onsemi-CM1454-08CP
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CM1454
Data Port EMI Filter Array
with ESD Protection
Description
The CM1454 is an EMI filter array with ESD protection in a CSP
form factor for the data port of a mobile handset.
The CM1454
−
08 is
configured in an 8 channel format and combines both
resistor
−
capacitor (R
−
C) and inductor
−
capacitor (L
−
C) filters in the
chip. There are five C
−
R
−
C filters with component values of 30 pF
−
100
W
−
30 pF which are used for the microphone and data ports.
There are also three C
−
L
−
C filters with values of 80 pF
−
3 nH
−
80 pF
which are designed for the stereo speaker port.
The CM1454’s C
−
RC filters have a cut
−
off frequency of 60 MHz
and an attenuation of better than 35 dB over the 800 MHz to 2.7 GHz
frequency range. The C
−
L
−
C filters have a cut
−
off frequency of
21 MHz with an attenuation of 40 dB at 1 GHz.
The parts integrate
ESD protection diodes on every pin that provide a very high level of
protection for sensitive electronic components against possible
electrostatic discharge (ESD). The ESD protection diodes connected
to the filter ports are designed and characterized to safely dissipate
ESD strikes of
15 k
V
,
w
hich is beyond the Level 4 requirement of the
IEC61000
−
4
−
2 international standard. In accordance with
MIL
−
STD
−
88
3
(
Method 3015) specification for Human Body Model
(HBM) ESD, the pins are also protected for contact discharges at
greater than
30 k
V
.
WLCSP20
CP SUFFIX
CASE 567BY
MARKING DIAGRAM
N548
CM1454
−
08
20
−
Bump CSP Package
N548
= CM1454
−
08CP
The CM1454 incorporates
OptiGuard
t
which results in improved
reliability at assembly. The CM1454 is available in a space saving, low
profile Chip Scale Package with RoHS compliant lead
−
free finishing.
ORDERING INFORMATION
†
Device
CM1454
−
08CP
Package
Shipping
CSP
−
20 3500/
T
a
pe
& Reel
(Pb
−
Free)
Features
•
OptiGuard
t
Coated for Improved Reliability
•
Eight Channels of EMI Filtering
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our
T
a
pe and Reel Packaging Specification
Brochure, BRD8011/D.
•
Three C
−
L
−
C Filters with ESD Protection for Stereo Speaker Port
•
Five C
−
R
−
C Filters with ESD Protection for Microphone and Data
Ports
•
15 kV ESD Protection on Each Channel
(IEC 61000
−
4
−
2 Level 4, Contact Discharge)
30 kV ESD Protection on Each Channel (HBM)
•
•
Chip Scale Package (CSP) Features Extremely Low Parasitic
Inductance for Optimum Filter and ESD Performance
•
20
−
Bump, 3.960 mm x 1.586 mm Footprint CSP
•
These Devices are Pb
−
Free and are RoHS Compliant
Applications
•
Combination I/O Data Port that has I/Os for Data,
Microphone and Speaker
•
EMI Filtering for Data Ports in Cell Phones, PDAs or
Notebook Computers
•
I/O Port Protection for Mobile Handsets, Notebook
Computers, PDAs, etc.
•
Wireless Handsets
•
Handheld PCs / PDAs
©
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
April, 2011
−
Rev. 3
CM1454/D
CM1454
ELECTRICAL SCHEMATIC
Figure 1. CM1454 Schematic Diagram of R
−
C and L
−
C Filter Arrays with ESD
2
CM1454
PACKAGE / PINOUT DIAGRAMS
T
o
p View
Bottom View
(Bumps Down View)
(Bumps Up View)
Orientation
Marking
1
2
3
4
5
6
7
8
+
A
B
C
C1 C2 C3 C4 C5 C6 C7 C8
B1
B2
B3
B4
Orientation
Marking
A1 A2 A3 A4 A5 A6 A7 A8
A1
CM1454
−
08CP
20
−
Bump CSP
Table 1. PIN DESCRIPTIONS
Pin Number
Pin Description
Pin Number
Pin Description
A1
A2
Filter #1 (Microphone)
Filter #2 (Microphone)
C1
C2
C3
C4
C5
C6
C7
C8
Filter #1
Filter #2
Filter #3
Filter #4
Filter #5
Filter #6
Filter #7
Filter #8
A3
Filter #3 (Stereo Headphone)
Filter #4 (Left Speaker)
Filter #5 (Right Speaker)
Filter #6 (Accessory ID)
Filter #7 (Data)
A4
A5
A6
A7
A8
Filter #8 (Data)
B1
−
B4
GND
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
°
C
Storage
T
e
mperature Range
DC current per Inductor
−
65 to +150
30
mA
W
DC Package Power Rating
0.5
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Rating
Units
Operating
T
e
mperature Range
−
40 to +85
°
C
3
CM1454
Symbol
Parameter
Conditions
Min
80
Typ
100
30
Max
120
36
Units
W
R
Resistance
Capacitance
Inductance
C
2.5 V dc; 1 MHz, 30 mV ac
24
pF
1
L
3.0
0.25
125
80
nH
W
R
Equivalent Series Resistance of Inductor
Capacitance
E
C
0 V dc, 1 MHz, 30 mV ac;
2.5 V dc, 1 MHz, 30 mV ac;
100
64
150
96
pF
2
pF
f
Cut
−
off Frequency
60
MHz
RC
Z
= 50
W
, Z
= 50
W
= 50
W
SOURCE
LOAD
f
Cut
−
off Frequency
= 50
W
, Z
21
MHz
LC
Z
SOURCE
LOAD
V
Stand
−
off Voltage
I = 10
m
A
6.0
0.1
V
m
A
V
ST
I
Diode Leakage Current
V
IN
= 3.3 V
1.0
LEAK
V
Signal Clamp Voltage
Positive Clamp
Negative Clamp
SIG
ESD
DYN
I
I
= 10 mA
=
−
10 mA
5.6
6.8
−
0.8
9.0
−
0.4
LOAD
LOAD
−
1.5
V
R
In
−
system ESD Withstand Voltage
a) Human Body Model, MIL
−
STD
−
883, Method 3015
b) Contact Discharge per IEC 61000
−
4
−
2 Level 4
kV
30
15
Dynamic Resistance
Positive
Negative
W
2.3
0.9
1. T =
25
°
C unless otherwise specified.
A
2. ESD
applied to input and output pins with respect to GND, one at a time.
3. Unused
pins are left open.
PERFORMANCE INFORMATION
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 2. Typical Diode Capacitance vs. Input Voltage
(normalized to 2.5 VDC)
4
CM1454
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50
W
Environment)
Figure 3. Attenuation Curve for CM1454 RC Filters: 1, 2, 6, 7, and 8
Figure 4. Attenuation Curve for CM1454 RC Filters: 3, 4, and 5
5
CM1454
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Value
0.240 mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non
−
Solder Mask defined pads
0.290 mm Round
0.125
−
0.150 mm
0.300 mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
50
m
m
T
o
lerance
−
Edge
T
o
C
orner Ball
Solder Ball Side Coplanarity
20
m
m
Maximum Dwell Time Above Liquidous
Maximum Soldering
T
e
mperature for Lead
−
free Devices using a Lead
−
free Solder Paste
60 seconds
260
°
C
Non
−
Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 5. Recommended Non
−
Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 6. Lead
−
free (SnAgCu) Solder Ball Reflow Profile
6
CM1454
PACKAGE DIMENSIONS
WLCSP20, 3.96×1.59
CASE 567BY
−
01
ISSUE O
D
A
B
NOTES:
1. DIMENSIONING
AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING
DIMENSION: MILLIMETERS.
3. COPLANARITY
APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
MILLIMETERS
DIM
A
A1
A2
b
MIN
0.56
0.21
MAX
0.72
0.27
2X
0.05
0.05
C
0.42 REF
0.29
0.35
2X
C
TOP VIEW
D
3.96 BSC
E
eD
eE
1.59 BSC
0.50 BSC
0.435 BSC
OptiGuard Option
A2
0.05
C
A
0.05
C
SEATING
PLANE
NOTE 3
C
A1
SIDE VIEW
eD/2
eD
20X
b
eE
0.05
0.03
C
C
A B
C
B
A
1
2
3
4
5
6
7
8
9
10 11 12
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.87
0.44
20X
0.25
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
OptiGuard
t
is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
SCILLC reserves the right to make changes without further notice
to any products herein.
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
SCILLC does not convey any license under its patent rights
nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal
Opportunity/Affirmative Action Employer.
This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMEN
T
:
N. American Technical Support
: 800
−
282
−
9855
T
o
ll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81
−
3
−
5773
−
3850
Literature Distribution Center for ON Semiconductor
P
.
O. Box 5163, Denver, Colorado 80217 USA
Phone
: 303
−
675
−
2175 or 800
−
344
−
3860
T
o
ll Free USA/Canada
Fax
: 303
−
675
−
2176 or 800
−
344
−
3867
T
o
ll Free USA/Canada
Email
: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
CM1454/D
