onsemi-BD675AG

Part #onsemi-BD675AG
Download 
onsemi-BD675AG
BD675G, BD675AG,  
BD677G, BD677AG,  
BD679G, BD679AG, BD681G  
Plastic Medium-Power  
Silicon NPN Darlingtons  
This series of plastic, medium−power silicon NPN Darlington  
transistors can be used as output devices in complementary  
general−purpose amplifier applications.  
4.0 AMPERES  
POWER TRANSISTORS  
NPN SILICON  
Features  
•
High DC Current Gain  
•
Monolithic Construction  
60, 80, 100 VOLTS, 40 WATTS  
•
Complementary to BD676, 676A, 678, 678A, 680, 680A, 682  
•
BD677, 677A, 679, 679A are Equivalent to MJE 800, 801, 802, 803  
•
These Devices are Pb−Free and are RoHS Compliant*  
COLLECTOR 2, 4  
BASE 3  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
EMITTER 1  
Collector−Emitter Voltage  
BD675G, BD675AG  
BD677G, BD677AG  
BD679G, BD679AG  
BD681G  
V
V
V
Vdc  
CEO  
CBO  
EBO  
45  
60  
80  
100  
TO−225  
CASE 77−09  
STYLE 1  
Collector−Base Voltage  
BD675G, BD675AG  
BD677G, BD677AG  
BD679G, BD679AG  
BD681G  
Vdc  
45  
60  
80  
100  
1
2
3
Emitter−Base Voltage  
Collector Current  
5.0  
4.0  
1.0  
Vdc  
Adc  
Adc  
I
C
MARKING DIAGRAMS  
Base Current  
I
B
T
o
tal Device Dissipation  
P
D
YWW  
BD6xxG  
YWW  
BD6xxAG  
@ T
 
= 25
°
C  
40  
0.32  
W
W/
°
C  
C
Derate above 25
°
C  
Operating and Storage Junction  
T
e
mperature Range  
T , T  
–
5
5 to
+
1
50  
°
C  
J
stg  
BD6xx/BD6xxA =
 
Device Code  
x = 75, 77, 79, 81  
=
Y
e
ar  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Y
WW  
G
= Work Week  
= Pb−Free Package  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
Thermal Resistance, Junction−to−Case  
R
3.13  
°
C/W  
q
JC  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
*For additional information on our Pb−Free strategy
 
and soldering details, please  
download the ON Semiconductor Soldering and Mounting
T
e
chniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
December, 2013 − Rev. 15  
BD675/D  

BD675G, BD675AG, BD677G, BD677AG, BD679G, BD679AG, BD681G  
ELECTRICAL CHARACTERISTICS
(T =
 
25
_
C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
Collector−Emitter Breakdown V

BV  
Vdc  
CEO  
(I =
 
50 mAdc, I
 
= 0)  
C
B
BD675G, BD675AG  
BD677G, BD677AG  
BD679G, BD679AG  
BD681G  
45  
60  
80  
−
−
−
−
100  
Collector Cutoff Current  
I
I
m
Adc  
CEO  
(V =
 
Half Rated V  
, I
 
= 0)  
B
−
500  
CE  
CEO  
Collector Cutoff Current  
mAdc  
CBO  
(V =
 
Rated BV  
(V =
 
Rated BV  
CB  
, I
 
= 0)  
, I
 
= 0, T
 
= 100’C)  
E C  
−
−
0.2  
2.0  
CB  
CEO  
CEO  
E
Emitter Cutoff Current  
(V =
 
5.0 Vdc, I
 
= 0)  
I
mAdc  
−
EBO  
−
2.0  
BE  
C
ON CHARACTERISTICS  
h
FE  
(I =
 
1.5 Adc,V
 
= 3.0 Vdc)  
C
CE  
BD675G, BD677G, BD679G, BD681G  
(I =
 
2.0 Adc, V
 
= 3.0 Vdc)  
750  
750  
−
−
C
CE  
BD675AG, BD677AG, BD679AG  
Collector−Emitter Saturation V

(I =
 
1.5 Adc, I
 
= 30 mAdc)  
V
CE(sat)  
Vdc  
Vdc  
C
B
BD677G, BD679G, BD681G  
(I =
 
2.0 Adc, I
 
= 40 mAdc)  
−
−
2.5  
2.8  
C
B
BD675AG, BD677AG, BD679AG  
Base−Emitter On V

V
BE(on)  
(I =
 
1.5 Adc, V
 
= 3.0 Vdc)  
C
CE  
BD677G, BD679G, BD681G  
(I =
 
2.0 Adc, V
 
= 3 0 Vdc)  
−
−
2.5  
2.5  
C
CE  
BD675AG, BD677AG, BD679AG  
DYNAMIC CHARACTERISTICS  
Small Signal Current Gain  
h
fe  
−
(I =
 
1.5 Adc, V
 
= 3.0 Vdc, f = 1.0 MHz)  
1.0  
−
C
CE  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
1. Pulse
 
T
e
st: Pulse Width
v
300
m
s, Duty Cycle
v
2.0%.  
50  
45  
5.0  
40  
35  
30  
25  
20  
2.0  
1.0  
BONDING WIRE LIMIT  
THERMALLY LIMIT at T
 
= 25
°
C  
C
SECONDARY BREAKDOWN LIMIT  
0.5  
15  
10  
0.2  
0.1  
BD675, 675A  
BD677, 677A  
T =
 
25
°
C  
C
BD679, 679A  
BD681  
5.0  
0
0.05  
15 30  
45  
60  
75  
90  
105 120 135 150 165  
1.0  
2.0  
V
5.0  
10  
20  
50  
100  
T ,
 
CASE TEMPERATURE (
°
C)  
C
, COLLECTOR-EMITTER VOLTAGE (VOLTS)  
CE  
Figure 1. Power Temperature Derating  
Figure 2. DC Safe Operating Area  
2
 

BD675G, BD675AG, BD677G, BD677AG, BD679G, BD679AG, BD681G  
There are two limitations on the power handling ability of  
a transistor average junction temperature and secondary  
At high case temperatures, thermal limitations will reduce  
the power that can be handled to values less than the  
limitations imposed by secondary breakdown.  
breakdown. Safe operating area curves indicate I
 
− V  
C
CE  
limits of the transistor that must be observed for reliable  
operation; e.g., the transistor must not be subjected to greater  
dissipation than the curves indicate.  
COLLECTOR  
NPN  
BD675G, BD675AG  
BD677G, BD677AG  
BD679G, BD679AG  
BD681G  
BASE  
[
8.0 k  
[
120  
EMITTER  
Figure 3. Darlington Circuit Schematic  
ORDERING INFORMATION  
Device  
Package  
Shipping  
BD675G  
TO−225  
500 Units / Box  
(Pb−Free)  
BD675AG  
BD677G  
BD677AG  
BD679G  
BD679AG  
BD681G  
TO−225  
(Pb−Free)  
500 Units / Box  
500 Units / Box  
500 Units / Box  
500 Units / Box  
500 Units / Box  
500 Units / Box  
TO−225  
(Pb−Free)  
TO−225  
(Pb−Free)  
TO−225  
(Pb−Free)  
TO−225  
(Pb−Free)  
TO−225  
(Pb−Free)  
3

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO
−
225  
CASE 77
−
09  
ISSUE AD  
4
DATE 25 MAR 2015  
1
3
2
2
1
3
FRONT VIEW  
BACK VIEW  
SCALE 1:1  
NOTES:  
E
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. NUMBER AND SHAPE OF LUGS OPTIONAL.  
A1  
Q
A
MILLIMETERS  
PIN 4  
BACKSIDE TAB  
DIM MIN  
MAX  
3.00  
1.50  
0.90  
0.88  
0.63  
11.10  
7.80  
2.54  
16.63  
2.54  
3.30  
4.20  
A
A1  
b
2.40  
1.00  
0.60  
0.51  
0.39  
10.60  
7.40  
2.04  
14.50  
1.27  
2.90  
3.80  
D
b2  
c
P
D
E
1
2
3
e
L
L1  
P
Q
L1  
GENERIC  
MARKING DIAGRAM*  
L
YWW  
XX  
XXXXXG  

2X

b2  
Y
=
Y
e
ar  
WW  
= Work Week  
XXXXX = Device Code  
= Pb
−
Free Package  
e
2X  
c
G
b
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”,  
may or may not be present.  
FRONT VIEW  
SIDE VIEW  
STYLE 1:  
STYLE 2:  
STYLE 3:  
PIN 1.
 
BASE  
STYLE 4:  
STYLE 5:  
PIN 1.
 
MT 1  
PIN 1.
 
EMITTER  
2., 4.
 
COLLECTOR  
3. BASE  
PIN 1.
 
CATHODE  
2., 4.
 
ANODE  
3. GATE  
PIN 1.
 
ANODE 1  
2., 4.
 
ANODE 2  
3. GATE  
2., 4.
 
COLLECTOR  
3. EMITTER  
2., 4.
 
MT 2  
3. GATE  
STYLE 6:  
STYLE 7:  
STYLE 8:  
STYLE 9:  
STYLE 10:  
PIN 1.
 
CATHODE  
2., 4.
 
GATE  
3. ANODE  
PIN 1.
 
MT 1  
2., 4.
 
GATE  
3. MT
 
2  
PIN 1.
 
SOURCE  
2., 4.
 
GATE  
3. DRAIN  
PIN 1.
 
GATE  
2., 4.
 
DRAIN  
3. SOURCE  
PIN 1.
 
SOURCE  
2., 4.
 
DRAIN  
3. GATE  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98ASB42049B  
TO
−
225  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2019  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
and/or subsidiaries in the United States and/or other countries.
onsemi
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of
onsemi
’s product/patent coverage may be accessed at

.
onsemi
reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “as
−
is” and
onsemi
makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using
onsemi
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
onsemi
does not convey any license  
under any of its intellectual property rights nor the rights of others.
onsemi
products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use
onsemi
products for any such unintended or unauthorized application, Buyer shall indemnify and hold
onsemi
and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that
onsemi
was negligent regarding the design or manufacture of the part.
onsemi
is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS
:  
onsemi Website:

For additional information, please contact your local Sales Representative at