onsemi-FDD3672-F085

Part #onsemi-FDD3672-F085
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onsemi-FDD3672-F085
March 2011  
FDD3672_F085  
N-Channel UltraFET Trench MOSFET  
100V, 44A, 28m
Ω  
Applications  
Features  
„
DC/DC converters and Off-Line UPS  
„
Typ r

DS(on)

= 24m
Ω
at V

GS

= 10V, I

D

= 44A  
„
Distributed Power Architectures and VRMs  
„
Primary Switch for 24V and 48V Systems  
„
High Voltage Synchronous Rectifier  
„
Typ Q

g(10)

= 24nC at V

GS

= 10V  
„
Low Miller Charge  
„
Low Q

rr

Body Diode  
„
Optimized efficiency at high frequencies  
„
UIS Capability (Single Pulse and Repetitive Pulse)  
„
Qualified to AEC Q101  
„
RoHS Compliant  
FDD3672_F085 Rev. C  
1

MOSFET Maximum Ratings
T

C

= 25°C unless otherwise noted  
Symbol  
V

DSS  

Parameter  
Ratings  
100  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
V

GS  

±20  
Drain Current Continuous (T

C

< 30

o

C, V

GS

= 10V)  
44  
I

D  

A
Pulsed  
See Figure 4  
73  
E

AS  

P

D  

Single Pulse Avalanche Energy  
Power Dissipation  
Derate above 25

o

C  
(Note 1)  
mJ  
W
W/

o

C  

o

C  
144  
0.96  
T

J

, T

STG

Operating and Storage
T
e
mperature  
-55 to +175  
Thermal Characteristics  
R

θ
JC  

R

θ
JA  

Maximum Thermal Resistance Junction to Case  
Maximum Thermal Resistance Junction to Ambient TO-263,1in

2

copper  
pad area  
1.04  
52  

o

C/W  

o

C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
2500 units  
FDD3672  
FDD3672_F085  
TO-252AA  
330mm  
16mm  
Electrical Characteristics
T

J

= 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
B

VDSS  

I

DSS  

Drain to Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
I

D

= 250
μ
A, V

GS

= 0V  
100  
–
–
–
–
–
1
V
V

DS

= 80V, V

GS

= 0V  
T

J

= 150

o

C  
–
–
–
μ
A  
nA  
250  
±100  
I

GSS  

V

GS

= ±20V  
On Characteristics  
V

GS(th)  

r

DS(on)  

Gate to Source Threshold Voltage  
Drain to Source On Resistance  
V

GS

= V

DS

, I

D

= 250
μ
A  

D

= 44A, V

GS

= 10V  
2
–
3
4
V
Ω
Ω
Ω
I
0.024  
0.028  
0.063  
0.028  
0.047  
0.074  
I

D

= 21A, V

GS

= 6
V
,  
–
I

D

= 44A, V

GS

= 10
V
,
T

J

= 175°C  
–
Dynamic Characteristics  
C

iss  

Input Capacitance  
–
–
–
–
–
–
–
–
1635  
240  
60  
–
–
pF  
pF  
pF  
nC  
nC  
nC  
nC  
nC  
V

DS

= 25V, V

GS

= 0V,  
f = 1MHz  
C

oss  

C

rss  

Output Capacitance  
Reverse Transfer Capacitance  
T
o
tal Gate Charge at 10V  
Threshold Gate Charge  
–
Q

g(TOT)  

Q

g(TH)  

Q

gs  

V

GS

= 0 to 10V  
24  
36  
4.5  
–
V

GS

= 0 to 2V  
3
V
I

DD

= 50V  

D

= 44A  
I

g

= 1.0mA  
Gate to Source Gate Charge  
Gate Charge Threshold to Plateau  
Gate to Drain “Miller“ Charge  
8.3  
5.3  
5.8  
Q

gs2  

Q

gd  

–
–
FDD3672_F085 Rev. C  
2

Electrical Characteristics
T

J

= 25

o

C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Switching Characteristics  
t

on  

t

d(on)  

t

r  

Turn-On Time  
–
–
–
–
–
–
–
78  
–
ns  
ns  
ns  
ns  
ns  
ns  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Turn-Off Time  
12  
37  
24  
44  
–
–
V
V

DD

= 50V, I

D

= 44A,  

GS

= 10V, R

GS

= 11
Ω  
t

d(off)  

t

f  

–
–
t

off  

70  
Drain-Source Diode Characteristics  
I

SD

= 44A  
–
–
–
–
0.9  
0.8  
44  
1.25  
1.0  
57  
V
V
V

SD  

Source to Drain Diode Voltage  
I

SD

= 21A  
t

rr  

Reverse Recovery Time  
ns  
nC  
I

F

= 44A, dI

SD

/dt = 100A/
μ
s  
Q

rr  

Reverse Recovery Charge  
58  
76  
Notes:  
o
1:
Starting T
 
= 25
 
C, L = 0.2mH, I
 
= 27A  
J
AS  
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry.
 
For  
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems  
certification.  
FDD3672_F085 Rev. C  
3

Typical Characteristics  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
50  
40  
30  
20  
10  
0
CURRENT LIMITED  
BY PACKAGE  
V

GS

= 10V  
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
T

C

, CASE TEMPERATURE
(

o

C
)  
T

C

, CASE TEMPERATURE
(

o

C
)  
Figure 2.
 
Maximum Continuous Drain Current vs  
Case Temperature  
Figure 1.
 
Normalized Power Dissipation vs Case  
Temperature  
2
DUTY CYCLE – DESCENDING ORDER  
1
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
P
DM  
t
1
0.1  
t
2
NOTES:  
DUTY FACTOR: D = t
 
/t  
1
2
PEAK T
 
= P  
x Z  
x R  
+ T  
J
DM  
θ
JA  
θ
JA C  
SINGLE PULSE  
0.01  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

t, RECTANGULAR
 
PULSE DURATION(s)  
Figure 3.
 
Normalized Maximum Transient Thermal Impedance  
1000  
100  
10  
T

C

= 25

o

C  
V

GS

= 10V  
FOR TEMPERATURES  
ABOVE 25

o

C DERATE PEAK  
CURRENT AS FOLLOWS:  
175 – T

C  

I = I

2  

150  
SINGLE PULSE  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

t, RECTANGULAR PULSE DURATION(s)  
Figure 4.
 
Peak Current Capability  
FDD3672_F085 Rev. C  
4

Typical Characteristics  
100  
10  
1
200  
100  
If R = 0  
= (L)(I
 
)/(1.3*RATED BV  
t
AV  
– V  
)
AS  
DSS  
DD  
If R  
AV  
≠
0  
t
= (L/R)ln[(I
 
*R)/(1.3*RATED BV  
– V
 
) +1]  
DSS DD  
AS  
100us  
10  
STARTING T

J

= 25

o

C  
SINGLE PULSE  
T
J
= MAX RATED  
o
T
C
= 25  
C
1
1ms  
STARTING T

J

= 150

o

C  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY r  
DS(on)  
10ms  
DC  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
1
10  
100  
300  
t

AV

, TIME IN AVALANCHE (ms)  
V

DS

, DRAIN TO SOURCE VOLTAGE (V)  
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515  
Figure 6.
 
Unclamped Inductive Switching  
Capability  
Figure 5.
 
Forward Bias Safe Operating Area  
80  
80  
PULSE DURATION = 80
μ
s  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80
μ
s  
DUTY CYCLE = 0.5% MAX  
V

GS

= 10V  
V

DD

= 5V  
60  
60  
40  
20  
0
V

GS

= 8V  
V

GS

= 7V  
V

GS

= 6V  
V

GS

= 5V  
40  
20  
0
T

J

= 25

o

C  
T

J

= 175

o

C  
T

J

= -55

o

C  
0
1
2
3
4
5
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5  
V

GS

, GATE TO SOURCE VOLTAGE (V)  
V

DS

, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7.
 
Transfer Characteristics  
Figure 8.
 
Saturation Characteristics  
100  
80  
60  
40  
20  
0
3.0  
PULSE DURATION = 80
μ
s  
DUTY CYCLE = 0.5% MAX  
I

D

=
44A  
PULSE DURATION = 80
μ
s  
DUTY CYCLE = 0.5% MAX  
2.5  
2.0  
1.5  
1.0  
0.6  
T

J

= 175

o

C  
T

J

= 25

o

C  
I

D

= 44A  
V

GS

= 10V  
5
6
7
8
9
10  
-80  
-40  
0
40  
80  
120  
160  
200  
o
T

J

, JUNCTION TEMPERATURE
(
C
)  
V

GS

, GATE TO SOURCE VOLTAGE
(
V
)  
Figure 9.
 
Drain to Source On-Resistance  
Variation vs Gate to Source Voltage  
Figure 10.
 
Normalized Drain to Source On  
Resistance vs Junction Temperature  
FDD3672_F085 Rev. C  
5

Typical Characteristics  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
V

GS

=
V

DS  

I

D

= 5mA  
I
D
= 250
μ
A  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
T

J

, JUNCTION TEMPERATURE
(

o

C
)  
T

J

, JUNCTION TEMPERATURE
(

o

C
)  
Figure 11.
 
Normalized Gate Threshold Voltage vs  
Junction Temperature  
Figure 12.
 
Normalized Drain to Source  
Breakdown Voltage vs Junction Temperature  
10  
10000  
I
D
= 44A  
V

DD

= 50
V  
8
C

iss  

V

DD

= 40
V  
1000  
V

DD

= 60V  
6
C

oss  

4
2
0
100  
f = 1MHz  
V

GS

= 0V  
C

rss  

10  
0.1  
0
5
10  
15  
20  
25  
1
10  
80  
V

DS

, DRAIN TO SOURCE VOLTAGE
(
V
)  
Q

g

,
GATE CHARGE(nC)  
Figure 13.
 
Capacitance vs Drain to Source  
Voltage  
Figure 14.
 
Gate Charge vs Gate to Source Voltage  
FDD3672_F085 Rev. C  
6