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December 2015
BSS123W
N-Channel Logic Level Enhancement Mode Field Effect
Transistor
Features
Description
• 0.17
A, 100
V
,
R
DS(ON)
= 6
Ω
at V
GS
= 10 V
R
DS(ON)
= 10
Ω
at V
GS
= 4.5 V
• High
Density Cell Design for Low R
DS(ON)
• Rugged
and Reliable
This N-channel enhancement mode field effect transistor
is produced using high cell density, trench MOSFET
technology. This product minimizes on-state resistance
while providing rugged, reliable and fast switching perfor-
mance. This product is particularly suited for low-voltage,
low-current applications such as small servo motor con-
trol, power MOSFET gate drivers, logic level transistor,
high speed line drivers, power management/power sup-
ply and switching applications.
• Ultra
Small Surface Mount Package
• Very
Low Capacitance
• Fast
Switching Speed
• Lead
Free / RoHS Compliant
D
D
S
SOT-323
G
G
S
Ordering Information
Part Number
Marking
Package
Packing Method
BSS123W
SA
SOT-323 3L
T
a
pe and Reel
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at T
A
= 25°C unless otherwise noted.
Symbol
V
DSS
Parameter
Value
100
Unit
V
Drain-Source Voltage
V
DGR
Drain-Gate Voltage R
GS
≤
20 k
Ω
100
V
V
GSS
Gate-Source Voltage
±20
V
Continuous
Pulsed
0.17
I
D
Drain Current
A
0.68
T
J
, T
STG
Operating and Storage
T
e
mperature Range
-55 to +150
°
C
© 2015 Fairchild Semiconductor Corporation
BSS123W Rev. 1.0
Thermal Characteristics
Values are at T
A
= 25°C unless otherwise noted.
Symbol
P
D
Parameter
Value
200
Unit
mW
T
o
tal Power Dissipation
Derate Above 25
°
C
1.6
mW/
°
C
°
C/W
R
θ
JA
Thermal Resistance, Junction-to-Ambient
(1)
625
Note:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch. Minimum land pad size.
Electrical Characteristics
Values are at T
A
= 25°C unless otherwise noted.
Symbol
Parameter
Conditions
Min.
Typ.
Max. Unit
Off Characteristics
BV
DSS
Drain-Source Breakdown Voltage
V
GS
= 0
V
,
I
D
= 250
μ
A
100
V
V
DS
= 100 V, V
GS
= 0 V
Zero Gate Voltage Drain Current
1
μ
A
nA
nA
nA
I
DSS
V
DS
= 20 V, V
GS
= 0 V
10
50
-50
I
GSSF
I
GSSR
Gate-Body Leakage, Forward
Gate-Body Leakage, Reverse
V
GS
= 20 V, V
DS
= 0 V
V
GS
= -20 V, V
DS
= 0 V
On Characteristics
(2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
,
I
D
= 1 mA
0.8
80
1.7
2.0
6
V
V
GS
= 10 V, I
D
= 0.17 A
1.39
1.48
R
DS(ON)
Static Drain-Source On-Resistance
Ω
V
GS
= 4.5 V, I
D
= 0.17 A
10
g
FS
Forward Transconductance
V
DS
= 10 V, I
D
= 0.17 A
mS
V
Drain-Source Diode Forward
Voltage
V
SD
V
GS
= 0
V
, I
S
= 0.34 A
0.81
1.30
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
71
6.6
pF
pF
pF
V
DS
= 25 V, V
GS
= 0 V,
Output Capacitance
f = 1.0 MHz
Reverse Transfer Capacitance
2.74
Switching Characteristics
(2)
t
r
Turn-On Rise Time
Turn-Off Fall Time
Turn-On Delay
1.24
5.73
2.94
8.4
8
16
8
ns
ns
ns
ns
t
f
V
DD
= 30 V, I
D
= 0.28 A,
V
GS
= 10 V, R
GEN
= 6
Ω
t
d(on)
t
d(off)
Note:
Turn-Off Delay
13
2. Pulse test: pulse width
≤
300
μ
s, duty cycle
≤
2.0%.
© 2015 Fairchild Semiconductor Corporation
BSS123W Rev. 1.0
2
Typical Performance Characteristics
1
1.6
1.5
1.4
1.3
1.2
1.1
1
V
GS
= 10V
3.5V
6.0V
0.8
4.5V
3.0V
V
GS
= 2.5V
0.6
0.4
0.2
0
2.5V
3.0V
3.5V
4.5V
0.6
6.0V
10V
2.0V
0.9
0
0.2
0.4
0.8
1
0
1
2
3
4
5
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
Figure 2. On-Resistance Variation with Drain Current
and Gate Voltage
Figure 1. On-Region Characteristics
2.2
2
3.4
I
D
= 170mA
V
GS
= 10V
I
D
= 0.08A
3
1.8
1.6
1.4
1.2
1
T
A
= 125
o
C
2.6
2.2
1.8
0.8
0.6
0.4
1.4
T
A
= 25
o
C
1
0
2
4
6
8
10
-50
-25
0
25
50
75
100
125
150
T
J
, JUNCTION TEMPERATURE (
o
C)
V
GS
, GATE TO SOURCE VOLTAGE (V)
Figure 4. On-Resistance Variation with Gate-to-
Source Voltage
Figure 3. On-Resistance Variation with Temperature
1
1
V
GS
= 0V
V
DS
= 10V
0.8
0.6
0.1
T
A
= 125
o
C
25
o
C
0.01
0.4
-55
o
C
T
A
= 125
o
C
25
o
C
0.001
0.2
-55
o
C
2.5
0
0.0001
1
1.5
2
3
0
0.2
0.4
0.6
0.8
1
1.2
V
GS
, GATE TO SOURCE VOLTAGE (V)
V
SD
, BODY
DIODE FORWARD VOLTAGE (V)
Figure 6. Body Diode Forward Voltage Variation with
Source Current and Temperature
Figure 5. Transfer Characteristics
© 2015 Fairchild Semiconductor Corporation
BSS123W Rev. 1.0
3
Typical Performance Characteristics
(Continued)
f = 1 MHz
GS
= 0 V
10
V
I
D
= 0.17A
V
DS
= 30V
50V
C
iss
100
10
1
8
6
4
2
0
70V
C
oss
C
rss
0
0.4
0.8
1.2
1.6
2
0.1
1
10
100
Q
g
, GATE CHARGE (nC)
V
DS
– DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance
Figure 7. Gate Charge Characteristics
© 2015 Fairchild Semiconductor Corporation
BSS123W Rev. 1.0
4
Physical Dimensions
Figure 9. 3-LEAD, SC70, EIAJ SC-70, 1.25MM WIDE
© 2015 Fairchild Semiconductor Corporation
BSS123W Rev. 1.0
5
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