onsemi-FPN660A

Part #onsemi-FPN660A
Download 
onsemi-FPN660A
FPN660/FPN660A  
PNP Low Saturation Transistor  
•
These devices are designed for high current gain and low saturation  
voltage with collector currents up to 3.0A continuous.  
Sourced from process PA.  
•
C
TO-226  
B
E
Absolute Maximum Ratings

T =25
°
C unless otherwise noted  

A
Symbol  
Parameter  
FPN660  
FPN660A  
Units  
V
V
Collector-Emitter Voltage  
60  
80  
5
60  
CEO  
CBO  
EBO  
V
V
Collector-Base Voltage  
Emitter-Base Voltage  
Collector Current  
60  
V
5
3
V
I
– Continuous  
3
A
C
T , T  
Operating and Storage Junction
T
e
mperature Range  
-55 ~ +150  
-55 ~ +150  
°
C  
J
STG  
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  
NOTES:  
1) These
 
ratings are based on a maximum junction temperature of 150
°
C.  
2) These
 
are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.  
3) All
 
voltage (V) and currents (A) are negative polarity for PNP transistors  
Electrical Characteristics

T =25
°
C unless otherwise noted  

A
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max. Units  
Off Characteristics  
BV  
BV  
Collector-Emitter Breakdown Voltage  
Collector-Base Breakdown Voltage  
I
= 10mA, I
 
= 0  
55  
V
CEO  
CBO  
C
B
I
= 100
µ
A, I
 
= 0  
FPN660  
FPN660A  
80  
60  
V
V
E
E
BV  
Emitter-Base Breakdown Voltage  
Collector-Base Cutoff Current  
I
= 100
µ
A, I
 
= 0  
5.0  
V
EBO  
E
C
I
V
V
= 30
V
, I
 
= 0  
100  
10  
nA  
µ
A  
CBO  
CB  
CB  
E
= 30
V
, I
 
=
0
, T
 
= 100
°
C  
E
A
I
Emitter-Base Cutoff Current  
V
= 4.0
V
, I
 
= 0  
100  
nA  
EBO  
EB  
C
On Characteristics *  
h
DC Current Gain  
I
I
= 100mA, V
 
= 2.0V  
70  
100  
250  
80  
FE  
C
C
CE  
= 500mA, V
 
= 2.0V  
FPN660  
FPN660A  
300  
550  
CE  
I
I
= 1.0A, V
 
= 2.0V  
CE  
C
C
= 2.0A, V
 
= 2.0V  
40  
CE  
V
(sat)  
Collector-Emitter Saturation Voltage  
I
I
= 1.0A, I
 
= 100mA  
300  
450  
400  
mV  
mV  
mV  
CE  
C
C
B
= 2.0A, I
 
= 200mA  
FPN660  
FPN660A  
B
V
V
(sat)  
(on)  
Base-Emitter Saturation Voltage  
Base-Emitter On Voltage  
I
I
= 1.0A, I
 
= 100mA  
1.25  
1.0  
V
V
BE  
C
B
= 1.0A, V
 
= 2.0V  
BE  
C
CE  
Small Signal Characteristics  
C
Output Capacitance  
Transition Frequency  
V
= 10
V
, I
 
=
0
, f = 1MHz  
45  
pF  
obo  
CB  
E
f
I
= 100mA, V
 
= 5.0
V
,  
75  
MHz  
T
C
CE  
f = 100MHz  
* Pulse Test: Pulse Width
≤
300
µ
s, Duty Cycle
≤
2.0%  
NOTE:
All voltage (V) and currents (A) are negative polarity for PNP transistors.  
©2002 Fairchild Semiconductor Corporation  
Rev. A2, November 2002  

Thermal Characteristics
T =25
°
C unless otherwise noted  
A
Max.  
Symbol  
Parameter  
Units  
FPN660/FPN660A  
P
T
o
tal Device Dissipation  
1
W
D
R
R
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
50  
°
C/W  
°
C/W  
θ
JC  
θ
JA  
125  
©2002 Fairchild Semiconductor Corporation  
Rev. A2, November 2002  

Typical Characteristics  
1.6  
1.4  
1.2  
1
1.4  
V

ce

= 2.0V  
β =
10  
1.2  
1
– 40°C  
– 40
°
C  
0.8  
0.8  
0.6  
0.4  
25°C  
0.6  
25
°
C  
1
2
5°C  
0.4  
1
2
5
°
C  
0.2  
0.2  
0.0001  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
I

C

– COLLECTOR CURRENT (A)  
I

C

– COLLECTOR CURRENT (A)  
Figure 2. Base-Emitter On Voltag  
vs Collector Current  
Figure 1. Base-Emitter Saturation Voltage  
vs Collector Current  
Collector-Emitter Saturation  
Input/Output Capacitance vs.  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
400  
350  
300  
250  
200  
150  
100  
50  
f
=
1
.0
M
H
z  
β =
10  
C

obo  

125
°
C  
25
°
C  
C

ibo  

– 40
°
C  
0
0.1  
0.5  
1
10 20  
50 100  
0.01  
0.1  
1
10  
V

CE

– COLLECTOR VOLTAGE (V)  
I

C

– COLLECTOR CURRENT (A)  
Figure 3. Collector-Emitter Saturation Voltage  
vs Collector Current  
Figure 4. Input/Output Capacitance  
vs Reverse Bias Voltage  
Current Gain vs. Collector Current  
1000  
V

ce

= 2.0V  
125
°
C  
1
0
.
75  
0.5  
0
.
25  
0
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
T
O
-226  
25
°
C  
– 40
°
C  
0
25  
50  
75  
1
0
0  
125  
1
5
0  
0.0001  
0.001  
0.01  
0.1  
1
10  
TE MPE RA
T
URE (
 
C)  
°
I

C

– COLLECTOR CURRENT (A)  
Figure 5. Current Gain vs Collector Current  
Figure 6. Power Dissipation vs Ambient Temperature  
©2002 Fairchild Semiconductor Corporation  
Rev. A2, November 2002  

Package Dimensions  
TO-226  
For leadformed option ordering,  
refer to
T
a
pe & Reel data information.  
Dimensions in Millimeters  
©2002 Fairchild Semiconductor Corporation  
Rev. A2, November 2002  

TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  
intended to be an exhaustive list of all such trademarks.  
ACEx™  
FACT™  
ImpliedDisconnect™ PACMAN™  
SPM™  
ActiveArray™  
Bottomless™  
CoolFET™  
CROSSVOLT
™ FRFET™  
DOME™  
FACT Quiet series™
 
ISOPLANAR™  
POP™  
Stealth™  
FAST

®  

LittleFET™  
MicroFET™  
MicroPak™  
Power247™  
PowerTrench

®  

QFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
FASTr™  
GlobalOptoisolator™ MICROWIRE™  
QS™  
EcoSPARK™  
E

2

CMOS™  
EnSigna™  
Across the board. Around the world.™  
The Power Franchise™  
GTO™  
HiSeC™  
I

2

C™  
MSX™  
MSXPro™  
OCX™  
OCXPro™  
OPTOLOGIC

®  

OPTOPLANAR™  
QT Optoelectronics™
 
TinyLogic™  
Quiet Series™  
TruTranslation™  
RapidConfigure™  
RapidConnect™  
UHC™  
UltraFET

®  

SILENT SWITCHER

®

VCX™  
SMART START™  
Programmable Active Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR  
CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
©2002 Fairchild Semiconductor Corporation  
Rev. I1