onsemi-BCW32LT1G

Part #onsemi-BCW32LT1G
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onsemi-BCW32LT1G
BCW32LT1G  
General Purpose  
Transistors  
NPN Silicon  
Features  
•
NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
COLLECTOR  
3
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
1
BASE  
MAXIMUM RATINGS  
2
EMITTER  
Rating  
Symbol  
Value  
32  
Unit  
Vdc  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
V
V
V
CEO  
32  
Vdc  
CBO  
EBO  
5.0  
Vdc  
3
Collector Current − Continuous  
I
C
100  
mAdc  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1
2
SOT−23 (TO−236)  
CASE 318  
THERMAL CHARACTERISTICS  
STYLE 6  
Characteristic  
Symbol  
Value  
Unit  
T
o
tal Device Dissipation  
FR-5 Board  
P
D
mW  
MARKING DIAGRAM  
(1)  
225  
T =
 
25
°
C  
Derate above 25
°
C  
A
1.8  
mW/
°
C  
°
C/W  
D2 M
G  
Thermal Resistance,  
Junction−to−Ambient  
R
556  
G
q
JA  
1
T
o
tal Device Dissipation  
Alumina Substrate,
 
T =
 
25
°
C  
Derate above 25
°
C  
P
300  
mW  
D
D2 =
 
Device Code  
(2)  
A
M
= Date Code*  
2.4  
mW/
°
C  
°
C/W  
G
= Pb−Free Package  
Thermal Resistance,  
Junction−to−Ambient  
R
417  
q
JA  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
Junction and Storage
T
e
mperature  
T , T  
J
−55 to +150  
°
C  
stg  
1. FR
−
5
 
=
1
.0
ꢀ
0.75
ꢀ
0.062 in.  
2. Alumina
 
= 0.4
ꢀ
0.3
ꢀ
0.024 in. 99.5% alumina.  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
BCW32LT1G  
SOT−23 3000
 
/
T
a
pe & Reel  
(Pb−Free)  
NSVBCW32LT1G  
SOT−23 3000
 
/
T
a
pe & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
November, 2016 − Rev. 4  
BCW32LT1/D  

BCW32LT1G  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Typ  
Max  
Unit  
Collecto
r
−
E
mitter Breakdown Voltage  
V
32  
32  
−
−
−
−
−
−
Vdc  
Vdc  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
(I =
 
2.0 mAdc, V
 
= 0)  
C
EB  
Collecto
r
−
B
ase Breakdown Voltage  
(I =
 
10
m
Adc, I
 
= 0)  
V
V
C
E
Emitte
r
−
B
ase Breakdown Voltage  
(I =
 
10
m
Adc, I
 
= 0)  
5.0  
E
C
Collector Cutoff Current  
(V =
 
32 Vdc, I
 
= 0)  
I
CBO  
−
−
−
−
100  
10  
nAdc  
m
Adc  
CB  
E
(V =
 
32 Vdc, I
 
= 0, T
 
= 100
°
C)  
CB  
E
A
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
−
(I =
 
2.0 mAdc, V
 
= 5.0 Vdc)  
200  
−
−
−
−
450  
0.25  
0.70  
C
CE  
Collecto
r
−
E
mitter Saturation Voltage  
(I =
 
10 mAdc, I
 
= 0.5 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
C
B
Bas
e
−
E
mitter On Voltage  
(I =
 
2.0 mAdc, V
 
= 5.0 Vdc)  
V
BE(on)  
0.55  
C
CE  
SMALL
−
S
IGNAL CHARACTERISTICS  
Output Capacitance  
C
−
−
−
−
4.0  
10  
pF  
dB  
obo  
(I =
 
0, V
 
= 10 Vdc, f = 1.0 MHz)  
E
CB  
Noise Figure  
(I =
 
0.2 mAdc, V
 
= 5.0 Vdc, R
 
= 2.0 k
W
, f = 1.0 kHz, BW = 200 Hz)  
NF  
C
CE  
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
TYPICAL NOISE CHARACTERISTICS  
(V

CE

= 5.0 Vdc, T

A

= 25
°
C)  
20  
10  
100  
50  
I
C
= 1.0 mA  
BANDWIDTH = 1.0 Hz  
R
≈ ∞  
BANDWIDTH = 1.0 Hz  
= 0  
I
C
= 1.0 mA  
R
S
S
20  
300
m
A  
300
m
A  
100
m
A  
10  
5.0  
7.0  
5.0  
100
m
A  
2.0  
1.0  
10
m
A  
30
m
A  
0.5  
0.2  
0.1  
30
m
A  
3.0  
2.0  
10
m
A  
10 20  
50 100 200  
500 1ꢀk  
2ꢀk  
5ꢀk 10ꢀk  
10  
20  
50 100 200  
500 1ꢀk  
2ꢀk  
5ꢀk 10ꢀk  
f, FREQUENCY (Hz)  
f, FREQUENCY (Hz)  
Figure 1. Noise Voltage  
Figure 2. Noise Current  
2

BCW32LT1G  
NOISE FIGURE CONTOURS  
(V

CE

= 5.0 Vdc, T

A

= 25
°
C)  
500ꢀk  
1ꢀM  
500ꢀk  
BANDWIDTH = 1.0 Hz  
BANDWIDTH = 1.0 Hz  
200ꢀk  
100ꢀk  
50ꢀk  
200ꢀk  
100ꢀk  
50ꢀk  
20ꢀk  
20ꢀk  
10ꢀk  
10ꢀk  
5ꢀk  
2.0 dB  
1.0 dB  
5ꢀk  
2ꢀk  
1ꢀk  
3.0 dB  
4.0 dB  
2.0 dB  
2ꢀk  
1ꢀk  
3.0 dB  
5.0 dB  
8.0 dB  
6.0 dB  
10 dB  
500  
500  
200  
100  
50  
200  
100  
10  
20 30  
50 70 100  
200 300  
500 700
 
1ꢀk  
10  
20 30  
50 70 100  
200 300  
500 700
 
1ꢀk  
I ,
 
COLLECTOR CURRENT (
m
A)  
C
I ,
 
COLLECTOR CURRENT (
m
A)  
C
Figure 3. Narrow Band, 100 Hz  
Figure 4. Narrow Band, 1.0 kHz  
500ꢀk  
10 Hz to 15.7 kHz  
200ꢀk  
100ꢀk  
50ꢀk  
Noise Figure is defined as:  
2
20ꢀk  
2
R
n S  
2
1
ń
2  
e
n
)
4KTR
)
I  
S
10ꢀk  
5ꢀk  

10

ǒ  
Ǔ
NF
+
20 log  
4KTR  
S
1.0 dB  
e
n
= Noise Voltage of the Transistor referred to the input. (Figure 3)  
2ꢀk  
1ꢀk  
2.0 dB  
I
= Noise Current of the Transistor referred to the input.  
3.0 dB  
(Figure 4)  
n
500  
−23  
K
= Boltzman’s Constant (1.38 x 10  
j/
°
K)  
5.0 dB  
8.0 dB  
T
R
=
T
e
mperature of the Source Resistance (
°
K)  
= Source Resistance (
W
)  
200  
100  
50  
S
20 30  
50 70 100  
200 300  
500 700
 
1ꢀk  
10  
I ,
 
COLLECTOR CURRENT (
m
A)  
C
Figure 5. Wideband  
3

BCW32LT1G  
TYPICAL STATIC CHARACTERISTICS  
400  
200  
T =
 
125
°
C  
J
25
°
C  
-ꢁ55
°
C  
100  
80  
60  
V
V
= 1.0 V  
= 10 V  
CE  
CE  
40  
0.004 0.006 0.01  
0.02 0.03
 
0.05 0.07 0.1  
0.2 0.3  
0.5 0.7
 
1.0  
3.0  
2.0  
5.0 7.0 10  
20  
30  
50 70
 
100  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 6. DC Current Gain  
1.0  
100  
T =
 
25
°
C  
A
T =
 
25
°
C  
J
I
B
= 500
m
A  
400
m
A  
PULSE WIDTH = 300
m
s  
DUTY CYCLE
≤
2.0%  
0.8  
0.6  
0.4  
0.2  
0
80  
60  
300
m
A  
200
m
A  
I
C
= 1.0 mA  
10 mA  
50 mA  
100 mA  
40  
20  
0
100
m
A  
0.002 0.005 0.01 0.02
 
0.05 0.1 0.2
 
0.5 1.0
 
2.0  
5.0 10
 
20  
0
5.0  
10  
15  
20  
25  
30  
35  
40  
I ,
 
BASE CURRENT (mA)  
B
V
CE  
, COLLECTOR-EMITTER VOLTAGE (VOLTS)  
Figure 7. Collector Saturation Region  
Figure 8. Collector Characteristics  
1.4  
1.2  
1.6  
0.8  
0
*APPLIES for I
 
/I
≤
h /2  
C
B
FE  
T =
 
25
°
C  
J
25
°
C to 125
°
C  
–
5
5
°
C to 25
°
C  
1.0  
0.8  
0.6  
0.4  
*
q
for V  
VC  
CE(sat)  
V
@ I
 
/I =
 
10  
C B  
BE(sat)  
-ꢁ0.8  
-ꢁ1.6  
-ꢁ2.4  
V
BE(on)  
@ V
 
= 1.0 V  
CE  
25
°
C to 125
°
C  
–
5
5
°
C to 25
°
C  
0.2  
0
q
for V  
BE  
VB  
V
@ I
 
/I =
 
10  
C B  
CE(sat)  
0.1 0.2  
0.5 1.0  
2.0  
5.0  
10  
20  
50 100  
0.1  
0.2  
0.5  
1.0 2.0  
5.0 10 20  
50 100  
I ,
 
COLLECTOR CURRENT (mA)  
C
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 9. “On” Voltages  
Figure 10. Temperature Coefficients  
4

BCW32LT1G  
TYPICAL DYNAMIC CHARACTERISTICS  
10  
7.0  
5.0  
T =
 
25
°
C  
J
f = 1.0 MHz  
C
ib  
C
ob  
3.0  
2.0  
1.0  
0.05 0.1  
0.2  
0.5 1.0  
2.0  
5.0  
10  
20  
50  
V ,
 
REVERSE VOLTAGE (VOLTS)  
R
Figure 11. Capacitance  
5

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
23 (TO
−
236)  
CASE 318
−
08  
ISSUE AS  
DATE 30 JAN 2018  
SCALE 4:1  
NOTES:  
D
1. DIMENSIONING
 
AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING
 
DIMENSION: MILLIMETERS.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
THE BASE MATERIAL.  
0.25  
3
4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS.  
T
H
E
E
1
2
MILLIMETERS  
INCHES  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.89  
0.01  
0.37  
0.08  
2.80  
1.20  
1.78  
0.30  
0.35  
2.10  
0
°
 
NOM  
1.00  
0.06  
0.44  
0.14  
2.90  
1.30  
1.90  
0.43  
0.54  
2.40  
−−−  
MAX  
MIN  
0.035  
0.000  
0.015  
0.003  
0.110  
0.047  
0.070  
0.012  
0.014  
0.083  
0
°  
NOM  
0.039  
0.002  
0.017  
0.006  
0.114  
0.051  
0.075  
0.017  
0.021  
0.094  
−−−  
MAX  
0.044  
0.004  
0.020  
0.008  
0.120  
0.055  
0.080  
0.022  
0.027  
0.104  
10
°  
L
1.11  
0.10  
0.50  
0.20  
3.04  
1.40  
2.04  
0.55  
0.69  
2.64  
10
°  
3X  
b
L1  
VIEW C  
e
TOP VIEW  
L1  
A
H
E
T
c
A1  
SEE VIEW C  
SIDE VIEW  
GENERIC  
MARKING DIAGRAM*  
END VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT  
XXXM
G  
G
1
3X  
0.90  
XXX = Specific Device Code  
2.90  
M
= Date Code  
G
= Pb
−
Free Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”,  
may or may not be present.  
3X  
0.95  
0.80  
PITCH  
DIMENSIONS: MILLIMETERS  
STYLE 1 THRU 5:  
CANCELLED  
STYLE 6:  
STYLE 7:  
PIN 1.
 
EMITTER  
2. BASE  
STYLE 8:  
PIN 1.
 
BASE  
2. EMITTER  
3. COLLECTOR  
PIN 1.
 
ANODE  
2. NO
 
CONNECTION  
3. CATHODE  
3. COLLECTOR  
STYLE 9:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 10:  
STYLE 11:  
STYLE 12:  
STYLE 13:  
PIN 1.
 
SOURCE  
2. DRAIN  
STYLE 14:  
PIN 1.
 
CATHODE  
2. GATE  
PIN 1.
 
DRAIN  
2. SOURCE  
3. GATE  
PIN 1.
 
ANODE  
PIN 1.
 
CATHODE  
2. CATHODE  
3. ANODE  
2. CATHODE  
3. CATHODE
−
ANODE  
3. CATHODE  
3. GATE  
3. ANODE  
STYLE 15:  
STYLE 16:  
STYLE 17:  
PIN 1.
 
NO CONNECTION  
2. ANODE  
STYLE 18:  
STYLE 19:  
STYLE 20:  
PIN 1.
 
GATE  
2. CATHODE  
3. ANODE  
PIN 1.
 
ANODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
NO CONNECTION
 
PIN 1.
 
CATHODE  
PIN 1.
 
CATHODE  
2. ANODE  
3. GATE  
2. CATHODE  
3. ANODE  
2. ANODE  
3. CATHODE
−
ANODE  
3. CATHODE  
STYLE 21:  
STYLE 22:  
STYLE 23:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 24:  
STYLE 25:  
STYLE 26:  
PIN 1.
 
GATE  
2. SOURCE  
3. DRAIN  
PIN 1.
 
RETURN  
2. OUTPUT  
3. INPUT  
PIN 1.
 
GATE  
2. DRAIN  
PIN 1.
 
ANODE  
2. CATHODE  
3. GATE  
PIN 1.
 
CATHODE  
2. ANODE  
3. SOURCE  
3. NO
 
CONNECTION  
3. CATHODE  
STYLE 27:  
STYLE 28:  
PIN 1.
 
CATHODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
ANODE  
2. ANODE  
3. ANODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42226B  
SOT
−
23 (TO
−
236)  
PAGE 1 OF 1  
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