onsemi-BCW68GLT1

Part #onsemi-BCW68GLT1
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onsemi-BCW68GLT1
BCW68GL  
General Purpose
T
r
ansistor  
PNP Silicon  
Features  
•
NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and P
P
A
P Capable  
COLLECTOR  
3
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
1
BASE  
2
MAXIMUM RATINGS  
EMITTER  
Rating  
Symbol  
Value  
−45  
Unit  
Vdc  
Collector−Emitter Voltage  
Collector−Base Voltage  
Emitter−Base Voltage  
V
V
CEO  
−60  
Vdc  
3
CBO  
SOT−23  
V
EBO  
−5.0  
−800  
Vdc  
CASE 318  
STYLE 6  
1
Collector Current − Continuous  
I
C
mAdc  
2
Stresses exceeding those listed in the Maximum Ratings table may damage  
the device. If any of these limits are exceeded, device functionality should not  
be assumed, damage may occur and reliability may be affected.  
MARKING DIAGRAM  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
DG M
G  
G
T
o
tal Device Dissipation FR−5 Board  
P
D
225  
mW  

(Note 1

) T
 
= 25
°
C  
A
Derate above 25
°
C  
1.8  
mW/
°
C  
°
C/W  
DG  
M
G
= Specific Device Code  
= Date Code*  
= Pb−Free Package  
Thermal Resistance,  
Junction−to−Ambient  
R
q
JA  
556  
T
o
tal Device Dissipation  
T =
 
25
°
C  
Derate above 25
°
C  
P
D
300  
mW  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may vary  
dependin
g
u
pon manufacturing location.  
A
2.4  
mW/
°
C  
°
C/W  
Thermal Resistance,  
Junction−to−Ambient  
R
q
JA  
417  
ORDERING INFORMATION  
†
Junction and Storage
T
e
mperature  
T , T  
−55 to +150  
°
C  
Device  
Package  
Shipping  
J
stg  
1. FR−5
 
= 1.0
 
 
0.75
 
 
0.062 in.  
BCW68G
L
T
1G,  
NSVBCW68G
L
T
1G  
SOT−23  
(Pb−Free)  
3000 /
T
a
pe &  
Reel  
2. Alumina
 
= 0.4
 
 
0.3
 
 
0.024 in 99.5% alumina.  
BCW68G
L
T
3G  
SOT−23  
(Pb−Free)  
10000 /
T
a
pe &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our
T
a
pe and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 1994  
1
Publication Order Number:  
Novembe
r
,
2
016 − Rev. 8  
BCW68G
L
T
1/D  
 

BCW68GL  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Typ  
Max  
Unit  
Collector−Emitter Breakdown Voltage  
V
−45  
−60  
−5.0  
−
−
−
−
−
−
Vdc  
Vdc  
Vdc  
(BR)CEO  
(I =
 
−10 mAdc, I
 
= 0)  
C
B
Collector−Emitter Breakdown Voltage  
(I =
 
−10
m
Adc, V
 
= 0)  
V
(BR)CES  
(BR)EBO  
C
EB  
Emitter−Base Breakdown Voltage  
(I =
 
−10
m
Adc, I
 
= 0)  
V
E
C
Collector Cutoff Current  
(V =
 
−45 Vdc, I
 
= 0)  
I
CES  
−
−
−
−
−20  
−10  
nAdc  
m
Adc  
CE  
E
(V =
 
−45 Vdc, I
 
= 0, T
 
= 150
°
C)  
CE  
B
A
Emitter Cutoff Current (V
 
= −4.0 Vdc, I
 
= 0)  
I
−
−
−20  
nAdc  
−
EB  
C
EBO  
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
(I =
 
−10 mAdc, V
 
= −1.0 Vdc)  
120  
160  
60  
−
−
−
400  
−
−
C
CE  
(I =
 
−100 mAdc, V
 
= −1.0 Vdc)  
C
CE  
(I =
 
−300 mAdc, V
 
= −1.0 Vdc)  
C
CE  
Collector−Emitter Saturation Voltage  
(I =
 
−500 mAdc, I
 
= −50 mAdc)  
V
−
−
−0.7  
−2.0  
Vdc  
Vdc  
CE(sat)  
C
B
Base−Emitter Saturation Voltage  
(I =
 
−500 mAdc, I
 
= −50 mAdc)  
V
BE(sat)  
−
−
C
B
SMALL−SIGNAL CHARACTERISTICS  
Current−Gain − Bandwidth Product  
f
100  
−
−
−
−
−
−
MHz  
pF  
T
(I =
 
−20 mAdc, V
 
= −10 Vdc, f = 100 MHz)  
C
CE  
Output Capacitance  
C
obo  
18  
(V =
 
−10 Vdc, I
 
= 0, f = 1.0 MHz)  
CB  
E
Input Capacitance  
C
ibo  
−
105  
10  
pF  
(V =
 
−0.5 Vdc, I
 
= 0, f = 1.0 MHz)  
EB  
C
Noise Figure  
N
−
dB  
F
(I =
 
−0.2 mAdc, V
 
= −5.0 Vdc, R
 
= 1.0 k
W
, f
 
= 1.0 kHz, BW = 200 Hz)  
C
CE  
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performanc
e
m
ay not be indicated by the Electrical Characteristics if operated under different conditions.  
2

BCW68GL  
TYPICAL CHARACTERISTICS  
500  
400  
300  
200  
1
150
°
C  
I /I
 
= 10  
C
B
V
CE  
= 1 V  
150
°
C  
25
°
C  
25
°
C  
−55
°
C  
0.1  
−55
°
C  
100  
0
0.01  
0.001  
0.01  
0.1  
1
0.001  
0.01  
0.1  
1
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 1. DC Current Gain vs. Collector  
Current  
Figure 2. Collector Emitter Saturation Voltage  
vs. Collector Current  
1.1  
1.2  
1.1  
1.0  
0.9  
V
CE  
= 5 V  
−55
°
C  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
I /I
 
= 10  
C
B
25
°
C  
−55
°
C  
25
°
C  
0.8  
0.7  
0.6  
0.5  
0.4  
150
°
C  
150
°
C  
0.3  
0.2  
0.3  
0.2  
0.0001  
0.001  
0.01  
0.1  
1
0.0001  
0.001  
0.01  
0.1  
1
I ,
 
COLLECTOR CURRENT (A)  
C
I ,
 
COLLECTOR CURRENT (A)  
C
Figure 3. Base Emitter Saturation Voltage vs.  
Collector Current  
Figure 4. Base Emitter Voltage vs. Collector  
Current  
1000  
V
CE  
= 1 V  
T =
 
25
°
C  
A
100  
10  
0.1  
1
10  
100  
1000  
I ,
 
COLLECTOR CURRENT (mA)  
C
Figure 5. Current Gain Bandwidth Product vs.  
Collector Current  
3

BCW68GL  
TYPICAL CHARACTERISTICS  
-1.0  
-0.8  
-0.6  
-0.4  
T =
 
25
°
C  
J
I
=
C
-500 mA  
I
= -300 mA  
C
-0.2  
0
I
= -100 mA  
C
I
= -10 mA  
C
-0.01  
-0.1  
-1.0  
I ,
 
BASE CURRENT (mA)  
-10  
-100  
B
Figure 6. Saturation Region  
100  
+1.0  
0
q
for V  
CE(sat)  
VC  
C
ib  
10  
-1.0  
-2.0  
C
ob  
q
for V  
BE  
VB  
1.0  
-0.1  
-1.0  
-10  
-100  
-1000  
-1.0  
-10  
-100  
I ,
 
COLLECTOR CURRENT (mA)  
C
V ,
 
REVERSE VOLTAGE (VOLTS)  
R
Figure 7. Temperature Coefficients  
Figure 8. Capacitances  
4

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
23 (TO
−
236)  
CASE 318
−
08  
ISSUE AS  
DATE 30 JAN 2018  
SCALE 4:1  
NOTES:  
D
1. DIMENSIONING
 
AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING
 
DIMENSION: MILLIMETERS.  
3. MAXIMUM
 
LEAD THICKNESS INCLUDES LEAD FINISH.  
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF  
THE BASE MATERIAL.  
0.25  
3
4. DIMENSIONS
 
D AND E DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS.  
T
H
E
E
1
2
MILLIMETERS  
INCHES  
DIM  
A
A1  
b
c
D
E
e
L
MIN  
0.89  
0.01  
0.37  
0.08  
2.80  
1.20  
1.78  
0.30  
0.35  
2.10  
0
°
 
NOM  
1.00  
0.06  
0.44  
0.14  
2.90  
1.30  
1.90  
0.43  
0.54  
2.40  
−−−  
MAX  
MIN  
0.035  
0.000  
0.015  
0.003  
0.110  
0.047  
0.070  
0.012  
0.014  
0.083  
0
°  
NOM  
0.039  
0.002  
0.017  
0.006  
0.114  
0.051  
0.075  
0.017  
0.021  
0.094  
−−−  
MAX  
0.044  
0.004  
0.020  
0.008  
0.120  
0.055  
0.080  
0.022  
0.027  
0.104  
10
°  
L
1.11  
0.10  
0.50  
0.20  
3.04  
1.40  
2.04  
0.55  
0.69  
2.64  
10
°  
3X  
b
L1  
VIEW C  
e
TOP VIEW  
L1  
A
H
E
T
c
A1  
SEE VIEW C  
SIDE VIEW  
GENERIC  
MARKING DIAGRAM*  
END VIEW  
RECOMMENDED  
SOLDERING FOOTPRINT  
XXXM
G  
G
1
3X  
0.90  
XXX = Specific Device Code  
2.90  
M
= Date Code  
G
= Pb
−
Free Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”,  
may or may not be present.  
3X  
0.95  
0.80  
PITCH  
DIMENSIONS: MILLIMETERS  
STYLE 1 THRU 5:  
CANCELLED  
STYLE 6:  
STYLE 7:  
PIN 1.
 
EMITTER  
2. BASE  
STYLE 8:  
PIN 1.
 
BASE  
2. EMITTER  
3. COLLECTOR  
PIN 1.
 
ANODE  
2. NO
 
CONNECTION  
3. CATHODE  
3. COLLECTOR  
STYLE 9:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 10:  
STYLE 11:  
STYLE 12:  
STYLE 13:  
PIN 1.
 
SOURCE  
2. DRAIN  
STYLE 14:  
PIN 1.
 
CATHODE  
2. GATE  
PIN 1.
 
DRAIN  
2. SOURCE  
3. GATE  
PIN 1.
 
ANODE  
PIN 1.
 
CATHODE  
2. CATHODE  
3. ANODE  
2. CATHODE  
3. CATHODE
−
ANODE  
3. CATHODE  
3. GATE  
3. ANODE  
STYLE 15:  
STYLE 16:  
STYLE 17:  
PIN 1.
 
NO CONNECTION  
2. ANODE  
STYLE 18:  
STYLE 19:  
STYLE 20:  
PIN 1.
 
GATE  
2. CATHODE  
3. ANODE  
PIN 1.
 
ANODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
NO CONNECTION
 
PIN 1.
 
CATHODE  
PIN 1.
 
CATHODE  
2. ANODE  
3. GATE  
2. CATHODE  
3. ANODE  
2. ANODE  
3. CATHODE
−
ANODE  
3. CATHODE  
STYLE 21:  
STYLE 22:  
STYLE 23:  
PIN 1.
 
ANODE  
2. ANODE  
STYLE 24:  
STYLE 25:  
STYLE 26:  
PIN 1.
 
GATE  
2. SOURCE  
3. DRAIN  
PIN 1.
 
RETURN  
2. OUTPUT  
3. INPUT  
PIN 1.
 
GATE  
2. DRAIN  
PIN 1.
 
ANODE  
2. CATHODE  
3. GATE  
PIN 1.
 
CATHODE  
2. ANODE  
3. SOURCE  
3. NO
 
CONNECTION  
3. CATHODE  
STYLE 27:  
STYLE 28:  
PIN 1.
 
CATHODE  
2. CATHODE  
3. CATHODE  
PIN 1.
 
ANODE  
2. ANODE  
3. ANODE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42226B  
SOT
−
23 (TO
−
236)  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
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Semiconductor Components Industries, LLC, 2019  

onsemi
,  
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onsemi
” or its affiliates  
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−
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onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
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