onsemi-CM1430-04DE
| Part # | onsemi-CM1430-04DE |
Download  | onsemi-CM1430-04DE |
LCD
a
nd Camera E
M
I
F
ilter
A
r
ray with ESD Protection
C
M
1
430
Features
Product Description
•
•
•
Four, six and eight channels of EMI filtering with
integrated ESD protection
Pi-style EMI filters in a capacitor-resistor-
capacitor (C-R-C) network
15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
Greater than 20dB attenuation (typical) at 1 GHz
TDFN package with 0.40mm lead pitch:
• 4-ch.
= 8-lead TDFN
The CM1430 is a family of pi-style EMI filter arrays
with ESD protection, which integrates four, six and
eight filters (C-R-C) in small form factor TDFN
0.40mm pitch packages. The CM1430 has
component values of 8.5pF-100
Ω
-8.5pF per channel.
The CM1430 has a cut-off frequency of 200MHz and
can be used in applications with data rates up to
80Mbps. The parts include ESD diodes on every pin,
which provide a very high level of protection for
sensitive electronic components that may be
subjected to electrostatic discharge (ESD). The ESD
protection diodes safely dissipate ESD strikes of
15kV, well beyond the maximum requirement of the
•
•
•
• 6-ch.
= 12-lead TDFN
• 8-ch.
= 16-lead TDFN
Tiny TDFN package size:
•
• 8-lead:
1.7mm x 1.35mm
• 12-lead:
2.5mm x 1.35mm
• 16-lead:
3.3mm x 1.35mm
Increased robustness against vertical impacts
during manufacturing process
IEC61000-4-2 international standard. Using the MIL-
STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than
30kV.
•
•
Lead-free version available
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-
to-use pin assignments. In particular, the CM1430 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
Applications
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
•
EMI filtering for data ports in cell phones, PDAs
or notebook computers.
•
•
•
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
The CM1430 is housed in space-saving, low-profile
8-,12- and 16-lead TDFN packages with a 0.4mm
pitch and is available with lead-free finishing. This
new small TDFN package provides up to 42% board
space savings vs. the 0.50mm pitch TDFN packages.
©2010 SCILLC.
All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1430/D
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PIN DESCRIPTIONS
DEVICE PIN(s)
DEVICE PIN(s)
NAME
DESCRIPTION
NAME
DESCRIPTION
-04
-06
-08
-04
-06
12
-08
16
1
1
1
FILTER1 Filter
+ ESD Channel 1
FILTER2 Filter
+ ESD Channel 2
FILTER3 Filter
+ ESD Channel 3
FILTER4 Filter
+ ESD Channel 4
FILTER5 Filter
+ ESD Channel 5
FILTER6 Filter
+ ESD Channel 6
FILTER7 Filter
+ ESD Channel 7
FILTER8 Filter
+ ESD Channel 8
8
FILTER1 Filter
+ ESD Channel 1
FILTER2 Filter
+ ESD Channel 2
FILTER3 Filter
+ ESD Channel 3
FILTER4 Filter
+ ESD Channel 4
FILTER5 Filter
+ ESD Channel 5
FILTER6 Filter
+ ESD Channel 6
FILTER7 Filter
+ ESD Channel 7
FILTER8 Filter
+ ESD Channel 8
2
3
4
2
3
4
5
6
2
3
4
5
6
7
8
7
6
5
11
10
9
15
14
13
12
11
10
9
8
7
GND PAD
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish
Ordering Part
Number
1
Ordering Part
Number
1
Pins
8
Package
TDFN-8
Part Marking
Part Marking
CM1430-04DF
CM1430-06DF
CM1430-08DF
VF
CM1430-04DE
CM1430-06DE
CM1430-08DE
VE
12
TDFN-12
TDFN-16
N30F
N30E
16
N308F
N308E
Note 1:
Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
DC Power per Resistor
100
500
mW
mW
DC Package Power Rating
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STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTIC
S
(SEE NOTE1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
22
Ω
C
TOTAL
Total Channel Capacitance
At 2.5VDC Reverse
14
17
pF
Bias, 1MHz, 30mVAC
C
Capacitance C1
At 2.5VDC Reverse
7
8.5
11
pF
Bias, 1MHz, 30mVAC
V
DIODE
I
LEAK
Standoff Voltage
I
DIODE
=10
μ
A
6.0
0.1
V
Diode Leakage Current (reverse bias)
V
DIODE
=+3.3V
1.0
μ
A
V
SIG
Signal Clamp Voltage
Positive Clamp
I
LOAD
= 10mA
I
LOAD
= -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
Negative Clamp
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
Note 2
30
15
kV
kV
b) Contact Discharge per IEC 61000-4-2 Level 4
R
DYN
Dynamic Resistance
Positive
2.3
0.9
Ω
Ω
Negative
Cut-off Frequency
Channel R = 100
Ω
,
Channel C = 8.5pF
f
C
Z
SOURCE
=50
Ω
, Z
LOAD
=50
Ω
200
MHz
Note 1:
T
A
=25
°
C unless otherwise specified.
Note 2:
ESD applied to input and output pins with respect to GND, one at a time.
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Performance Information
Typical Filter Performance (T
A
=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1.
Insertion Loss vs. Frequency (FILTER1 Input to GND)
Figure 2.
Insertion Loss vs. Frequency (FILTER2 Input to GND)
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Performance Information (cont’d)
Typical Diode Capacitance vs. Input Voltage
Figure 5.
Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5VDC and 25°C)
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Mechanical Details
CM1430-04DF/DE Mechanical Specifications
Dimensions for the CM1430-04DF/DE suplied in a 8-lead, 0.4mm pitch TDFN package are presented below.
For complete information on the TDFN-8, see the California Micro Devices TDFN Package Information
document.
PACKAGE DIMENSIONS
TDFN
Package
MO-229C
JEDEC
No.
8
Leads
Dim.
Millimeters
Inches
Min
Nom Max
Min
Nom Max
0.70
0.75
0.02
0.80 0.028
0.030 0.031
0.05 0.000
0.001 0.002
0.008 REF
A
A1
A3
b
0.00
0.20 REF
0.20
0.15
1.60
1.10
1.25
0.30
0.25 0.006
0.008 0.010
1.80 0.063
0.067 0.071
1.30 0.043
0.047 0.051
1.45 0.049
0.053 0.057
0.50 0.012
0.016 0.020
0.016 BSC
1.70
D
1.20
D2
E
1.35
0.40
E2
e
0.40 BSC
0.20
0.15
0.008
K
0.25
0.35 0.006
0.010 0.014
3000 pieces
L
# per
tape and
reel
Dimensions for 8-Lead, 0.4mm pitch
TDFN package
Controlling dimension: millimeters
This package is compliant with JEDEC standard MO-229C with the
exception of the “D”, “D2”, “E”, “E2”, “K” and “L” dimensions as
called out in the table above.
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Mechanical Details (cont’d)
CM1430-06DF/DE Mechanical Specifications
Dimensions for the CM1430-06DF/DE suplied in a 12-lead, 0.4mm pitch TDFN package are presented below.
PACKAGE DIMENSIONS
TDFN
Package
MO-229C
JEDEC
No.
12
Leads
Dim.
Millimeters
Inches
Min
Nom Max
Min
Nom Max
0.70
0.75
0.02
0.80 0.028
0.030 0.031
0.05 0.000
0.001 0.002
0.008 REF
A
A1
A3
b
0.00
0.20 REF
0.20
0.15
2.40
1.90
1.25
0.30
0.25 0.006
0.008 0.010
2.60 0.094
0.098 0.102
2.10 0.075
0.079 0.083
1.45 0.049
0.053 0.057
0.50 0.012
0.016 0.020
0.016 BSC
2.50
D
2.00
D2
E
1.35
0.40
E2
e
0.40 BSC
0.20
0.15
0.008
K
0.25
0.35 0.006
0.010 0.014
3000 pieces
L
Dimensions for 12-Lead, 0.4mm pitch
TDFN package
# per
tape and
reel
Controlling dimension: millimeters
This package is compliant with JEDEC standard MO-229C with the
exception of the “D”, “D2”, “E”, “E2”, “K” and “L” dimensions as
called out in the table above.
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Mechanical Details (cont’d)
CM1430-08DF/DE Mechanical Specifications
Dimensions for the CM1430-08DF/DE supplied in a 16-lead, 0.4mm pitch TDFN package are presented below.
For complete information on the TDFN-16, see the California Micro Devices TDFN Package Information
document.
PACKAGE DIMENSIONS
TDFN
Package
MO-229C
JEDEC
No.
16
Leads
Dim.
Millimeters
Inches
Min
Nom Max
Min
Nom Max
0.70
0.75
0.02
0.80 0.028
0.030 0.031
0.05 0.000
0.001 0.002
0.008 REF
A
A1
A3
b
0.00
0.200 REF
0.20
0.15
3.20
2.70
1.25
0.30
0.25 0.006
0.008 0.010
3.40 0.126
0.130 0.134
2.90 0.106
0.110 0.114
1.45 0.049
0.053 0.057
0.50 0.012
0.016 0.020
0.016 BSC
3.30
D
2.80
D2
E
1.35
0.40
E2
e
0.40 BSC
0.20
0.15
0.008
K
0.25
0.35 0.006
0.010 0.014
3000 pieces
L
Dimensions for 16-Lead, 0.4mm pitch
TDFN package
# per
tape and
reel
Controlling dimension: millimeters
This package is compliant with JEDEC standard MO-229C with the
exception of the “D”, “D2”, “E”, “E2”, “K” and “L” dimensions as
called out in the table above.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein.
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
SCILLC does not convey any license under its patent rights nor the
rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
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harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
Employer. This
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