onsemi-FMG1G50US60H

Part #onsemi-FMG1G50US60H
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onsemi-FMG1G50US60H
IGBT  
FMG1G50US60H  
Molding Type Module  
General Description  
Fairchild’s Insulated Gate Bipolar Transistor (IGBT) power  
modules provide low conduction and switching losses as  
well as short circuit ruggedness. They are designed for  
applications such as motor control, uninterrupted power  
supplies (UPS) and general inverters where short circuit  
ruggedness is a required feature.  
Features  
•
•
•
•
•
•
UL Certified
 
No. E209204  
Short Circuit rated 10us @ T
 
= 100
°
C, V
 
= 15V  
C
GE  
High Speed Switching  
Low Saturation Voltage : V  
High Input Impedance  
Package Code : 7PM-GA  
= 2.2 V @ I
 
= 50A  
CE(sat)  
C
Fast & Soft Anti-Parallel FWD  
E1/C2  
Application  
C1  
E2  
•
•
•
•
•
AC & DC Motor Controls  
General Purpose Inverters  
Robotics  
Servo Controls  
UPS  
G1  
E1  
Internal Circuit Diagram  
Absolute Maximum Ratings  
T =
 
25
°
C unless otherwise noted  
C
Symbol  
Description  
FMG1G50US60H  
Units  
V
V
V
Collector-Emitter Voltage  
600  
±
20  
CES  
GES  
Gate-Emitter Voltage  
V
I
I
I
I
Collector Current  
@ T  
=
25
°
C  
50  
A
C
C
Pulsed Collector Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Short Circuit Withstand Time  
M a x i m u m P o w e r D i s s i p a t i o n  
Operating Junction
T
e
mperature  
Storage
T
e
mperature Range  
Isolation Voltage  
100  
A
CM (1)  
F
@ T
 
= 100
°
C  
50  
A
C
100  
A
FM  
T
@ T
 
= 100
°
C  
10  
us  
W
SC  
C
P
@ T  
=
C
25
°
C  
250  
D
J
T
-40 to +150  
-40 to +125  
2500  
2.0  
°
C  
°
C  
V
T
stg  
V
@ AC 1minute  
iso  
Power
T
e
rminals Screw : M5  
Mounting Screw : M5  
N.m  
N.m  
Mounting  
T
o
rque  
2.0  
Notes :  
(1) Repetitive rating : Pulse width limited by max. junction temperature  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

Electrical Characteristics of IGBT  
T
= 25
°
C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BV  
Collector-Emitter Breakdown Voltage  
T
e
mperature Coeff. of Breakdown  
Voltage  
V
V
= 0
V
, I
 
=
2
50uA  
600  
—  
—  
—  
—  
V
CES  
GE  
C
∆
B  
/
VCES  
J
= 0
V
, I
 
=
1
mA  
0.6  
V/
°
C  
GE  
C
∆
T  
I
I
Collector Cut-Off Current  
G-E Leakage Current  
V
V
= V  
= V  
, V
 
= 0V  
—  
—  
—  
—  
250  
uA  
nA  
CES  
GES  
CE  
CES  
GE  
, V
 
= 0V  
±
100  
GE  
GES  
CE  
On Characteristics  
V
G-E Threshold Voltage  
Collector to Emitter  
Saturation Voltage  
V
= 0V,  
I =
 
50mA  
C
5.0  
—  
6.0  
2.2  
8.5  
2.8  
V
V
GE(th)  
GE  
V
I
= 50A
,
V =
 
15V  
GE  
CE(sat)  
C
Dynamic Characteristics  
C
C
C
Input Capacitance  
—  
—  
—  
3460  
480  
—  
—  
—  
pF  
pF  
pF  
ies  
V
= 30V
 
V =
 
0V,  
, GE  
CE  
Output Capacitance  
oes  
res  
f = 1MHz  
Reverse Transfer Capacitance  
140  
Switching Characteristics  
t
t
t
t
Turn-On Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
20  
30  
—  
—  
ns  
ns  
d(on)  
Rise Time  
r
Turn-Off Delay Time  
Fall Time  
60  
—  
ns  
V
R
= 300
V
, I
 
=
5
0A,  
C
d(off)  
CC  
= 5.9
Ω
, V
 
= 15V  
110  
1.1  
1.2  
2.3  
20  
200  
—  
ns  
f
G
GE  
Inductive Load, T
 
= 25
°
C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
T
o
tal Switching Loss  
Turn-On Delay Time  
Rise Time  
mJ  
mJ  
mJ  
ns  
C
on  
—  
off  
—  
ts  
t
t
t
t
—  
d(on)  
r
30  
—  
ns  
Turn-Off Delay Time  
Fall Time  
70  
—  
ns  
V
= 300
V
, I
 
=
5
0A,  
C
d(off)  
f
CC  
R
= 5.9
Ω
, V
 
= 15V  
250  
1.2  
2.4  
3.6  
—  
ns  
G
GE  
Inductive Load, T
 
= 125
°
C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
T
o
tal Switching Loss  
—  
mJ  
mJ  
mJ  
C
on  
off  
ts  
—  
—  
V
= 300
V
, V
 
=
1
5V  
GE  
CC  
T
Short Circuit Withstand Time  
10  
—  
—  
us  
sc  
@
T =
 
100
°
C  
C
Q
T
o
tal Gate Charge  
—  
—  
—  
145  
28  
210  
40  
nC  
nC  
nC  
g
V
V
= 300
V
, I
 
=
5
0A,  
= 15V  
CE  
GE  
C
Q
Q
Gate-Emitter Charge  
Gate-Collector Charge  
ge  
gc  
65  
95  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

Electrical Characteristics of DIODE  
T
= 25
°
C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
—  
Typ.  
1.9  
1.8  
90  
Max.  
2.8  
—  
Units  
T
T
T
T
T
T
T
T
=
25
°
C  
= 100
°
C  
25
°
C  
= 100
°
C  
25
°
C  
= 100
°
C  
25
°
C  
C
C
C
C
C
C
C
C
V
Diode Forward Voltage  
I
= 50A  
F
V
FM  
—  
=
—  
130  
—  
t
I
Diode Reverse Recovery Time  
ns  
A
rr  
—  
130  
5
=
—  
6.5  
—  
Diode Peak Reverse Recovery  
Current  
I =
 
50A  
F
rr  
di / dt = 100 A/us  
—  
7
=
—  
225  
455  
422  
—  
Q
Diode Reverse Recovery Charge  
nC  
rr  
= 100
°
C  
—  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
—  
Max.  
0.5  
1.0  
—  
Units  
R
R
R
Junction-to-Case (IGBT
 
Part, per 1/2 Module)  
Junction-to-Case (DIODE
 
Part, per 1/2 Module)  
°
C
/
W  
°
C
/
W  
°
C
/
W  
g
θ
JC  
θ
JC  
θ
CS  
—  
Case-to-Sink  
(Conductive grease applied)  
0.05  
—  
Weight  
Weight of Module  
190  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

140  
120  
100  
80  
15V  
20V  
Common Emitter  
T

C

= 25
℃
 
140  
120  
100  
80  
Common Emitter  
V

GE

= 15V  
T

C  

= 25
℃
━
━  
T

C

= 125
℃
——  
12V  
60  
60  
V

GE

= 10V  
40  
40  
20  
20  
0
0
0
2
4
6
8
1
10  
Collector – Emitter Voltage, V

CE

[V]  
Collector – Emitter Voltage, V

CE

[V]  
Fig 1.
 
Typical Output Characteristics  
Fig 2.
 
Typical Saturation Voltage Characteristics  
5
60  
V

CC

= 300V  
Common Emitter  
Load Current : peak of square wave  
V

GE

= 15V  
50  
4
3
2
1
0
100A  
40  
30  
20  
50A  
I

C

= 30A  
10  
Duty cycle : 50%  
℃
T

C

= 100  
Power Dissipation = 70W  
0
1
10  
100  
1000  
-50  
0
50  
100  
150  
℃
Case Temperature, T

C  

[
]
Frequency [KHz]  
Fig 3. Saturation Voltage vs. Case  
Fig 4. Load Current vs. Frequency  
Temperature at Variant Current Level  
20  
20  
16  
12  
8
Common Emitter  
Common Emitter  
℃
T

C

= 125
℃
 
T

C

= 25  
16  
12  
8
100A  
100A  
4
4
50A  
50A  
I

C

= 30A  
I

C

= 30A  
8
0
0
0
4
12  
16  
20  
0
4
8
12  
16  
20  
Gate – Emitter Voltage, V

GE

[V]  
Gate – Emitter Voltage, V

GE

[V]  
Fig 5. Saturation Voltage vs. V  
Fig 6. Saturation Voltage vs. V  
GE  
GE  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
1000  
100  
10  
Common Emitter  
V

GE

= 0V, f = 1MHz  
Common Emitter  
V

CC

= 300V, V

GE

= +/- 15V  
℃
T

C

= 25  
I

C

= 50A  
T

C

= 25

0

C  
T

C

= 125

0

C  
Ton  
Tr  
Cies  
Coes  
Cres  
1
10  
Collector – Emitter Voltage, V

CE

[V]  
1
10  
Gate Resistance, R

G

[
Ω
]  
Fig 8. Turn-On Characteristics vs.  
Gate Resistance  
Fig 7. Capacitance Characteristics  
Common Emitter  
Common Emitter  
V

CC

= 300V, V

GE

= +/- 15V  
V

CC

= 300V, V

GE

= +/- 15V  
I

C

= 50A  

C

= 25

0

C  

C

= 125

0

C  
I

C

= 50A  

C

= 25

0

C  

C

= 125

0

C  
10000  
T
T
T
T
1000  
Toff  
Tf  
Eoff  
Eon  
Eoff  
100  
1000  
1
10  
1
10  
Gate Resistance, R

G

[
Ω
]  
Gate Resistance, R

g

[
Ω
]  
Fig 9. Turn-Off Characteristics vs.  
Gate Resistance  
Fig 10. Switching Loss vs. Gate Resistance  
Common Emitter  
Common Emitter  
V

CC

= 300V, V

GE

= +/- 15V  
V

CC

= 300V, V

GE

= +/- 15V  

G

= 5.9
Ω
 
T

C

= 25

0

C  

C

= 125

0

C  
R

G

= 5.9
Ω  
R
1000  
T

C

= 25

0

C  
T

C

= 125

0

C  
T
Toff  
Ton  
Tr  
100  
Tf  
Toff  
Tf  
100  
10  
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Collector Current, I

C

[A]  
Collector Current, I

C

[A]  
Fig 11. Turn-On Characteristics vs.  
Collector Current  
Fig 12. Turn-Off Characteristics vs.  
Collector Current  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

15  
12  
9
Common Emitter  

CC

= 300V, V

GE

= +/- 15V  

G

= 5.9
Ω  
T

C

= 25

0

C  

C

= 125

0

C  
Common Emitter  
V
R

L

= 5.9
Ω
 
R
℃
T

C

= 25  
300 V  
200 V  
V

CC

= 100 V  
10000  
1000  
100  
T
Eoff  
Eon  
Eoff  
6
3
0
0
40  
80  
120  
160  
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Collector Current, I

C

[A]  
Gate Charge, Qg [ nC ]  
Fig 14. Gate Charge Characteristics  
Fig 13. Switching Loss vs. Collector Current  
300  
300  
100  
I

C

MAX. (Pulsed)  
100  
50us  
I

C

MAX. (Continuous)  
100us  
㎳
1
10  
1
DC Operation  
10  
Single Nonrepetitive  
℃
Pulse T

C

= 25  
Curves must be derated  
linerarly with increase  
in temperature  
Safe Operating Area  
V

GE

= 20V, T

C

= 100

o

C  
100  
Collector-Emitter Voltage,
 
V

CE

[V]  
0.1  
1
0.3  
1
10  
100  
1000  
1
10  
1000  
Collector-Emitter Voltage,
 
V

CE

[V]  
Fig 15. SOA Characteristics  
Fig 16. Turn-Off SOA Characteristics  
300  
100  
1
0.1  
10  
0.01  
1
Single Nonrepetitive  
≤
℃
125  
T

C

= 25  
IGBT  
℃
:
Pulse T

J  

V

GE

15V  
=
DIODE :  
R

G

= 5.9
Ω  
1E-3  
0.1  
0
100  
200  
300  
400  
500  
600  
700  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

Rectangular Pulse Duration [sec]  
Collector-Emitter Voltage,
 
V

CE

[V]  
Fig 18. Transient Thermal Impedance  
Fig 17. RBSOA Characteristics  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

20  
10  
160  
120  
80  
Common Cathode  
V

GE

= 0V  
℃
℃
T

C  

T

C

= 125  
= 25  
T

rr  

I

rr  

5
40  
Common Cathode  
㎲
di/dt = 100A/  
℃
℃
T

C  

= 25  
T

C

= 100  
2
0
0
10  
20  
30  
40  
50  
0
1
2
3
4
Forward Current, I

F

[A]  
Forward Voltage,
 
V

F

[V]  
Fig 20. Reverse Recovery Characteristics  
Fig 19. Forward Characteristics  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

Package Dimension  
7PM-GA  
Dimensions in Millimeters  
©2002 Fairchild Semiconductor Corporation  
FMG1G50US60H Rev. A  

TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarksꢀ  
â
â
SILENT SWITCHER  
SMAR
T
S
TART™  
SPM™  
STAR*POWER™  
Stealth™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
UHC™  
UltraFET  
VCX™  
FAST  
ACEx™  
Bottomless™  
CoolFET™  
CROSSVOLT
™  
DenseTrench™  
DOME™  
MICROWIRE™  
OPTOLOGIC  
OPTOPLANAR™  
PACMAN™  
POP™  
â
â
FASTr™  
FRFET™  
GlobalOptoisolator™  
GTO™  
HiSeC™  
Power247™  
I

2

C™  
â
EcoSPARK™  
PowerTrench  
E

2

CMOS

TM  

ISOPLANAR™  
LittleFET™  
MicroFET™  
MicroPak™  
QFET™  
QS™  
QT Optoelectronics™  
Quiet Series™  
EnSigna

TM  

TinyLogic™  
TruTranslation™  
FACT™  
FACT Quiet Series™  
STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE T
O
A
NY PRODUCTS HEREIN TO IMPROVE RELIABILIT
Y
,
F
UNCTION OR DESIGNꢀ FAIRCHILD  
DOES NO
T
A
SSUM
E
A
NY LIABILIT
Y
A
RISING OUT OF TH
E
A
PPLICATION OR USE O
F
A
NY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERSꢀ  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOU
T
T
HE EXPRESS WRITTE
N
A
PPROVA
L
O
F FAIRCHILD SEMICONDUCTOR CORPORATIONꢀ  
As used herein:  
1ꢀ Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
userꢀ  
2ꢀ A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectivenessꢀ  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product developmentꢀ Specifications may change in  
any manner without noticeꢀ  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later dateꢀ  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
designꢀ  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specificationsꢀ Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve designꢀ  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductorꢀ  
The datasheet is printed for reference information onlyꢀ  
Revꢀ H5