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June 2001
FDT458P
30V P-Channel PowerTrench
Ò
MOSFET
General Description
Features
This
P
–
Channel MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers, and battery chargers.
·
3.4 A, –30 V.
R
DS(ON)
= 130 m
W
@ V
GS
= 10 V
R
DS(ON)
= 200 m
W
@ V
GS
= 4.5 V
·
Fast switching speed
These MOSFETs feature faster switching and lower
gate charge than other MOSFETs with comparable
R
DS(ON)
specifications.
·
Low gate charge (2.5 nC ty
p
ical)
·
High performance trench technology for extremely
low R
DS(ON)
Applications
·
Battery chargers
·
Motor drives
·
High power and current handling capability in a
widely used surface mount package
D
D
D
D
S
S
D
G
S
G
D
S
SOT-223
*
(J23Z)
G
G
SOT-223
Absolute Maximum Ratings
T
A
=25
o
C unless otherwise noted
Symbol
V
DSS
Parameter
Drain-Source Voltage
Ratings
– 30
Units
V
V
A
V
GSS
I
D
Gate-Source Voltage
Drain Current
– Continuous
– Pulsed
±
20
(Note 1a)
3.4
10
P
D
W
Maximum Power Dissipation
(Note 1a)
(Note 1b)
(Note 1c)
3.0
1.3
1.1
T
J
, T
STG
Operating and Storage Junction Temperature Range
–55 to +150
°
C
Thermal Characteristics
R
q
JA
Thermal Resistance, Junction-to-Ambient
(Note 1a)
(Note 1)
42
12
°
C/W
°
C/W
R
q
J
C
Thermal Resistance, Junction-to-Case
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
458P
FDT458P
13’’
12mm
2500 units
Ó
2001 Fairchild Semiconductor Corporation
FDT458P Rev. B(W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= –250
m
A
–30
V
Breakdown Voltage Temperature
Coefficient
D
BV
DSS
D
T
J
I
D
= –250
m
A, Referenced to 25
°
C
–23
mV/
°
C
I
DSS
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
V
DS
= –24 V,
V
GS
= 0 V
V
GS
= –25 V,
V
DS
= 0 V
V
GS
= –25 V,
V
DS
= 0 V
–1
m
A
nA
nA
I
GSSF
I
GSSR
100
–100
On Characteristics
(Note 2)
V
GS(th)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
V
DS
= V
G
S
,
I
D
= –250
m
A
–1
–5
–1.8
4
–3
V
D
V
GS(th)
D
T
J
R
DS(on)
I
D
= –250
m
A, Referenced to 25
°
C
mV/
°
C
m
W
Static Drain–Source
On–Resistance
V
GS
= –10 V,
I
D
= –3.4 A
105
157
147
130
200
210
V
GS
= –4.5 V,
I
D
= –2.7 A
V
G
S
=–10 V, I
D
=–3.4 A, T
J
=125
°
C
I
D(on)
g
FS
On–State Drain Current
V
GS
= –10 V,
V
DS
= –5 V,
V
DS
= –5 V
I
D
= –3.4 A
A
S
Forward Transconductance
3
Dynamic Characteristics
C
Input Capacitance
205
55
pF
pF
pF
iss
V
DS
= –15 V,
f = 1.0 MHz
V
GS
= 0 V,
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
26
Switching Characteristics
(Note 2)
t
d(on)
t
r
t
d(off)
t
f
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V
DD
= –15 V,
V
GS
= –10 V,
I
D
= –1 A,
R
GEN
= 6
W
4.5
12.5
11
9
23
20
4
ns
ns
ns
2
ns
Q
g
V
DS
= –15 V,
V
GS
= –10 V
I
D
= –3.4 A,
2.5
0.7
1
3.5
nC
nC
nC
Q
gs
Q
gd
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current
–2.5
–1.2
A
V
Drain–Source Diode Forward
V
SD
V
GS
= 0 V,
I
S
= –2.5 A
(Note 2)
–0.8
Voltage
Notes:
1.
R
q
J
A
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins.
R
q
J
C
is guaranteed by design while R
q
C
A
is determined by the user’s board design.
a) 42°C/W
when
mounted on a 1in
pad of 2 oz copper
b) 95°C/W
when
mounted on a .0066
i
n
2
pad of 2 oz
copper
c) 110°C/W
when mounted on a
minimum pad.
2
2.
Pulse Test: Pulse Width < 300
m
s, Duty Cycle < 2.0%
FDT458P Rev. B(W)
Typical Characteristics
2
1.8
1.6
1.4
1.2
1
10
V
GS
= -10V
-6.0V
-5.0V
-4.5V
8
6
4
2
0
V
GS
=-4.5V
-4.0V
-5.0V
-6.0V
-3.5V
-7.0V
-8.0V
-10V
-3.0V
0.8
0
1
2
3
4
5
0
2
4
6
8
10
–
V
D
S
, DRAIN TO SOURCE VOLTAGE (V)
-I
D
, DRAIN CURRENT (A)
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
1.7
1.5
1.3
1.1
0.9
0.7
0.55
I
D
= -3.4A
V
GS
= -10V
I
D
= -1.7A
0.45
0.35
0.25
0.15
0.05
T
A
= 125
o
C
T
A
= 25
o
C
-50
-25
0
25
50
75
100
125
150
175
2
4
6
8
10
T
J
, JUNCTION TEMPERATURE
(
o
C)
–
V
GS
, GATE TO SOURCE VOLTAGE (V)
Figure 3. On-Resistance Variation with
Temperature.
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
5
4
3
2
1
0
10
V
GS
=0V
V
D
S
= -5V
25
o
C
125
o
C
T
A
= -55
o
C
T
A
= 12
5
o
C
1
25
o
C
0.1
-5
5
o
C
0.01
0.001
0.0001
1.5
2
2.5
3
3.5
4
0
0.2
0.4
0.6
0.8
1
1.2
1.4
–
V
GS
, GATE TO SOURCE VOLTAGE (V)
–
V
S
D
, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
FDT458P Rev. B(W)
Typical Characteristics
10
300
250
200
150
100
50
I
D
= -3.4A
V
D
S
= -5V
-10V
f = 1 MHz
V
GS
= 0 V
8
6
4
2
0
C
ISS
-15V
C
OSS
C
RSS
0
0
1
2
3
4
5
0
5
10
15
20
25
30
Q
g
, GATE CHARGE (nC)
-V
D
S
, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics.
Figure 8. Capacitance Characteristics.
100
10
200
SINGLE PULSE
R
q
J
A
= 11
0
o
C
/W
T
A
= 25
o
C
160
100
m
s
R
DS(ON)
LIMIT
1m
10ms
120
80
100ms
1
1s
10s
DC
V
GS
= -10V
SINGLE PULSE
R
q
JA
= 11
0
o
C/W
T
A
= 25
o
C
0.1
0.01
40
0
0.1
1
10
100
0.0001
0.001
0.01
0.1
1
10
100
1000
-V
D
S
, DRAIN-SOURCE VOLTAGE (V)
SINGLE PULSE TIME (SEC)
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
R
q
JA
(t) = r(t) +
R
q
0.2
JA
R
q
= 110 °C/W
JA
0.1
0.01
0.1
0.05
P(pk)
0.02
t
1
0.01
t
2
T
J
–
T
A
= P *
R
q
JA
(t)
Single Pulse
Duty Cycle, D =
t
1
/
t
2
0.001
0.001
0.01
0.1
1
10
100
1000
t
1
, TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDT458P Rev. B(W)
6.70
6.20
B
0.10
C B
3.10
2.90
3.25
4
1.90
A
3.70
3.30
6.10
1.90
1
3
0.84
0.60
2.30
2.30
0.95
4.60
0.10
C B
LAND PATTERN RECOMMENDATION
SEE DETAIL A
1.80 MAX
7.30
6.70
0.08
C
C
0.10
0.00
NOTES: UNLESS OTHERWISE SPECIFIED
A) DRAWING
BASED ON JEDEC REGISTRATION
TO-261C, VARIATION AA.
B) ALL
DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE BURRS
OR MOLD FLASH. MOLD FLASH OR BURRS
DOES NOT EXCEED 0.10MM.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M-2009.
R0.15±0.05
R0.15±0.05
10°
5°
GAGE
PLANE
0.35
0.20
E) LANDPATTERN
NAME: SOT230P700X180-4BN
F) DRAWING
FILENAME: MKT-MA04AREV3
10°
0°
TYP
0.25
10°
5°
0.60 MIN
SEATING
PLANE
1.70
DETAIL A
SCALE: 2:1
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. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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