onsemi-FDB050AN06A0
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FDP050AN06A0 / FDB050AN06A0
®
N-Channel PowerTrench
MOSFET
60
V,
80 A,
5
m
Ω
Features
R
DS(on)
=
4.3
m
Ω
( Typ.) @ V
GS
= 10 V, I
D
= 80 A
Q
G(tot)
=
61
nC ( Typ.) @ V
GS
= 10 V
Low Miller Charge
•
•
•
•
Applications
•
•
•
Synchronous Rectification for ATX / Server / Telecom PS
U
Battery Protection Circui
t
Low Q
rr
Body Diode
Motor drives and Uninterruptible Power Supplie
s
•
UIS Capability (Single Pulse and Repetitive Pulse)
Formerly developmental type 82
5
75
D
D
G
G
G
D
2
-PAK
D
S
S
TO-220
S
MOSFET Maximum Ratings
T =
25°C unless otherwise noted
C
FDP050AN06A0
FDB050AN06A0
U
nit
Symbol
Parameter
V
DSS
V
GS
Drain to Source Voltage
Gate to Source Voltage
Drain Current
60
20
V
V
Continuous (T
C
< 135
o
C, V
GS
= 10V)
Continuous (
T
A
= 25
o
C, V
GS
= 10
V
,
R
θ
JA
= 43
o
C/W)
Pulsed
80
A
I
D
18
Figure 4
470
A
A
E
AS
Single Pulse Avalanche Energy (Note 1)
Power dissipation
Derate above 25
o
C
mJ
W
W/
o
C
o
C
245
P
D
1.63
T
J
, T
STG
Operating and Storage
T
e
mperature
-55 to 175
Thermal Characteristics
R
θ
JC
R
θ
JA
R
θ
JA
Thermal Resistance Junction to Case, Max. TO-220,
D
2
-PAK
Thermal Resistance Junction to Ambient, Max. TO-220,
D
2
-PAK
(Note 2)
Thermal Resistance Junction to Ambient
D
2
-PAK
, Max. 1in
2
copper pad area
0
.61
o
C/W
o
C/W
o
C/W
62
43
Publication Order Number:
©
200
3
Semiconductor Components Industries, LLC.
November
-2017,
Rev.
3
FDP050AN06A0/D
Package Marking and Ordering Information
Device Marking
FDB050AN06A0
FDP050AN06A0
Device
Package
D
2
–
PAK
TO-220
Reel Size
330 mm
T
u
be
Tape Width
24 mm
N/A
Quantity
800 units
50 units
FDB050AN06A0
FDP050AN06A0
Electrical Characteristics
T
C
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Off Characteristics
B
VDSS
Drain to Source Breakdown
V
o
ltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I
D
= 250
µ
A, V
GS
= 0V
60
–
–
–
–
–
–
V
V
DS
= 50V
1
I
DSS
µ
A
nA
V
GS
= 0V
T
C
= 150
o
C
–
250
100
I
GSS
V
GS
= 20V
–
On Characteristics
V
GS(TH)
Gate to Source Threshold
V
o
ltage
V
GS
= V
DS
, I
D
= 250
µ
A
D
= 80A, V
GS
= 10V
I
D
= 40A, V
GS
= 6V
2
–
–
4
V
I
0.0043 0.005
0.007 0.011
–
r
DS(ON)
Drain to Source On Resistance
Ω
I
D
= 80A, V
GS
= 10
V
,
–
0.0085 0.010
T
J
= 175
o
C
Dynamic Characteristics
C
ISS
Input Capacitance
–
–
–
3900
750
270
61
–
–
pF
pF
pF
nC
nC
nC
nC
nC
V
DS
= 25V, V
GS
= 0V,
f = 1MHz
C
OSS
C
RSS
Q
g(TOT)
Q
g(TH)
Q
gs
Output Capacitance
Reverse
T
r
ansfer Capacitance
T
o
tal Gate Charge at 10V
Threshold Gate Charge
–
V
GS
= 0V to 10V
80
11
–
V
GS
= 0V to 2V
–
–
–
–
8
V
DD
= 30V
I
D
= 80A
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
24
I
g
= 1.0mA
Q
gs2
16
–
Q
gd
15
–
Switching Characteristics
(V
GS
= 10V)
t
ON
t
d(ON)
t
r
T
u
rn-On Time
T
u
rn-On Delay Time
Rise Time
–
–
–
–
–
–
–
16
160
28
29
–
264
ns
ns
ns
ns
ns
ns
–
–
V
DD
= 30
V
,
I
D
= 80A
V
GS
= 10V, R
GS
= 4.3
Ω
t
d(OFF)
t
f
T
u
rn-Off Delay Time
Fall Time
–
–
t
OFF
T
u
rn-Off Time
86
Drain-Source Diode Characteristics
I
I
SD
= 80A
SD
= 40A
–
–
–
–
–
–
–
–
1.25
1.0
34
V
V
V
SD
Source to Drain Diode
V
o
ltage
t
rr
Reverse Recovery Time
I
SD
= 75A, dI
SD
/dt = 100A/
µ
s
I
SD
= 75A, dI
SD
/dt = 100A/
µ
s
ns
nC
Q
RR
Reverse Recovered Charge
25
Notes:
1:
Starting T
= 25°C, L = 229
µ
H, I
= 64A.
J
AS
2:
Pulse width = 100s.
2
Typical Characteristics
T
= 25°C unless otherwise noted
C
1.2
160
CURRENT LIMITED
BY
P
ACKAGE
1.0
120
0.8
0.6
0.4
0.2
0
80
40
0
150
0
25
50
75
100
175
25
50
75
100
125
150
175
125
o
o
T
, CASE TEMPERATURE (
C)
C
T
, CASE TEMPERATURE (
C)
C
Figure 1.
Normalized Power Dissipation vs
Ambient Temperature
Figure 2.
Maximum Continuous Drain Current vs
Case Temperature
2
DUTY CYCLE – DESCENDING ORDER
0.5
0.2
1
0.1
0.05
0.02
0.01
P
DM
0.1
t
1
t
2
NOTES:
DUTY FACTOR: D = t /t
1
2
SINGLE PULSE
PEAK T
= P
x Z
x R
+ T
J
DM
θ
JC
θ
JC C
0.01
10
-5
-4
-3
-2
-1
0
1
10
10
10
t,
R
ECTANGULAR PULSE DURATION (s)
10
10
10
Figure 3.
Normalized Maximum Transient Thermal Impedance
2000
1000
o
T
= 25
C
C
FOR TEMPERATURES
o
ABOVE 25 C DERATE PEAK
CURRENT AS FOLLOWS:
175 – T
150
C
I = I
25
V
= 10V
GS
TRANSCONDUC
T
ANCE
M
A
Y
L
IMIT CURRENT
IN THIS REGION
100
50
-5
-4
-3
-2
-1
0
1
10
10
10
10
t, PULSE WIDTH (s)
10
10
10
Figure 4.
Peak Current Capability
3
Typical Characteristics
T
= 25°C unless otherwise noted
C
1000
100
10
500
If R = 0
= (L)(I
)/(1.3*RATED BV
t
– V
DD
)
AV
AS
DSS
10
µ
s
If R
≠
0
t
AV
= (L/R)ln[(I
*R)/(1.3*RATED BV
– V
) +1]
DD
AS
DSS
100
µ
s
100
1ms
o
S
T
ARTING T
= 25 C
J
OPERATION IN THIS
AREA M
A
Y
B
E
10ms
LIMITED BY r
DS(ON)
10
DC
1
o
SINGLE PULSE
STARTING T
= 150
C
J
T
= MAX RATED
J
o
T
= 25
C
C
1
0.01
0.1
0.1
1
10
100
1
10
, DRAIN TO SOURCE VOLTAGE (V)
100
V
t ,
TIME IN AVALANCHE (ms)
AV
DS
NOTE: Refer to
ON Semiconductor
Application Notes AN7514 and
AN7515
Figure 5.
Forward Bias Safe Operating Area
Figure 6.
Unclamped Inductive Switching
Capability
160
160
PULSE DURATION = 80
µ
s
V
= 7V
GS
DUTY CYCLE = 0.5% MAX
V
= 15V
DD
V
= 10V
V
= 6V
GS
GS
120
80
40
0
120
80
40
0
o
T
= 175 C
J
V
= 5V
o
GS
T
= 25
C
J
o
T
= 25 C
C
o
PULSE DURATION = 80
µ
s
DUTY CYCLE = 0.5% MAX
T
= -55
C
J
0
0.5
1.0
1.5
4.0
4.5
5.0
5.5
6.0
V
, G
A
TE TO SOURCE VOLTAGE (V)
V
, DRAIN TO SOURCE VOLTAGE (V)
GS
DS
Figure 7.
Transfer Characteristics
Figure 8.
Saturation Characteristics
8
2.0
PULSE DUR
A
T
ION = 80
µ
s
DUTY CYCLE = 0.5% MAX
PULSE DURATION = 80
µ
s
DUTY CYCLE = 0.5% MAX
V
= 6V
GS
7
6
5
4
1.5
1.0
0.5
V
= 10V
GS
V
= 10
V
, I
=80A
D
GS
0
20
40
, DRAIN CURRENT (A)
60
80
-80
-40
0
40
80
120
160
200
o
I
T , JUNCTION TEMPERATURE ( C)
D
J
Figure 9.
Drain to Source On Resistance vs Drain
Current
Figure 10.
Normalized Drain to Source On
Resistance vs Junction Temperature
4
Typical Characteristics
T
= 25°C unless otherwise noted
C
1.4
1.2
1.0
0.8
0.6
0.4
1.15
1.10
1.05
1.00
0.95
0.90
I
= 250
µ
A
V
= V
, I
= 250
µ
A
DS D
D
GS
-80
-40
0
40
80
120
160
200
-80
-40
0
40
80
120
160
200
o
o
T , JUNCTION TEMPERATURE (
C)
T ,
JUNCTION TEMPERATURE (
C)
J
J
Figure 11.
Normalized Gate Threshold Voltage vs
Junction Temperature
Figure 12.
Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
10000
10
V
= 30V
DD
C
=
C +
C
GD
ISS
GS
8
6
4
2
0
C
≅
C +
C
GD
OSS
DS
1000
C
=
C
RSS
GD
WAVEFORMS IN
DESCENDING ORDER:
I
I
= 80A
= 18A
D
D
V
= 0
V
, f =
1
MHz
GS
100
0.1
0
10
20
30
40
50
60
70
60
1
10
V
, DRAIN TO SOURCE VOLTAGE (V)
Q ,
GATE CHARGE (nC)
DS
g
Figure 13.
Capacitance vs Drain to Source
Voltage
Figure 14.
Gate Charge Waveforms for Constant
Gate Current
5
Test Circuits and Waveforms
V
DS
BV
DSS
t
P
L
V
DS
I
VARY t
TO OBTAIN
P
AS
+
–
V
DD
R
REQUIRED PEAK I
G
AS
V
DD
V
GS
DUT
t
P
I
0V
AS
0
0.01
Ω
t
AV
Figure 15.
Unclamped Energy Test Circuit
Figure 16.
Unclamped Energy Waveforms
V
DS
V
Q
DD
g(TOT)
V
L
DS
V
GS
V
= 10V
GS
V
GS
+
–
Q
gs2
V
DD
DUT
V
= 2V
GS
I
g(REF)
0
Q
g(TH)
Q
Q
gs
gd
I
g(REF)
0
Figure 17.
Gate Charge Test Circuit
Figure 18.
Gate Charge Waveforms
V
DS
t
t
ON
OFF
t
d(OFF)
t
d(ON)
R
L
t
t
f
r
V
DS
90%
90%
+
–
V
GS
V
DD
10%
10%
0
DUT
90%
50%
R
GS
V
GS
50%
PULSE WIDTH
V
10%
GS
0
Figure 19.
Switching Time Test Circuit
Figure 20.
Switching Time Waveforms
6
Thermal Resistance vs. Mounting Pad Area
The maximum rated junction temperature, T
JM
, and the
thermal resistance of the heat dissipating path determines
the maximum allowable device power dissipation, P
DM
, in an
80
60
40
20
R
= 26.51+ 19.84/(0.262+Area) EQ.2
θ
JA
R
= 26.51+ 128/(1.69+Area) EQ.3
θ
JA
application.
Therefore the application’s ambient
temperature, T
A
(
o
C), and thermal resistance R
θ
JA
(
o
C/W)
must be reviewed to ensure that T
JM
is never exceeded.
Equation 1 mathematically represents the relationship and
serves as the basis for establishing the rating of the part.
(
T
–
T
)
A
JM
(EQ. 1)
P
=
–
—————————-
DM
R
θ
JA
In using surface mount devices such as the TO-263
package, the environment in which it is applied will have a
significant influence on the part’s current and maximum
power dissipation ratings. Precise determination of P
DM
is
complex and influenced by many factors:
10
0.1
(0.645)
1
(6.45)
(64.5)
2
2
AREA, TOP COPPER AREA in
(cm )
Figure 21.
Thermal Resistance vs Mounting
Pad Area
1. Mounting pad area onto which the device is attached and
whether there is copper on one side or both sides of the
board.
2. The number of copper layers and the thickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non steady state applications, the pulse width, the
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
ON Semiconductor
provides thermal information to
assist the designer’s
preliminary application evaluation.
Figure 21
defines the R
θ
JA
for the device as a function of the top
copper (component side) area. This is for a horizontally
positioned FR-4 board with 1oz copper after 1000 seconds of
steady state power with no air flow. This graph provides the
necessary information for calculation of the steady state
junction temperature or power dissipation. Pulse applications
can be evaluated using the
ON Semiconductor
device
Spice thermal model or manually utilizing the normalized
maximum transient thermal impedance curve.
Thermal resistances corresponding to other copper areas
can be obtained from Figure 21 or by calculation using
Equation 2 or 3. Equation 2 is used for copper area
defined in inches square and equation 3 is for area in
centimeters square. The area, in square inches or square
centimeters is the top copper area including the gate and
source pads.
19.84
(
0.262 +
Area
)
R
=
26.51 +
–
———————————–
(EQ. 2)
θ
JA
θ
JA
Area in Inches Squared
128
R
=
26.51 +
–
——————————–
(EQ. 3)
(
1.69 +
Area
)
Area in Centimeters Squared
7
PSPICE Electrical Model
.SUBCKT FDB050AN06A0
2 1 3 ; rev February 2003
Ca 12 8 1.5e-9
Cb 15 14 1.5e-9
Cin 6 8 3.75e-9
LDRAIN
DPLCAP
DRAIN
2
5
10
Dbody 7 5 DbodyMOD
Dbreak 5 11 DbreakMOD
Dplcap 10 5 DplcapMOD
RLDRAIN
RSLC1
51
DBREAK
11
+
RSLC2
5
ESLC
51
Ebreak 11 7 17 18 64.8
Eds 14 8 5 8 1
Egs 13 8 6 8 1
Esg 6 10 6 8 1
Evthres 6 21 19 8 1
–
+
17
50
–
DBODY
RDRAIN
6
8
EBREAK 18
–
ESG
EVTHRES
+
16
21
+
–
19
8
MWEAK
Evtemp 20 6 18 22 1
LGATE
EVTEMP
RG
A
TE
GATE
1
6
+
–
18
22
MMED
It 8 17 1
9
20
MSTRO
8
RLGATE
Lgate 1 9 4.7e-9
Ldrain 2 5 1.0e-9
Lsource 3 7 4.03e-9
LSOURCE
CIN
SOURCE
3
7
RSOURCE
RLSOURCE
RLgate 1 9 47
RLdrain 2 5 10
RLsource 3 7 40
S1A
S2A
RBREAK
12
15
13
14
13
17
18
8
RVTEMP
19
–
S1B
S2B
Mmed 16 6 8 8 MmedMOD
Mstro 16 6 8 8 MstroMOD
Mweak 16 21 8 8 MweakMOD
13
CB
CA
IT
14
+
+
VBAT
6
8
5
8
EGS
EDS
+
Rbreak 17 18 RbreakMOD 1
Rdrain 50 16 RdrainMOD 1.1e-3
Rgate 9 20 1.3
–
–
8
22
RVTHRES
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3
Rsource 8 7 RsourceMOD 2.1e-3
Rvthres 22 8 RvthresMOD 1
Rvtemp 18 19 RvtempMOD 1
S1a 6 12 13 8 S1AMOD
S1b 13 12 13 8 S1BMOD
S2a 6 15 14 13 S2AMOD
S2b 13 15 14 13 S2BMOD
Vbat 22 19 DC 1
ESLC 51 50
VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*250),10))}
.MODEL DbodyMOD D (IS=1.3E-11 N=1.04 RS=1.76e-3 TRS1=2.7e-3 TRS2=2e-7
+ CJO=2.7e-9 M=5.4e-1 TT=1e-10 XTI=3.9)
.MODEL DbreakMOD D (RS=8e-1 TRS1=5e-4 TRS2=-8.9e-6)
.MODEL DplcapMOD D (CJO=1.3e-9 IS=1e-30 N=10 M=0.45)
.MODEL MmedMOD NMOS (VTO=3.7 KP=9 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=1.3)
.MODEL MstroMOD NMOS (VTO=4.29 KP=155 IS=1e-30 N=10 TOX=1 L=1u W=1u)
.MODEL MweakMOD NMOS (VTO=3.05 KP=0.03 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=13 RS=0.1)
.MODEL RbreakMOD RES (TC1=9.3e-4 TC2=-5.5e-7)
.MODEL RdrainMOD RES (TC1=1.3e-2 TC2=4e-5)
.MODEL RSLCMOD RES (TC1=1e-3 TC2=1e-5)
.MODEL RsourceMOD RES (TC1=1e-3 TC2=1e-6)
.MODEL RvthresMOD RES (TC1=-5.8e-3 TC2=-1.4e-5)
.MODEL RvtempMOD RES (TC1=-2.8e-3 TC2=1e-6)
.MODEL S1AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-4 VOFF=-2)
.MODEL S1BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-2 VOFF=-4)
.MODEL S2AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-1.5 VOFF=0.5)
.MODEL S2BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=0.5 VOFF=-1.5)
.ENDS
Note: For further discussion of the PSPICE model, consult
A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options
; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank
Wheatley.
8
SABER Electrical Model
rev February 2003
template FDB050AN06A0 n2,n1,n3
electrical n2,n1,n3
{
var i iscl
dp..model dbodymod =
(isl=1.3e-11,nl=1.04,rs=1.76e-3,trs1=2.7e-3,trs2=2e-7,cjo=2.7e-9,m=5.4e-1,tt=1e-10,xti=3.9)
dp..model dbreakmod = (rs=8e-1,trs1=5e-4,trs2=-8.9e-6)
dp..model dplcapmod =
(cjo=1.3e-9,isl=10e-30,nl=10,m=0.45)
m..model mmedmod = (type=_n,vto=3.7,kp=9,is=1e-30, tox=1)
m..model mstrongmod = (type=_n,vto=4.29,kp=155,is=1e-30, tox=1)
m..model mweakmod = (type=_n,vto=3.05,kp=0.03,is=1e-30, tox=1,rs=0.1)
LDRAIN
sw_vcsp..model s1amod =
(ron=1e-5,roff=0.1,von=-4,voff=-2)
sw_vcsp..model s1bmod =
(ron=1e-5,roff=0.1,von=-2,voff=-4)
sw_vcsp..model s2amod =
(ron=1e-5,roff=0.1,von=-1.5,voff=0.5)
sw_vcsp..model s2bmod =
(ron=1e-5,roff=0.1,von=0.5,voff=-1.5)
c.ca n12 n8 = 1.5e-9
DPLCAP
5
DRAIN
2
10
RLDRAIN
RSLC1
51
RSLC2
c.cb n15 n14 = 1.5e-9
c.cin n6 n8 = 3.75e-9
ISCL
DBREAK
11
50
–
dp.dbody n7 n5 = model=dbodymod
dp.dbreak n5 n11 = model=dbreakmod
dp.dplcap n10 n5 = model=dplcapmod
RDRAIN
6
8
ESG
DBODY
EVTHRES
+
16
21
+
–
19
8
MWEAK
LGATE
EVTEMP
spe.ebreak n11 n7 n17 n18 = 64.8
RG
A
T
E
G
A
TE
1
+
6
–
18
22
EBREAK
+
spe.eds n14 n8 n5 n8 = 1
spe.egs n13 n8 n6 n8 = 1
spe.esg n6 n10 n6 n8 = 1
spe.evthres n6 n21 n19 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
MMED
9
20
MSTRO
8
17
18
–
RLGATE
LSOURCE
CIN
SOURCE
3
7
RSOURCE
RLSOURCE
i.it n8 n17 = 1
S1A
S2A
RBREAK
12
15
13
8
14
13
l.lgate n1 n9 = 4.7e-9
l.ldrain n2 n5 = 1.0e-9
l.lsource n3 n7 = 4.03e-9
17
18
RVTEMP
19
S1B
S2B
13
CB
CA
IT
14
–
+
+
res.rlgate n1 n9 = 47
res.rldrain n2 n5 = 10
res.rlsource n3 n7 = 40
VBAT
6
8
5
8
EGS
EDS
+
–
–
8
22
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u
RVTHRES
m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u
m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u
res.rbreak n17 n18
= 1, tc1=9.3e-4,tc2=-5.5e-7
res.rdrain n50 n16
= 1.1e-3, tc1=1.3e-2,tc2=4e-5
res.rgate n9 n20 = 1.3
res.rslc1 n5 n51
= 1e-6, tc1=1e-3,tc2=1e-5
res.rslc2 n5 n50 = 1e3
res.rsource n8 n7
= 2.1e-3, tc1=1e-3,tc2=1e-6
res.rvthres n22 n8
= 1, tc1=-5.8e-3,tc2=-1.4e-5
res.rvtemp n18 n19
= 1, tc1=-2.8e-3,tc2=1e-6
sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod
sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod
v.vbat n22 n19 = dc=1
equations {
i (n51->n50) +=iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/250))** 10))
}
}
9
SPICE Thermal Model
JUNCTION
th
REV 23 February 2003
FDB050AN06A0T
CTHERM1 TH 6 5e-3
CTHERM2 6 5 1.3e-2
CTHERM3 5 4 1.4e-2
CTHERM4 4 3 1.9e-2
CTHERM5 3 2 4.7e-2
CTHERM6 2 TL 9e-2
RTHERM1
RTHERM2
RTHERM3
RTHERM4
RTHERM5
RTHERM6
CTHERM1
6
RTHERM1 TH 6 1e-2
RTHERM2 6 5 3.1e-2
RTHERM3 5 4 4.5e-2
RTHERM4 4 3 1.2e-1
RTHERM5 3 2 1.3e-1
RTHERM6 2 TL 1.52e-1
CTHERM2
CTHERM3
CTHERM4
CTHERM5
CTHERM6
5
SABER Thermal Model
SABER thermal model FDB050AN06A0T
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 6 =5e-3
ctherm.ctherm2 6 5 =1.3e-2
ctherm.ctherm3 5 4 =1.4e-2
ctherm.ctherm4 4 3 =1.9e-2
ctherm.ctherm5 3 2 =4.7e-2
ctherm.ctherm6 2 tl =9e-2
4
3
2
rtherm.rtherm1 th 6 =1e-2
rtherm.rtherm2 6 5 =3.1e-2
rtherm.rtherm3 5 4 =4.5e-2
rtherm.rtherm4 4 3 =1.2e-1
rtherm.rtherm5 3 2 =1.3e-1
rtherm.rtherm6 2 tl =1.52e-1
}
tl
CASE
10
Mechanical Dimensions
TO-220 3L
Figure
2
2
.
TO-220, Molded, 3Lead, Jedec Variation AB
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11
Mechanical Dimensions
TO-263 2L (D
2
PAK)
Figure
2
3
. 2LD, TO263, Surface Mount
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Dimension in Millimeters
12
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