onsemi-FDI8442

Part #onsemi-FDI8442
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onsemi-FDI8442
August 2007  
FDI8442  
N-Channel PowerTrench
 
MOSFET  
®
40V, 80A, 2.9m
Ω  
Features  
Applications  
„
Automotive Engine Control  
„
Typ r

DS(on)

= 2.3m
Ω
at V

GS

= 10V, I

D

= 80A  
„
Powertrain Management  
„
Solenoid and Motor Drivers  
„
Electronic Steering  
„
Typ Q

g(10)

= 181nC at V

GS

= 10V  
„
Low Miller Charge  
„
Low Q

rr

Body Diode  
„
Integrated Starter / Alternator  
„
UIS Capability (Single Pulse and Repetitive Pulse)  
„
Qualified to AEC Q101  
„
Distributed Power Architectures and VRMs  
„
Primary Switch for 12V Systems  
„
RoHS Compliant  
©2007 Fairchild Semiconductor Corporation  
1
FDI8442 Rev
. A  

MOSFET Maximum Ratings
T

C

= 25°C unless otherwise noted  
Symbol  
V

DSS  

Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
40  
V
V

GS  

±20  
V
Drain Current Continuous (T

C

<158

o

C, V

GS

= 10V)  
Drain Current Continuous (T

amb

= 25

o

C, V

GS

= 10V, with R

θ
JA

= 62

o

C/W)  
Pulsed  
80  
23  
I

D  

A
See Figure 4  
720  
E

AS  

P

D  

Single Pulse Avalanche Energy  
(Note 1)  
mJ  
W
W/

o

C  

o

C  
Power Dissipation  
Derate above 25

o

C  
254  
1.7  
T

J

, T

STG

Operating and Storage Temperature  
-55 to +175  
Thermal Characteristics  
R

θ
JC  

Thermal Resistance Junction to Case  
0.59  
62  

o

C/W  

o

C/W  
R

θ
JA  

Thermal Resistance Junction to Ambient  
(Note 2)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
50 units  
FDI8442  
FDI8442  
TO-262  
Tube  
N/A  
Electrical Characteristics
T

J

= 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
B

VDSS  

Drain to Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
I

D

= 250
μ
A, V

GS

= 0V  
40  
–
–
–
–
–
–
V
1
V

DS

= 32V  
I

DSS  

μ
A  
nA  
V

GS

= 0V  
T

J

= 150°C  
–
250  
±
100  
I

GSS  

V

GS

=
±
20V  
–
On Characteristics  
V

GS(th)  

Gate to Source Threshold Voltage  
V

DS

= V

GS

, I

D

= 250
μ
A  
2
–
2.9  
2.3  
4
V
I

D

= 80A, V

GS

= 10V  
2.9  
r

DS(on
)  

Drain to Source On Resistance  
I

D

= 80A, V

GS

= 10V,  
T

J

= 175°C  
m
Ω  
–
3.9  
5.0  
Dynamic Characteristics  
C

iss  

C

oss  

C

rss  

R

G  

Input Capacitance  
–
–
–
–
–
–
–
–
–
12200  
1040  
640  
1.0  
–
pF  
pF  
pF  
Ω
V

DS

= 25V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
–
–
V

GS

= 0.5V, f = 1MHz  
V

GS

= 0 to 10V  
–
235  
30  
–
Q

g(TOT)

Total Gate Charge at 10V  
181  
23  
nC  
nC  
nC  
nC  
nC  
Q

g(TH)  

Q

gs  

Threshold Gate Charge  
V

GS

= 0 to 2V  
V

DD

= 20V  

D

= 80A  
I

g

= 1mA  
Gate to Source Gate Charge  
Gate Charge Threshold to Plateau  
Gate to Drain “Miller” Charge  
I
49  
Q

gs2  

Q

gd  

26  
–
41  
–
FDI8442 Rev
. A  
2

Electrical Characteristics
T

J

= 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Switching Characteristics  
t

(on)  

t

d(on)  

t

r  

Turn-On Time  
–
–
–
–
–
–
–
62  
ns  
ns  
ns  
ns  
ns  
ns  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Turn-Off Time  
19.5  
19.3  
57  
–
–
V
V

DD

= 20V, I

D

= 80A  

GS

= 10V, R

GS

= 2
Ω  
t

d(off)  

t

f  

–
–
17.2  
–
t

off  

118  
Drain-Source Diode Characteristics  
I

SD

= 80A  
–
–
–
–
0.9  
0.8  
49  
1.25  
1.0  
64  
V
V
V

SD  

Source to Drain Diode Voltage  
I

SD

= 40A  
t

rr  

Reverse Recovery Time  
Reverse Recovery Charge  
I

F

= 75A, di/dt = 100A/
μ
s  
I

F

= 75A, di/dt = 100A/
μ
s  
ns  
nC  
Q

rr  

70  
91  
Notes:  
o
1:
Starting T
 
= 25
 
C, L = 0.35mH, I
 
= 64A  
J
AS  
2:
Pulse width = 100s.  
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry.
 
For  
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems  
certification.  
FDI8442 Rev
. A  
3

Typical Characteristics  
300  
250  
200  
150  
100  
50  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
CURRENT LIMITED  
BY PACKAGE  
V

GS

= 10V  
0
25  
50  
75  
100  
125  
150  
175  
0
25  
50  
75  
100  
125  
150  
175  
T

C

, CASE TEMPERATURE
(

o

C
)  
T

C

, CASE TEMPERATURE
(

o

C
)  
Figure 1.
 
Normalized Power Dissipation vs Case  
Temperature  
Figure 2.
 
Maximum Continuous Drain Current vs  
Case Temperature  
2
DUTY CYCLE – DESCENDING ORDER  
1
D = 0.50  
0.20  
0.10  
P
DM  
0.1  
0.01  
1E-3  
0.05  
0.02  
0.01  
t
1
t
2
NOTES:  
DUTY FACTOR: D = t /t  
1
2
PEAK T
 
= P  
x Z  
x R  
+ T  
J
DM  
θ
JC  
θ
JC C  
SINGLE PULSE  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

t, RECTANGULAR
 
PULSE DURATION(s)  
Figure 3.
 
Normalized Maximum Transient Thermal Impedance  
10000  
T

C

= 25

o

C  
V

GS

= 10V  
TRANSCONDUCTANCE  
FOR TEMPERATURES  
ABOVE 25

o

C DERATE PEAK  
MAY LIMIT CURRENT  
IN THIS REGION  
CURRENT AS FOLLOWS:  
1000  
100  
10  
175 – T

C  

I = I

25  

150  
SINGLE PULSE  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

t, RECTANGULAR PULSE DURATION(s)  
Figure 4.
 
Peak Current Capability  
FDI8442 Rev
. A  
4

Typical Characteristics  
500  
100  
4000  
1000  
If R = 0  
= (L)(I
 
)/(1.3*RATED BV  
t
AV  
– V  
)
AS  
DSS  
DD  
If R  
≠
0  
10us  
t
= (L/R)ln[(I
 
*R)/(1.3*RATED BV  
– V
 
) +1]  
DSS DD  
AV  
AS  
100us  
100  
STARTING T

J

= 25

o

C  
10  
10  
1
LIMITED  
BY PACKAGE  
STARTING T

J

= 150

o

C  
1ms  
1
SINGLE PULSE  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY r  
DS(on)  
T
J
= MAX RATED  
10ms  
DC  
o
T
C
= 25
 
C  
0.1  
5000  
1000  
0.01  
0.1  
1
10  
100  
1
10  
V

DS

, DRAIN TO SOURCE VOLTAGE (V)  
100  
t

AV

, TIME IN AVALANCHE (ms)  
NOTE:
Refer to Fairchild Application Notes AN7514 and AN7515  
Figure 6.
 
Unclamped Inductive Switching  
C
apability  
Figure 5.
 
Forward Bias Safe Operating Area  
160  
160  
PULSE DURATION = 80
μ
s  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80
μ
s  
DUTY CYCLE = 0.5% MAX  
V

GS

= 10V  
V

DD

= 5V  
120  
V

GS

= 5V  
120  
V

GS

= 4.5V  
T

J

= 175

o

C  
80  
80  
T

J

= 25

o

C  
T

J

= -55

o

C  
40  
40  
V

GS

= 4V  
0
0
2.0  
0
1
2
3
4
5
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
V

DS

, DRAIN TO SOURCE VOLTAGE (V)  
V

GS

, GATE TO SOURCE VOLTAGE (V)  
Figure 7.
 
Transfer Characteristics  
Figure 8.
 
Saturation Characteristics  
50  
1.8  
PULSE DURATION = 80
μ
s  
PULSE DURATION = 80
μ
s  
DUTY CYCLE = 0.5% MAX  
DUTY CYCLE = 0.5% MAX  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
40  
30  
20  
10  
0
T

J

= 175

o

C  
T

J

= 25

o

C  
I

D

= 80A  
V

GS

= 10V  
4
5
6
7
8
9
10  
-80  
-40  
0
40  
80  
120  
160  
200  
o
T

J

, JUNCTION TEMPERATURE
(
C
)  
V

GS

, GATE TO SOURCE VOLTAGE
(
V
)  
Figure 9.
 
Drain to Source On-Resistance  
Variation vs Gate to Source Voltage  
Figure 10.
 
Normalized Drain to Source On  
Resistance vs Junction Temperature  
FDI8442 Rev
. A  
5

Typical Characteristics  
1.10  
1.05  
1.00  
0.95  
0.90  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
I

D

= 250
μ
A  
V

GS

=
V

DS  

I

D

=
250
μ
A  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
T

J

, JUNCTION TEMPERATURE
(

o

C
)  
T

J

, JUNCTION TEMPERATURE
(

o

C
)  
Figure 11.
 
Normalized Gate Threshold Voltage vs  
Junction Temperature  
Figure 12.
 
Normalized Drain to Source  
Breakdown Voltage vs Junction Temperature  
40000  
10  
C

iss  

I
D
= 80A  
8
10000  
V

DD

= 15V  
V

DD

= 20V  
C

oss  

6
V

DD

= 25V  
1000  
4
2
0
C

rss  

f = 1MHz  
V

GS

= 0V  
100  
0.1  
1
10  
50  
0
50  
100  
150  
200  
V

DS

, DRAIN TO SOURCE VOLTAGE
(
V
)  
Q

g

,
GATE CHARGE(nC)  
Figure 13.
 
Capacitance vs Drain to Source  
Voltage  
Figure 14.
 
Gate Charge vs Gate to Source Voltage  
FDI8442 Rev
. A  
6

TRADEMARKS  
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and  
is not intended to be an exhaustive list of all such trademarks.  
ACEx

®  

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™  
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ISOPLANAR™  
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MicroFET™  
Power247

®  

SuperSOT™-8  
SyncFET™  
Build it Now™  
CorePLUS™  
CROSSVOLT
™  
CTL™  
POWEREDGE

®  

Power-SPM™  
PowerTrench

®  

Programmable Active Droop™  
QFET

®  

The Power Franchise

®  

Current Transfer Logic™  
TinyBoost™  
TinyBuck™  
TinyLogic

®  

TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
µSerDes™  
UHC

®  

EcoSPARK

®  

QS™  
®
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
SMART START™  
SPM

®  

STEALTH™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
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®  

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®  

FACT Quiet Series™  
FACT

®  

MicroPak™  
MillerDrive™  
Motion-SPM™  
OPTOLOGIC

®  

FAST

®  

FastvCore™  
FPS™  
OPTOPLANAR

®  

®
UniFET™  
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®  

PDP-SPM™  
Power220

®  

Global Power Resource

SM  

DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF  
THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE  
UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF  
FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE  
PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life
 
support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A
 
critical component in any component of a life support,  
device, or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
This datasheet contains the design specifications for product  
development. Specifications may change in any manner without notice.  
Advance Information  
Formative or In Design  
This datasheet contains preliminary data; supplementary data will be  
published at a later date. Fairchild Semiconductor reserves the right to make  
changes at any time without notice to improve design.  
Preliminary  
First Production  
Full Production  
Not In Production  
This datasheet contains final specifications. Fairchild Semiconductor reserves  
the right to make changes at any time without notice to improve design.  
No Identification Needed  
Obsolete  
This datasheet contains specifications on a product that has been  
discontinued by Fairchild Semiconductor. The datasheet is printed for  
reference information only.  
Rev. I31  
FDI8442 Rev
. A  
7