NXP-Semicon-PN7161A1EV-C100K

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NXP-Semicon-PN7161A1EV-C100K
PN7160_PN7161  
Near Field Communication (NFC) controller  
Rev. 3.9 — 8 March 2023  
Product data sheet  
1 Introduction  
This data sheet describes the PN7160 and PN7161 NFC controllers with NCI interface and integrated firmware.  
The PN7161 support all features of PN7160 plus “Enhanced Contactless Polling” (ECP) by Apple (see Ref.  

[13]

). Please note, that the ECP feature is available after formal authorization only.  
In the following document PN7160 refers to PN7160 and PN7161, otherwise stated.  
This data sheet requires additional documents for functional chip description and design in. Refer to the  
references listed in this document for full list of documentation provided by NX
P
.  
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
2 General
 
description  
PN7160 is an NFC controller designed for integration in mobile devices and devices compliant with NFC  
standards (NFC Forum, NCI).  
PN7160 is designed based on experience from previous NXP NFC device generation to ease the integration of  
NFC technology in mobile devices by providing:  
•
A low PCB footprint and a reduced external Bill of Material  
•
An optimized architecture for low-power consumption in different modes (Standby, low-power polling loop)  
•
A highly efficient integrated power management unit allowing direct supply from an extended battery supply  
range (2.8 V to 5.5 V).  
•
Support of an external DC-to-DC like NXP PCA941xA (with x = 0, 1 and 2), to provide more output power.  
PN7160 embeds a new generation RF contactless front-end, supporting various transmission modes according  
to NFCIP-1 (see Ref.

) and NFCIP-2 (see Ref.

), ISO/IEC14443 (see Ref.

) , ISO/IEC 15693 (see Ref.  

[10]

), MIFARE and FeliCa specifications. This new contactless front-end design brings a major performance  
step-up with on one hand a higher sensitivity and on the other hand the capability to work in active load  
modulation communication enabling the support of small antenna form factor. It also allows to provide a higher  
output power by supplying the transmitter output stage from 2.7 V to 5.25
V
.  
•
Enhanced Dynamic LMA (DLMA) to optimize and to enhance load modulation amplitude depending on  
external field strength. It allows higher range communication distance in card mode.  
•
Independent LMA phase adjustment by step of 5° for type A, B and F  
•
Dynamic power control which allows to make use of the maximum power in reader mode without exceeding  
the maximum power allowed by the standard in 0 distance.  
•
Card mode receiver sensitivity of 20 mV

(p-p)  

•
Support of single ended receiver  
•
1.3 W output transmitter power  
Supported transmission modes are listed in

. For contactless card functionality, the PN7160 can act  
autonomously if previously configured by the host in such a manner. PICC functionality can be supported  
without host being turned on.  
NFC FORUM  
NFC-IP MODES  
READER  
(PCD – VCD)  
CARD  
(PICC)  
READER FOR NFC FORUM  
TAGS 1 TO 5  
ISO/IEC 14443 A  
ISO/IEC 14443 B  
ISO/IEC 15693  
T4T – ISO/IEC 14443 A  
T4T – ISO/IEC 14443 B  
P2P ACTIVE  
106 TO 424 kbps  
INITIATOR AND TARGET  
MIFARE 1K / 4K  
MIFARE DESFire  
P2P PASSIVE  
106 TO 424 kbps  
INITIATOR AND TARGET  
(1)  
Sony FeliCa  
aaa-042748  
1. According
 
to ISO/IEC 18092 (Ecma 340) standard.  
Figure 1.ꢀPN7160 transmission modes  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
2 / 67  
 
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
3 Features
 
and benefits  
•
Highly integrated demodulator and decoder  
•
Buffered output drivers to connect an antenna with minimum number of external components  
•
Integrated RF level detector  
•
Integrated Polling Loop for automatic device discovery  
•
RF protocols supported  
–
ISO/IEC 14443A, ISO/IEC 14443B PICC mode  
–
ISO/IEC 14443A, ISO/IEC 14443B PCD mode designed according to NFC Forum digital protocol T4T  
platform and ISO-DEP (see Ref.

)  
–
FeliCa PCD mode  
–
MIFARE PCD encryption mechanism (MIFARE 1K/4K)  
–
NFC Forum tags T1
T
,
T
2
T
,
T
3
T
,
T
4T and T5T (see Ref.

)  
–
NFCIP-1, NFCIP-2 protocol (see Ref.

and Ref.

)  
–
NFC Forum certification for P2
P
,
r
eader and card mode (see Ref.

)  
–
ISO/IEC 15693/ICODE VCD mode (see Ref.

)  
–
NFC Forum-compliant embedded T4T for NDEF short record  
–
Support for “Enhanced Contactless Polling” by Apple (see Ref.

) (PN7161 only)  
•
Supported host interfaces  
–
NCI protocol interface according to NFC Forum standardization (see Ref.

)  
–
I

2

C-bus High-speed mode (see Ref.

)  
–
SPI-bus (see Ref.

)  
•
Flexible clock supply concept to facilitate PN7160 integration  
–
Internal oscillator for 27.12 MHz crystal connection  
–
Integrated PLL unit to make use of device reference clock and facilitate PN7160 integration  
•
Integrated power management unit  
–
Direct connection to a battery (2.5 V to 5.5 V voltage supply range)  
–
Support different low-power states configuration: Hard Power-Down state and Standby state activated by  
firmware  
–
Autonomous mode when host is shut down  
•
Automatic wake-up via RF field, internal timer, and host interfaces  
•
Integrated non-volatile memory to store data and executable code for customization  
–
Anti tearing support to recover from tearing events  
•
Standards compliance  
–
NFC Forum Device Requirements (see Ref.

)  
–
NCI 2.0  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
3 / 67  
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
4 Applications  
•
Mobile devices  
•
Portable equipment (personal digital assistants, tablet, notebook, wearable)  
•
Consumer devices  
•
Smart home gateways  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
4 / 67  
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
5 Quick
 
reference data  
Table 1.ꢀQuick reference data  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
V

BAT  

battery supply voltage  
Card Emulation and Passive
T
a
rget;  
V

SS

= 0 V  
2.5  
–
5.5  
5.5  
5.8  
5.8  
V
V
V
V
Reader, Active Initiator and Active  
T
a
rget; V

SS

= 0 V  
2.8  
2.8  
2.5  
–
–
–
V

DD(UP)  

V

DD(UP)

input supply voltage  
Reader, Active Initiator and Active  
T
a
rget; V

SS

= 0 V  
All other cases except Hard Power  
Down state; V

SS

= 0 V  
V

DD(PAD)  

V

DD(PAD)

supply voltage  
battery supply current  
supply voltage for host interface; V

SS  

= 0 V  
1.65  
3.0  
–
1.8  
1.95  
3.6  
16  
V
3.3  
V
I

BAT  

in Hard Power Down state; V

BAT  

3.6 V; T = 25 °C  
=
10.5  
μA  
in Standby state; V

BAT

= 3.6 V  
enhanced RF detector  
–
–
–
32  
52  
36  
–
μA  
μA  
μA  
low sensitivity RF detector  
21  
in low-power polling loop; V

BAT

= 3.6  
V; T = 25 °C; loop time = 500 ms  
100  
continuous total current consumption  
in PCD mode at V

BAT

= 3.6 V  
–
–
290  
mA  
I

th(Ilim)  

P

tot  

current limit threshold  
total power dissipation  
current limiter on transmitter  
270  
–
300  
–
330  
620  
mA  
PCD mode at typical V

DD(TX)

= 5.25  
V,
V

DD(UP)

= 5.8 V and V

BAT

= 3.6  
V; includes power from V

BAT

and  
V

DD(UP)  

mW  
T

amb  

ambient operating temperature
 
JEDEC PCB-0.5  
-30  
–
+85  
°C  
[1] V

SS

represents V

SS(PAD)

and V

SS(TX)  

.
[2] When
 
V

DD(UP)

is below 2.8 V the TXLDO can be in follower mode (see

), there will be no more V

DD(UP)

noise rejection. Any noise below 848  
kbit/s will affect the performance.  
[3] External
 
clock on NFC_CLK_XTAL1 must be LOW.  
[4] This
 
is considering an antenna tuned to sink maximum 250 mA continuous current from the transmitter. The antenna shall be tuned to never exceed this  
250 mA maximum current.  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
5 / 67  
 
 
 
 
 
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
6 Firmware
 
versions  
6.1 Version
 
12.50.09  
Changes in this version:  
•
NDEF write from NFC supported, when the device is in Autonomous NDEF mode.  
•
ECP supported in EMVCo profile (PN7161 only).  
•
Optimized card removal procedure when ECP is enabled (PN7161 only).  
•
Added PRBS support for ISO/IEC 15693.  
•
This version is not available on hardware, only as firmware update file  
6.2 Version
 
12.50.06  
Changes in this version:  
•
Changes to support NFC Forum CR12.  
•
Added helper command to configure the Dynamic Power Control (DPC)  
•
This version is not available on hardware, only as firmware update file  
6.3 Version
 
12.50.05  
Initial version  
Production samples will have 12.50.05 firmware.  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
6 / 67  
 
 
 
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
7 Ordering
 
information  
Table 2.ꢀOrdering information  
Type number  
Package  
Name  
Description  
Version  
PN7160xyzz/C100

VFBGA64  
plastic very thin fine-pitch ball grid array package;  
64 balls  
SOT1860-1  
SOT618-1  
SOT1860-1  
SOT618-1  
HVQFN40  
VFBGA64  
HVQFN40  
plastic thermal enhanced very thin quad flat  
package; no leads; 40 terminals  
PN7161xyzz/C100

plastic very thin fine-pitch ball grid array package;  
64 balls  
plastic thermal enhanced very thin quad flat  
package; no leads; 40 terminals  
[1] x:
 
A = I

2

C-bus interface; B = SPI-bus interface.  
[2] y:
 
correspond to firmware variant.  
[3] zz:
 
correspond to package variant. HN = HVQFN40 package; EV = VFBGA64 package.  
PN7160 is available in different configurations:  
Table 3.ꢀProduct variants PN7160  
Part number  
Control  
Package  
Packing  
MOQ  
Marking  
12NC  
interface /  
firmware  
version  
PN7160A1EV/ I

2

C / 12.50.05  
C100  
PN7160A1EV/ I

2

C / 12.50.05  
C100  
PN7160A1HN/ I

2

C / 12.50.05  
C100  
PN7160A1HN/ I

2

C / 12.50.05  
C100  
VFBGA64  
VFBGA64  
HVQFN40  
HVQFN40  
VFBGA64  
VFBGA64  
HVQFN40  
HVQFN40  
Reel  
4500  
2450  
4000  
490  
71601  
71601  
71601  
71601  
71602  
71602  
71602  
71602  
9354 166 64518  
9354 166 64557  
9354 166 65518  
9354 166 65551  
9354 237 43518  
9354 237 43557  
9354 237 44518  
9354 237 44551  
5-Tray  
Reel  
1-Tray  
Reel  
PN7160B1EV/ SPI
 
/ 12.50.05  
C100  
4500  
2450  
4000  
490  
PN7160B1EV/ SPI
 
/12.50.05  
C100  
5-Tray  
Reel  
PN7160B1HN/ SPI
 
/12.50.05  
C100  
PN7160B1HN/ SPI
 
/ 12.50.05  
C100  
1-Tray  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
7 / 67  
 
 
 
 
 
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 4.ꢀProduct variants PN7161  
Part number  
Control  
Package  
Packing  
MOQ  
Marking  
12NC  
interface/firmwar
version  
PN7161A1EV/ I

2

C / 12.50.05  
C100  
PN7161A1EV/ I

2

C / 12.50.05  
C100  
PN7161A1HN/ I

2

C / 12.50.05  
C100  
PN7161A1HN/ I

2

C / 12.50.05  
C100  
VFBGA64  
VFBGA64  
HVQFN40  
HVQFN40  
VFBGA64  
VFBGA64  
HVQFN40  
HVQFN40  
Reel  
4500  
2450  
4000  
490  
71611  
71611  
71611  
71611  
71612  
71612  
71612  
71612  
9354 237 58518  
9354 237 58557  
9354 237 59518  
9354 237 59551  
9354 237 61518  
9354 237 61557  
9354 237 62518  
9354 237 62551  
5-Tray  
Reel  
1-Tray  
Reel  
PN7161B1EV/ SPI
 
/ 12.50.05  
C100  
4500  
2450  
4000  
490  
PN7161B1EV/ SPI
 
/ 12.50.05  
C100  
5-Tray  
Reel  
PN7161B1HN/ SPI
 
/ 12.50.05  
C100  
PN7161B1HN/ SPI
 
/ 12.50.05  
C100  
1-Tray  
PN7160_PN7161  
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© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
8 / 67  
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
8 Marking  
8.1 Marking
 
VFBGA64  
aaa-007526  
Figure 2.ꢀPN7160 package marking (top view)  
Table 5.ꢀMarking code  
Line number  
Line 1  
Marking code  
product version identification  
diffusion batch sequence number + assembly lot ID  
Line 2  
Line 3  
manufacturing code including:  
•
diffusion center code:  
–
S: Power chip (PTCT)  
•
assembly center code:  
–
S: ATKH  
•
RoHS compliancy indicator:  
–
D: Dark Green; fully compliant RoHS and no halogen and antimony  
•
manufacturing year and week, 3 digits:  
–
Y: year  
–
WW: week code  
•
product life cycle status code:  
–
X: means not qualified product  
–
nothing means released product  
PN7160_PN7161  
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© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
9 / 67  
 
 
 
 

NXP Semiconductors  
8.2 Marking
 
HVQFN40  
PN7160_PN7161  
Near Field Communication (NFC) controller  
terminal 1  
index area  
A : 7  
B1 : 6  
B2 : 6  
C : 8  
0
5
aaa-043477  
Figure 3.ꢀPN7160 Package marking HVQFN40 (top view)  
Table 6.ꢀMarking codes  
Type number  
Marking code  
Line A  
7 characters used: product version identification  
Line B1 + Line B2  
Diffusion Bath ID (9 digits) + space + assembly ID number (2  
digits)  
Line C  
8 characters used: manufacturing code  
including:  
•
diffusion center code:  
–
S: Power chip (PTCT)  
•
assembly center code:  
–
S: ATKH  
•
RoHS compliancy indicator:  
–
D: Dark Green; fully compliant RoHS  
and no halogen and antimony  
•
manufacturing year and week, 3 digits:  
–
YY: year  
–
WW: week code  
•
product life cycle status code:  
–
X: means not qualified product  
–
nothing means released product  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
10 / 67  
 
 
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
9 Block
 
diagram  
CLESS  
CLESS UART  
HOST INTERFACE  
INTERFACE UNIT  
2
SPI-bus I
 
C-bus  
RF DETECT  
DEMOD  
DRIVER  
PLL  
SENSOR  
ADC  
RX CODEC  
TX CODEC  
SIGNAL  
PROCESSING  
TxCtrl  
BG  
ARM  
DATA  
CORTEX M0  
MEMORY  
SRAM  
8 kBytes  
VMID  
EEPROM  
4 kBytes  
MEMORY  
CONTROL  
AHB to APB  
CODE  
MEMORY  
POWER  
MANAGEMENT UNIT  
MISCELLANEOUS  
CLOCK MANAGEMENT UNIT  
OSCILL
A
TOR OSCILLATOR  
ROM  
128 kBytes  
TEMPERATURE  
SENSOR  
TIMERS  
5.25 V  
TXLDO  
370 kHz  
40 MHz  
EEPROM  
28 kBytes  
FRACN  
PLL  
QUARTZ  
OSCILL
A
TOR  
CRC  
1.8 V  
COPROCESSOR  
DSLDO  
RANDOM  
NUMBER  
GENERATOR  
aaa-04
1
1
81  
Figure 4.ꢀPN7160 block diagram  
PN7160_PN7161  
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© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
11 / 67  
 
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
10 Pinning
 
information  
10.1 Pinning  
H
G
F
terminal 1  
index area  
2
I C_ADR0/SPI_NSS  
DWL_REQ  
1
2
3
4
5
6
7
8
9
30 NFC_CLK_XTA
L
1  
29 X
T
A
L2  
E
D
C
B
A
2
I C_ADR1/SPI_MOSI  
28  
27  
26  
25  
V
V
V
V
BAT  
V
SS(PAD)  
DD  
2
I C_SDA/SPI_MISO  
DD(A)  
DD(HF)  
NFCC  
V
DD(PAD)  
2
I C_SCL/SPI_SCK  
IRQ  
24 ANT2  
23 ANT1  
ball A1  
index area  
1
2
3
4
5
6
7
8
V
22  
V
DD_IN2  
V
SS(A)  
SS  
aaa-027834  
VEN 10  
21 TX1  
Figure 5.ꢀPN7160 pinning VFBGA64 (bottom view)  
T
r
ansparent top view  
aaa-04
1
144  
Figure 6.ꢀPN7160 pinning HVQFN40  
Table 7.ꢀPN7160 pin description  
Symbol  
Pin  
Pin  
Type

Refer  
Description  
HVQFN40  
VFBGA64  
I

2

C_ADR0/SPI_NSS  
DWL_REQ  
I

2

C_ADR1/SPI_MOSI  
1
2
3
4
C3  
D3  
D1  
C1  
I/O  
I
V

DD(PAD)

Host interface pin 1  
V

DD(PAD)

Firmware download control pin  
V

DD(PAD)

Host interface pin 2  
I/O  
G
V

SS(PAD)  

n/a  
Pad ground. Must be connected to  
ground.  
I

2

C_SDA/SPI_MISO  
V

DD(PAD)  

I

2

C_SCL/SPI_SCK  
5
E1  
D2  
E2  
E3  
G3  
H1  
I/O  
P
V

DD(PAD)

Host interface pin 3  
n/a Pad
 
supply voltage  
6
7
I/O  
O
V

DD(PAD)

Host interface pin 4  
IRQ  
8
V

DD(PAD)

Interrupt request output  
V

SS(A)  

9
G
n/a  
Analog ground supply voltage  
VEN  
10  
I
V

BAT  

Reset pin. Set the device in Hard Power  
Down.  
i.c.  
11  
12  
–
–
–
–
Internally Connected.
T
o
b
e left open.  
V

BAT2  

P
n/a  
Battery supply voltage. Must be  
connected to V

BAT

. VFBGA package:  
internally connected.  
V

DD(UP)  

V

DD(TX)  

RXN  
13  
14  
15  
H3  
G7  
H6  
P
P
I
n/a  
TXLDO input supply voltage  
Transmitter supply voltage  
Negative receiver input  
n/a  
V

DD(A)  

PN7160_PN7161  
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© 2023 NXP B.
V
.
A
ll rights reserved.  
Product data sheet  
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12 / 67  
 
 
 
 
 

NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 7.ꢀPN7160 pin description
…continued  
Symbol  
Pin  
Pin  
Type

Refer  
Description  
HVQFN40  
VFBGA64  
RXP  
16  
17  
18  
H5  
H4  
–
I
V

DD(A)  

n/a  
Positive receiver input  
V

DD(VMID)  

TVDD_IN  
P
P
Receiver reference input supply voltage  
n/a  
Must be connected to V

DD(TX)

and  
TVDD_IN2. VFBGA package: internally  
connected.  
TX2  
19  
20  
H7  
H8  
O
G
V

DD(TX)  

n/a  
Antenna driver output  
V

SS(TX)  

Contactless transmitter ground. Must be  
connected to ground.  
TX1  
21  
22  
G8  
–
O
P
V

DD(TX)  

Antenna driver output  
TVDD_IN2  
Must be connected to V

DD(TX)

and  
TVDD_IN. VFBGA package: internally  
connected.  
ANT1  
ANT2  
V

DD(HF)  

V

DD(A)  

23  
24  
25  
26  
F7  
E7  
D6  
D7  
P
P
P
P
n/a  
n/a  
n/a  
n/a  
Antenna connection for wake-up  
Antenna connection for wake-up  
Monitor rectifier output voltage  
Analog supply voltage. Connect to  
V

DD(D)  

.
V

DD  

27  
28  
–
Must be connected to AVDD and DVDD.  
VFBGA package: internally connected.  
V

BAT  

E8  
P
n/a  
Battery supply voltage. Must be  
connected to V

BAT2  

Oscillator output  
PLL input  
.
XTAL2  
29  
30  
31  
D8  
C8  
C7  
O
I
V

DD(D)  

V

DD(D)  

n/a  
NFC_CLK_XTAL1  
V

DD(D)  

P
Digital supply voltage for decoupling.  
Must be connected to V

DD

and V

DD(A)  

.
n.c.  
32  
33  
34  
35  
36  
37  
–
n.c.  
–
n.c.  
–
n.c.  
–
n.c.  
–
DCDC_EN  
A2  
O
V

DD(PAD)

External DC-DC enable request on  
V

DD(PAD)  

i.c.  
38  
B2  
A1  
B1  
–
To
b
e left open.  
WKUP_REQ  
CLK_REQ  
V

SS  

39  
I
V

DD(PAD)

Wake-up request when in standby  
V

DD(PAD)

Clock request pin  
40  
O
G
Center Pad  
n/a  
Pad ground. Must be connected to  
ground.  
i.c.  
i.c.  
–
–
A3  
A4  
To
b
e left open.  
Must be connected to ground.  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 7.ꢀPN7160 pin description
…continued  
Symbol  
Pin  
Pin  
Type

Refer  
Description  
HVQFN40  
VFBGA64  
i.c.  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
A5  
A6  
A7  
A8  
B3  
B4  
B5  
B6  
B7  
B8  
C2  
C4  
C5  
C6  
To
b
e left open.  
To
b
e left open.  
Must be connected to ground.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
i.c.  
i.c.  
i.c.  
i.c.  
n.c.  
n.c.  
i.c.  
i.c.  
i.c.  
i.c.  
n.c.  
n.c.  
V

SS(D)  

G
n/a  
Digital ground supply voltage. Must be  
connected to ground.  
n.c.  
–
–
–
–
–
–
–
–
–
–
–
–
D4  
D5  
E4  
E5  
E6  
F1  
F2  
F3  
F4  
F5  
F6  
F8  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
To
b
e left open.  
n.c.  
n.c.  
n.c.  
n.c.  
i.c.  
i.c.  
i.c.  
n.c.  
n.c.  
n.c.  
TX_PWR_REQ  
O
V

DD(D)  

External TX power supply request on  
V

DD(D)  

i.c.  
–
–
–
–
–
–
G1  
G2  
G4  
G5  
G6  
H2  
Must be connected to ground.  
To
b
e left open.  
i.c.  
n.c.  
To
b
e left open.  
V

SS(A)  

V

SS(A)  

i.c.  
G
G
n/a  
n/a  
Analog ground supply voltage  
Analog ground supply voltage  
To
b
e left open.  
[1] P
 
= power supply; G = ground; I = input; O = output; I/O = input/output  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
11 Functional
 
description  
PN7160 can be connected on a host controller through different physical interfaces (I

2

C-bus and SPI-bus). The  
logical interface towards the host controller is NCI-compliant Ref.

with additional command set for NXP-  
specific product features. This IC is fully user controllable by the firmware interface described in Ref.

.  
Moreover, PN7160 provides flexible and integrated power management unit in order to preserve energy  
supporting Power Off mode.  
APPLICATION  
PROCESSOR  
Host interface  
EXTERNAL SUPPLIES  
NFCC  
AND CLOCK  
ANTENNA  
M
A
TCHING  
aaa-041132  
Figure 7.ꢀPN7160 connection in mobile system  
11.1 System
 
modes  
11.1.1 System
 
power modes  
4 power modes are specified: Full power mode, Autonomous mode, Low-power mode and Power Off mode.  
Table 8.ꢀSystem power modes description  
System power mode  
Full power mode  
Description  
The battery supply (V

BAT

) as well as the pad supply (V

DD(PAD)

) are available  
Autonomous mode  
The battery supply (V

BAT

) as well as the pad supply (V

DD(PAD)

) are available. Via a SW  
command the host sets the NFC controller in autonomous mode (AutoMode bit is set). In  
that power mode, the NFC controller will not send any command or signal over V

DD(PAD)  

connected pins.  
In case of reset via VEN pin the AutoMode bit value is kept unchanged.  
This mode is useful to present an NDEF message in Card Emulation mode although the  
main system is shut down.  
Low-power mode  
Power Off mode  
The battery supply (V

BAT

) is available but the pad supply (V

DD(PAD)

) is not available. No  
host communication is available.  
The system is not supplied from any source or the system is kept Hard Power Down  
(HPD)  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
AutoMode = 1  
Autonomous mode  
Full power mode  
= Off]  
AutoMode = 0  
[V  
[V  
= Off]  
DD(PAD)  
DD(PAD)  
[V  
= On]  
DD(PAD)  
[V  
DD(PAD)  
= On]  
[V  
= On && V  
= On  
DD(PAD)  
B
A
T  
Low-power mode  
VEN = On]  
[V  
= Off || VEN = Off]  
BAT  
[V  
= On && V  
DD(PAD)  
= Off  
B
A
T  
VEN = On]  
[V  
= Off || VEN = Off]  
BAT  
[V  
= Off || VEN = Off]  
(1)  
BAT  
Power Off mode  
[AutoMode = 1
 
&& VEN = On]  
[VEN = Off]  
aaa-022797  
1. When
 
V

BAT

goes OF
F
,
A
utoMode = 0.  
Figure 8.ꢀSystem power mode diagram  

T

summarizes the system power mode of the PN7160 depending on the status of the external supplies  
available in the system:  
Table 9.ꢀSystem power modes configuration  
V

BAT  

Off  
V

DD(PAD)  

VEN  
X
AutoMode bit  
Power mode  
X
X
X
0
Power Off mode  
Power Off mode  
Full power mode  
Autonomous mode  
Low-power mode  
On  
X
Off  
On  
On  
On  
On  
On  
On  
Off  
On  
1
On  
X
Depending on power modes, some application states are limited:  
Table 10.ꢀSystem power modes description  
System power mode  
Allowed communication modes  
not applicable  
Power Off mode  
Low-power mode  
Autonomous mode  
Card Emulation only  
Full power mode  
Reader/Writer, Card Emulation, P2P modes  
11.1.2 PN7160
 
power states  
Next to system power modes defined by the status of the power supplies, the power states include the logical  
status of the system. Thus extend the power modes.  
3 power states are specified: Hard Power Down (HPD), Standby, Active.  
Table 11.ꢀPN7160 power states  
Power state name  
Description  
Hard Power Down  
The PN7160 is supplied by V

BAT

within its operating range and PN7160 is kept in Hard Power  
Down (VEN voltage is kept low by host or SW programming) to have the minimum power  
consumption. The system mode is in Power Off.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 11.ꢀPN7160 power states
…continued  
Power state name  
Description  
Standby  
The PN7160 is supplied by V

BAT

within its operating range, VEN voltage is high (by host or SW  
programming) and minimum part of PN7160 is kept supplied to enable configured wake-up  
sources which allow to switch to Active state; RF field, Host interface (if V

DD(PAD)

is high). The  
system mode is Low-power mode or Full power mode.  
Active  
The PN7160 is supplied by V

BAT

within its operating range, VEN voltage is high (by host or SW  
programming), V

DD(PAD)

is high and the PN7160 internal blocks are supplied. 3 sub-modes are  
defined: Idle, Listener and Poller. The system mode is Full power mode.  
At application level, the PN7160 will continuously switch between different states to optimize the current  
consumption (polling loop mode). Refer to

for targeted current consumption in here described states.  
The PN7160 is designed to allow the host controller to have full control over its functional states.  
11.1.2.1 Hard
 
Power Down (HPD) state  
The Hard Power Down state is entered when V

DD(PAD)

and V

BAT

are high by setting VEN voltage < 0.4
V
.
A
s  
these signals are under host control, the PN7160 has no influence on entering or exiting this state.  
11.1.2.2 Standby
 
state  
Active state is PN7160’s default state after boot sequence in order to allow a quick configuration of PN7160. It is  
recommended to change the default state to Standby state after first boot in order to save power. PN7160 can  
switch to Standby state autonomously (if configured by host). This state is independent of the V

DD(PAD)

value.  
In this state, PN7160 most blocks including CPU are disconnected from power supply. Number of wake-up  
sources exist to put PN7160 into Active state (all host-related wake-up events imply that V

DD(PAD)

is available):  
•
Host interface wake-up event (I

2

C-bus, SPI-bus)  
•
Host interface wake-up via WKUP_REQ pin  
•
Antenna RF level detector  
•
Internal timer event when using polling loop (370 kHz Low-power oscillator is enabled)  
If wake-up event occurs, PN7160 will switch to Active state. Any further operation depends on software  
configuration and/or wake-up source.  
11.1.2.3 Active
 
state  
Within the Active state, the system is acting as an NFC device. The device can be in 3 different power states:  
Idle, Listener and Poller.  
Table 12.ꢀFunctional modes in active state  
Functional modes  
Description  
Idle  
the PN7160 is active and host interface communication is on going. The RF interface is not  
activated. If Standby state is de-activated PN7160 stays in Idle mode even when no host  
communication.  
Listener  
Poller  
the PN7160 is active and is listening to external device. The RF interface is activated.  
the PN7160 is active and is in Poller mode. It polls external device. The RF interface is  
activated.  
PN7160_PN7161  
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NXP Semiconductors  
Poller mode  
PN7160_PN7161  
Near Field Communication (NFC) controller  
In this mode, PN7160 is acting as Reader/Writer or NFC Initiator, searching for or communicating with passive  
tags or NFC target. Once RF communication has ended, PN7160 will switch to Idle mode or Standby state to  
save energy. Poller mode shall be used with 2.8 V < V

BAT

< 5.5 V and VEN voltage > 1.1
V
.
P
oller mode shall  
not be used with V

BAT

< 2.8
V
.
V

DD(PAD)

is within its operational range (see

).  
Listener mode  
In this mode, PN7160 is acting as a card or as an NFC
T
a
rget. Listener mode shall be used with 2.8 V < V

BAT  

< 5.5 V and VEN voltage > 1.1
V
.
O
nce RF communication has ended, PN7160 will switch to Idle mode or  
Standby state to save energy.  
11.1.2.4 Polling
 
loop  
The polling loop will sequentially set PN7160 in different power states (Active or Standby). All RF technologies  
supported by PN7160 can be independently enabled within this polling loop.  
There are 2 main phases in the polling loop:  
•
Listening phase. The PN7160 can be in Standby power state or Idle mode (called pause in

; no  
communication is on-going) or Listener mode (called Emulation in

; card / target communication is  
started)  
•
Polling phase. The PN7160 is in Poller mode  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Listening phase  
Emulation  
Pause  
Type A  
Type B  
Type F  
@424  
Type F  
@212  
ISO15693  
Polling phase  
aaa-016741  
Figure 9.ꢀPolling loop: all phases enabled  
In Listening phase when no RF field PN7160 is in Standby state if enabled (otherwise it is Idle mode) and is in  
Listener mode (Emulation) when RF field is detected. When in Polling phase, PN7160 goes to Poller mode.  
To
f
urther decrease the power consumption when running the polling loop, PN7160 features a low-power RF  
polling. When PN7160 is in Polling phase instead of sending regularly RF command PN7160 senses with  
a short RF field duration if there is any NFC
T
a
rget or card/tag present. If yes, then it goes back to standard  
polling loop. With 500 ms (configurable duration, see Ref.

) listening phase duration, the average power  
consumption is around 100 μA depending on RF matching conditions.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Listening phase  
Emulation  
Pause  
Polling phase  
aaa-016743  
Figure 10.ꢀPolling loop: low-power RF polling  
Detailed description of polling loop configuration options is given in Ref.

.  
11.2 Host
 
interfaces

PN7160 provides the support of the following host interfaces:  
•
I

2

C-bus
T
a
rget Interface, up to 3.4 MBaud  
•
SPI-bus
T
a
rget Interface, up to 7 MBaud  
Only one host interface can be active at a time, as the pins are shared for all interfaces.  
The selection between interfaces is fused during IC manufacturing so that different ordering numbers for the  
I

2

C-bus and SPI-bus version are in place.  
The host interfaces are woken-up in the following way:  
•
wake-up with WKUP_REQ input pin  
•
I

2

C-bus: wake-up on I

2

C-bus address  
•
SPI-bus: transition of NSS serial  
•
data received on RX line  
2
Updated the terms “Master/Slave” to “Controller/
T
a
rget” to align with the recommendation of the NXP – I2C standards organization.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
To
e
nable and ensure data flow control between PN7160 and host controller, additionally a dedicated interrupt  
line IRQ is provided which Active state is programmable. See Ref.

for more information.  
11.2.1 I

2

C-bus interface

The I

2

C-bus interface implements a target I

2

C-bus interface with integrated shift register, shift timing generation  
and target address recognition.  
I

2

C-bus Standard mode (100 kHz SCL), Fast mode (400 kHz SCL) and High-speed mode (3.4 MHz SCL) are  
supported.  
The main hardware characteristics of the I

2

C-bus module are:  
•
Support target I

2

C-bus  
•
Standard, Fast and High-speed modes supported  
•
Wake-up of PN7160 on its address only  
•
Serial clock synchronization can be used by PN7160 as a handshake mechanism to suspend and resume  
serial transfer (clock stretching)  
The I

2

C-bus interface module meets the I

2

C-bus specification Ref.

except General call, 10 bit addressing  
and Fast mode Plus (Fm+).  
11.2.1.1 I

2

C-bus configuration  
The I

2

C-bus interface shares four pins with SPI-bus interface also supported by PN7160. When I

2

C-bus is  
configured in EEPROM settings, functionality of the interface pins changes as described in

.  
Table 13.ꢀFunctionality for I

2

C-bus interface  
Pin name  
HIF1  
Functionality  
I

2

C-bus address 0  
I

2

C-bus address 1  
I

2

C-bus data line  
I

2

C-bus clock line  
HIF2  
HIF3

HIF4

[1] HIF3
 
and HIF4 are not fail-safe and V

DD(pad)

shall always be available when using the SCL and SDA lines connected to these pins.  
PN7160 supports 7-bit addressing mode. Selection of the I

2

C-bus address is done by 2-pin configurations on  
top of a fixed binary header: 0, 1, 0, 1, 0, HIF2, HIF1, R/W.  
Table 14.ꢀI

2

C-bus interface addressing  
HIF2  
HIF1  
I

2

C-bus address  
(R/W = 0, write)  
I

2

C-bus address  
(R/W = 1, read)  
0
0
1
1
0
1
0
1
0x50  
0x52  
0x54  
0x56  
0x51  
0x53  
0x55  
0x57  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
11.2.2 Serial
 
Peripheral Interface bus (SPI-bus)

11.2.2.1 Features  
•
Synchronous, Serial, Full-Duplex communication, 7 MHz maximum  
•
T
a
rget mode  
11.2.2.2 SPI-bus
 
configuration options

In order to select SPI-bus interface for host communication, some EEPROM settings are programmed during  
production.  
The CPOL/CPHA EEPROM settings are fixed as specified in

.  
The selection between interfaces is fused during IC manufacturing so that different ordering numbers for the  
SPI-bus version.  
Table 15.ꢀSPI-bus configuration  
Connection  
CPHA switch: Clock PHAse: defines the sampling edge of MOSI data  
•
CPHA = 0: data are sampled on MOSI on the odd clock edges of SCK after NSS goes low  
CPOL switch: Clock POLarity  
•
IFSEL1 = 0: the clock is idle low and the first valid edge of SCK will be a rising one  
The SPI-bus interface shares 4 pins with the I

2

C-bus interface. During production of the device, the interface  
is fixed to SPI or I²C and cannot be changed later. The functionality of the interface pins in SPI configuration is  
described in

.  
Table 16.ꢀFunctionality for SPI-bus interface  
Pin name  
HIF1  
Functionality  
NSS (Not
T
a
rget Select)  
MOSI (Controller Out
T
a
rget In)  
MISO (Controller In
T
a
rget Out)  
SCK (Serial Clock)  
HIF2  
HIF3  
HIF4  
11.2.2.3 SPI-bus
 
functional description

When a controller device transmits data to PN7160 (target device) via the MOSI line, PN7160 responds by  
sending data to the controller device via the controllers MISO line. This implies full-duplex transmission with  
both data out and data in synchronized with the same clock signal.  
PN7160 starts sampling when receiving a logic low at pin NSS and the clock at input pin SCK. Thus, PN7160 is  
synchronized with the controller. Data from the controller is received serially at the target MOSI line and loads  
the 8-bit shift register. After the 8-bit shift register is loaded, its data is transferred to the read buffer. During a  
write cycle, data is written into the shift register, then PN7160 waits for a clock train from the controller to shift  
the data out on the targets MISO line.  
•
Controller In
T
a
rget Out (MISO)  
The MISO line is configured as an input in a controller device and as an output in a target device. It is used to  
transfer data from the target to the controller, with the most significant bit sent first. The MISO line of a target  
device should be placed in the high impedance state if the target is not selected.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
•
Controller Out
T
a
rget In (MOSI)  
The MOSI line is configured as an output in a controller device and as an input in a target device. It is used to  
transfer data from the controller to a target, with the Most Significant Bit (MSB) sent first.  
•
Serial Clock (SCK)  
The serial clock is used to synchronize data movement both in and out of the device through its MOSI and  
MISO lines. The controller and target devices are capable of exchanging a byte of information during a  
sequence of eight clock cycles. Since the controller device generates SCK, this line becomes an input on a  
target device and an output at the controller device.  
•
Not
T
a
rget Select (NSS)  
The target select input line is used to select a target device. It has to be low prior to data transactions and  
must stay low of the duration of the transaction. The NSS line on controller side must be tied high.  
Both controller and target devices must operate with the same timing. The controller device always places data  
on the MOSI line a half cycle before the clock edge SCK, in order for the target device to latch the data.  
For more information about the SPI-bus functionality, see Ref.

.  
11.3 PN7160
 
clock concept  
There are 4 different clock sources in PN7160:  
•
27.12 MHz clock coming either/or from:  
–
Internal oscillator for 27.12 MHz crystal connection on NFC_CLK_XTAL1 and XTAL2 pins  
–
External reference clock on pin NFC_CLK_XTAL1. It is internally forwarded to an integrated PLL which  
includes a 1 GHz VCO.  
•
13.56 MHz RF clock recovered from RF field  
•
Low-power oscillator 40 MHz  
•
Low-power oscillator 370 kHz  
11.3.1 27.12
 
MHz quartz oscillator  
When enabled, the 27.12 MHz quartz oscillator applied to PN7160 is the time reference for the RF front end  
when PN7160 is behaving in Reader mode or NFCIP-1 Initiator.  
Therefore stability of the clock frequency is an important factor for reliable operation. It is recommended to  
adopt the circuit shown in

.  
NFCC  
NFC_CLK_XTAL1  
X
T
AL2  
crystal  
27.12 MHz  
c
c
aaa-041133  
Figure 11.ꢀ27.12 MHz crystal oscillator connection  

T

describes the levels of accuracy and stability required on the crystal.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 17.ꢀCrystal requirements  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
f

xtal  

crystal frequency  
ISO/IEC, FCC and FeliCa  
global compliancy  
–
27.12  
–
MHz  
Δf

xtal  

ESR  
C

L  

crystal frequency accuracy  
equivalent series resistance  
load capacitance  
full operating range  
-50  
–
+50  
100  
–
ppm  
Ω
–
–
–
50  
10  
–
pF  
P

xtal  

crystal power dissipation  
100  
μW  
[1] This
 
requirement is according to FCC regulations (± 100 ppm) and FeliCa global (± 50 ppm) requirements.
T
o
m
eet only ISO/IEC 14443 and ISO/IEC  
18092, then ± 14 kHz apply which is equivalent to ± 516 ppm.  
11.3.2 Integrated
 
PLL to make use of external clock  
When enabled, the PLL is designed to generate a low noise 27.12 MHz from an input clock 19.2 MHz, 26 MHz,  
32 MHz, 38.4 MHz and 48 MHz.  
The 27.12 MHz of the PLL is used as the time reference for the RF front end.  
The input clock on NFC_CLK_XTAL1 shall comply with the.following phase noise requirements for the following  
input frequency: 19.2 MHz, 26 MHz, 32 MHz, 38.4 MHz and 48 MHz:  
dBc/Hz  
-20dBc/decade  
input reference  
noise floor  
-140 dBc/Hz  
Hz  
input reference noise corner  
50 kHz  
aaa-026327  
Figure 12.ꢀInput reference phase noise characteristics  
This phase noise is equivalent to an RMS jitter of 6.23 ps from 10 Hz to 1 MHz. For configuration of input  
frequency, refer to Ref.

. There are 7 pre programmed and validated frequencies for the PLL: 19.2 MHz, 26  
MHz, 32 MHz, 38.4 MHz and 48 MHz.  
Table 18.ꢀPLL input requirements  
Coupling: single-ended, AC coupling;  
Symbol  
Parameter  
Conditions  
Min  
Typ  
19.2  
26  
Max  
Unit  
MHz  
MHz  
MHz  
MHz  
MHz  
f

clk  

clock frequency  
ISO/IEC, FCC and FeliCa global  
compliancy  
–
–
–
–
–
–
–
–
–
–
32  
38.4  
48  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 18.ꢀPLL input requirements
…continued  
Coupling: single-ended, AC coupling;  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
f

i(ref)acc  

reference input frequency  
accuracy  
full operating range; frequencies  
typical values: 19.2 MHz, 26 MHz,  
32 MHz, 38.4 MHz and 48 MHz  
-20  
–
+20  
ppm  
φ

n  

phase noise  
input noise floor at 50 kHz  
-140  
–
–
dB/Hz  
Sinusoidal shape  
V

i(p-p)  

V

i(clk)  

peak-to-peak input voltage  
clock input voltage  
0.2  
0
–
–
1.8  
1.8  
V
V
Square shape  
V

i(clk)

clock input voltage  
0
–
1.8  
V
[1] This
 
requirement is according to FCC regulations (± 100 ppm) and FeliCa global (± 50 ppm) requirements.
T
o
m
eet only ISO/IEC 14443 and ISO/IEC  
18092, then ± 7 kHz apply which is equivalent to ± 516 ppm.  
[2] Overshoot
 
and undershoot shall not exceed 10%.  
For detailed description of clock request mechanisms, refer to Ref.

and Ref.

.  
11.3.3 Low-power
 
40 MHz ± 2.5 % oscillator  
Low-power 40 MHz ± 2.5 % oscillator is used as system clock of the system.  
Output clock 40 MHz is used by default to clock the system.  
11.3.4 Low-power
 
370 kHz oscillator  
A Low Frequency Oscillator (LFO) is implemented to drive a counter (WUC) waking-up PN7160 from Standby  
state. This allows implementation of low-power reader polling loop at application level.  
Moreover, this 370 kHz is used as the reference clock for write access to EEPROM memory.  
11.4 Power
 
concept  
11.4.1 PMU
 
functional description  
The Power Management Unit of PN7160 generates internal supplies required by PN7160 out of V

BAT

and  
V

DD(UP)

input supply voltages:  
•
V

DDA

: analog output supply voltage. It must be connected to V

DDD  

.
•
V

DDD

: digital input supply voltage. It is internally connected to the output of the DSLDO V

DD  

.
•
V

DD(TX)

: output supply voltage for the transmitter. It is internally connected to the transmitter input supply  
voltage  
The

describes the main blocks available in PMU:  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
V
V
V
DDA  
BAT  
DDD  
V
DD  
V
V
DD(UP)  
DD(TX)  
TXLDO  
DSLDO  
TVDD_IN  
BANDGAP  
DIE  
NFCC  
aaa-041134  
Figure 13.ꢀPMU functional diagram  
11.4.2 DSLDO:
 
Dual Supply LDO  
The input pin of the DSLDO regulator is V

BAT  

.
The output of this regulator (V

DD

) is internally connected to supply the internal digital blocks which are on V

DDD  

.
It must be externally de-coupled and V

DDD

must be connected to V

DDA  

.
11.4.3 TXLDO  
Transmitter voltage is generated by internal LDO (V

DD(TX)

).  
This TXLDO allows a maximum continuous current load up to 250 mA in order to support ISO/IEC 14443 and  
NFC Forum standard compliant operations.  
The Low Drop Out regulator has been designed to reject the noise which could interfere with the RF  
communication.  
Table 19.ꢀTXLDO  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V

DD(TXLDO)  

drop TXLDO supply  
voltage  
V

DD(UP)

= 5.3 V; Transmitter current =  
250 mA  
–
–
0.3  
V
(drop)  
The regulator has been designed to work in 2 modes:  
11.4.3.1 Configuration
 
1: the battery voltage is directly used to generate the RF field  
The input supply of the regulator is directly the V

BAT

voltage which is connected to V

DD(UP)

the input of the  
TXLDO.  
The output is called V

DD(TX)  

.
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
V
V
DD(UP)  
BATTERY  
V
BAT  
NFCC  
DD(TX)  
aaa-041135  
Figure 14.ꢀV

DD(UP)

= V

BAT  

V

BAT

acceptable range depends on communication modes to be covered (see

)  
The V

DD(TX)

value is programmable and shall be chosen according to the minimum targeted VBAT value for  
which reader and card modes shall work: VTHRESHOLD.  
The TXLDO output voltage is then given by:  

Figure 15

shows V

DD(TX)

offset disabled behavior for both cases of V

DD(TX)

programmed for 3.0
V
,
3
.3 V or 3.6  
V.  
5.0 V  
3.6 V  
V
~ 1 Ω * load  
DD(TXLDO)(drop)  
3.3 V  
3.0 V  
2.8 V  
4.5 V  
3.6 V  
3.3 V  
3.0 V  
2.8 V  
aaa-025682  
Figure 15.ꢀV

DD(TX)

behavior when supplied from V

BAT  

In Standby state, whatever V

THRESHOLD

value is configured, V

DD(TX)

is regulated at 2.5
V
.  

Figure 16

shows the case where the PN7160 is in standby state.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
V
BAT  
2.5 V  
2.5 V  
aaa-009463  
Figure 16.ꢀV

DD(TX)

behavior when PN7160 is in Standby state  
11.4.3.2 Configuration
 
2: an extra external voltage is used to generate the RF field  
TXLDO has also the possibility to generate V

DD(TX)

up to 5.25 V in case the supply of this regulator is an  
external supply.  
V
DD(UP)  
EXTERNAL 5 V  
BATTERY  
V
BAT  
NFCC  
V
DD(TX)  
aaa-041136  
Figure 17.ꢀV

DD(UP)

up to 5.8
V
,
V

BAT

up to 5.5 V  
Minimum V

DD(UP)

and V

BAT

acceptable values depend on communication modes to be covered (see

)  
The TXLDO output voltage is then given by:  

Figure 18

shows the behavior of V

DD(TX)

depending on V

DD(UP)

value.  
V
5.5 V  
DD(UP)  
4.75 V  
4.5 V  
V
DD(TX)  
V
~ 1 Ω * load  
DD(TXLDO)(drop)  
aaa-025683  
Figure 18.ꢀV

DD(TX)

behavior when PN7160 is supply using external supply on V

DD(UP)  

PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
In Standby state, whatever V

THRESHOLD

is configured, V

DD(TX)

is regulated at 2.5 V as illustrated by

.  
11.4.3.3 TXLDO
 
limiter  
The TXLDO includes a current limiter to avoid too high current within TX1 and TX2.  
The current limiter block compares an image of the TXLDO output current to a reference, when the reference is  
reached the output current gets limited.  
The limiting current is 300 mA ± 30 mA, above the specified maximum current allowed for RF operation (250  
mA).  
11.4.3.4 TXLDO:
 
configuration  
Table 20.ꢀConfigurations using TXLDO  
PN7160 power state  
TXLDO config.  
configuration 1  
configuration 2  
Mode  
V

DD(TX)  

2.7 V/3 V/3.3 V/3.6 V

Active mode  
Full-power  
Full-power  
2.7 V/3 V/3.3 V/3.6 V/3.9 V/4.2 V/4.5 V/4.7  
V/4.75 V/5 V/5.25 V

Standby  
configuration 1 and  
configuration 2  
Low-power  
Power-off  
2.5 V  
Hard-Power down  
configuration 1 and  
configuration 2  
High impedance  
[1] For
 
proper operation, the V

DD(TX)

voltage value set shall be below the V

DD(UP)

– 0.3 V value. The maximum V

DD(UP)

value is 5.8 V in configuration 2. In  
configuration 1, the voltage is given by the battery then the higher voltages might not be usable.  
When using an external DC-to-DC with pass-through functionality, the signal TX_PWR_REQ is used for control  
purpose. The DC-to-DC will be in pass-through mode except when high transmitter power is required (by default  
when RF emission or RF field present).  
Note:
the signal TX_PWR_REQ is not available on the HVQFN package variant.  
Alternatively the signal DCDC_EN can be used for the same purpose. This signal is available on both package  
variants. HVQFN and VFBGA.  
11.4.4 Very
 
low-power RF field detector  
A very specific use case is the RF field detection when the NFCC is in Power Off mode. In this scenario, the  
NFCC should detect the presence of an external magnetic field and notify the host system about its presence.  

Figure 19

shows the internal rectifier circuit. The circuit is built up by the input switches SW1 and SW2 which  
can disconnect the rectifier from the antenna by creating a short to ground. The rectifier itself is followed by a  
limiter.  
ANT1  
rectifier  
SW1  
SW2  
V
DD(HF)  
C
vdhf  
limiter  
ANT2  
aaa-022801  
Figure 19.ꢀInternal rectifier circuit  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
11.5 Reset
 
and download concept  
11.5.1 Resetting
 
PN7160  
To
e
nter reset, the V

EN

voltage shall be set to low (this is also the Hard Power Down state):  
Reset means resetting the embedded FW execution and the registers values to their default values. Parts of  
these default values are defined from EEPROM data loaded values, others are hardware defined. See Ref.

to know which ones are accessible to tune PN7160 to the application environment.  
To
g
et out of reset:  
•
Pulling VEN voltage high with V

BAT

within its operating range  

Figure 20

shows reset done via VEN pin.  
V
BAT  
V
DD(PAD)  
host  
communication  
possible  
V
EN  
t
t
boot  
WL(VEN)  
aaa-024833  
Figure 20.ꢀResetting PN7160 via VEN pin  
See

for the timings values.  
11.5.2 Power-up
 
sequences  
PN7160 allows V

BAT

and V

DD(PAD)

to be set up independently, therefore different power-up sequences have to  
be considered.  
In all cases, host communication with PN7160 will only be possible after one defined amount of time from the  
different supply sequence setup and VEN reset pin.  
11.5.2.1 V

BAT

is set up before V

DD(PAD)  

This is at least the case when V

BAT

pin is directly connected to the battery and when PN7160 V

BAT

is always  
supplied as soon the system is supplied.  
As VEN pin is referred to V

BAT

pin, V

EN

shall go high after V

BAT

has been set.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
V
BAT  
V
DD(PAD)  
interface selection  
t
t
t(VDDPAD-VEN)  
boot  
host  
communication  
possible  
V
EN  
aaa-013871  
Figure 21.ꢀV

BAT

is set up before V

DD(PAD)  

See

and

for the timings values.  
11.5.2.2 V

DD(PAD)

and V

BAT

are set up at the same time  
This is the case, when V

BAT

pin is connected to a PMU/regulator which also supply V

DD(PAD)  

.
V
BAT  
t
t(VBAT-VEN)  
V
DD(PAD)  
t
boot  
host  
communication  
possible  
V
EN  
aaa-013872  
Figure 22.ꢀV

DD(PAD)

and V

BAT

are set up in the same time  
See

and

for the timings values.  
11.5.2.3 PN7160
 
has been enabled before V

DD(PAD)

is set up or before V

DD(PAD)

has been cut-off  
This can be the case when V

BAT

pin is directly connected to the battery and when V

DD(PAD)

is generated from a  
PMU. When the battery voltage is too low, then the PMU might no more be able to generate V

DD(PAD)

. When the  
device gets charged again, then V

DD(PAD)

is set up again.  
As the pins to select the interface are biased from V

DD(PAD)

, when V

DD(PAD)

disappears the pins might not be  
correctly biased internally and the information might be lost. Therefore it is required to make the IC boot after  
V

DD(PAD)

is set up again.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
V
BAT  
V
DD(PAD)  
interface selection  
t
t
t(VDD
P
A
D-VEN)  
boot  
host  
communication  
possible  
V
t
WL(VEN)  
EN  
aaa-024841  
Figure 23.ꢀV

DD(PAD)

is set up or cut-off after PN7160 has been enabled  
See

and

for the timings values.  
11.5.3 Power-down
 
sequences  
During power-down sequence, V

EN

shall always be set low before V

DD(PAD)

is shut down.  
V
BAT  
V
EN  
t
WL(VEN)  
V
DD(PAD)  
aaa-024910  
Figure 24.ꢀPN7160 power-down sequence  
See

for the timings values.  
11.5.4 Download
 
mode  
PN7160 offers the possibility to download EEPROM with upgrades using the host interface commands, see Ref.  

[6]

for more details.  
To
e
nter this mode, the pin DWL_REQ shall be pulled to V

DD(PAD)

before reset via VEN pin is done.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
V
BAT  
V
DD(PAD)  
DWL_REQ  
t
t
boot  
t(DWL_REQ-VEN)  
t
V
WL(VEN)  
EN  
download  
possible  
aaa-024842  
Figure 25.ꢀPN7160 download mode sequence  
See

and

for the timings values.  
11.6 Contactless
 
Interface Unit  
PN7160 supports various communication modes at different transfer speeds and modulation schemes. The  
following chapters give more detailed overview of selected communication modes.  
Remark:
all indicated modulation index and modes in this chapter are system parameters. This means that  
beside the IC settings a suitable antenna tuning is required to achieve the optimum performance.  
11.6.1 Reader/Writer
 
communication modes  
Generally 5 Reader/Writer communication modes are supported:  
•
PCD Reader/Writer for ISO/IEC 14443A/MIFARE (NFC Forum Types 2 and 4
T
a
gs)  
•
PCD Reader/Writer for NFC Forum Type 1
T
a
g  
•
PCD Reader/Writer for NFC Forum Type 3
T
a
g  
•
PCD Reader/Writer for ISO/IEC 14443B (NFC Forum Type 4
T
a
g)  
•
VCD Reader/Writer for NFC Forum Type 5
T
a
g  
11.6.1.1 R/W
 
mode for NFC Forum Type 1 and 2 Tags and Type 4 Tag type A  
The R/W mode for NFC Forum Type 1
T
a
g (T1T), Type 2
T
a
g (T2T) and Type 4
T
a
g type A (T4T) is the general  
reader to card communication scheme according to the ISO/IEC 14443A specification.  

Figure 26

describes the communication on a physical level, the communication table describes the physical  
parameters (the numbers take the antenna effect on modulation depth for higher data rates).  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
PCD to PICC  
100 % ASK at 106 kbit/s  
> 25 % ASK at 212, 424 or 848 kbit/s  
Modified Miller coded  
NFCC  
PICC (Card)  
PICC to PCD,  
subcarrier load modulation  
Manchester coded at 106 kbit/s  
ISO/IEC 14443A – MIFARE
 
BPSK coded at 212, 424 or 848 kbit/s  
PCD mode  
ISO/IEC 14443A – MIFARE  
aaa-041137  
Figure 26.ꢀR/W mode for NFC Forum T1
T
,
T
2T and T4T type A communication diagram  
Table 21.ꢀCommunication overview for NFC Forum T1
T
,
T
2T and T4T type A R/W mode  
Communication  
direction  
ISO/IEC 14443A/
 
ISO/IEC 14443A higher transfer speeds  
MIFARE/  
NFC Forum T2T  
and T4T  
Transfer speed  
Bit length  
106 kbit/s  
212 kbit/s  
424 kbit/s  
848 kbit/s  
(128/13.56) μs  
(64/13.56) μs  
(32/13.56) μs  
(16/13.56) μs  
PN7160
→
PICC  
(data sent by PN7160 to a
 
modulation on  
100 % ASK  
> 25 % ASK  
> 25 % ASK  
> 25 % ASK  
card)  
PN7160 side  
bit coding  
Modified Miller  
Modified Miller  
Modified Miller  
Modified Miller  
PICC →
PN7160  
(data received by PN7160
 
modulation on  
subcarrier load  
modulation  
subcarrier load  
modulation  
subcarrier load  
modulation  
subcarrier load  
modulation  
from a card)  
PICC side  
subcarrier  
frequency  
13.56 MHz/16  
13.56 MHz/16  
13.56 MHz/16  
13.56 MHz/16  
bit coding  
Manchester  
BPSK  
BPSK  
BPSK  
The contactless coprocessor and the on-chip CPU of PN7160 handle the complete ISO/IEC 14443A/MIFARE  
RF-protocol, nevertheless a dedicated external host has to handle the application layer communication.  
11.6.1.2 R/W
 
mode for NFC Forum Type 3 Tag, FeliCa communication mode  
The R/W mode for NFC Forum Type 3
T
a
g (T3T) is the general Reader/Writer to card communication  
scheme according to the FeliCa specification.

describes the communication on a physical level, the  
communication overview describes the physical parameters.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
PCD to PICC,  
8 – 12 % ASK at 212 or 424 kbits/s  
Manchester coded  
NFCC  
PICC (Card)  
PICC to PCD,  
load modulation  
Manchester coded at 212 or 424 kbits/s  
ISO/IEC 18092 – FeliCa  
PCD mode  
FeliCa card  
aaa-04
1
138  
Figure 27.ꢀR/W mode for NFC Forum T3T communication diagram  
Table 22.ꢀCommunication overview for NFC Forum T3T R/W mode, FeliCa communication mode  
Communication direction  
FeliCa  
FeliCa higher transfer speeds  
424 kbit/s  
Transfer speed  
Bit length  
212 kbit/s  
(64/13.56) μs  
(32/13.56) μs  
PN7160
→
PICC  
(data sent by PN7160 to a card)  
modulation on  
PN7160 side  
8 % – 12 % ASK  
Manchester  
8 % – 12 % ASK  
Manchester  
bit coding  
PICC →
PN7160  
(data received by PN7160 from a card)  
modulation on PICC
 
load modulation  
side  
load modulation  
subcarrier frequency
 
no subcarrier  
no subcarrier  
Manchester  
bit coding  
Manchester  
The contactless coprocessor of PN7160 and the on-chip CPU handle the FeliCa protocol. Nevertheless a  
dedicated external host has to handle the application layer communication.  
11.6.1.3 R/W
 
mode for NFC Forum type 4 Tag (T4T) type B  
The R/W mode for the NFC Forum Type 4
T
a
g of type B is the general reader to card communication scheme  
according to the ISO/IEC 14443B specification.

describes the communication on a physical level, the  
communication table describes the physical parameters.  
PCD to PICC,  
8 – 14 % ASK at 106, 212, 424 or 848 kbit/s  
NRZ coded  
NFCC  
PICC (Card)  
PICC to PCD,  
subcarrier load modulation  
BPSK coded at 106, 212, 424 or 848 kbit/s  
ISO/IEC 14443 Type B  
PCD mode  
ISO/IEC 14443 Type B  
aaa-04
1
139  
Figure 28.ꢀR/W mode for NFC forumT4T type B communication diagram  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 23.ꢀCommunication overview for NFC Forum T4T type B R/W mode  
Communication  
direction  
ISO/IEC 14443B
 
ISO/IEC 14443B higher transfer speeds  
Transfer speed  
Bit length  
106 kbit/s  
212 kbit/s  
424 kbit/s  
848 kbit/s  
(128/13.56) μs  
(64/13.56) μs  
(32/13.56) μs  
(16/13.56) μs  
PN7160
→
PICC  
(data sent by PN7160 to a
 
modulation on  
8 % – 14 % ASK
 
8 % – 14 % ASK
 
8 % – 14 % ASK
 
8 % – 14 % ASK  
card)  
PN7160 side  
bit coding  
NRZ  
NRZ  
NRZ  
NRZ  
PICC →
PN7160  
(data received by PN7160
 
modulation on  
subcarrier load  
modulation  
subcarrier load  
modulation  
subcarrier load  
modulation  
subcarrier load  
modulation  
from a card)  
PICC side  
subcarrier  
frequency  
13.56 MHz/16  
13.56 MHz/16  
13.56 MHz/16  
13.56 MHz/16  
bit coding  
BPSK  
BPSK  
BPSK  
BPSK  
The contactless coprocessor and the on-chip CPU of PN7160 handles the complete ISO/IEC 14443B RF-  
protocol, nevertheless a dedicated external host has to handle the application layer communication.  
11.6.1.4 R/W
 
mode for NFC Forum Type 5 Tag  
The R/W mode for NFC Forum Type 5
T
a
g (T5T) is the general reader to card communication scheme  
according to the ISO/IEC 15693 specification. PN7160 communicates with VICC (Type 5
T
a
g) using only 26.48  
kbit/s with single subcarrier.  
PN7160 supports the commands as defined by the ETSI HCI (see Ref.

) and on top offers the inventory of  
the tags (anti-collision sequence) on its own.  
VCD to VICC,  
100 % ASK at 26.48 kbit/s  
pulse position coded  
NFCC  
Card  
(VICC/TAG)  
VICC to VCD,  
subcarrier load modulation  
Manchester coded at 26.48 kbit/s  
ISO/IEC 15693  
VCD mode  
ISO/IEC 15693  
aaa-041140  
Figure 29.ꢀR/W mode for NFC Forum T5T communication diagram  

Figure 29

shows the communication schemes used.  
The following communication scheme is possible.  
Table 24.ꢀCommunication overview for NFC Forum T5T R/W mode  
Communication direction  
PN7160
→
VICC  
(data sent by PN7160 to a tag)  
transfer speed  
26.48 kbit/s  
(512/13.56) μs  
100 % ASK  
bit length  
modulation on PN7160 side  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 24.ꢀCommunication overview for NFC Forum T5T R/W mode
…continued  
Communication direction  
bit coding  
pulse position modulation 1 out of 4 mode  
VICC →
PN7160  
(data received by PN7160 from a tag)
 
transfer speed  
bit length  
26.48 kbit/s  
(512/13.56) μs  
modulation on VICC side  
subcarrier load modulation  
single subcarrier  
Manchester  
subcarrier frequency  
bit coding  
11.6.2 ISO/IEC
 
18092, Ecma 340 NFCIP-1 communication modes  
An NFCIP-1 communication takes place between 2 devices:  
•
NFC Initiator: generates RF field at 13.56 MHz and starts the NFCIP-1 communication.  
•
NFC
T
a
rget: responds to NFC Initiator command either in a load modulation scheme in Passive  
communication mode or using a self-generated and self-modulated RF field for Active communication mode.  
The NFCIP-1 communication differentiates between Active and Passive communication modes.  
•
Active communication mode means both the NFC Initiator and the NFC
T
a
rget are using their own RF field to  
transmit data  
•
Passive communication mode means that the NFC
T
a
rget answers to an NFC Initiator command in a load  
modulation scheme. The NFC Initiator is active in terms of generating the RF field.  
PN7160 supports the Active Initiator, Active
T
a
rget, Passive Initiator and Passive
T
a
rget communication modes  
at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s as defined in the NFCIP-1 standard.  
BATTERY  
HOST  
BATTERY  
HOST  
NFCC  
NFCC  
initiator: active  
target: passive or active  
aaa-04
1
141  
Figure 30.ꢀNFCIP-1 communication mode  
The contactless coprocessor of PN7160 and the on-chip CPU handle NFCIP-1 protocol, for all communication  
modes and data rates, for both NFC Initiator and NFC
T
a
rget.  
Nevertheless a dedicated external host has to handle the application layer communication.  
11.6.2.1 Active
 
communication mode  
Active communication mode means both the NFC Initiator and the NFC
T
a
rget are using their own RF field to  
transmit data.  
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Near Field Communication (NFC) controller  
host  
host  
NFCC  
NFC Target  
NFC Initiator  
1. NFC Initiator starts the communication at selected transfer speed  
power  
power  
to generate  
the field  
for digital  
processing  
host  
host  
NFCC  
NFC Target  
NFC Initiator  
2. NFC Target answers at the same transfer speed  
power  
power  
for digital  
processing  
to generate  
the field  
aaa-041142  
Figure 31.ꢀActive communication mode  

T

gives an overview of the Active communication modes:  
Table 25.ꢀOverview for Active communication mode  
Communication direction  
NFC Initiator to NFC Target  
NFC Target to NFC Initiator  
ISO/IEC 18092, Ecma 340, NFCIP-1  
Baud rate  
Bit length  
106 kbit/s  
212 kbit/s  
424 kbit/s  
(32/13.56) μs  
(128/13.56) μs  
(64/13.56) μs  
modulation  
bit coding  
100 % ASK  
8 % – 30 % ASK

8 % – 30 % ASK

Manchester Manchester  
Modified Miller  
modulation  
bit coding  
100 % ASK  
Miller  
8 % – 30 % ASK

8 % – 30 % ASK

Manchester Manchester  
[1] This
 
modulation index range is according to NFCIP-1 standard. It might be that some NFC Forum type 3 cards does not withstand the full range as based  
on FeliCa range which is narrow (8 % to 14 % ASK).
T
o
a
djust the index, see

.  
11.6.2.2 Passive
 
communication mode  
Passive communication mode means that the NFC
T
a
rget answers to an NFC Initiator command in a load  
modulation scheme.  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
host  
host  
NFCC  
NFC Target  
NFC lnitiator  
1. NFC Initiator starts the communication at selected transfer speed  
power  
power  
to generate  
the field  
for digital  
processing  
host  
host  
NFCC  
NFC Target  
NFC lnitiator  
2. NFC Target answers using load modulation at the same transfer speed  
power  
power  
to generate  
the field  
for digital  
processing  
aaa-041143  
Figure 32.ꢀPassive communication mode  

T

gives an overview of the Passive communication modes:  
Table 26.ꢀOverview for Passive communication mode  
Communication direction  
NFC Initiator to NFC Target  
NFC Target to NFC Initiator  
ISO/IEC 18092, Ecma 340, NFCIP-1  
Baud rate  
Bit length  
106 kbit/s  
212 kbit/s  
424 kbit/s  
(128/13.56) μs  
(64/13.56) μs  
(32/13.56) μs  
modulation  
bit coding  
100 % ASK  
8 % – 30 % ASK

8 % – 30 % ASK

Modified Miller  
Manchester  
Manchester  
modulation  
subcarrier load  
modulation  
load modulation  
load modulation  
subcarrier frequency  
bit coding  
13.56 MHz/16  
Manchester  
no subcarrier  
Manchester  
no subcarrier  
Manchester  
[1] This
 
modulation index range is according to NFCIP-1 standard. It might be that some NFC Forum type 3 cards does not withstand the full range as based  
on FeliCa range which is narrow (8 % to 14 % ASK).
T
o
a
djust the index, see Ref.

.  
11.6.2.3 NFCIP-1
 
framing and coding  
The NFCIP-1 framing and coding in Active and Passive communication modes are defined in the NFCIP-1  
standard: ISO/IEC 18092 or Ecma 340.  
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Near Field Communication (NFC) controller  
11.6.2.4 NFCIP-1
 
protocol support  
The NFCIP-1 protocol is not completely described in this document. For detailed explanation of the protocol,  
refer to the ISO/IEC 18092 or Ecma 340 NFCIP-1 standard. However the datalink layer is according to the  
following policy:  
•
Transaction includes initialization, anti-collision methods and data transfer. This sequence must not be  
interrupted by another transaction.  
•
PSL shall be used to change the speed between the target selection and the data transfer, but the speed  
should not be changed during a data transfer.  
11.6.3 Card
 
mode  
PN7160 can be addressed as an NFC Forum T4
T
,
I
SO/IEC 14443A, MIFARE, or ISO/IEC 14443B card. This  
means that PN7160 can generate an answer in a load modulation scheme according to the ISO/IEC 14443A,  
and ISO/IEC 14443B interface description.  
Remark:
PN7160 does not support a complete card protocol. This has to be handled by the host controller.  

T

,

describe the physical parameters.  
11.6.3.1 NFC
 
Forum T4
T
,
I
SO/IEC 14443A  
Table 27.ꢀOverview for NFC Forum T4
T
,
I
SO/IEC 14443A card mode  
Communication  
direction  
ISO/IEC 14443A  
106 kbit/s  
ISO/IEC 14443A higher transfer speeds  
Transfer speed  
Bit length  
212 kbit/s  
424 kbit/s  
(128/13.56) μs  
(64/13.56) μs  
(32/13.56) μs  
PCD →
PN7160  
(data received by PN7160
 
modulation on PCD
 
100 % ASK  
> 25 % ASK  
> 25 % ASK  
from a card)  
side  
bit coding  
Modified Miller  
Modified Miller  
Modified Miller  
PN7160
→
PCD  
(data sent by PN7160 to a
 
modulation on  
subcarrier load modulation
 
subcarrier load  
modulation  
subcarrier load  
modulation  
card)  
PN7160 side  
subcarrier  
frequency  
13.56 MHz/16  
13.56 MHz/16  
13.56 MHz/16  
bit coding  
Manchester  
BPSK  
BPSK  
11.6.3.2 NFC
 
Forum T4
T
,
I
SO/IEC 14443B card mode  
Table 28.ꢀOverview for NFC Forum T4
T
,
I
SO/IEC 14443B card mode  
Communication  
direction  
ISO/IEC 14443B  
106 kbit/s  
ISO/IEC 14443B higher transfer speeds  
Transfer speed  
Bit length  
212 kbit/s  
424 kbit/s  
(128/13.56) μs  
(64/13.56) μs  
(32/13.56) μs  
PCD →
PN7160  
(data received by PN7160
 
modulation on PCD
 
8 % – 14 % ASK  
8 % – 14 % ASK  
NRZ  
8 % – 14 % ASK  
NRZ  
from a Reader)  
side  
bit coding  
NRZ  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 28.ꢀOverview for NFC Forum T4
T
,
I
SO/IEC 14443B card mode
…continued  
Communication  
direction  
ISO/IEC 14443B  
106 kbit/s  
ISO/IEC 14443B higher transfer speeds  
Transfer speed  
Bit length  
212 kbit/s  
424 kbit/s  
(128/13.56) μs  
(64/13.56) μs  
(32/13.56) μs  
PN7160
→
PCD  
(data sent by PN7160 to a
 
modulation on  
subcarrier load  
modulation  
subcarrier load  
modulation  
subcarrier load  
modulation  
Reader)  
PN7160 side  
subcarrier  
frequency  
13.56 MHz/16  
13.56 MHz/16  
13.56 MHz/16  
bit coding  
BPSK  
BPSK  
BPSK  
11.6.4 Frequency
 
interoperability  
When in communication, PN7160 is generating some RF frequencies. PN7160 is also sensitive to some RF  
signals as it is looking from data in the field.  
In order to avoid interference with others RF communication, it is required to tune the antenna and design the  
board according to Ref.

.  
Although ISO/IEC 14443 and ISO/IEC 18092/Ecma 340 allows an RF frequency of 13.56 MHz ± 7 kHz, FCC  
regulation does not allow this wide spread and limits the dispersion to ± 100 ppm, which is in line with PN7160  
capability, see

and

.  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
12 Limiting
 
values  
Table 29.ꢀLimiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
V

DD(PAD)  

V

DD(UP)  

V

BAT  

Parameter  
Conditions  
Min  
Max  
4.2  
7
Unit  
V
V

DD(PAD)

supply voltage  
V

DD(UP)

supply voltage  
battery supply voltage  
electrostatic discharge voltage  
supply voltage for host interface  
supply voltage for host interface  
–
–
–
–
V
6
V
V

ESD  

HBM; 1500 Ω, 100 pF; EIA/  
JESD22-A114-D  
2
kV  
CDM; field induced model; EIA/  
JESC22-C101-C  
–
1
kV  
T

stg  

storage temperature  
total power dissipation  
RXN input voltage  
RXP input voltage  
-40  
–
+150  
620  
2.5  
°C  
mW  
V
P

tot  

all modes  
V

RXN(i)  

V

RXP(i)  

0
0
2.5  
V
[1] The
 
design of the solution shall be done so that for the different use cases targeted the power to be dissipated from the field or generated by PN7160  
does not exceed this value.  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
13 Recommended
 
operating conditions  
Table 30.ꢀOperating conditions  
Symbol  
T

amb  

Parameter  
Conditions  
Min  
-30  
2.5  
Typ  
Max  
+85  
5.5  
Unit  
°C  
ambient operating temperature
 
JEDEC PCB-0.5  
–
–
V

BAT  

battery supply voltage  
Card Emulation and Passive  
T
a
rget; V

SS

= 0 V  
V
Reader, Active Initiator and  
Active
T
a
rget; V

SS

= 0 V  
2.8  
2.8  
2.5  
–
–
–
5.5  
5.8  
5.8  
V
V
V
V

DD(UP)  

V

DD(UP)

input supply voltage  
Reader, Active Initiator and  
Active
T
a
rget; V

SS

= 0 V  
All other cases except HPD  
state; V

SS

= 0 V  
V

DD(PAD)  

V

DD(PAD)

supply voltage  
total power dissipation  
supply voltage for host  
interface; V

SS

= 0 V  
1.65  
3.0  
–
1.8  
3.3  
–
1.95  
3.6  
V
V
P

tot  

PCD mode at typical V

DD(TX)  

= 5.25
V
,
V

DD(UP)

= 5.8 V and  
V

BAT

= 3.6 V; includes power  
from V

BAT

and V

DD(UP)  

620  
mW  
I

BAT  

battery supply current  
in Hard Power Down state;  
V

BAT

= 3.6 V; T = 25 °C  
–
10.5  
16  
μA  
in Standby state; V

BAT

= 3.6 V  
enhanced RF detector  
–
–
–
31  
52  
36  
–
μA  
μA  
μA  
low sensitivity RF detector  
21  
in low-power polling loop; V

BAT  

= 3.6 V; T = 25 °C; loop time =  
500 ms  
100  
continuous total current  
consumption in PCD mode at  
V

BAT

= 3.6 V  
–
–
290  
330  
mA  
mA  
I

th(Ilim)  

current limit threshold  
current limiter on transmitter  
270  
300  
[1] V

SS

represents V

SS(PAD)

and V

SS(TX)  

.
[2] When
 
V

DD(UP)

is below 2.8 V the TXLDO can be in follower mode (see

), there will be no more V

DD(UP)

noise rejection. Any noise below 848  
kbit/s will affect the performance.  
[3] External
 
clock on NFC_CLK_XTAL1 must be LOW.  
[4] This
 
is considering an antenna tuned to sink maximum 250 mA continuous current from the transmitter. The antenna shall be tuned to never exceed this  
250 mA maximum current.  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
14 Thermal
 
characteristics  
Table 31.ꢀThermal characteristics VFBGA64 package  
Symbol  
Parameter  
Conditions  
Typ  
Unit  
R

th(j-a)  

thermal resistance from junction to  
ambient  
in free air with exposed pad soldered on a
 
52.0  
4 layer JEDEC PCB  
K/W  
R

th(j-c)  

thermal resistance from junction to case  
–
10.0  
K/W  
Table 32.ꢀThermal characteristics HVQFN40 package  
Symbol  
Parameter  
Conditions  
Typ  
Unit  
R

th(j-a)  

thermal resistance from junction to  
ambient  
in free air with exposed pad soldered on a
 
28.0  
4 layer JEDEC PCB  
K/W  
R

th(j-c)  

thermal resistance from junction to case  
–
13.2  
K/W  
Table 33.ꢀJunction Temperature  
Symbol  
Parameter  
Conditions  
Max  
Unit  
T

j_max  

maximum junction temperature  
–
125  
°C  
Table 34.ꢀThermal Shutdown Temperature  
Symbol  
Parameter  
Conditions  
Typ  
Unit  
T

shutdown  

shutdown of chip due to high temperature
 
–  
detected by temp sensor  
125  
°C  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
15 Characteristics  
15.1 Current
 
consumption characteristics  
Table 35.ꢀCurrent consumption characteristics for operating ambient temperature range  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
I

BAT  

battery supply current  
in Hard Power Down state; V

BAT  

= 3.6 V; VEN voltage = 0 V  
–
10  
24  
μA  
in Standby state; V

BAT

= 3.6 V;  
–
–
20  
35  
–
μA  
in Idle and
T
a
rget Active power  
states; V

BAT

= 3.6 V  
4.55  
mA  
in Initiator Active power state;  
V

BAT

= 3.6 V; RF on  
–
240  
–
mA  
[1] Refer
 
to

for the description of the power modes.  
[2] For
 
transmitter current tuned at 210 mA unloaded.  
15.2 Functional
 
block electrical characteristics  
15.2.1 Reset
 
via VEN  
Table 36.ꢀReset timing  
Symbol  
t

WL(VEN)  

t

boot  

Parameter  
Conditions  
Min  
Typ  
Max  
–
Unit  
μs  
pulse width VEN LOW  
boot time  
to reset  
10  
–
–
–
2.5  
ms  
15.2.2 Power-up
 
timings  
Table 37.ꢀPower-up timings  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
t

t(VBAT-VEN)  

transition time from pin V

BAT

to pin
 
V

BAT

, VEN voltages =  
VEN HIGH  
0
–
–
ms  
t

t(VDDPAD-VEN)  

t

t(VBAT-VDDPAD)  

transition time from pin V

DD(PAD)

to V

DD(PAD)

, VEN  
pin VEN
 
voltages = HIGH  
0
0
–
–
–
–
ms  
ms  
transition time from pin V

BAT

to pin
 
V

BAT

, V

DD(PAD)  

=
V

DD(PAD)  

HIGH  
15.2.3 Power-down
 
timings  
Table 38.ꢀPower-down timings  
Symbol  
t

WL(VBAT)  

t

d  

Parameter  
Conditions  
Min  
20  
0
Typ  
Max  
Unit  
ms  
pulse width V

BAT

LOW  
delay time  
–
–
–
–
ms  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
15.2.4 Download
 
mode timings  
Table 39.ꢀDownload mode timings  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
t

t(DWL_REQ-VEN)  

transition time from pin  
DWL_REQ to pin VEN  
DWL_REQ, VEN  
voltages = HIGH  
0
0.5  
–
ms  
15.2.5 I

2

C-bus timings  
Here below are timings and frequency specifications.  
t
t
t
f(HIF3)  
r(HIF3)  
HD;DAT  
HIF3 (SDA)  
t
t
HD;STA  
t
SU;STA  
HIGH  
t
SU;DAT  
t
LOW  
HIF4 (SCL)  
aaa-014046  
Figure 33.ꢀI

2

C-bus timings  
Table 40.ꢀHigh-speed mode I

2

C-bus timings specification  
Symbol  
f

clk(HIF4)  

t

SU;STA  

Parameter  
Conditions  
I

2

C-bus SCL; C

b

< 100 pF  
Min  
0
Max  
3.4  
–
Unit  
MHz  
ns  
clock frequency on pin HIF4  
set-up time for a repeated START  
condition  
C

b

< 100 pF  
160  
t

HD;STA  

t

LOW  

hold time (repeated) START condition
 
C

b

< 100 pF  
160  
160  
60  
10  
0
–
ns  
ns  
ns  
ns  
ns  
ns  
ns  
V
LOW period of the SCL clock  
HIGH period of the SCL clock  
data set-up time  
C

b

< 100 pF  
–
t

HIGH  

C

b

< 100 pF  
–
t

SU;DAT  

t

HD;DAT  

t

r(HIF3)  

t

f(HIF3)  

V

hys  

C

b

< 100 pF  
–
data hold time  
C

b

< 100 pF  
–
rise time on pin HIF3  
fall time on pin HIF3  
hysteresis voltage  
I

2

C-bus SDA; C

b

< 100 pF  
I

2

C-bus SDA; C

b

< 100 pF  
10  
10  
80  
80  
–
Schmitt trigger inputs; C

b

<  
100 pF  
0.1V

DD(PAD)  

Table 41.ꢀFast mode I

2

C-bus timings specification  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
f

clk(HIF4)  

clock frequency on pin HIF4  
I

2

C-bus SCL; C

b

< 400 pF  
0
400  
kHz  
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Near Field Communication (NFC) controller  
Table 41.ꢀFast mode I

2

C-bus timings specification
…continued  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
t

SU;STA  

set-up time for a repeated START  
condition  
C

b

< 400 pF  
600  
–
ns  
t

HD;STA  

t

LOW  

hold time (repeated) START condition
 
C

b

< 400 pF  
600  
–
ns  
μs  
ns  
ns  
ns  
V
LOW period of the SCL clock  
HIGH period of the SCL clock  
data set-up time  
C

b

< 400 pF  
C

b

< 400 pF  
C

b

< 400 pF  
C

b

< 400 pF  
1.3  
–
t

HIGH  

600  
–
t

SU;DAT  

t

HD;DAT  

V

hys  

100  
–
data hold time  
0
900  
–
hysteresis voltage  
Schmitt trigger inputs; C

b

<  
400 pF  
0.1V

DD(PAD)  

15.2.6 SPI-bus
 
timings  
HIF4 (SCK)  
T
clk(HIF4)  
t
t
h(HIF2)  
su(HIF2)  
HIF2 (MOSI)  
MSB  
t
h(HIF3)  
HIF3 (MISO)  
HIF1 (NSS)  
MSB  
t
t
h(HIF1)  
su(HIF1)  
aaa-014175  
Figure 34.ꢀSPI-bus timing diagram  
Table 42.ꢀSPI-bus timings specification  
Symbol  
T

clk(HIF4)  

t

su(HIF2)  

t

h(HIF2)  

Parameter  
Conditions  
SPI SCK  
Min  
142  
35  
Max  
Unit  
ns  
clock period on pin HIF4  
HIF2 set-up time  
HIF2 hold time  
HIF3 hold time  
HIF1 hold time  
HIF1 set-up time  
–
SPI MOSI  
SPI MOSI  
SPI MISO  
SPI NSS  
–
ns  
35  
–
ns  
t

h(HIF3)  

–
37  
–
ns  
t

h(HIF1)  

37  
ns  
t

su(HIF1)  

SPI NSS  
142  
–
ns  
[1] Controlled
 
by host.  
[2] Controlled
 
by PN7160.  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
15.2.7 Active
 
load modulation phase  
Table 43.ꢀActive load modulation phase error  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
E

φ  

phase error  
ALM phase error from RXP input to clock  
recovery output 50 mV < V

RX

< 500 mV  
– 5  
–
+ 5  
°
15.3 Pin
 
characteristics  
15.3.1 NFC_CLK_XTAL1
 
and XTAL2 pins characteristics  
Table 44.ꢀInput clock characteristics on NFC_CLK_XTAL1 when using PLL  
Symbol  
V

i(p-p)  

δ
Parameter  
Conditions  
Min  
0.2  
35  
Typ  
Max  
Unit  
peak-to-peak input voltage  
duty cycle  
–
–
1.8  
65  
V
%
Table 45.ꢀPin characteristics for NFC_CLK_XTAL1 when PLL input  
Symbol  
Parameter  
Conditions  
V

I

= V

DDD  

V

I

= 0 V  
Min  
Typ  
Max  
+1  
+1  
V

DDD  

–
Unit  
μA  
μA  
V
I

IH  

HIGH-level input current  
LOW-level input current  
input voltage  
-1  
-1  
–
–
I

IL  

–
V

i  

–
V

i(clk)(p-p)  

C

i  

peak-to-peak clock input voltage  
input capacitance  
200  
–
–
mV  
pF  
all power modes  
2
–
Table 46.ꢀPin characteristics for 27.12 MHz crystal oscillator  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
C

i(NFC_CLK_XTAL1)  

NFC_CLK_XTAL1 input  
capacitance  
V

DDD

= 1.8 V  
–
2
–
pF  
C

i(XTAL2)  

XTAL2 input capacitance  
–
2
–
pF  
Table 47.ꢀPLL accuracy  
Symbol  
Parameter  
output frequency accuracy  
Conditions  
Min Typ  
-30  
Max  
Unit  
f

o(acc)  

deviation added to NFC_CLK_XTAL1  
frequency on RF frequency generated;  
worst case whatever input frequency  
–
+30  
ppm  
15.3.2 VEN
 
input pin characteristics  
Table 48.ꢀVEN input pin characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V

IH  

HIGH-level input voltage  
1.1  
–
V

BAT  

V
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 48.ꢀVEN input pin characteristics
…continued  
Symbol  
Parameter  
Conditions  
Min  
0
Typ  
Max  
0.4  
+1  
+1  
–
Unit  
V
V

IL  

I

IH  

I

IL  

LOW-level input voltage  
HIGH-level input current  
LOW-level input current  
input capacitance  
–
VEN voltage = V

BAT  

VEN voltage = 0 V  
-1  
-1  
–
–
μA  
μA  
pF  
–
C

i  

5
15.3.3 Output
 
pin characteristics for IRQ, CLK_REQ  
V
DDD  
or  
80 %  
80 %  
V
DD(PAD)  
20 %
 
20 %  
V
SS  
t
t
r
aaa-041297  
f
Figure 35.ꢀOutput timing measurement condition  
Table 49.ꢀOutput pin characteristics for IRQ, CLK_REQ  
Symbol  
V

OH  

V

OL  

C

L  

Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V
HIGH-level output voltage
 
I

OH

< 3 mA  
LOW-level output voltage
 
I

OL

< 3 mA  
load capacitance  
V

DD(PAD)

– 0.4  
–
–
–
–
–
–
–
V

DD(PAD)  

0.4  
0
V
–
20  
pF  
ns  
t

f  

fall time  
C

L

= 12 pF max  
2
10  
t

r  

rise time  
C

L

= 12 pF max  
2
10  
ns  
R

pd  

pull-down resistance  
for IRQ and CLK_REQ  
for IRQ and CLK_REQ  
0.35  
55  
0.85  
120  
MΩ  
kΩ  
[1] See
 

.  
[2] Pull-down
 
resistance is activated in HPD state.  
[3] Pull-down
 
resistance can be activated by firmware in Standby state.  
[4] Pull-down
 
resistance can be activated by firmware in Active state.  
15.3.4 Output
 
pin characteristics for TX_PWR_REQ  
Table 50.ꢀOutput pin characteristics for TX_PWR_REQ  
Symbol  
V

OH  

V

OL  

C

L  

Parameter  
Conditions  
Min  
Typ  
Max  
V

DDD  

0.4  
Unit  
V
HIGH-level output voltage
 
I

OH

< 3 mA  
LOW-level output voltage
 
I

OL

< 3 mA  
load capacitance  
V

DDD

– 0.4  
–
–
–
–
–
–
–
0
V
–
20  
pF  
ns  
ns  
kΩ  
kΩ  
t

f  

fall time  
C

L

= 12 pF max  
C

L

= 12 pF max  
2
10  
t

r  

rise time  
2
10  
R

pd  

R

pu  

pull-down resistance  
pull-up resistance  
55  
55  
120  
120  
[1] TX_PWR_REQ
 
active driving is only possible when V

DD(PAD)

is present. When V

DD(PAD)

is not present, only pull-up or pull-down resistors can be enabled.  
[2] See
 

.  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
[3] Unless
 
disable by firmware, pull-down resistance is always activated.  
[4] Can
 
be enabled by firmware.  
15.3.5 Output
 
pin characteristics for DCDC_EN  
Table 51.ꢀOutput pin characteristics for DCDC_EN  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V

OH  

HIGH-level output voltage  
I

OH

< 3 mA  
V

DD(PAD)  

– 0.4  
–
V

DD(PAD)  

V
V

OL  

C

L  

LOW-level output voltage  
load capacitance  
I

OL

< 3 mA  
0
–
–
–
0.4  
20  
V
pF  
[1] DCDC_EN
 
active driving is only possible when V

DD(PAD)

is present. When V

DD(PAD)

is not present, only pull-up or pull-down resistors can be enabled.  
15.3.6 Input
 
pin characteristics for DWL_REQ, WKUP_REQ  
Table 52.ꢀInput pin characteristics for DWL_REQ, WKUP_REQ  
Symbol  
Parameter  
Conditions  
Min  
Typ Max  
Unit  
V

IH  

HIGH-level input voltage  
typical 1.8 V interface  
supply voltage  
0.65V

DD(PAD)  

–
–
V
typical 3.3 V interface  
supply voltage  
2.0  
–
V
V
V

IL  

LOW-level input voltage  
typical 1.8 V interface  
supply voltage  
–
0.35V

DD(PAD)  

0.8  
typical 3.3 V interface  
supply voltage  
I

IH  

I

IL  

HIGH-level input current  
LOW-level input current  
input capacitance  
-1  
-1  
–
–
+1  
+1  
–
μA  
μA  
pF  
–
C

i  

5
R

pd  

pull-down resistance  
pull-down  
DWL_REQ pin  
WKUP_REQ pin  
0.35  
55  
–
–
0.85  
120  
MΩ  
kΩ  
[1] Activated
 
in HPD state.  
15.3.7 Input
 
pin characteristics for RXN and RXP  
Table 53.ꢀInput pin characteristics for RXN and RXP  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V

RXN(i)  

RXN input voltage  
0
–
V

DDA  

0.05  
–
–
V
V

RXP(i)  

RXP input voltage  
0
–
V

DDA  

0.05  
V
C

i(RXN)  

RXN input capacitance  
RXP input capacitance  
–
6
6
–
–
pF  
pF  
kΩ  
C

i(RXP)  

–
–
Z

i(RXN-VDDMID)  

input impedance between RXN  
and V

DD(MID)  

Reader, card and P2P  
modes  
0
15  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 53.ꢀInput pin characteristics for RXN and RXP
…continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Z

i(RXP-VDDMID)  

input impedance between RXP  
and V

DD(MID)  

Reader, card and P2P  
modes  
0
–
15  
kΩ  
V

i(dyn)(RXN)  

RXN minimum dynamic input  
voltage  
Miller coded  
106 kbit/s  
–
–
–
–
20  
20  
mV(p-p)  
mV(p-p)  
212 kbit/s to 424 kbit/  
s
V

i(dyn)(RXP)  

RXP minimum dynamic input  
voltage  
Miller coded  
106 kbit/s  
–
–
–
–
20  
20  
mV(p-p)  
mV(p-p)  
212 kbit/s to 424 kbit/  
s
V

i(dyn)(RXN)  

RXN minimum dynamic input  
voltage  
Manchester, NRZ or  
BPSK coded; 106 kbit/s  
to 848 kbit/s  
–
–
–
–
20  
20  
mV(p-p)  
mV(p-p)  
V

i(dyn)(RXP)  

RXP minimum dynamic input  
voltage  
Manchester, NRZ or  
BPSK coded; 106 kbit/s  
to 848 kbit/s  
V

i(dyn)(RXN)  

V

i(dyn)(RXP)  

V

i(RF)  

RXN maximum dynamic input  
voltage  
All data coding; 106 kbit/  
s to 848 kbit/s  
–
–
V

DDA  

0.05  
–
–
V(p-p)  
V(p-p)  
mV(p-p)  
RXP maximum dynamic input  
voltage  
All data coding; 106 kbit/  
s to 848 kbit/s  
–
–
V

DDA  

0.05  
RF input voltage for RF level  
detector  
RF input voltage  
detected for 9 mV  
threshold  
5.5  
9
15  
RF input voltage for NFC level  
detector  
RF input voltage  
detected for 15 mV  
threshold  
8
15  
23  
mV(p-p)  
15.3.8 ANT1
 
and ANT2 pin characteristics  
Table 54.ꢀElectrical characteristics of ANT1 and ANT2  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
R

I  

input resistance  
switches closed; for  
pins ANTX  
–
10  
17  
Ω
I

I  

input current  
for pins ANTX  
-50  
–
+50  
mA  
[1] With
 
X = 1 or 2.  
15.3.9 V

DD(HF)

and V

DDD

pins characteristics  
Table 55.ꢀElectrical characteristics of V

DD(HF)

and V

DDD  

Symbol  
V

DD(HF)  

V

DDD  

Parameter  
Conditions  
I

ANTX

= 5 mA  
V

SS

= 0 V  
Min  
–
Typ  
2.7  
1.8  
Max  
–
Unit  
V
V

DD(HF)

supply voltage  
V

DDD

supply voltage 1.8 V  
1.7  
1.95  
V
[1] With
 
X = 1 or 2.  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
15.3.10 Output
 
pin characteristics for TX1 and TX2  
Table 56.ꢀOutput pin characteristics for TX1 and TX2  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V

OH  

HIGH-level output  
voltage  
V

DD(TX)

= 3.3 V and I

OH

= 30  
mA; PMOS driver fully on  
V

DD(TX)

– 150  
–
–
mV  
V

OL  

LOW-level output  
voltage  
V

DD(TX)

= 3.3 V and I

OL

= 30  
mA; NMOS driver fully on  
–
–
200  
mV  
Table 57.ꢀOutput resistance for TX1 and TX2  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
R

OL  

LOW-level output resistance
 
V

DD(TX)

– 100 mV; CWGsN =  
01h  
–
–
80  
Ω
V

DD(TX)

– 100 mV; CWGsN =  
0Fh  
–
0.9  
0.9  
–
Ω
Ω
R

OH  

HIGH-level output resistance
 
V

DD(TX)

= 5 V; V

(TXn)

= V

DD(TX)  

100 mV  
–
0.65  
1.4  
[1] With
 
n = 1 or 2.  
15.3.11 Input
 
pin characteristics for HIF1 (used as SPI-bus NSS, used as I

2

C-bus address 0),  
HIF2 (used as SPI-bus MOSI, used as I

2

C-bus address 1), HIF4 (used as SPI-bus SCK)  
Table 58.ꢀInput pin characteristics for HIF1 (used as SPI-bus NSS, used as I

2

C-bus address 0), HIF2 (used as SPI-  
bus MOSI, used as I

2

C-bus address 1), HIF4 (used as SPI-bus SCK)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V

IH  

HIGH-level input  
voltage  
0.65V

DD(PAD)  

–
V

DD(PAD)  

V
V

IL  

I

IH  

LOW-level input voltage  
0
–
–
0.35V

DD(PAD)  

+1  
V
HIGH-level input  
current  
V

I

= V

DD(PAD)  

-1  
μA  
I

IL  

LOW-level input current
 
V

I

= 0 V  
input capacitance  
-1  
–
–
+1  
–
μA  
pF  
kΩ  
C

i  

5
–
R

pu  

pull-up resistance  
HIF1 used as I

2

C-bus  
55  
120  
address 0; HIF2 used as  
I

2

C-bus address 1  
[1] Unless
 
disable by firmware, extra pull-up resistance is always activated.  
15.3.12 Pin
 
characteristics for HIF3 (used as I

2

C-bus SDA) and HIF4 (used as I

2

C-bus SCL)  
Table 59.ꢀPin characteristics for HIF3 (used as I

2

C-bus SDA) and HIF4 (used as I

2

C-bus SCL)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
V

OL  

LOW-level output  
voltage  
I

OL

< 3 mA  
0
–
0.4  
V
C

L  

load capacitance  
–
–
10  
pF  
PN7160_PN7161  
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Product data sheet  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 59.ꢀPin characteristics for HIF3 (used as I

2

C-bus SDA) and HIF4 (used as I

2

C-bus SCL)
…continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
t

f  

fall time  
C

L

= 100 pF; Rpull-up = 2 kΩ;  
Standard and Fast mode  
30  
–
250  
ns  
C

L

= 100 pF; Rpull-up = 1 kΩ;  
High-speed mode  
80  
30  
10  
–
–
–
110  
250  
100  
ns  
ns  
ns  
t

r  

rise time  
C

L

= 100 pF; Rpull-up = 2 kΩ;  
Standard and Fast mode  
C

L

= 100 pF;  
Rpull-up = 1 kΩ;  
High-speed mode  
V

IH  

V

IL  

I

IH  

HIGH-level input  
voltage  
0.7V

DD(PAD)  

–
–
–
–
V

DD(PAD)  

0.3V

DD(PAD)  

+1  
V
LOW-level input  
voltage  
0
V
HIGH-level input  
current  
V

I

= V

DD(PAD)

; high impedance  
-1  
-1  
μA  
μA  
I

IL  

LOW-level input  
current  
V

I

= 0 V;  
+1  
high impedance  
C

i  

input capacitance  
–
5
–
pF  
[1] Only
 
for pin HIF3 (I

2

C-bus SDA), HIF4 (I

2

C-bus SCL) is only used as input.  
15.3.13 Pin
 
characteristics for HIF3 (used as SPI-bus MISO)  
Table 60.ꢀPin characteristics for HIF3 (used as SPI-bus MISO)  
Symbol  
V

OH  

V

OL  

C

L  

Parameter  
Conditions  
I

OH

< 4 mA  
I

OL

< 4 mA  
Min  
Typ  
Max  
V

DD(PAD)  

0.4  
Unit  
V
HIGH-level output voltage  
LOW-level output voltage  
load capacitance  
fall time  
V

DD(PAD)

– 0.4  
–
–
–
0
–
V
20  
pF  
t

f  

C

L

= 12 pF max  
high speed  
1
3
–
–
3
ns  
ns  
slow speed  
10  
t

r  

rise time  
C

L

= 12 pF max  
high speed  
1
3
–
–
3
ns  
ns  
slow speed  
10  
PN7160_PN7161  
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Near Field Communication (NFC) controller  
16 Package
 
outline VFBGA64  
VFBGA64: plastic very thin fine-pitch ball grid array package; 64 balls  
SOT1860-1  
B
A
D
ball A1  
index area  
A
2
E
A
A
1
detail X  
e
1
1/2 e  
C
B
A
Ø v  
Ø w  
C
C
y
y
e
C
b
1
e
H
G
F
E
D
C
B
A
e
2
1/2 e  
ball A1  
index area  
1
2
3
4
5
6
7
8
X
0
5 mm  
scale  
Dimensions (mm are the original dimensions)  
Unit  
A
A
A
2
b
D
E
e
e
e
2
v
w
y
y
1
1
1
max 0.90
 
0.25 0.65
 
0.30  
nom  
4.1  
4.0  
3.9  
4.1  
4.0  
3.9  
mm  
0.80 0.20 0.60
 
0.25  
min 0.70 0.15 0.55
 
0.20  
0.4  
2.8  
2.8 0.15
 
0.05 0.08  
0.1  
sot1860-1_po  
Issue date  
References  
Outline  
version  
European  
projection  
IEC  
JEDEC  
– – –  
JEITA  
16-02-05  
16-03-31  
sot1860-1  
Figure 36.ꢀPackage outline  
PN7160_PN7161  
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Near Field Communication (NFC) controller  
17 Package
 
outline HVQFN40  
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;  
40 terminals; body 6 x 6 x 0.85 mm  
SOT618-1  
B
A
D
terminal 1  
index area  
A
A
1
E
c
detail X  
e
1
C
v
C
C
A B  
e
b
1/2 e  
y
y
C
1
w
11  
20  
L
21  
10  
e
E
e
2
h
1/2 e  
1
30  
terminal 1  
index area  
40  
31  
X
D
h
0
2.5  
5 mm  
v
scale  
Dimensions (mm are the original dimensions)  
(1) (1)  
(1)  
E
Unit  
A
A
b
c
D
D
E
e
e
e
L
w
y
y
1
1
h
h
1
2
max 1.00 0.05 0.30
 
0.2 6.1
 
4.25 6.1 4.25 0.5
 
4.5 4.5 0.5 0.1
 
0.05 0.05
 
0.1  
mm nom 0.85 0.02 0.21  
min 0.80 0.00 0.18  
6.0 4.10 6.0 4.10  
5.9 3.95 5.9 3.95  
0.4  
0.3  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
sot618-1_po  
Issue date  
References  
Outline  
version  
European  
projection  
IEC  
JEDEC  
JEITA  
02-10-22  
13-11-05  
SOT618-1  
MO-220  
Figure 37.ꢀPackage outline, HVQFN40, SOT618-1, MSL3  
PN7160_PN7161  
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Near Field Communication (NFC) controller  
18 Soldering
 
of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can  
be found in Application Note
AN10365 “Surface mount reflow soldering description”
.  
18.1 Introduction
 
to soldering  
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards  
(PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection.  
There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when  
through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with  
increased miniaturization.  
18.2 Wave
 
and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of  
liquid solder. The wave soldering process is suitable for the following:  
•
Through-hole components  
•
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have  
solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch  
smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by component placement and  
exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all  
reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
•
Board specifications, including the board finish, solder masks and vias  
•
Package footprints, including solder thieves and orientation  
•
The moisture sensitivity level of the packages  
•
Package placement  
•
Inspection and repair  
•
Lead-free soldering versus SnPb soldering  
18.3 Wave
 
soldering  
Key characteristics in wave soldering are:  
•
Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave  
parameters, and the time during which components are exposed to the wave  
•
Solder bath specifications, including temperature and impurities  
18.4 Reflow
 
soldering  
Key characteristics in reflow soldering are:  
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak  
temperatures (see

) than a SnPb process, thus reducing the process window  
•
Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large  
and small components on one board  
PN7160_PN7161  
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Near Field Communication (NFC) controller  
•
Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak  
temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to  
make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low  
enough that the packages and/or boards are not damaged. The peak temperature of the package depends on  
package thickness and volume and is classified in accordance with

and

Table 61.ꢀSnPb eutectic process (from J-STD-020C)  
Package thickness (mm)  
Package reflow temperature (°C)  
Volume (mm

3

)  
< 350  
235  
≥ 350  
220  
< 2.5  
≥ 2.5  
220  
220  
Table 62.ꢀLead-free process (from J-STD-020C)  
Package thickness (mm)  
Package reflow temperature (°C)  
Volume (mm

3

)  
< 350  
260  
350 to 2ꢁ000  
260  
> 2ꢁ000  
260  
< 1.6  
1.6 to 2.5  
> 2.5  
260  
250  
245  
250  
245  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.  
Studies have shown that small packages reach higher temperatures during reflow soldering, see

.  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Figure 38.ꢀTemperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note
AN10365 “Surface mount reflow  
soldering description”
.  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
19 Abbreviations  
Table 63.ꢀAbbreviations  
Acronym  
Description  
Amplitude Shift keying  
ASK  
ASK modulation index
 
The ASK modulation index is defined as the voltage ratio (Vmax – Vmin)/ (Vmax + Vmin) × 100%  
Automatic device  
discovery  
Detect and recognize any NFC peer devices (NFC Initiator or NFC
T
a
rget) like: NFC Initiator or  
NFC
T
a
rget, ISO/IEC 14443-3, -4 Type A&B PICC, MIFARE Classic and MIFARE Ultralight PICC,  
ISO/IEC 15693 VICC  
BPSK  
Bit Phase Shift Keying  
Card Emulation  
The IC is capable of handling a PICC emulation on the RF interface including part of the protocol  
management. The application handling is done by the host controller  
DEP  
Data Exchange Protocol  
DSLDO  
FW  
Dual Supplied LDO  
FirmWare  
HPD  
Hard Power Down  
LDO  
Low Drop Out  
LFO  
Low Frequency Oscillator  
MISO  
MOSFET  
MOSI  
MSL  
Controller In
T
a
rget Out (for SPI-bus interface)  
Metal Oxide Semiconductor Field Effect Transistor  
Controller Out
T
a
rget In (for SPI-bus interface)  
Moisture Sensitivity Level  
NCI  
NFC Controller Interface  
NFC  
Near Field Communication  
NFCC  
NFC Initiator  
NFCIP  
NFC
T
a
rget  
NRZ  
NFC Controller, PN7160 in this data sheet  
Initiator as defined in ISO/IEC 18092 or Ecma 340: NFCIP-1 communication  
NFC Interface and Protocol  
T
a
rget as defined in ISO/IEC 18092 or Ecma 340: NFCIP-1 communication  
Non Return to Zero  
NSS  
Not
T
a
rget Select (for SPI-bus interface)  
Peer to Peer  
P2P  
PCD  
Proximity Coupling Device. Definition for a Card reader/writer device according to the ISO/IEC  
14443 specification or MIFARE  
PCD -> PICC  
PICC  
Communication flow between a PCD and a PICC according to the ISO/IEC 14443 specification or  
MIFARE  
Proximity Interface Coupling Card. Definition for a contactless Smart Card according to the ISO/  
IEC 14443 specification or MIFARE  
PICC-> PCD  
Communication flow between a PICC and a PCD according to the ISO/IEC 14443 specification or  
MIFARE  
PMOS  
PMU  
P-channel MOSFET  
Power Management Unit  
PN7160_PN7161  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Table 63.ꢀAbbreviations
…continued  
Acronym  
PSL  
Description  
Parameter SeLection  
Serial Clock (for SPI interface)  
Serial Peripheral Interface bus  
Transmitter LDO  
SCK  
SPI-bus  
TXLDO  
UM  
User Manual  
VCD  
Vicinity Coupling Device. Definition for a reader/writer device according to the ISO/IEC 15693  
specification  
VCO  
VICC  
WUC  
Voltage Controlled Oscillator  
Vicinity Integrated Circuit Card  
Wake-up Counter  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
20 References  
[1] NFC
 
Forum Device Requirements V2.0  
[2] NFC
 
Controller Interface (NCI)
T
e
chnical Specification V2.0  
[3] ISO/IEC
 
14443 parts 2: 2001 COR 1 2007 (01/11/2007), part 3: 2001 COR 1 2006 (01/09/2006) and part  
4: 2nd edition 2008 (15/07/2008)  
[4] I

2

C Specification, UM10204 rev4 (13/02/2012)  
[5] SPI
 
Motorola de-facto standard described in Motorola 68HC11 data sheet  
[6] UM11577
 
PN7161 NFC controller user manual  
[7] AN12988
 
PN7160 hardware design guide  
[8] AN13219
 
PN7160 antenna design and matching guide  
[9] ISO/IEC
 
18092 (NFCIP-1)
 
edition, 15/03/2013. This is similar to Ecma 340.  
[10] ISO/IEC15693
 
part 2: 2nd edition (15/12/2006), part 3: 1st edition (01/04/2001)  
[11] ISO/IEC
 
21481 (NFCIP-2)
 
edition, 01/07/2012. This is similar to Ecma 352.  
[12] ETSI
 
HCI TS 102 622; UICC – Contactless Front-end (CLF) Interface; Host Controller Interface (HCI)  
(Release 12)  
[13] Apple
 
Enhanced Contactless Polling Specification: Version 1.1.  
PN7160_PN7161  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
21 Revision
 
history  
Table 64.ꢀRevision history  
Document ID  
Release date
 
Data sheet status  
20230308 Product
 
data sheet  
•
FeliCa card mode removed  
Supersedes  
PN7160_PN7161 v.3.9  
Modifications:  
PN7160_PN7161 v.3.8  
•
Updated the terms “Master/Slave” to “Controller/
T
a
rget” to align with the recommendation of  
the NXP – I2C standards organization.  
PN7160_PN7161 v.3.8  
Modifications:  
20221214  
Product data sheet  
PN7160_PN7161 v.3.7  
T

amb

updated into -30°C  
PN7160_PN7161 v.3.7  
Modifications:  
20221207  
Product data sheet  
PN7160_PN7161 v.3.6  
PN7160_PN7161 v.3.6  
Modifications:  
20220905  
•

: Description of Pin 37 updated  
20220819 Product
 
data sheet  
Product data sheet  
PN7160_PN7161 v.3.5  
PN7160_PN7161 v.3.5  
Modifications:  
PN7160_PN7161 v.3.4  
•
Added information about DCDC_EN pin as an alternative to the pin TX_PWR_REQ, see  
•
Clarified voltage level of pin V

DDD

, see

PN7160_PN7161 v.3.4  
Modifications:  
20220804  
Product data sheet  
PN7160_PN7161 v.3.3  
•
Functional description SPI interface: Setting of CPHA and CPOL are fixed during production  
and cannot be changed by customer.  
PN7160_PN7161 v.3.3  
Modifications:  
20220217  
Product data sheet  
PN7160_PN7161 v.3.2  
PN7160_PN7161 v.3.2  
Modifications:  
20210930  
•
Clarified pin naming TVDD vs V

DD(TX)  

20210913 Product
 
data sheet  
•
Security status changed into “Company public”  
20210819 Product
 
data sheet  
Product data sheet  
PN7160_PN7161 v.3.1  
PN7160_PN7161 v.3.0  
PN7160_PN7161 v.2.0  
PN7160_PN7161 v.3.1  
Modifications:  
PN7160_PN7161 v.3.0  
Modifications:  
•
Data sheet status changed into “Product data sheet”  
•
Security status changed into “Company restricted”  
PN7160_PN7161 v.2.0  
Modifications:  
20210709  
Preliminary data sheet  
PN7160 v.1.0  
•
PN7161 included  
•

: updated  
•
Some figures updated  
PN7160 v.1.0  
20210308  
Objective data sheet  
–
•
Initial version  
PN7160_PN7161  
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22 Legal
 
information  
22.1 Data
 
sheet status  
Document status

Product status

Definition  
Objective [short] data sheet  
Development  
This document contains data from the objective specification for product  
development.  
Preliminary [short] data sheet  
Product [short] data sheet  
Qualification  
Production  
This document contains data from the preliminary specification.  
This document contains the product specification.  
[1] Please
 
consult the most recently issued document before initiating or completing a design.  
[2] The
 
term ‘short data sheet’ is explained in section “Definitions”.  
[3] The
 
product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple  
Suitability for use
— NXP Semiconductors products are not designed,  
22.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
Draft
— A draft status on a document indicates that the content is still  
malfunction of an NXP Semiconductors product can reasonably be expected  
under internal review and subject to formal approval, which may result  
to result in personal injury, death or severe property or environmental  
in modifications or additions. NXP Semiconductors does not give any  
damage. NXP Semiconductors and its suppliers accept no liability for  
representations or warranties as to the accuracy or completeness of  
inclusion and/or use of NXP Semiconductors products in such equipment or  
information included in a draft version of a document and shall have no  
applications and therefore such inclusion and/or use is at the customer’s own  
liability for the consequences of use of such information.  
risk.  
Short data sheet
— A short data sheet is an extract from a full data sheet  
Applications
— Applications that are described herein for any of these  
with the same product type number(s) and title. A short data sheet is  
products are for illustrative purposes only. NXP Semiconductors makes no  
intended for quick reference only and should not be relied upon to contain  
representation or warranty that such applications will be suitable for the  
detailed and full information. For detailed and full information see the  
specified use without further testing or modification.  
relevant full data sheet, which is available on request via the local NXP  
Customers are responsible for the design and operation of their  
Semiconductors sales office. In case of any inconsistency or conflict with the  
applications and products using NXP Semiconductors products, and NXP  
short data sheet, the full data sheet shall prevail.  
Semiconductors accepts no liability for any assistance with applications or  
customer product design. It is customer’s sole responsibility to determine  
Product specification
— The information and data provided in a Product  
whether the NXP Semiconductors product is suitable and fit for the  
data sheet shall define the specification of the product as agreed between  
customer’s applications and products planned, as well as for the planned  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
application and use of customer’s third party customer(s). Customers should  
customer have explicitly agreed otherwise in writing. In no event however,  
provide appropriate design and operating safeguards to minimize the risks  
shall an agreement be valid in which the NXP Semiconductors product  
associated with their applications and products.  
is deemed to offer functions and qualities beyond those described in the  
NXP Semiconductors does not accept any liability related to any default,  
Product data sheet.  
damage, costs or problem which is based on any weakness or default  
in the customer’s applications or products, or the application or use by  
customer’s third party customer(s). Customer is responsible for doing all  
necessary testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications  
22.3 Disclaimers  
and the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
Limited warranty and liability
— Information in this document is believed  
to be accurate and reliable. However, NXP Semiconductors does not give  
any representations or warranties, expressed or implied, as to the accuracy  
Limiting values
— Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those  
given in the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
or completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including – without limitation –  
lost profits, lost savings, business interruption, costs related to the removal  
or replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale
— NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability  
towards customer for the products described herein shall be limited in  
accordance with the
T
e
rms and conditions of commercial sale of NXP  
Semiconductors.  
Right to make changes
— NXP Semiconductors reserves the right to  
make changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license
— Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or  
the grant, conveyance or implication of any license under any copyrights,  
patents or other industrial or intellectual property rights.  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
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PN7160_PN7161  
Near Field Communication (NFC) controller  
Quick reference data
— The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
22.4 Licenses  
Purchase of NXP ICs with ISO/IEC 14443 type B functionality  
Export control
— This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
RATP/Innovatron
T
e
chnology  
This NXP Semiconductors IC is ISO/IEC  
14443 Type B software enabled and is  
licensed under Innovatron’s Contactless  
Card patents license for ISO/IEC 14443 B.  
Suitability for use in non-automotive qualified products
— Unless  
this data sheet expressly states that this specific NXP Semiconductors  
product is automotive qualified, the product is not suitable for automotive  
use. It is neither qualified nor tested in accordance with automotive testing  
or application requirements. NXP Semiconductors accepts no liability for  
inclusion and/or use of non-automotive qualified products in automotive  
equipment or applications.  
The license includes the right to use the IC  
in systems and/or end-user equipment.  
Purchase of NXP ICs with NFC technology
— Purchase of an NXP  
Semiconductors IC that complies with one of the Near Field Communication  
(NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey an  
implied license under any patent right infringed by implementation of any of  
those standards. Purchase of NXP Semiconductors IC does not include a  
license to any NXP patent (or other IP right) covering combinations of those  
products with other products, whether hardware or software.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards,  
customer (a) shall use the product without NXP Semiconductors’ warranty  
of the product for such automotive applications, use and specifications, and  
(b) whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
22.5 Trademarks  
Notice: All referenced brands, product names, service names, and  
trademarks are the property of their respective owners.  
Translations
— A non-English (translated) version of a document, including  
the legal information in that document, is for reference only. The English  
version shall prevail in case of any discrepancy between the translated and  
English versions.  
NXP
— wordmark and logo are trademarks of NXP B.
V
.  
AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE,  
Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle,  
Keil, Mali, Mbed, Mbed Enabled, NEON, PO
P
,
R
ealView, SecurCore,  
Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-  
PLUS, ULINKpro, μVision, Versatile
— are trademarks and/or registered  
trademarks of Arm Limited (or its subsidiaries or affiliates) in the US and/or  
elsewhere. The related technology may be protected by any or all of patents,  
copyrights, designs and trade secrets. All rights reserved.  
Security
— Customer understands that all NXP products may be subject to  
unidentified vulnerabilities or may support established security standards or  
specifications with known limitations. Customer is responsible for the design  
and operation of its applications and products throughout their lifecycles  
to reduce the effect of these vulnerabilities on customer’s applications  
and products. Customer’s responsibility also extends to other open and/or  
proprietary technologies supported by NXP products for use in customer’s  
applications. NXP accepts no liability for any vulnerability. Customer should  
regularly check security updates from NXP and follow up appropriately.  
DESFire
— is a trademark of NXP B.
V
.  
EdgeVerse
— is a trademark of NXP B.
V
.  
FeliCa
— is a trademark of Sony Corporation.  
ICODE and I-CODE
— are trademarks of NXP B.
V
.  
I2C-bus
— logo is a trademark of NXP B.
V
.  
MIFARE
— is a trademark of NXP B.
V
.  
Customer shall select products with security features that best meet rules,  
regulations, and standards of the intended application and make the  
ultimate design decisions regarding its products and is solely responsible  
for compliance with all legal, regulatory, and security related requirements  
concerning its products, regardless of any information or support that may be  
provided by NX
P
.  
MIFARE Classic
— is a trademark of NXP B.
V
.  
MIFARE Ultralight
— is a trademark of NXP B.
V
.  
SmartMX
— is a trademark of NXP B.
V
.  
NXP has a Product Security Incident Response
T
e
am (PSIRT) (reachable  
at

) that manages the investigation, reporting, and solution  
release to security vulnerabilities of NXP products.  
PN7160_PN7161  
All information provided in this document is subject to legal disclaimers.  
© 2023 NXP B.
V
.
A
ll rights reserved.  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Tables  
PN7160_PN7161  
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V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Figures  
PN7160_PN7161  
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V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Contents  
PN7160_PN7161  
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V
.
A
ll rights reserved.  
Product data sheet  
Rev. 3.9 — 8 March 2023  
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NXP Semiconductors  
PN7160_PN7161  
Near Field Communication (NFC) controller  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© 2023 NXP B.V.  
All rights reserved.  
Date of release: 8 March 2023  
Document identifier: PN7160_PN7161