onsemi-FGPF4533

Part #onsemi-FGPF4533
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onsemi-FGPF4533
November 2013  
FGPF4533  
330 V PDP Trench IGBT  
Features  
General Description  
•
•
•
•
•
High Current Capability  
Low Saturation Voltage: V  
High Input Impedance  
Fast Switching  
Using novel trench IGBT technology, Fairchild’s new series of  
trench IGB
T
s
o
ffer the optimum performance for consumer  
appliances, PDP TV and lighting applications where low con-  
duction and switching losses are essential.  
= 1.55 V @ IC = 50 A  
CE (sat)  
RoHS Compliant  
Applications  
•
PDP T
V
, Consumer Appliances, Lighting  
TO-220F  
(Retractable)  
G C
 
E  
Absolute Maximum Ratings  
Symbol  
Description  
Ratings  
330  
Unit  
V

CES  

Collector to Emitter Voltage  
Gate to Emitter Voltage  
Collector Current  
V
V
A
V

GES  

30  
@ T

C

= 25

o

C  
200  
I

C pulse(1)*  

Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction
T
e
mperature  
Storage
T
e
mperature Range  
@ T

C

= 25

o

C  
@ T

C

= 100

o

C  
28.4  
W
W

o

C  

o

C  
P

D  

11.4  
T

J  

-55 to +150  
-55 to +150  
T

stg  

Maximum Lead
T
e
mp. for soldering  
Purposes, 1/8” from case for 5 seconds  

o

C  
T

L  

300  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
4.4  
Unit  

o

C
/
W  

o

C
/
W  
R

JC

(IGBT)  
R

JA  

Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
–
–
62.5  
Notes:  

(1) Half Sine Wave, D < 0.01,
 
pluse width < 5

sec  
* Ic_pluse limited by max Tj  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev. C1  
1

Package Marking and Ordering Information  
Part Number  
Top Mark  
Package Packing
 
Method  
Reel Size  
Tape Width  
Quantity  
FGPF4533  
FGPF4533  
TO-220F  
Tube  
N/A  
N/A  
50  
Electrical Characteristics of the IGBT  
T =
 
25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
BV

CES  

Collector to Emitter Breakdown Voltage
 
V

GE

= 0 V, I

C

= 250
A  
330  
–
–
–
–
V
BV

CES  

T

J  

T
e
mperature Coefficient of Breakdown  
0.3  
V/

o

C  
V

GE

= 0 V, I

C

= 250
A  
Voltage  
I

CES  

I

GES  

Collector Cut-Off Current  
G-E Leakage Current  
V

CE

= V

CES

, V

GE

= 0 V  
V

GE

= V

GES

, V

CE

= 0 V  
–
–
–
–
100  
A  
±400  
nA  
On Characteristics  
V

GE(th)  

G-E Threshold Voltage  
I

C

= 250
A, V

CE

= V

GE  

I

C

= 20 A
,
V

GE

= 15 V  
I

C

= 50 A
,
V

GE

= 15 V,  
2.4  
–
3.3  
4.0  
–
V
V
1.15  
V

CE(sat)  

Collector to Emitter  
Saturation Voltage  
–
–
1.55  
1.6  
1.8  
–
V
V
T

C

= 25

o

C  
I
T

C

= 50 A
,
V

GE

= 15 V,  

C

= 125

o

C  
Dynamic Characteristics  
C

ies  

C

oes  

C

res  

Input Capacitance  
–
–
–
1294  
57  
–
–
–
pF  
pF  
pF  
V

CE

= 30 V V

GE

= 0 V,  
,
Output Capacitance  
f = 1 MHz  
Reverse Transfer Capacitance  
41  
Switching Characteristics  
t

d(on)

Turn-On Delay Time  
t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

–
–
–
–
–
–
–
–
–
–
–
6
22  
40  
220  
6
–
–
–
–
–
–
–
–
–
–
–
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
V
R

CC

= 200 V, I

C

= 20 A  

G

= 5
, V

GE

= 15 V  
ResistiveLoad,T

C

=25

o

C  
Rise Time  
Turn-Off Delay Time  
Fall Time  
Turn-On Delay Time  
Rise Time  
V

CC

= 200 V, I

C

= 20 A,  

G

= 5

, V

GE

= 15 V,  
Resistive Load, T

C

= 125

o

C  
24  
42  
277  
44  
6
R
Turn-Off Delay Time  
Fall Time  
Q

g  

T
o
tal Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
V

CE

= 200 V I

C

= 20 A  
V
,
Q

ge  

Q

gc  

GE

= 15 V  
14  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev. C1  
2

Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
200  
200  
T

C

= 25

o

C  
12V  
20V  
15V  
20V  
10V  
T

C

= 125

o

C  
12V  
15V  
10V  
150  
150  
V

GE

= 8V  
V

GE

= 8V  
100  
100  
50  
0
50  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Collector-Emitter Voltage, V

CE

[V]  
Collector-Emitter Voltage, V

CE

[V]  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Transfer Characteristics  
200  
200  
Common Emitter  
V

CE

= 10V  
T

C

= 25

o

C  
T

C

= 125

o

C  
Common Emitter  
V

GE

= 15V  
T

C

= 25

o

C  
T

C

= 125

o

C  
150  
150  
100  
100  
50  
0
50  
0
0
2
4
6
8
10  
12  
0
1
2
3
4
5
Collector-Emitter Voltage, V

CE

[V]  
Gate-Emitter Voltage,V

GE

[V]  
Figure 5. Saturation Voltage vs. Case  
Figure 6. Saturation Voltage vs. V  
GE  
Temperature at Variant Current Level  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
20  
Common Emitter  
T

C

= 25

o

C  
Common Emitter  
V

G
E

= 15V  
16  
12  
8
50A  
50A  
30A  
30A  
I

C

= 20A  
4
I

C

= 20A  
4
0
0
8
12  
16  
20  
0
20  
40  
60  
80 100
 
120 140  
Case Temperature, T

C

[

o

C
]  
Gate-Emitter Voltage, V

GE

[V]  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev. C1  
3

Typical Performance Characteristics  
Figure 7. Saturation Voltage vs. V  
Figure 8. Capacitance Characteristics  
GE  
20  
2400  
Common Emitter  
T

C

= 125

o

C  
Common Emitter  
V

GE

= 0V, f = 1MHz  
T

C

= 25

o

C  
2000  
16  
12  
8
1600  
C

ies  

50A  
1200  
30A  
800  
4
C

oes  

C

res  

400  
I

C

= 20A  
0
0
0.1  
0
4
8
12  
16  
20  
1
10  
30  
Gate-Emitter Voltage, V

GE

[V]  
Collector-Emitter Voltage, V

CE

[V]  
Figure 9. Gate charge Characteristics  
Figure 10. SOA Characteristics  
500  
15  
Common Emitter  
T

C

= 25

o

C  
100  
10
s  
12  
100
s  
1ms  
10 ms  
DC  
10  
1
V

CC

= 100V  
9
200V  
6
Single Nonrepetitive  
o
Pulse T
 
= 25
 
C  
C
Curves must be derated  
linearly with increase  
in temperature  
0.1  
3
0
0.01  
0.1  
1
10  
100  
1000  
0
15  
30  
45  
Collector-Emitter Voltage, V

CE

[V]  
Gate Charge, Q

g

[nC]  
Figure 11. Turn-on Characteristics vs.  
Figure 12. Turn-off Characteristics vs.  
Gate Resistance  
Gate Resistance  
1000  
100  
t

d(off)  

t

r  

100  
10  
Common Emitter  
V

CC

= 200V, V

GE

= 15V  
t

d(on)  

Common Emitter  
V

CC

= 200V, V

GE

= 15V  
t

f  

I

C

= 20A  
I

C

= 20A  
T

C

= 25

o

C  
T

C

= 125

o

C  
T

C

= 25

o

C  
T

C

= 125

o

C  
10  
1
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
Gate Resistance, R

G

[
]  
Gate Resistance, R

G

[
]  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev. C1  
4

Typical Performance Characteristics  
Figure 13. Turn-on Characteristics vs.  
Collector Current  
Figure 14. Turn-off Characteristics vs.  
Collector Current  
100  
400  
t

r  

t

d(off)  

100  
10  
t

d(on)  

Common Emitter  
V

GE

= 15V, R

G

= 5
 
t

f  

Common Emitter  
V

GE

= 15V, R

G

= 5
  
T

C

= 25

o

C  
T

C

= 25

o

C  
T

C

= 125

o

C  
T

C

= 125

o

C  
1
10  
10  
10  
20  
30  
40  
50  
20  
30  
40  
50  
Collector Current, I

C

[A]  
Collector Current, I

C

[A]  
Figure 15. Switching Loss vs. Gate Resistance  
Figure 16. Switching Loss vs. Collector Current  
1000  
5000  
Common Emitter  
V

CC

= 200V, V

GE

= 15V  
I

C

= 20A  
1000  
T

C

= 25

o

C  
T

C

= 125

o

C  
E

off  

100  
E

off  

100  
E

on  

10  
Common Emitter  
V

GE

= 15V, R

G

= 5
 
E

on  

T

C

= 25

o

C  
T

C

= 125

o

C  
1
10  
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
Gate Resistance, R

G

[
]  
Collector Current, I

C

[A]  
Figure 17. Turn off Switching SOA Characteristics  
500  
100  
10  
1
Safe Operating Area  
V

GE

= 15V, T

C

= 125

o

C  
0.1  
1
10  
100  
500  
Collector-Emitter Voltage, V

CE

[V]  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev. C1  
5

Typical Performance Characteristics  
Figure 18.Transient Thermal Impedance of IGBT  
8
1
0.5  
0.2  
0.1  
0.05  
P

DM  

0.02  
0.01  
0.1  
t

1  

t

2  

Dut
y
F
actor,
D
=
t
1/t2  
single pulse  
Peak T
 
= Pdm x Zthjc + T  
j
C
0.01  
1E-5  
1E-4  
1E-3  
0.01  
0.1  
1
10  
100  
Rectangular Pulse Duration [sec]  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev. C1  
6

Package Dimensions  
Figure 19. TO-220F 3L – TO220, MOLDED, 3LD, FULL PACK, EIAJ SC91, STRAIGHT LEAD  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-  
ically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev. C1  
7

TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
AccuPower™  
AX-CAP *  
BitSiC™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT
™  
CTL™  
F-PFS™  
FRFET  
Sync-Lock™  
®*  
®
®
®
®
Global Power Resource

SM  

GreenBridge™  
Green FPS™  
PowerTrench  
PowerXS™  
Programmable Active Droop™  
QFET  
QS™  
Quiet Series™  
RapidConfigure™  
™
®
TinyBoost  
TinyBuck  
®
®
Green FPS™ e-Series™  
G
max
™  
GTO™  
TinyCalc™  
®
TinyLogic  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
TranSiC™  
TriFault Detect™  
Current Transfer Logic™  
IntelliMAX™  
®
DEUXPEED  
ISOPLANAR™  
Marking Small Speakers Sound Louder  
and Better™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MicroPak2™  
MillerDrive™  
MotionMax™  
Dual Cool™  
®
EcoSPARK  
Saving our world, 1mW/W/kW at a time™  
SignalWise™  
SmartMax™  
EfficentMax™  
ESBC™  
®
TRUECURRENT *  
SerDes™  
SMART START™  
®
Solutions for Your Success™  
®
®
SPM  
Fairchild  
®
STEALTH™  
SuperFET  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
Fairchild Semiconductor  
FACT Quiet Series™  
®
®
UHC  
®
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
VoltagePlus™  
XS™  
®
mWSaver  
OptoHiT™  
OPTOLOGIC  
OPTOPLANAR  
FACT  
FAST  
®
®
FastvCore™  
FETBench™  
FPS™  
®
®
SupreMOS  
SyncFET™  
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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THEREIN, WHICH COVERS THESE PRODUCTS.  
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As used here in:  
1. Life
 
support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance with  
instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A
 
critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or  
effectiveness.  
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PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I66  
©2010 Fairchild Semiconductor Corporation  
FGPF4533 Rev.C1  
8