onsemi-EMI7403FCTBG
| Part # | onsemi-EMI7403FCTBG |
| Download | onsemi-EMI7403FCTBG |
EMI7403
EMI Filter with ESD
Protection for MicroSD Card
Applications
Product Description
MARKING
The EMI7403 is a combination EMI filter with integrated TVS
diodes for use on Multimedia Card interfaces. This state
−
of
−
the
−
art
device utilizes solid
−
state, silicon
−
avalanche technology for superior
clamping performance and DC electrical characteristics. The
EMI7403 has been optimized for protection of MicroSD interfaces in
smart phones and other portable electronics.
DIAGRAM
74
YW
G
WLCSP15
CASE 567FX
Features
•
Provides ESD Protection to IEC61000
−
4
−
2:
15 kV Contact Discharge
74
Y
W
G
= Specific Device Code
=
Y
e
ar
= Work Week
•
Protection and Termination for 6 Lines + V
CC
= Pb
−
Free Package
•
These Devices are Pb
−
Free, Halogen Free/BFR Free and are RoHS
Compliant
ORDERING INFORMATION
†
Applications
Device
Package
Shipping
•
MicroSD Interfaces
•
MMC Interfaces
EMI7403FCTBG WLCSP15
5000 /
T
a
pe & Reel
(Pb
−
Free)
•
Feature Phones, Smart Phones
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our
T
a
pe and Reel Packaging Specifications
Brochure, BRD8011/D.
PACKAGE / PINOUT DIAGRAMS
A1 Corner
Indicator
1
2
3
4
4
3
2
1
A
B
C
D
A
B
C
D
74
YW
T
o
p View
(Bumps Down View)
Bottom View
(Bumps Up View)
©
Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
July, 2014
−
Rev. 0
EMI5106/D
EMI7403
Figure 1. Electrical Schematic
Table 1. PIN DESCRIPTIONS
Pin
A1
A2
A3
A4
Description
data0 Internal
Pin
B1
B2
B3
B4
Description
Pin
Description
Pin
D1
D2
D3
D4
Description
data3 Internal
clk Internal
C1
cmd Internal
data1 Internal
V
CC
External
data2 Internal
SDdata1 External
SDdata0 External
GND
SDclk External
C3
C4
GND
SDdata2 External
SDdata3 External
SDcmd External
2
EMI7403
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Unit
°
C
Storage
T
e
mperature Range
Operating
T
e
mperature Range
−
55 to +150
−
40 to +85
°
C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS
(T =
25
°
C unless otherwise noted)
A
Symbol
Parameter
Reverse Working Voltage
Test Conditions
Min
Typ
Max
Unit
V
V
RWM
3.3
V
Breakdown Voltage
6.0
9.0
0.5
V
BR
T
I
Channel Leakage Current
Channel Resistance (R1 to R6)
Cut
–
off Frequency
V
IN
= 3.3 V
0.1
40
m
A
W
LEAK
R
CH
f
50
W
Source and Load
300
MHz
3dB
T
e
rmination
F
Stop Band Attenuation
@ 700 MHz
@ 900 MHz
20
35
dB
kV
atten
V
In
–
system ESD Withstand Voltage
a) Contact discharge per IEC 61000
–
4
–
2 standard, Level 4
(External Pins)
b) Contact discharge per IEC 61000
–
4
–
2 standard, Level 1
(Internal Pins)
ESD
15
2
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Standard
IEC61000
−
4
−
2 with C
= 150 p
F
, R
= 330, GND grounded.
Discharge
Discharge
2. These
measurements performed with no external capacitor
.
3. TVS
devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
), which should be equal to or greater than the DC
RWM
4. V
is measured at pulse test current I
.
BR
T
3
EMI7403
RF CHARACTERISTICS
m1
0
−
5
−
10
−
15
−
20
−
25
−
30
−
35
−
40
−
45
−
50
1E+06
1E+07
1E+08
1E+09
1E+10
FREQUENCY (Hz)
Figure 2. S21 Attenuation Simulation
Data Rate
(Mbyte/s)
Interface
Fundamental Frequency (MHz)
EMI7403 Insertion Loss (dB)
m1 = 3.27
DDR50/SDR50
50
100 (m1)
4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP15, 1.56×1.56
CASE 567FX
ISSUE O
SCALE 4:1
DATE 07 JUN 2012
D
A
B
E
NOTES:
1. DIMENSIONING
AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING
DIMENSION: MILLIMETERS.
3. COPLANARITY
APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
b
D
E
MIN
0.47
0.185
0.305 REF
0.24
1.56 BSC
1.56 BSC
0.40 BSC
MAX
0.53
0.205
2X
0.10
0.10
C
0.29
2X
C
TOP VIEW
SIDE VIEW
e
A2
A
0.10
C
GENERIC
MARKING DIAGRAM*
0.05
C
XX
YW
G
SEATING
PLANE
NOTE 3
C
A1
e/2
XX =
Specific Device Code
15X
b
Y
W
G
=
Y
e
ar
= Work Week
= Pb
−
Free Package
e
e
0.05
0.03
C
C
A B
D
C
B
A
e/2
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb
−
Free indicator, “G” or microdot “
G
”,
may or may not be present.
1
2
3
4
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PITCH
A1
PACKAGE
OUTLINE
15X
0.23
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb
−
Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting
T
e
chniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions
are uncontrolled
except when stamped
“CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON81359E
WLCSP15, 1.56X1.56
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
©
Semiconductor Components Industries, LLC, 2019
onsemi
,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates
and/or subsidiaries in the United States and/or other countries.
onsemi
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of
onsemi
’s product/patent coverage may be accessed at
www.onsemi.com/site/pdf/Patent
−
Marking.pdf
.
onsemi
reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as
−
is” and
onsemi
makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using
onsemi
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
onsemi
does not convey any license
under any of its intellectual property rights nor the rights of others.
onsemi
products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use
onsemi
products for any such unintended or unauthorized application, Buyer shall indemnify and hold
onsemi
and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that
onsemi
was negligent regarding the design or manufacture of the part.
onsemi
is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS
:
For additional information, please contact your local Sales Representative at
