onsemi-CM6300
| Part # | onsemi-CM6300 |
Download  | onsemi-CM6300 |
CM6300
EMI Filters with ESD
Protection for SIM Card
Applications
Product Description
The CM6300 is a 3 x 3, 8
−
bump EMI filter with ESD protection
device for SIM card applications in 0.5 mm pitch CSP form factor. It is
fully compliant with IEC 61000
−
4
−
2. The CM6300 is RoHS II
compliant.
Table 1. PIN DESCRIPTIONS
WLCSP8
CASE 567CD
8
−
bump CSP Package
Pin
A2
A3
B1
B2
B3
C1
C2
C3
Description
Channel 1 External
Channel 1 Internal
Channel 2 External
GND
MARKING DIAGRAM
+
632
WWYY
Channel 2 Internal
Channel 3 External
V External
632
= CM6300
WWYY =
Date Code
Channel 3 Internal
ORDERING INFORMATION
PACKAGE / PINOUT DIAGRAMS
†
Device
CM6300
Package
Shipping
T
o
p View
Bottom View
CSP
−
8
5000/
T
a
pe & Reel
(Bumps Down View)
(Bumps Up View)
(Pb
−
Free)
Orientation
Marking
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our
T
a
pe and Reel Packaging Specification
Brochure, BRD8011/D.
1
2
3
3
2
1
A1
+
A3 A2
B3 B2
A
A
B
Orientation
Marking
B
C
B1
632
C3 C2 C1
C
ELECTRICAL SCHEMATIC
V (C2) {External}
R1
R2
R3
O1 (A3)
O2 (B3)
O3 (C3)
I1 (A2)
I2 (B1)
I3 (C1)
GND (B2)
©
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
April, 2011
−
Rev. 7
CM6300/D
CM6300
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Units
°
C
Storage
T
e
mperature Range
Operating
T
e
mperature Range
–55 to +150
–40 to +85
°
C
Symbol Parameter
Conditions
Min
80
Typ
100
47
Max
120
56.4
120
20
Units
W
R
R
R
Resistance
Resistance
Resistance
1
2
3
37.6
80
W
100
16.7
10.3
6.8
W
C
Capacitance on filter channels 1, 2 and 3
Capacitance on clamp channel (pin C2)
Breakdown Voltage (Positive)
At 1 MHz, V
= 0 V
13.4
8.2
6
pF
pF
V
IN
At 1 MHz, V
= 0 V
12.4
20
IN
V
B
I =
8 mA
F
V
ESD
ESD Protection Peak Discharge Voltage at A2, B1 and C1 pins
a) Contact Discharge per IEC 61000
−
4
−
2 standard
b) Air Discharge per IEC 61000
−
4
−
2 standard
kV
15
15
ESD Protection Peak Discharge Voltage at C2 pin
a) Contact Discharge per IEC 61000
−
4
−
2 standard
b) Air Discharge per IEC 61000
−
4
−
2 standard
kV
kV
15
15
ESD Protection Peak Discharge Voltage at A3, B3 and C3 pins
a) Contact Discharge per IEC 61000
−
4
−
2 standard
b) Air Discharge per IEC 61000
−
4
−
2 standard
4
4
1. All
parameters specified at T
= 25
°
C unless otherwise noted.
A
2. Standard
IEC 61000
−
4
−
2 with C
= 150 p
F
, R
= 330
W
.
Discharge
Discharge
MECHANICAL SPECIFICATION
Vertical Structure Specification*
Table 4. VERTICAL STRUCTURE DIMENSIONS
(nominal)
Ref.
a
Parameter
Die Thickness
Repassivation
UBM
−
(Ti/Cu)
Material
Silicon
Dimension
396
m
m
10
m
m
h
Polyimide
Plated Cu
Sputtered Cu
Sputtered Ti
5.0
m
m
0.4
m
m
d
0.1
m
m
UBM Wetting Area
Diameter
280
m
m
e
b
f
Bump Standoff
240
m
m
320
m
m
Solder Bump Diameter
after Bump Reflow
c
Metal Pad Height
Metal Pad Diameter
Finished Thickness
AlSiCu
1.5
m
m
60
m
m
g
D1
D2
0.650 mm
0.406 mm
Figure 1. Sectional View
* Daisy Chain CM6020
2
CM6300
RF CHARACTERISTICS
Figure 2. Insertion Loss, Filter 1 (pins A2, A3) and Filter 3 (pins C1, C3) (Bias = 0
V
, T
A
= 25
5
C)
Figure 3. Insertion Loss, Filter 2 (pins B1, B3) (Bias = 0
V
, T
A
= 25
5
C)
3
CM6300
PACKAGE DIMENSIONS
WLCSP8, 1.6×1.6
CASE 567CD
−
01
ISSUE O
D
A
B
E
NOTES:
PIN A1
1. DIMENSIONING
AND TOLERANCING PER
ASME Y14.5M, 1994.
REFERENCE
2. CONTROLLING
DIMENSION: MILLIMETERS.
3. COPLANARITY
APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
b
D
E
MIN
0.61
0.21
0.41 REF
0.29
1.60 BSC
1.60 BSC
0.50 BSC
MAX
0.69
0.27
2X
0.05
0.05
C
0.34
2X
C
TOP VIEW
SIDE VIEW
A2
A
e
0.05
C
RECOMMENDED
SOLDERING FOOTPRINT*
0.05
C
PACKAGE
OUTLINE
A1
SEATING
PLANE
NOTE 3
C
A1
e
8X
b
8X
e
0.05
0.03
C
C
A
B
0.25
C
B
A
0.50
PITCH
0.50
PITCH
DIMENSIONS: MILLIMETERS
1
2
3
BOTTOM VIEW
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).
SCILLC reserves the right to make changes without further notice
to any products herein.
SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
SCILLC does not convey any license under its patent rights
nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal
Opportunity/Affirmative Action Employer.
This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMEN
T
:
N. American Technical Support
: 800
−
282
−
9855
T
o
ll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81
−
3
−
5773
−
3850
Literature Distribution Center for ON Semiconductor
P
.
O. Box 5163, Denver, Colorado 80217 USA
Phone
: 303
−
675
−
2175 or 800
−
344
−
3860
T
o
ll Free USA/Canada
Fax
: 303
−
675
−
2176 or 800
−
344
−
3867
T
o
ll Free USA/Canada
Email
: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
CM6300/D
