onsemi-FMG2G75US60

Part #onsemi-FMG2G75US60
Download 
onsemi-FMG2G75US60
September 2001  
IGBT  
FMG2G75US60  
Molding Type Module  
General Description  
Fairchild’s Insulated Gate Bipolar Transistor (IGBT) power  
modules provide low conduction and switching losses as  
well as short circuit ruggedness. They are designed for  
applications such as motor control, uninterrupted power  
supplies (UPS) and general inverters where short circuit  
ruggedness is a required feature.  
Features  
•
•
•
•
•
•
UL Certified
 
No. E209204  
Short Circuit rated 10us @ T
 
= 100
°
C, V
 
= 15V  
C
GE  
High Speed Switching  
Low Saturation Voltage : V  
High Input Impedance  
Package Code : 7PM-GA  
= 2.2 V @ I
 
= 75A  
CE(sat)  
C
Fast & Soft Anti-Parallel FWD  
E1/C2  
Application  
C1  
E2  
•
•
•
•
•
AC & DC Motor Controls  
General Purpose Inverters  
Robotics  
Servo Controls  
UPS  
G1 E1  
G2 E2  
Internal Circuit Diagram  
Absolute Maximum Ratings  
T =
 
25
°
C unless otherwise noted  
C
Symbol  
Description  
FMG2G75US60  
Units  
V
V
V
Collector-Emitter Voltage  
600  
±
20  
CES  
GES  
Gate-Emitter Voltage  
V
I
I
I
I
Collector Curent  
@ T  
=
25
°
C  
75  
A
C
C
Pulsed Collector Current  
Diode Continuous Forwar
d
C
urrent  
Diode Maximum Forward Current  
Short Circuit Withstand Time  
Maximum Power Dissipation  
Operating Junction
T
e
mperature  
Storage
T
e
mperature Range  
Isolation Voltage  
150  
A
CM (1)  
F
@ T
 
= 100
°
C  
75  
A
C
150  
A
FM  
T
@ T
 
= 100
°
C  
10  
us  
W
SC  
C
P
@ T  
=
C
25
°
C  
310  
D
J
T
-40 to +150  
-40 to +125  
2500  
2.0  
°
C  
°
C  
V
T
stg  
V
@ AC 1minute  
iso  
Power
T
e
rminals Screw : M5  
Mounting Screw : M5  
N.m  
N.m  
Mounting  
T
o
rque  
2.0  
Notes :  
(1) Repetitive rating : Pulse width limited by max. junction temperature  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

Electrical Characteristics of IGBT  
T
= 25
°
C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BV  
Collector-Emitter Breakdown Voltage  
T
e
mperature Coeff. of Breakdown  
Voltage  
V
V
= 0
V
, I
 
=
2
50uA  
600  
—  
—  
—  
—  
V
CES  
GE  
C
∆
B  
/
VCES  
J
= 0
V
, I
 
=
1
mA  
0.6  
V/
°
C  
GE  
C
∆
T  
I
I
Collector Cut-Off Current  
G-E Leakage Current  
V
V
= V  
= V  
, V
 
= 0V  
—  
—  
—  
—  
250  
uA  
nA  
CES  
GES  
CE  
CES  
GE  
, V
 
= 0V  
±
100  
GE  
GES  
CE  
On Characteristics  
V
G-E Threshold Voltage  
Collector to Emitter  
Saturation Voltage  
V
= 0
V
, I
 
=
7
5mA  
5.0  
—  
6.0  
2.2  
8.5  
2.8  
V
V
GE(th)  
GE  
C
V
I
= 75A
,
V =
 
15V  
GE  
CE(sat)  
C
Dynamic Characteristics  
C
C
C
Input Capacitance  
—  
—  
—  
7056  
672  
—  
—  
—  
pF  
pF  
pF  
ies  
V
= 30V
 
V =
 
0V,  
, GE  
CE  
Output Capacitance  
oes  
res  
f = 1MHz  
Reverse Transfer Capacitance  
180  
Switching Characteristics  
t
t
t
t
Turn-On Delay Time  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
20  
40  
—  
—  
ns  
ns  
d(on)  
Rise Time  
r
Turn-Off Delay Time  
Fall Time  
70  
—  
ns  
V
R
= 300
V
, I
 
=
7
5A,  
C
d(off)  
CC  
= 3.3
Ω
, V
 
= 15V  
110  
1.4  
1.7  
3.1  
20  
200  
—  
ns  
f
G
GE  
Inductive Load, T
 
= 25
°
C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
T
o
tal Switching Loss  
Turn-On Delay Time  
Rise Time  
mJ  
mJ  
mJ  
ns  
C
on  
—  
off  
—  
ts  
t
t
t
t
—  
d(on)  
r
50  
—  
ns  
Turn-Off Delay Time  
Fall Time  
80  
—  
ns  
V
= 300
V
, I
 
=
7
5A,  
C
d(off)  
f
CC  
R
= 3.3
Ω
, V
 
= 15V  
250  
1.6  
3.0  
4.6  
—  
ns  
G
GE  
Inductive Load, T
 
= 125
°
C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
T
o
tal Switching Loss  
—  
mJ  
mJ  
mJ  
C
on  
off  
ts  
—  
—  
V
= 300
V
, V
 
=
1
5V  
GE  
CC  
T
Short Circuit Withstand Time  
10  
—  
—  
us  
sc  
@
T =
 
100
°
C  
C
Q
T
o
tal Gate Charge  
—  
—  
—  
310  
62  
350  
—  
nC  
nC  
nC  
g
V
V
= 300
V
, I
 
=
7
5A,  
= 15V  
CE  
GE  
C
Q
Q
Gate-Emitter Charge  
Gate-Collector Charge  
ge  
gc  
130  
—  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

Electrical Characteristics of DIODE  
T
= 25
°
C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
—  
Typ.  
1.9  
1.8  
90  
Max.  
2.8  
—  
Units  
T
T
T
T
T
T
T
T
=
25
°
C  
= 100
°
C  
25
°
C  
= 100
°
C  
25
°
C  
= 100
°
C  
25
°
C  
C
C
C
C
C
C
C
C
V
Diode Forward Voltage  
I
= 75A  
F
V
FM  
—  
=
—  
130  
—  
t
I
Diode Reverse Recovery Time  
ns  
A
rr  
—  
130  
7
=
—  
9
Diode Peak Reverse Recovery  
Current  
I =
 
75A  
F
rr  
di / dt = 150 A/us  
—  
10  
—  
=
—  
315  
650  
590  
—  
Q
Diode Reverse Recovery Charge  
nC  
rr  
= 100
°
C  
—  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
—  
Max.  
0.4  
0.9  
—  
Units  
R
R
R
Junction-to-Case (IGBT
 
Part, per 1/2 Module)  
Junction-to-Case (DIODE
 
Part, per 1/2 Module)  
°
C
/
W  
°
C
/
W  
°
C
/
W  
g
θ
JC  
θ
JC  
θ
CS  
—  
Case-to-Sink  
(Conductive grease applied)  
0.05  
—  
Weight  
Weight of Module  
190  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

200  
180  
160  
140  
120  
100  
80  
200  
160  
120  
80  
Common Emitter  
Common Emitter  
V

GE

= 15V  
20V  
15V  
℃
T

C

= 25  
12V  
℃
℃
T

C  

= 25  
T

C

= 125  
Vge = 10V  
60  
40  
40  
20  
0
0
0
2
4
6
8
0.3  
1
10  
20  
Collector – Emitter Voltage, V

CE

[V]  
Collector – Emitter Voltage, V

CE

[V]  
Fig 1.
 
Typical Output Characteristics  
Fig 2.
 
Typical Saturation Voltage Characteristics  
5
100  
V

CC

= 300V  
Load Current : peak of square wave  
Common Emitter  
V

GE

= 15V  
4
3
2
80  
150A  
75A  
60  
40  
I

C

= 40A  
1
0
20  
Duty cycle : 50%  
℃
Tc = 100  
Power Dissipation = 100W  
0
0
30  
60  
90  
120  
150  
0.1  
1
10  
100  
1000  
℃
Case Temperature, Tc [  
]
Frequency [Khz]  
Fig 3. Saturation Voltage vs. Case  
Fig 4. Load Current vs. Frequency  
Temperature at Variant Current Level  
20  
16  
12  
8
20  
Common Emitter  
Common Emitter  
℃
℃
T

C

= 125  
T

C

= 25  
16  
12  
8
150A  
150A  
75A  
4
4
75A  
Ic = 40A  
Ic = 40A  
0
0
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
Gate – Emitter Voltage, V

GE

[V]  
Gate – Emitter Voltage, V

GE

[V]  
Fig 5. Saturation Voltage vs. V  
Fig 6. Saturation Voltage vs. V  
GE  
GE  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

1000  
100  
10  
16000  
14000  
12000  
10000  
8000  
6000  
4000  
2000  
0
Common Emitter  
V

GE

= 0V, f = 1MHz  
Common Emitter  
V

CC

= 300V, V

GE

= +/- 15V  
I

C

= 75A  
℃
T

C

= 25  
T

C

= 25

0

C  
Ton  
Tr  
T

C

= 125

0

C  
Cies  
Coes  
Cres  
1
10  
1
10  
Collector – Emitter Voltage, V

CE

[V]  
Gate Resistance, R

G

[
Ω
]  
Fig 8. Turn-On Characteristics vs.  
Fig 7. Capacitance Characteristics  
Common Emitter  
Common Emitter  
V

CC

= 300V, V

GE

= +/- 15V  
V

CC

= 300V, V

GE

= +/- 15V  
I

C

= 75A  

C

= 25

0

C  

C

= 125

0

C  
I

C

= 75A  

C

= 25

0

C  

C

= 125

0

C  
10000  
T
T
T
T
1000  
Eon  
Toff  
Tf  
Eoff  
100  
1000  
1
10  
1
10  
Gate Resistance, R

g

[
Ω
]  
Gate Resistance, R

G

[
Ω
]  
Fig 9. Turn-Off Characteristics vs.  
Gate Resistance  
Fig 10. Switching Loss vs. Gate Resistance  
Common Emitter  
Common Emitter  
V

CC

= 300V, V

GE

= +/- 15V  
V

CC

= 300V, V

GE

= +/- 15V  

G

= 3.3
Ω
 
T

C

= 25

0

C  

C

= 125

0

C  
R

G

= 3.3
Ω  
T

C

= 25

0

C  

C

= 125

0

C  
R
1000  
T
T
Ton  
100  
Toff  
Tf  
Tr  
Toff  
Tf  
100  
10  
20  
40  
60  
80  
100  
120  
140  
20  
40  
60  
80  
100  
120  
140  
Collector Current, I

C

[A]  
Collector Current, I

C

[A]  
Fig 11. Turn-On Characteristics vs.  
Collector Current  
Fig 12. Turn-Off Characteristics vs.  
Collector Current  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

15  
12  
9
Common Emitter  
R

L

= 4
Ω  
T

C

= 25
℃
 
Common Emitter  

CC

= 300V, V

GE

= +/- 15V  

G

= 3.3
Ω  
T

C

= 25

0

C  
V
R
300 V  
10000  
1000  
100  
T

C

= 125

0

C  
Eoff  
Eon  
200 V  
Eoff  
Eon  
V

CC

= 100 V  
6
3
0
0
50  
100  
150  
200  
250  
300  
350  
20  
40  
60  
80  
100  
120  
140  
Collector Current, I

C

[A]  
Gate Charge, Qg [ nC ]  
Fig 14. Gate Charge Characteristics  
Fig 13. Switching Loss vs. Collector Current  
500  
I

C

MAX. (Pulsed)  
100 I

C

MAX. (Continuous)  
50us  
100  
100us  
㎳
1
10  
1
DC Operation  
10  
Single Nonrepetitive  
℃
Pulse T

C

= 25  
Curves must be derated  
linerarly with increase  
in temperature  
Safe Operating Area  
V

GE

= 20V, T

C

= 100

o

C  
100  
Collector-Emitter Voltage,
 
V

CE

[V]  
0.1  
1
0.3  
1
10  
100  
1000  
1
10  
1000  
Collector-Emitter Voltage,
 
V

CE

[V]  
Fig 15. SOA Characteristics  
Fig 16. Turn-Off SOA Characteristics  
500  
100  
1
0.1  
10  
0.01  
1
Single Nonrepetitive  
℃
:
≤
℃
125  
T

C

= 25  
IGBT  
Pulse T

J  

V

GE

15V  
=
R

G

= 3.3
Ω
 
DIODE :  
0.1  
1E-3  
0
100  
200  
300  
400  
500  
600  
700  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

Collector-Emitter Voltage,
 
V

CE

[V]  
Rectangular Pulse Duration [sec]  
Fig 18. Transient Thermal Impedance  
Fig 17. RBSOA Characteristics  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

200  
160  
120  
80  
20  
10  
Common Cathode  
V

GE

= 0V  
℃
℃
T

C  

= 25  
T

C

= 125  
T

rr  

I

rr  

5
Common Cathode  
40  
㎲
di/dt = 150A/  
℃
℃
T

C  

T

C

= 100  
= 25  
2
0
0
1
2
3
4
0
10  
20  
30  
40  
50  
60  
70  
80  
Forward Current, I

F

[A]  
Forward Voltage,
 
V

F

[V]  
Fig 19. Forward Characteristics  
Fig 20. Reverse Recovery Characteristics  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

Package Dimension  
7PM-GA  
Dimensions in Millimeters  
©2001 Fairchild Semiconductor Corporation  
FMG2G75US60 Rev. A  

TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  
intended to be an exhaustive list of all such trademarks.  
ACEx™  
Bottomless™  
CoolFET™  
FAST

®  

FASTr™  
FRFET™  
OPTOLOGIC™  
OPTOPLANAR™  
PACMAN™  
SMART START™  
STAR*POWER™  
Stealth™  
VCX™  
CROSSVOLT
™  
DenseTrench™  
DOME™  
EcoSPARK™  
E

2

CMOS™  
EnSigna™  
GlobalOptoisolator™  
GTO™  
HiSeC™  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MicroPak™  
MICROWIRE™  
POP™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
TruTranslation™  
TinyLogic™  
Power247™  
PowerTrench

®  

QFET™  
QS™  
QT Optoelectronics™  
Quiet Series™  
SLIENT SWITCHER

®  

FACT™  
FACT Quiet Series™  
UHC™  
UltraFET

®  

STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR  
INTERNATIONAL.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
©2001 Fairchild Semiconductor Corporation  
Rev. H4