to-DC will be in pass-through mode except when high transmitter power is required (by default
when RF emission or RF field present).
Note:
the signal TX_PWR_REQ is not available on the HVQFN package variant.
Alternatively the signal DCDC_EN can be used for the same purpose. This signal is available on both package
variants. HVQFN and VFBGA.
11.4.4 Very
low-power RF field detector
A very specific use case is the RF field detection when the NFCC is in Power Off mode. In this scenario, the
NFCC should detect the presence of an external magnetic field and notify the host system about its presence.
Figure 19
shows the internal rectifier circuit. The circuit is built up by the input switches SW1 and SW2 which
can disconnect the rectifier from the antenna by creating a short to ground. The rectifier itself is followed by a
limiter.
ANT1
rectifier
SW1
SW2
V
DD(HF)
C
vdhf
limiter
ANT2
aaa-022801
Figure 19.ꢀInternal rectifier circuit
PN7160_PN7161
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11.5 Reset
and download concept
11.5.1 Resetting
PN7160
To
e
nter reset, the V
EN
voltage shall be set to low (this is also the Hard Power Down state):
Reset means resetting the embedded FW execution and the registers values to their default values. Parts of
these default values are defined from EEPROM data loaded values, others are hardware defined. See Ref.
[6]
to know which ones are accessible to tune PN7160 to the application environment.
To
g
et out of reset:
•
Pulling VEN voltage high with V
BAT
within its operating range
Figure 20
shows reset done via VEN pin.
V
BAT
V
DD(PAD)
host
communication
possible
V
EN
t
t
boot
WL(VEN)
aaa-024833
Figure 20.ꢀResetting PN7160 via VEN pin
11.5.2 Power-up
sequences
PN7160 allows V
BAT
and V
DD(PAD)
to be set up independently, therefore different power-up sequences have to
be considered.
In all cases, host communication with PN7160 will only be possible after one defined amount of time from the
different supply sequence setup and VEN reset pin.
11.5.2.1 V
BAT
is set up before V
DD(PAD)
This is at least the case when V
BAT
pin is directly connected to the battery and when PN7160 V
BAT
is always
supplied as soon the system is supplied.
As VEN pin is referred to V
BAT
pin, V
EN
shall go high after V
BAT
has been set.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
V
BAT
V
DD(PAD)
interface selection
t
t
t(VDDPAD-VEN)
boot
host
communication
possible
V
EN
aaa-013871
Figure 21.ꢀV
BAT
is set up before V
DD(PAD)
11.5.2.2 V
DD(PAD)
and V
BAT
are set up at the same time
This is the case, when V
BAT
pin is connected to a PMU/regulator which also supply V
DD(PAD)
.
V
BAT
t
t(VBAT-VEN)
V
DD(PAD)
t
boot
host
communication
possible
V
EN
aaa-013872
Figure 22.ꢀV
DD(PAD)
and V
BAT
are set up in the same time
11.5.2.3 PN7160
has been enabled before V
DD(PAD)
is set up or before V
DD(PAD)
has been cut-off
This can be the case when V
BAT
pin is directly connected to the battery and when V
DD(PAD)
is generated from a
PMU. When the battery voltage is too low, then the PMU might no more be able to generate V
DD(PAD)
. When the
device gets charged again, then V
DD(PAD)
is set up again.
As the pins to select the interface are biased from V
DD(PAD)
, when V
DD(PAD)
disappears the pins might not be
correctly biased internally and the information might be lost. Therefore it is required to make the IC boot after
V
DD(PAD)
is set up again.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
V
BAT
V
DD(PAD)
interface selection
t
t
t(VDD
P
A
D-VEN)
boot
host
communication
possible
V
t
WL(VEN)
EN
aaa-024841
Figure 23.ꢀV
DD(PAD)
is set up or cut-off after PN7160 has been enabled
11.5.3 Power-down
sequences
During power-down sequence, V
EN
shall always be set low before V
DD(PAD)
is shut down.
V
BAT
V
EN
t
WL(VEN)
V
DD(PAD)
aaa-024910
Figure 24.ꢀPN7160 power-down sequence
11.5.4 Download
mode
PN7160 offers the possibility to download EEPROM with upgrades using the host interface commands, see Ref.
[6]
for more details.
To
e
nter this mode, the pin DWL_REQ shall be pulled to V
DD(PAD)
before reset via VEN pin is done.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
V
BAT
V
DD(PAD)
DWL_REQ
t
t
boot
t(DWL_REQ-VEN)
t
V
WL(VEN)
EN
download
possible
aaa-024842
Figure 25.ꢀPN7160 download mode sequence
11.6 Contactless
Interface Unit
PN7160 supports various communication modes at different transfer speeds and modulation schemes. The
following chapters give more detailed overview of selected communication modes.
Remark:
all indicated modulation index and modes in this chapter are system parameters. This means that
beside the IC settings a suitable antenna tuning is required to achieve the optimum performance.
11.6.1 Reader/Writer
communication modes
Generally 5 Reader/Writer communication modes are supported:
•
PCD Reader/Writer for ISO/IEC 14443A/MIFARE (NFC Forum Types 2 and 4
T
a
gs)
•
PCD Reader/Writer for NFC Forum Type 1
T
a
g
•
PCD Reader/Writer for NFC Forum Type 3
T
a
g
•
PCD Reader/Writer for ISO/IEC 14443B (NFC Forum Type 4
T
a
g)
•
VCD Reader/Writer for NFC Forum Type 5
T
a
g
11.6.1.1 R/W
mode for NFC Forum Type 1 and 2 Tags and Type 4 Tag type A
The R/W mode for NFC Forum Type 1
T
a
g (T1T), Type 2
T
a
g (T2T) and Type 4
T
a
g type A (T4T) is the general
reader to card communication scheme according to the ISO/IEC 14443A specification.
Figure 26
describes the communication on a physical level, the communication table describes the physical
parameters (the numbers take the antenna effect on modulation depth for higher data rates).
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
PCD to PICC
100 % ASK at 106 kbit/s
> 25 % ASK at 212, 424 or 848 kbit/s
Modified Miller coded
NFCC
PICC (Card)
PICC to PCD,
subcarrier load modulation
Manchester coded at 106 kbit/s
ISO/IEC 14443A – MIFARE
BPSK coded at 212, 424 or 848 kbit/s
PCD mode
ISO/IEC 14443A – MIFARE
aaa-041137
Figure 26.ꢀR/W mode for NFC Forum T1
T
,
T
2T and T4T type A communication diagram
Table 21.ꢀCommunication overview for NFC Forum T1
T
,
T
2T and T4T type A R/W mode
Communication
direction
ISO/IEC 14443A/
ISO/IEC 14443A higher transfer speeds
MIFARE/
NFC Forum T2T
and T4T
Transfer speed
Bit length
106 kbit/s
212 kbit/s
424 kbit/s
848 kbit/s
(128/13.56) μs
(64/13.56) μs
(32/13.56) μs
(16/13.56) μs
PN7160
→
PICC
(data sent by PN7160 to a
modulation on
100 % ASK
> 25 % ASK
> 25 % ASK
> 25 % ASK
card)
PN7160 side
bit coding
Modified Miller
Modified Miller
Modified Miller
Modified Miller
PICC →
PN7160
(data received by PN7160
modulation on
subcarrier load
modulation
subcarrier load
modulation
subcarrier load
modulation
subcarrier load
modulation
from a card)
PICC side
subcarrier
frequency
13.56 MHz/16
13.56 MHz/16
13.56 MHz/16
13.56 MHz/16
bit coding
Manchester
BPSK
BPSK
BPSK
The contactless coprocessor and the on-chip CPU of PN7160 handle the complete ISO/IEC 14443A/MIFARE
RF-protocol, nevertheless a dedicated external host has to handle the application layer communication.
11.6.1.2 R/W
mode for NFC Forum Type 3 Tag, FeliCa communication mode
The R/W mode for NFC Forum Type 3
T
a
g (T3T) is the general Reader/Writer to card communication
scheme according to the FeliCa specification.
Figure 27
describes the communication on a physical level, the
communication overview describes the physical parameters.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
PCD to PICC,
8 – 12 % ASK at 212 or 424 kbits/s
Manchester coded
NFCC
PICC (Card)
PICC to PCD,
load modulation
Manchester coded at 212 or 424 kbits/s
ISO/IEC 18092 – FeliCa
PCD mode
FeliCa card
aaa-04
1
138
Figure 27.ꢀR/W mode for NFC Forum T3T communication diagram
Table 22.ꢀCommunication overview for NFC Forum T3T R/W mode, FeliCa communication mode
Communication direction
FeliCa
FeliCa higher transfer speeds
424 kbit/s
Transfer speed
Bit length
212 kbit/s
(64/13.56) μs
(32/13.56) μs
PN7160
→
PICC
(data sent by PN7160 to a card)
modulation on
PN7160 side
8 % – 12 % ASK
Manchester
8 % – 12 % ASK
Manchester
bit coding
PICC →
PN7160
(data received by PN7160 from a card)
modulation on PICC
load modulation
side
load modulation
subcarrier frequency
no subcarrier
no subcarrier
Manchester
bit coding
Manchester
The contactless coprocessor of PN7160 and the on-chip CPU handle the FeliCa protocol. Nevertheless a
dedicated external host has to handle the application layer communication.
11.6.1.3 R/W
mode for NFC Forum type 4 Tag (T4T) type B
The R/W mode for the NFC Forum Type 4
T
a
g of type B is the general reader to card communication scheme
according to the ISO/IEC 14443B specification.
Figure 28
describes the communication on a physical level, the
communication table describes the physical parameters.
PCD to PICC,
8 – 14 % ASK at 106, 212, 424 or 848 kbit/s
NRZ coded
NFCC
PICC (Card)
PICC to PCD,
subcarrier load modulation
BPSK coded at 106, 212, 424 or 848 kbit/s
ISO/IEC 14443 Type B
PCD mode
ISO/IEC 14443 Type B
aaa-04
1
139
Figure 28.ꢀR/W mode for NFC forumT4T type B communication diagram
PN7160_PN7161
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Near Field Communication (NFC) controller
Table 23.ꢀCommunication overview for NFC Forum T4T type B R/W mode
Communication
direction
ISO/IEC 14443B
ISO/IEC 14443B higher transfer speeds
Transfer speed
Bit length
106 kbit/s
212 kbit/s
424 kbit/s
848 kbit/s
(128/13.56) μs
(64/13.56) μs
(32/13.56) μs
(16/13.56) μs
PN7160
→
PICC
(data sent by PN7160 to a
modulation on
8 % – 14 % ASK
8 % – 14 % ASK
8 % – 14 % ASK
8 % – 14 % ASK
card)
PN7160 side
bit coding
NRZ
NRZ
NRZ
NRZ
PICC →
PN7160
(data received by PN7160
modulation on
subcarrier load
modulation
subcarrier load
modulation
subcarrier load
modulation
subcarrier load
modulation
from a card)
PICC side
subcarrier
frequency
13.56 MHz/16
13.56 MHz/16
13.56 MHz/16
13.56 MHz/16
bit coding
BPSK
BPSK
BPSK
BPSK
The contactless coprocessor and the on-chip CPU of PN7160 handles the complete ISO/IEC 14443B RF-
protocol, nevertheless a dedicated external host has to handle the application layer communication.
11.6.1.4 R/W
mode for NFC Forum Type 5 Tag
The R/W mode for NFC Forum Type 5
T
a
g (T5T) is the general reader to card communication scheme
according to the ISO/IEC 15693 specification. PN7160 communicates with VICC (Type 5
T
a
g) using only 26.48
kbit/s with single subcarrier.
PN7160 supports the commands as defined by the ETSI HCI (see Ref.
[12]
) and on top offers the inventory of
the tags (anti-collision sequence) on its own.
VCD to VICC,
100 % ASK at 26.48 kbit/s
pulse position coded
NFCC
Card
(VICC/TAG)
VICC to VCD,
subcarrier load modulation
Manchester coded at 26.48 kbit/s
ISO/IEC 15693
VCD mode
ISO/IEC 15693
aaa-041140
Figure 29.ꢀR/W mode for NFC Forum T5T communication diagram
Figure 29
shows the communication schemes used.
The following communication scheme is possible.
Table 24.ꢀCommunication overview for NFC Forum T5T R/W mode
Communication direction
PN7160
→
VICC
(data sent by PN7160 to a tag)
transfer speed
26.48 kbit/s
(512/13.56) μs
100 % ASK
bit length
modulation on PN7160 side
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
Table 24.ꢀCommunication overview for NFC Forum T5T R/W mode
…continued
Communication direction
bit coding
pulse position modulation 1 out of 4 mode
VICC →
PN7160
(data received by PN7160 from a tag)
transfer speed
bit length
26.48 kbit/s
(512/13.56) μs
modulation on VICC side
subcarrier load modulation
single subcarrier
Manchester
subcarrier frequency
bit coding
11.6.2 ISO/IEC
18092, Ecma 340 NFCIP-1 communication modes
An NFCIP-1 communication takes place between 2 devices:
•
NFC Initiator: generates RF field at 13.56 MHz and starts the NFCIP-1 communication.
•
NFC
T
a
rget: responds to NFC Initiator command either in a load modulation scheme in Passive
communication mode or using a self-generated and self-modulated RF field for Active communication mode.
The NFCIP-1 communication differentiates between Active and Passive communication modes.
•
Active communication mode means both the NFC Initiator and the NFC
T
a
rget are using their own RF field to
transmit data
•
Passive communication mode means that the NFC
T
a
rget answers to an NFC Initiator command in a load
modulation scheme. The NFC Initiator is active in terms of generating the RF field.
PN7160 supports the Active Initiator, Active
T
a
rget, Passive Initiator and Passive
T
a
rget communication modes
at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s as defined in the NFCIP-1 standard.
BATTERY
HOST
BATTERY
HOST
NFCC
NFCC
initiator: active
target: passive or active
aaa-04
1
141
Figure 30.ꢀNFCIP-1 communication mode
The contactless coprocessor of PN7160 and the on-chip CPU handle NFCIP-1 protocol, for all communication
modes and data rates, for both NFC Initiator and NFC
T
a
rget.
Nevertheless a dedicated external host has to handle the application layer communication.
11.6.2.1 Active
communication mode
Active communication mode means both the NFC Initiator and the NFC
T
a
rget are using their own RF field to
transmit data.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
host
host
NFCC
NFC Target
NFC Initiator
1. NFC Initiator starts the communication at selected transfer speed
power
power
to generate
the field
for digital
processing
host
host
NFCC
NFC Target
NFC Initiator
2. NFC Target answers at the same transfer speed
power
power
for digital
processing
to generate
the field
aaa-041142
Figure 31.ꢀActive communication mode
Table 25.ꢀOverview for Active communication mode
Communication direction
NFC Initiator to NFC Target
NFC Target to NFC Initiator
ISO/IEC 18092, Ecma 340, NFCIP-1
Baud rate
Bit length
106 kbit/s
212 kbit/s
424 kbit/s
(32/13.56) μs
(128/13.56) μs
(64/13.56) μs
modulation
bit coding
100 % ASK
Manchester Manchester
Modified Miller
modulation
bit coding
100 % ASK
Miller
Manchester Manchester
[1] This
modulation index range is according to NFCIP-1 standard. It might be that some NFC Forum type 3 cards does not withstand the full range as based
11.6.2.2 Passive
communication mode
Passive communication mode means that the NFC
T
a
rget answers to an NFC Initiator command in a load
modulation scheme.
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
host
host
NFCC
NFC Target
NFC lnitiator
1. NFC Initiator starts the communication at selected transfer speed
power
power
to generate
the field
for digital
processing
host
host
NFCC
NFC Target
NFC lnitiator
2. NFC Target answers using load modulation at the same transfer speed
power
power
to generate
the field
for digital
processing
aaa-041143
Figure 32.ꢀPassive communication mode
Table 26.ꢀOverview for Passive communication mode
Communication direction
NFC Initiator to NFC Target
NFC Target to NFC Initiator
ISO/IEC 18092, Ecma 340, NFCIP-1
Baud rate
Bit length
106 kbit/s
212 kbit/s
424 kbit/s
(128/13.56) μs
(64/13.56) μs
(32/13.56) μs
modulation
bit coding
100 % ASK
Modified Miller
Manchester
Manchester
modulation
subcarrier load
modulation
load modulation
load modulation
subcarrier frequency
bit coding
13.56 MHz/16
Manchester
no subcarrier
Manchester
no subcarrier
Manchester
[1] This
modulation index range is according to NFCIP-1 standard. It might be that some NFC Forum type 3 cards does not withstand the full range as based
11.6.2.3 NFCIP-1
framing and coding
The NFCIP-1 framing and coding in Active and Passive communication modes are defined in the NFCIP-1
standard: ISO/IEC 18092 or Ecma 340.
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11.6.2.4 NFCIP-1
protocol support
The NFCIP-1 protocol is not completely described in this document. For detailed explanation of the protocol,
refer to the ISO/IEC 18092 or Ecma 340 NFCIP-1 standard. However the datalink layer is according to the
following policy:
•
Transaction includes initialization, anti-collision methods and data transfer. This sequence must not be
interrupted by another transaction.
•
PSL shall be used to change the speed between the target selection and the data transfer, but the speed
should not be changed during a data transfer.
11.6.3 Card
mode
PN7160 can be addressed as an NFC Forum T4
T
,
I
SO/IEC 14443A, MIFARE, or ISO/IEC 14443B card. This
means that PN7160 can generate an answer in a load modulation scheme according to the ISO/IEC 14443A,
and ISO/IEC 14443B interface description.
Remark:
PN7160 does not support a complete card protocol. This has to be handled by the host controller.
11.6.3.1 NFC
Forum T4
T
,
I
SO/IEC 14443A
Table 27.ꢀOverview for NFC Forum T4
T
,
I
SO/IEC 14443A card mode
Communication
direction
ISO/IEC 14443A
106 kbit/s
ISO/IEC 14443A higher transfer speeds
Transfer speed
Bit length
212 kbit/s
424 kbit/s
(128/13.56) μs
(64/13.56) μs
(32/13.56) μs
PCD →
PN7160
(data received by PN7160
modulation on PCD
100 % ASK
> 25 % ASK
> 25 % ASK
from a card)
side
bit coding
Modified Miller
Modified Miller
Modified Miller
PN7160
→
PCD
(data sent by PN7160 to a
modulation on
subcarrier load modulation
subcarrier load
modulation
subcarrier load
modulation
card)
PN7160 side
subcarrier
frequency
13.56 MHz/16
13.56 MHz/16
13.56 MHz/16
bit coding
Manchester
BPSK
BPSK
11.6.3.2 NFC
Forum T4
T
,
I
SO/IEC 14443B card mode
Table 28.ꢀOverview for NFC Forum T4
T
,
I
SO/IEC 14443B card mode
Communication
direction
ISO/IEC 14443B
106 kbit/s
ISO/IEC 14443B higher transfer speeds
Transfer speed
Bit length
212 kbit/s
424 kbit/s
(128/13.56) μs
(64/13.56) μs
(32/13.56) μs
PCD →
PN7160
(data received by PN7160
modulation on PCD
8 % – 14 % ASK
8 % – 14 % ASK
NRZ
8 % – 14 % ASK
NRZ
from a Reader)
side
bit coding
NRZ
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
Table 28.ꢀOverview for NFC Forum T4
T
,
I
SO/IEC 14443B card mode
…continued
Communication
direction
ISO/IEC 14443B
106 kbit/s
ISO/IEC 14443B higher transfer speeds
Transfer speed
Bit length
212 kbit/s
424 kbit/s
(128/13.56) μs
(64/13.56) μs
(32/13.56) μs
PN7160
→
PCD
(data sent by PN7160 to a
modulation on
subcarrier load
modulation
subcarrier load
modulation
subcarrier load
modulation
Reader)
PN7160 side
subcarrier
frequency
13.56 MHz/16
13.56 MHz/16
13.56 MHz/16
bit coding
BPSK
BPSK
BPSK
11.6.4 Frequency
interoperability
When in communication, PN7160 is generating some RF frequencies. PN7160 is also sensitive to some RF
signals as it is looking from data in the field.
In order to avoid interference with others RF communication, it is required to tune the antenna and design the
Although ISO/IEC 14443 and ISO/IEC 18092/Ecma 340 allows an RF frequency of 13.56 MHz ± 7 kHz, FCC
regulation does not allow this wide spread and limits the dispersion to ± 100 ppm, which is in line with PN7160
PN7160_PN7161
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PN7160_PN7161
Near Field Communication (NFC) controller
12 Limiting
values
Table 29.ꢀLimiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DD(PAD)
V
DD(UP)
V
BAT
Parameter
Conditions
Min
Max
4.2
7
Unit
V
V
DD(PAD)
supply voltage
V
DD(UP)
supply voltage
battery supply voltage
electrostatic discharge voltage
supply voltage for host interface
supply voltage for host interface
–
–
–
–
V
6
V
V
ESD
HBM; 1500 Ω, 100 pF; EIA/
JESD22-A114-D
2
kV
CDM; field induced model; EIA/
JESC22-C101-C
–
1
kV
T
stg
storage temperature
total power dissipation
RXN input voltage
RXP input voltage
-40
–
+150
620
2.5
°C
mW
V
P
tot
all modes
V
RXN(i)
V
RXP(i)
0
0
2.5
V
[1] The
design of the solution shall be done so that for the different use cases targeted the power to be dissipated from the field or generated by PN7160
does not exceed this value.
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Near Field Communication (NFC) controller
13 Recommended
operating conditions
Table 30.ꢀOperating conditions
Symbol
T
amb
Parameter
Conditions
Min
-30
2.5
Typ
Max
+85
5.5
Unit
°C
ambient operating temperature
JEDEC PCB-0.5
–
–
V
BAT
battery supply voltage
Card Emulation and Passive
T
a
rget; V
SS
= 0 V
V
Reader, Active Initiator and
Active
T
a
rget; V
SS
= 0 V
2.8
2.8
2.5
–
–
–
5.5
5.8
5.8
V
V
V
V
DD(UP)
V
DD(UP)
input supply voltage
Reader, Active Initiator and
Active
T
a
rget; V
SS
= 0 V
All other cases except HPD
state; V
SS
= 0 V
V
DD(PAD)
V
DD(PAD)
supply voltage
total power dissipation
supply voltage for host
interface; V
SS
= 0 V
1.65
3.0
–
1.8
3.3
–
1.95
3.6
V
V
P
tot
PCD mode at typical V
DD(TX)
= 5.25
V
,
V
DD(UP)
= 5.8 V and
V
BAT
= 3.6 V; includes power
from V
BAT
and V
DD(UP)
620
mW
I
BAT
battery supply current
in Hard Power Down state;
V
BAT
= 3.6 V; T = 25 °C
–
10.5
16
μA
in Standby state; V
BAT
= 3.6 V
enhanced RF detector
–
–
–
31
52
36
–
μA
μA
μA
low sensitivity RF detector
21
in low-power polling loop; V
BAT
= 3.6 V; T = 25 °C; loop time =
500 ms
100
continuous total current
consumption in PCD mode at
V
BAT
= 3.6 V
–
–
290
330
mA
mA
I
th(Ilim)
current limit threshold
current limiter on transmitter
270
300
[1] V
SS
represents V
SS(PAD)
and V
SS(TX)
.
[2] When
V
DD(UP)
is below 2.8 V the TXLDO can be in follower mode (see
Section 11.4.3
), there will be no more V
DD(UP)
noise rejection. Any noise below 848
kbit/s will affect the performance.
[3] External
clock on NFC_CLK_XTAL1 must be LOW.
[4] This
is considering an antenna tuned to sink maximum 250 mA continuous current from the transmitter. The antenna shall be tuned to never exceed this
250 mA maximum current.
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Near Field Communication (NFC) controller
14 Thermal
characteristics
Table 31.ꢀThermal characteristics VFBGA64 package
Symbol
Parameter
Conditions
Typ
Unit
R
th(j-a)
thermal resistance from junction to
ambient
in free air with exposed pad soldered on a
52.0
4 layer JEDEC PCB
K/W
R
th(j-c)
thermal resistance from junction to case
–
10.0
K/W
Table 32.ꢀThermal characteristics HVQFN40 package
Symbol
Parameter
Conditions
Typ
Unit
R
th(j-a)
thermal resistance from junction to
ambient
in free air with exposed pad soldered on a
28.0
4 layer JEDEC PCB
K/W
R
th(j-c)
thermal resistance from junction to case
–
13.2
K/W
Table 33.ꢀJunction Temperature
Symbol
Parameter
Conditions
Max
Unit
T
j_max
maximum junction temperature
–
125
°C
Table 34.ꢀThermal Shutdown Temperature
Symbol
Parameter
Conditions
Typ
Unit
T
shutdown
shutdown of chip due to high temperature
–
detected by temp sensor
125
°C
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Near Field Communication (NFC) controller
15 Characteristics
15.1 Current
consumption characteristics
Table 35.ꢀCurrent consumption characteristics for operating ambient temperature range
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
I
BAT
battery supply current
in Hard Power Down state; V
BAT
= 3.6 V; VEN voltage = 0 V
–
10
24
μA
in Standby state; V
BAT
= 3.6 V;
–
–
20
35
–
μA
in Idle and
T
a
rget Active power
states; V
BAT
= 3.6 V
4.55
mA
in Initiator Active power state;
V
BAT
= 3.6 V; RF on
–
240
–
mA
[2] For
transmitter current tuned at 210 mA unloaded.
15.2 Functional
block electrical characteristics
15.2.1 Reset
via VEN
Table 36.ꢀReset timing
Symbol
t
WL(VEN)
t
boot
Parameter
Conditions
Min
Typ
Max
–
Unit
μs
pulse width VEN LOW
boot time
to reset
10
–
–
–
2.5
ms
15.2.2 Power-up
timings
Table 37.ꢀPower-up timings
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
t
t(VBAT-VEN)
transition time from pin V
BAT
to pin
V
BAT
, VEN voltages =
VEN HIGH
0
–
–
ms
t
t(VDDPAD-VEN)
t
t(VBAT-VDDPAD)
transition time from pin V
DD(PAD)
to V
DD(PAD)
, VEN
pin VEN
voltages = HIGH
0
0
–
–
–
–
ms
ms
transition time from pin V
BAT
to pin
V
BAT
, V
DD(PAD)
=
V
DD(PAD)
HIGH
15.2.3 Power-down
timings
Table 38.ꢀPower-down timings
Symbol
t
WL(VBAT)
t
d
Parameter
Conditions
Min
20
0
Typ
Max
Unit
ms
pulse width V
BAT
LOW
delay time
–
–
–
–
ms
PN7160_PN7161
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Near Field Communication (NFC) controller
15.2.4 Download
mode timings
Table 39.ꢀDownload mode timings
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
t
t(DWL_REQ-VEN)
transition time from pin
DWL_REQ to pin VEN
DWL_REQ, VEN
voltages = HIGH
0
0.5
–
ms
15.2.5 I
2
C-bus timings
Here below are timings and frequency specifications.
t
t
t
f(HIF3)
r(HIF3)
HD;DAT
HIF3 (SDA)
t
t
HD;STA
t
SU;STA
HIGH
t
SU;DAT
t
LOW
HIF4 (SCL)
aaa-014046
Figure 33.ꢀI
2
C-bus timings
Table 40.ꢀHigh-speed mode I
2
C-bus timings specification
Symbol
f
clk(HIF4)
t
SU;STA
Parameter
Conditions
I
2
C-bus SCL; C
b
< 100 pF
Min
0
Max
3.4
–
Unit
MHz
ns
clock frequency on pin HIF4
set-up time for a repeated START
condition
C
b
< 100 pF
160
t
HD;STA
t
LOW
hold time (repeated) START condition
C
b
< 100 pF
160
160
60
10
0
–
ns
ns
ns
ns
ns
ns
ns
V
LOW period of the SCL clock
HIGH period of the SCL clock
data set-up time
C
b
< 100 pF
–
t
HIGH
C
b
< 100 pF
–
t
SU;DAT
t
HD;DAT
t
r(HIF3)
t
f(HIF3)
V
hys
C
b
< 100 pF
–
data hold time
C
b
< 100 pF
–
rise time on pin HIF3
fall time on pin HIF3
hysteresis voltage
I
2
C-bus SDA; C
b
< 100 pF
I
2
C-bus SDA; C
b
< 100 pF
10
10
80
80
–
Schmitt trigger inputs; C
b
<
100 pF
0.1V
DD(PAD)
Table 41.ꢀFast mode I
2
C-bus timings specification
Symbol
Parameter
Conditions
Min
Max
Unit
f
clk(HIF4)
clock frequency on pin HIF4
I
2
C-bus SCL; C
b
< 400 pF
0
400
kHz
PN7160_PN7161
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Near Field Communication (NFC) controller
Table 41.ꢀFast mode I
2
C-bus timings specification
…continued
Symbol
Parameter
Conditions
Min
Max
Unit
t
SU;STA
set-up time for a repeated START
condition
C
b
< 400 pF
600
–
ns
t
HD;STA
t
LOW
hold time (repeated) START condition
C
b
< 400 pF
600
–
ns
μs
ns
ns
ns
V
LOW period of the SCL clock
HIGH period of the SCL clock
data set-up time
C
b
< 400 pF
C
b
< 400 pF
C
b
< 400 pF
C
b
< 400 pF
1.3
–
t
HIGH
600
–
t
SU;DAT
t
HD;DAT
V
hys
100
–
data hold time
0
900
–
hysteresis voltage
Schmitt trigger inputs; C
b
<
400 pF
0.1V
DD(PAD)
15.2.6 SPI-bus
timings
HIF4 (SCK)
T
clk(HIF4)
t
t
h(HIF2)
su(HIF2)
HIF2 (MOSI)
MSB
t
h(HIF3)
HIF3 (MISO)
HIF1 (NSS)
MSB
t
t
h(HIF1)
su(HIF1)
aaa-014175
Figure 34.ꢀSPI-bus timing diagram
Table 42.ꢀSPI-bus timings specification
Symbol
T
clk(HIF4)
t
su(HIF2)
t
h(HIF2)
Parameter
Conditions
SPI SCK
Min
142
35
Max
Unit
ns
clock period on pin HIF4
HIF2 set-up time
HIF2 hold time
HIF3 hold time
HIF1 hold time
HIF1 set-up time
–
SPI MOSI
SPI MOSI
SPI MISO
SPI NSS
–
ns
35
–
ns
t
h(HIF3)
–
37
–
ns
t
h(HIF1)
37
ns
t
su(HIF1)
SPI NSS
142
–
ns
[1] Controlled
by host.
[2] Controlled
by PN7160.
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PN7160_PN7161
Near Field Communication (NFC) controller
15.2.7 Active
load modulation phase
Table 43.ꢀActive load modulation phase error
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
E
φ
phase error
ALM phase error from RXP input to clock
recovery output 50 mV < V
RX
< 500 mV
– 5
–
+ 5
°
15.3 Pin
characteristics
15.3.1 NFC_CLK_XTAL1
and XTAL2 pins characteristics
Table 44.ꢀInput clock characteristics on NFC_CLK_XTAL1 when using PLL
Symbol
V
i(p-p)
δ
Parameter
Conditions
Min
0.2
35
Typ
Max
Unit
peak-to-peak input voltage
duty cycle
–
–
1.8
65
V
%
Table 45.ꢀPin characteristics for NFC_CLK_XTAL1 when PLL input
Symbol
Parameter
Conditions
V
I
= V
DDD
V
I
= 0 V
Min
Typ
Max
+1
+1
V
DDD
–
Unit
μA
μA
V
I
IH
HIGH-level input current
LOW-level input current
input voltage
-1
-1
–
–
I
IL
–
V
i
–
V
i(clk)(p-p)
C
i
peak-to-peak clock input voltage
input capacitance
200
–
–
mV
pF
all power modes
2
–
Table 46.ꢀPin characteristics for 27.12 MHz crystal oscillator
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
C
i(NFC_CLK_XTAL1)
NFC_CLK_XTAL1 input
capacitance
V
DDD
= 1.8 V
–
2
–
pF
C
i(XTAL2)
XTAL2 input capacitance
–
2
–
pF
Table 47.ꢀPLL accuracy
Symbol
Parameter
output frequency accuracy
Conditions
Min Typ
-30
Max
Unit
f
o(acc)
deviation added to NFC_CLK_XTAL1
frequency on RF frequency generated;
worst case whatever input frequency
–
+30
ppm
15.3.2 VEN
input pin characteristics
Table 48.ꢀVEN input pin characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
IH
HIGH-level input voltage
1.1
–
V
BAT
V
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Near Field Communication (NFC) controller
Table 48.ꢀVEN input pin characteristics
…continued
Symbol
Parameter
Conditions
Min
0
Typ
Max
0.4
+1
+1
–
Unit
V
V
IL
I
IH
I
IL
LOW-level input voltage
HIGH-level input current
LOW-level input current
input capacitance
–
VEN voltage = V
BAT
VEN voltage = 0 V
-1
-1
–
–
μA
μA
pF
–
C
i
5
15.3.3 Output
pin characteristics for IRQ, CLK_REQ
V
DDD
or
80 %
80 %
V
DD(PAD)
20 %
20 %
V
SS
t
t
r
aaa-041297
f
Figure 35.ꢀOutput timing measurement condition
Table 49.ꢀOutput pin characteristics for IRQ, CLK_REQ
Symbol
V
OH
V
OL
C
L
Parameter
Conditions
Min
Typ
Max
Unit
V
HIGH-level output voltage
I
OH
< 3 mA
LOW-level output voltage
I
OL
< 3 mA
load capacitance
V
DD(PAD)
– 0.4
–
–
–
–
–
–
–
V
DD(PAD)
0.4
0
V
–
20
pF
ns
t
f
fall time
C
L
= 12 pF max
2
10
t
r
rise time
C
L
= 12 pF max
2
10
ns
R
pd
pull-down resistance
for IRQ and CLK_REQ
for IRQ and CLK_REQ
0.35
55
0.85
120
MΩ
kΩ
[2] Pull-down
resistance is activated in HPD state.
[3] Pull-down
resistance can be activated by firmware in Standby state.
[4] Pull-down
resistance can be activated by firmware in Active state.
15.3.4 Output
pin characteristics for TX_PWR_REQ
Table 50.ꢀOutput pin characteristics for TX_PWR_REQ
Symbol
V
OH
V
OL
C
L
Parameter
Conditions
Min
Typ
Max
V
DDD
0.4
Unit
V
HIGH-level output voltage
I
OH
< 3 mA
LOW-level output voltage
I
OL
< 3 mA
load capacitance
V
DDD
– 0.4
–
–
–
–
–
–
–
0
V
–
20
pF
ns
ns
kΩ
kΩ
t
f
fall time
C
L
= 12 pF max
C
L
= 12 pF max
2
10
t
r
rise time
2
10
R
pd
R
pu
pull-down resistance
pull-up resistance
55
55
120
120
[1] TX_PWR_REQ
active driving is only possible when V
DD(PAD)
is present. When V
DD(PAD)
is not present, only pull-up or pull-down resistors can be enabled.
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Near Field Communication (NFC) controller
[3] Unless
disable by firmware, pull-down resistance is always activated.
[4] Can
be enabled by firmware.
15.3.5 Output
pin characteristics for DCDC_EN
Table 51.ꢀOutput pin characteristics for DCDC_EN
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
OH
HIGH-level output voltage
I
OH
< 3 mA
V
DD(PAD)
– 0.4
–
V
DD(PAD)
V
V
OL
C
L
LOW-level output voltage
load capacitance
I
OL
< 3 mA
0
–
–
–
0.4
20
V
pF
[1] DCDC_EN
active driving is only possible when V
DD(PAD)
is present. When V
DD(PAD)
is not present, only pull-up or pull-down resistors can be enabled.
15.3.6 Input
pin characteristics for DWL_REQ, WKUP_REQ
Table 52.ꢀInput pin characteristics for DWL_REQ, WKUP_REQ
Symbol
Parameter
Conditions
Min
Typ Max
Unit
V
IH
HIGH-level input voltage
typical 1.8 V interface
supply voltage
0.65V
DD(PAD)
–
–
V
typical 3.3 V interface
supply voltage
2.0
–
V
V
V
IL
LOW-level input voltage
typical 1.8 V interface
supply voltage
–
0.35V
DD(PAD)
0.8
typical 3.3 V interface
supply voltage
I
IH
I
IL
HIGH-level input current
LOW-level input current
input capacitance
-1
-1
–
–
+1
+1
–
μA
μA
pF
–
C
i
5
R
pd
pull-down resistance
pull-down
DWL_REQ pin
WKUP_REQ pin
0.35
55
–
–
0.85
120
MΩ
kΩ
[1] Activated
in HPD state.
15.3.7 Input
pin characteristics for RXN and RXP
Table 53.ꢀInput pin characteristics for RXN and RXP
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
RXN(i)
RXN input voltage
0
–
V
DDA
0.05
–
–
V
V
RXP(i)
RXP input voltage
0
–
V
DDA
0.05
V
C
i(RXN)
RXN input capacitance
RXP input capacitance
–
6
6
–
–
pF
pF
kΩ
C
i(RXP)
–
–
Z
i(RXN-VDDMID)
input impedance between RXN
and V
DD(MID)
Reader, card and P2P
modes
0
15
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Near Field Communication (NFC) controller
Table 53.ꢀInput pin characteristics for RXN and RXP
…continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Z
i(RXP-VDDMID)
input impedance between RXP
and V
DD(MID)
Reader, card and P2P
modes
0
–
15
kΩ
V
i(dyn)(RXN)
RXN minimum dynamic input
voltage
Miller coded
106 kbit/s
–
–
–
–
20
20
mV(p-p)
mV(p-p)
212 kbit/s to 424 kbit/
s
V
i(dyn)(RXP)
RXP minimum dynamic input
voltage
Miller coded
106 kbit/s
–
–
–
–
20
20
mV(p-p)
mV(p-p)
212 kbit/s to 424 kbit/
s
V
i(dyn)(RXN)
RXN minimum dynamic input
voltage
Manchester, NRZ or
BPSK coded; 106 kbit/s
to 848 kbit/s
–
–
–
–
20
20
mV(p-p)
mV(p-p)
V
i(dyn)(RXP)
RXP minimum dynamic input
voltage
Manchester, NRZ or
BPSK coded; 106 kbit/s
to 848 kbit/s
V
i(dyn)(RXN)
V
i(dyn)(RXP)
V
i(RF)
RXN maximum dynamic input
voltage
All data coding; 106 kbit/
s to 848 kbit/s
–
–
V
DDA
0.05
–
–
V(p-p)
V(p-p)
mV(p-p)
RXP maximum dynamic input
voltage
All data coding; 106 kbit/
s to 848 kbit/s
–
–
V
DDA
0.05
RF input voltage for RF level
detector
RF input voltage
detected for 9 mV
threshold
5.5
9
15
RF input voltage for NFC level
detector
RF input voltage
detected for 15 mV
threshold
8
15
23
mV(p-p)
15.3.8 ANT1
and ANT2 pin characteristics
Table 54.ꢀElectrical characteristics of ANT1 and ANT2
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
R
I
input resistance
switches closed; for
pins ANTX
–
10
17
Ω
I
I
input current
for pins ANTX
-50
–
+50
mA
[1] With
X = 1 or 2.
15.3.9 V
DD(HF)
and V
DDD
pins characteristics
Table 55.ꢀElectrical characteristics of V
DD(HF)
and V
DDD
Symbol
V
DD(HF)
V
DDD
Parameter
Conditions
I
ANTX
= 5 mA
V
SS
= 0 V
Min
–
Typ
2.7
1.8
Max
–
Unit
V
V
DD(HF)
supply voltage
V
DDD
supply voltage 1.8 V
1.7
1.95
V
[1] With
X = 1 or 2.
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Near Field Communication (NFC) controller
15.3.10 Output
pin characteristics for TX1 and TX2
Table 56.ꢀOutput pin characteristics for TX1 and TX2
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
OH
HIGH-level output
voltage
V
DD(TX)
= 3.3 V and I
OH
= 30
mA; PMOS driver fully on
V
DD(TX)
– 150
–
–
mV
V
OL
LOW-level output
voltage
V
DD(TX)
= 3.3 V and I
OL
= 30
mA; NMOS driver fully on
–
–
200
mV
Table 57.ꢀOutput resistance for TX1 and TX2
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
R
OL
LOW-level output resistance
V
DD(TX)
– 100 mV; CWGsN =
01h
–
–
80
Ω
V
DD(TX)
– 100 mV; CWGsN =
0Fh
–
0.9
0.9
–
Ω
Ω
R
OH
HIGH-level output resistance
V
DD(TX)
= 5 V; V
(TXn)
= V
DD(TX)
100 mV
–
0.65
1.4
[1] With
n = 1 or 2.
15.3.11 Input
pin characteristics for HIF1 (used as SPI-bus NSS, used as I
2
C-bus address 0),
HIF2 (used as SPI-bus MOSI, used as I
2
C-bus address 1), HIF4 (used as SPI-bus SCK)
Table 58.ꢀInput pin characteristics for HIF1 (used as SPI-bus NSS, used as I
2
C-bus address 0), HIF2 (used as SPI-
bus MOSI, used as I
2
C-bus address 1), HIF4 (used as SPI-bus SCK)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
IH
HIGH-level input
voltage
0.65V
DD(PAD)
–
V
DD(PAD)
V
V
IL
I
IH
LOW-level input voltage
0
–
–
0.35V
DD(PAD)
+1
V
HIGH-level input
current
V
I
= V
DD(PAD)
-1
μA
I
IL
LOW-level input current
V
I
= 0 V
input capacitance
-1
–
–
+1
–
μA
pF
kΩ
C
i
5
–
R
pu
pull-up resistance
HIF1 used as I
2
C-bus
55
120
address 0; HIF2 used as
I
2
C-bus address 1
[1] Unless
disable by firmware, extra pull-up resistance is always activated.
15.3.12 Pin
characteristics for HIF3 (used as I
2
C-bus SDA) and HIF4 (used as I
2
C-bus SCL)
Table 59.ꢀPin characteristics for HIF3 (used as I
2
C-bus SDA) and HIF4 (used as I
2
C-bus SCL)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
OL
LOW-level output
voltage
I
OL
< 3 mA
0
–
0.4
V
C
L
load capacitance
–
–
10
pF
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Near Field Communication (NFC) controller
Table 59.ꢀPin characteristics for HIF3 (used as I
2
C-bus SDA) and HIF4 (used as I
2
C-bus SCL)
…continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
t
f
fall time
C
L
= 100 pF; Rpull-up = 2 kΩ;
Standard and Fast mode
30
–
250
ns
C
L
= 100 pF; Rpull-up = 1 kΩ;
High-speed mode
80
30
10
–
–
–
110
250
100
ns
ns
ns
t
r
rise time
C
L
= 100 pF; Rpull-up = 2 kΩ;
Standard and Fast mode
C
L
= 100 pF;
Rpull-up = 1 kΩ;
High-speed mode
V
IH
V
IL
I
IH
HIGH-level input
voltage
0.7V
DD(PAD)
–
–
–
–
V
DD(PAD)
0.3V
DD(PAD)
+1
V
LOW-level input
voltage
0
V
HIGH-level input
current
V
I
= V
DD(PAD)
; high impedance
-1
-1
μA
μA
I
IL
LOW-level input
current
V
I
= 0 V;
+1
high impedance
C
i
input capacitance
–
5
–
pF
[1] Only
for pin HIF3 (I
2
C-bus SDA), HIF4 (I
2
C-bus SCL) is only used as input.
15.3.13 Pin
characteristics for HIF3 (used as SPI-bus MISO)
Table 60.ꢀPin characteristics for HIF3 (used as SPI-bus MISO)
Symbol
V
OH
V
OL
C
L
Parameter
Conditions
I
OH
< 4 mA
I
OL
< 4 mA
Min
Typ
Max
V
DD(PAD)
0.4
Unit
V
HIGH-level output voltage
LOW-level output voltage
load capacitance
fall time
V
DD(PAD)
– 0.4
–
–
–
0
–
V
20
pF
t
f
C
L
= 12 pF max
high speed
1
3
–
–
3
ns
ns
slow speed
10
t
r
rise time
C
L
= 12 pF max
high speed
1
3
–
–
3
ns
ns
slow speed
10
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
16 Package
outline VFBGA64
VFBGA64: plastic very thin fine-pitch ball grid array package; 64 balls
SOT1860-1
B
A
D
ball A1
index area
A
2
E
A
A
1
detail X
e
1
1/2 e
C
B
A
Ø v
Ø w
C
C
y
y
e
C
b
1
e
H
G
F
E
D
C
B
A
e
2
1/2 e
ball A1
index area
1
2
3
4
5
6
7
8
X
0
5 mm
scale
Dimensions (mm are the original dimensions)
Unit
A
A
A
2
b
D
E
e
e
e
2
v
w
y
y
1
1
1
max 0.90
0.25 0.65
0.30
nom
4.1
4.0
3.9
4.1
4.0
3.9
mm
0.80 0.20 0.60
0.25
min 0.70 0.15 0.55
0.20
0.4
2.8
2.8 0.15
0.05 0.08
0.1
sot1860-1_po
Issue date
References
Outline
version
European
projection
IEC
JEDEC
– – –
JEITA
16-02-05
16-03-31
sot1860-1
Figure 36.ꢀPackage outline
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
17 Package
outline HVQFN40
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6 x 6 x 0.85 mm
SOT618-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
e
1
C
v
C
C
A B
e
b
1/2 e
y
y
C
1
w
11
20
L
21
10
e
E
e
2
h
1/2 e
1
30
terminal 1
index area
40
31
X
D
h
0
2.5
5 mm
v
scale
Dimensions (mm are the original dimensions)
(1) (1)
(1)
E
Unit
A
A
b
c
D
D
E
e
e
e
L
w
y
y
1
1
h
h
1
2
max 1.00 0.05 0.30
0.2 6.1
4.25 6.1 4.25 0.5
4.5 4.5 0.5 0.1
0.05 0.05
0.1
mm nom 0.85 0.02 0.21
min 0.80 0.00 0.18
6.0 4.10 6.0 4.10
5.9 3.95 5.9 3.95
0.4
0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
sot618-1_po
Issue date
References
Outline
version
European
projection
IEC
JEDEC
JEITA
02-10-22
13-11-05
SOT618-1
MO-220
Figure 37.ꢀPackage outline, HVQFN40, SOT618-1, MSL3
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
18 Soldering
of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can
be found in Application Note
AN10365 “Surface mount reflow soldering description”
.
18.1 Introduction
to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards
(PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection.
There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when
through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with
increased miniaturization.
18.2 Wave
and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of
liquid solder. The wave soldering process is suitable for the following:
•
Through-hole components
•
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have
solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch
smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by component placement and
exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all
reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
Board specifications, including the board finish, solder masks and vias
•
Package footprints, including solder thieves and orientation
•
The moisture sensitivity level of the packages
•
Package placement
•
Inspection and repair
•
Lead-free soldering versus SnPb soldering
18.3 Wave
soldering
Key characteristics in wave soldering are:
•
Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave
parameters, and the time during which components are exposed to the wave
•
Solder bath specifications, including temperature and impurities
18.4 Reflow
soldering
Key characteristics in reflow soldering are:
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak
•
Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large
and small components on one board
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
•
Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak
temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to
make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low
enough that the packages and/or boards are not damaged. The peak temperature of the package depends on
Table 61.ꢀSnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm
3
)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 62.ꢀLead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm
3
)
< 350
260
350 to 2ꢁ000
260
> 2ꢁ000
260
< 1.6
1.6 to 2.5
> 2.5
260
250
245
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.
Studies have shown that small packages reach higher temperatures during reflow soldering, see
Figure 38
.
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Figure 38.ꢀTemperature profiles for large and small components
For further information on temperature profiles, refer to Application Note
AN10365 “Surface mount reflow
soldering description”
.
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
19 Abbreviations
Table 63.ꢀAbbreviations
Acronym
Description
Amplitude Shift keying
ASK
ASK modulation index
The ASK modulation index is defined as the voltage ratio (Vmax – Vmin)/ (Vmax + Vmin) × 100%
Automatic device
discovery
Detect and recognize any NFC peer devices (NFC Initiator or NFC
T
a
rget) like: NFC Initiator or
NFC
T
a
rget, ISO/IEC 14443-3, -4 Type A&B PICC, MIFARE Classic and MIFARE Ultralight PICC,
ISO/IEC 15693 VICC
BPSK
Bit Phase Shift Keying
Card Emulation
The IC is capable of handling a PICC emulation on the RF interface including part of the protocol
management. The application handling is done by the host controller
DEP
Data Exchange Protocol
DSLDO
FW
Dual Supplied LDO
FirmWare
HPD
Hard Power Down
LDO
Low Drop Out
LFO
Low Frequency Oscillator
MISO
MOSFET
MOSI
MSL
Controller In
T
a
rget Out (for SPI-bus interface)
Metal Oxide Semiconductor Field Effect Transistor
Controller Out
T
a
rget In (for SPI-bus interface)
Moisture Sensitivity Level
NCI
NFC Controller Interface
NFC
Near Field Communication
NFCC
NFC Initiator
NFCIP
NFC
T
a
rget
NRZ
NFC Controller, PN7160 in this data sheet
Initiator as defined in ISO/IEC 18092 or Ecma 340: NFCIP-1 communication
NFC Interface and Protocol
T
a
rget as defined in ISO/IEC 18092 or Ecma 340: NFCIP-1 communication
Non Return to Zero
NSS
Not
T
a
rget Select (for SPI-bus interface)
Peer to Peer
P2P
PCD
Proximity Coupling Device. Definition for a Card reader/writer device according to the ISO/IEC
14443 specification or MIFARE
PCD -> PICC
PICC
Communication flow between a PCD and a PICC according to the ISO/IEC 14443 specification or
MIFARE
Proximity Interface Coupling Card. Definition for a contactless Smart Card according to the ISO/
IEC 14443 specification or MIFARE
PICC-> PCD
Communication flow between a PICC and a PCD according to the ISO/IEC 14443 specification or
MIFARE
PMOS
PMU
P-channel MOSFET
Power Management Unit
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Table 63.ꢀAbbreviations
…continued
Acronym
PSL
Description
Parameter SeLection
Serial Clock (for SPI interface)
Serial Peripheral Interface bus
Transmitter LDO
SCK
SPI-bus
TXLDO
UM
User Manual
VCD
Vicinity Coupling Device. Definition for a reader/writer device according to the ISO/IEC 15693
specification
VCO
VICC
WUC
Voltage Controlled Oscillator
Vicinity Integrated Circuit Card
Wake-up Counter
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
20 References
[1] NFC
Forum Device Requirements V2.0
[2] NFC
Controller Interface (NCI)
T
e
chnical Specification V2.0
[3] ISO/IEC
14443 parts 2: 2001 COR 1 2007 (01/11/2007), part 3: 2001 COR 1 2006 (01/09/2006) and part
4: 2nd edition 2008 (15/07/2008)
[4] I
2
C Specification, UM10204 rev4 (13/02/2012)
[5] SPI
Motorola de-facto standard described in Motorola 68HC11 data sheet
[6] UM11577
PN7161 NFC controller user manual
[7] AN12988
PN7160 hardware design guide
[8] AN13219
PN7160 antenna design and matching guide
[9] ISO/IEC
18092 (NFCIP-1)
edition, 15/03/2013. This is similar to Ecma 340.
[10] ISO/IEC15693
part 2: 2nd edition (15/12/2006), part 3: 1st edition (01/04/2001)
[11] ISO/IEC
21481 (NFCIP-2)
edition, 01/07/2012. This is similar to Ecma 352.
[12] ETSI
HCI TS 102 622; UICC – Contactless Front-end (CLF) Interface; Host Controller Interface (HCI)
(Release 12)
[13] Apple
Enhanced Contactless Polling Specification: Version 1.1.
PN7160_PN7161
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
21 Revision
history
Table 64.ꢀRevision history
Document ID
Release date
Data sheet status
20230308 Product
data sheet
•
FeliCa card mode removed
Supersedes
PN7160_PN7161 v.3.9
Modifications:
PN7160_PN7161 v.3.8
•
Updated the terms “Master/Slave” to “Controller/
T
a
rget” to align with the recommendation of
the NXP – I2C standards organization.
PN7160_PN7161 v.3.8
Modifications:
20221214
Product data sheet
PN7160_PN7161 v.3.7
T
amb
updated into -30°C
PN7160_PN7161 v.3.7
Modifications:
20221207
Product data sheet
PN7160_PN7161 v.3.6
PN7160_PN7161 v.3.6
Modifications:
20220905
20220819 Product
data sheet
Product data sheet
PN7160_PN7161 v.3.5
PN7160_PN7161 v.3.5
Modifications:
PN7160_PN7161 v.3.4
•
Added information about DCDC_EN pin as an alternative to the pin TX_PWR_REQ, see
PN7160_PN7161 v.3.4
Modifications:
20220804
Product data sheet
PN7160_PN7161 v.3.3
•
Functional description SPI interface: Setting of CPHA and CPOL are fixed during production
and cannot be changed by customer.
PN7160_PN7161 v.3.3
Modifications:
20220217
Product data sheet
PN7160_PN7161 v.3.2
PN7160_PN7161 v.3.2
Modifications:
20210930
•
Clarified pin naming TVDD vs V
DD(TX)
20210913 Product
data sheet
•
Security status changed into “Company public”
20210819 Product
data sheet
Product data sheet
PN7160_PN7161 v.3.1
PN7160_PN7161 v.3.0
PN7160_PN7161 v.2.0
PN7160_PN7161 v.3.1
Modifications:
PN7160_PN7161 v.3.0
Modifications:
•
Data sheet status changed into “Product data sheet”
•
Security status changed into “Company restricted”
PN7160_PN7161 v.2.0
Modifications:
20210709
Preliminary data sheet
PN7160 v.1.0
•
PN7161 included
•
Some figures updated
PN7160 v.1.0
20210308
Objective data sheet
–
•
Initial version
PN7160_PN7161
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V
.
A
ll rights reserved.
Product data sheet
Rev. 3.9 — 8 March 2023
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NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
22 Legal
information
22.1 Data
sheet status
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Product [short] data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please
consult the most recently issued document before initiating or completing a design.
[2] The
term ‘short data sheet’ is explained in section “Definitions”.
[3] The
product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
Suitability for use
— NXP Semiconductors products are not designed,
22.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Draft
— A draft status on a document indicates that the content is still
malfunction of an NXP Semiconductors product can reasonably be expected
under internal review and subject to formal approval, which may result
to result in personal injury, death or severe property or environmental
in modifications or additions. NXP Semiconductors does not give any
damage. NXP Semiconductors and its suppliers accept no liability for
representations or warranties as to the accuracy or completeness of
inclusion and/or use of NXP Semiconductors products in such equipment or
information included in a draft version of a document and shall have no
applications and therefore such inclusion and/or use is at the customer’s own
liability for the consequences of use of such information.
risk.
Short data sheet
— A short data sheet is an extract from a full data sheet
Applications
— Applications that are described herein for any of these
with the same product type number(s) and title. A short data sheet is
products are for illustrative purposes only. NXP Semiconductors makes no
intended for quick reference only and should not be relied upon to contain
representation or warranty that such applications will be suitable for the
detailed and full information. For detailed and full information see the
specified use without further testing or modification.
relevant full data sheet, which is available on request via the local NXP
Customers are responsible for the design and operation of their
Semiconductors sales office. In case of any inconsistency or conflict with the
applications and products using NXP Semiconductors products, and NXP
short data sheet, the full data sheet shall prevail.
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
Product specification
— The information and data provided in a Product
whether the NXP Semiconductors product is suitable and fit for the
data sheet shall define the specification of the product as agreed between
customer’s applications and products planned, as well as for the planned
NXP Semiconductors and its customer, unless NXP Semiconductors and
application and use of customer’s third party customer(s). Customers should
customer have explicitly agreed otherwise in writing. In no event however,
provide appropriate design and operating safeguards to minimize the risks
shall an agreement be valid in which the NXP Semiconductors product
associated with their applications and products.
is deemed to offer functions and qualities beyond those described in the
NXP Semiconductors does not accept any liability related to any default,
Product data sheet.
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
22.3 Disclaimers
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limited warranty and liability
— Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
Limiting values
— Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including – without limitation –
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale
— NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the
T
e
rms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes
— NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license
— Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
PN7160_PN7161
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© 2023 NXP B.
V
.
A
ll rights reserved.
Product data sheet
Rev. 3.9 — 8 March 2023
62 / 67
NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Quick reference data
— The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
22.4 Licenses
Purchase of NXP ICs with ISO/IEC 14443 type B functionality
Export control
— This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
RATP/Innovatron
T
e
chnology
This NXP Semiconductors IC is ISO/IEC
14443 Type B software enabled and is
licensed under Innovatron’s Contactless
Card patents license for ISO/IEC 14443 B.
Suitability for use in non-automotive qualified products
— Unless
this data sheet expressly states that this specific NXP Semiconductors
product is automotive qualified, the product is not suitable for automotive
use. It is neither qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts no liability for
inclusion and/or use of non-automotive qualified products in automotive
equipment or applications.
The license includes the right to use the IC
in systems and/or end-user equipment.
Purchase of NXP ICs with NFC technology
— Purchase of an NXP
Semiconductors IC that complies with one of the Near Field Communication
(NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey an
implied license under any patent right infringed by implementation of any of
those standards. Purchase of NXP Semiconductors IC does not include a
license to any NXP patent (or other IP right) covering combinations of those
products with other products, whether hardware or software.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
22.5 Trademarks
Notice: All referenced brands, product names, service names, and
trademarks are the property of their respective owners.
Translations
— A non-English (translated) version of a document, including
the legal information in that document, is for reference only. The English
version shall prevail in case of any discrepancy between the translated and
English versions.
NXP
— wordmark and logo are trademarks of NXP B.
V
.
AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE,
Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle,
Keil, Mali, Mbed, Mbed Enabled, NEON, PO
P
,
R
ealView, SecurCore,
Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-
PLUS, ULINKpro, μVision, Versatile
— are trademarks and/or registered
trademarks of Arm Limited (or its subsidiaries or affiliates) in the US and/or
elsewhere. The related technology may be protected by any or all of patents,
copyrights, designs and trade secrets. All rights reserved.
Security
— Customer understands that all NXP products may be subject to
unidentified vulnerabilities or may support established security standards or
specifications with known limitations. Customer is responsible for the design
and operation of its applications and products throughout their lifecycles
to reduce the effect of these vulnerabilities on customer’s applications
and products. Customer’s responsibility also extends to other open and/or
proprietary technologies supported by NXP products for use in customer’s
applications. NXP accepts no liability for any vulnerability. Customer should
regularly check security updates from NXP and follow up appropriately.
DESFire
— is a trademark of NXP B.
V
.
EdgeVerse
— is a trademark of NXP B.
V
.
FeliCa
— is a trademark of Sony Corporation.
ICODE and I-CODE
— are trademarks of NXP B.
V
.
I2C-bus
— logo is a trademark of NXP B.
V
.
MIFARE
— is a trademark of NXP B.
V
.
Customer shall select products with security features that best meet rules,
regulations, and standards of the intended application and make the
ultimate design decisions regarding its products and is solely responsible
for compliance with all legal, regulatory, and security related requirements
concerning its products, regardless of any information or support that may be
provided by NX
P
.
MIFARE Classic
— is a trademark of NXP B.
V
.
MIFARE Ultralight
— is a trademark of NXP B.
V
.
SmartMX
— is a trademark of NXP B.
V
.
NXP has a Product Security Incident Response
T
e
am (PSIRT) (reachable
release to security vulnerabilities of NXP products.
PN7160_PN7161
All information provided in this document is subject to legal disclaimers.
© 2023 NXP B.
V
.
A
ll rights reserved.
Product data sheet
Rev. 3.9 — 8 March 2023
63 / 67
NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Tables
PN7160_PN7161
All information provided in this document is subject to legal disclaimers.
© 2023 NXP B.
V
.
A
ll rights reserved.
Product data sheet
Rev. 3.9 — 8 March 2023
64 / 67
NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Figures
PN7160_PN7161
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V
.
A
ll rights reserved.
Product data sheet
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65 / 67
NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Contents
PN7160_PN7161
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© 2023 NXP B.
V
.
A
ll rights reserved.
Product data sheet
Rev. 3.9 — 8 March 2023
66 / 67
NXP Semiconductors
PN7160_PN7161
Near Field Communication (NFC) controller
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© 2023 NXP B.V.
All rights reserved.
Date of release: 8 March 2023
Document identifier: PN7160_PN7161
