onsemi-FQPF6N40CT
| Part # | onsemi-FQPF6N40CT |
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TM
QFET
FQP6N40C/FQPF6N40C
400V N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe,
DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
electronic lamp ballasts based on half bridge topology.
•
•
•
•
•
•
6A, 400V, R
= 1.0
Ω
@V =
10 V
DS(on) GS
Low gate charge ( typical 16nC)
Low Crss ( typical 15pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
!
●
◀
▲
●
●
G
!
TO-220F
FQPF Series
TO-220
FQP Series
G D
S
G
D S
!
S
Absolute Maximum Ratings
T =
25°C unless otherwise noted
C
Symbol
Parameter
FQP6N40C
FQPF6N40C
Units
V
V
I
Drain-Source Voltage
400
DSS
– Continuous (T
= 25°C)
Drain Current
6
6 *
A
D
C
– Continuous (T
= 100°C)
3.6
24
3.6 *
24 *
A
C
I
(Note 1)
Drain Current
– Pulsed
A
DM
V
E
I
Gate-Source Voltage
±
30
270
6
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
7.3
4.5
mJ
V/ns
W
AR
dv/dt
P
Power Dissipation (T
= 25°C)
73
38
D
C
– Derate above 25°C
Operating and Storage
T
e
mperature Range
0.58
0.3
W/°C
°C
T , T
-55 to +150
300
J
STG
Maximum lead temperature for soldering purposes,
T
°C
L
1/8
”
from case for 5 seconds
* Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
FQP6N40C
FQPF6N40C
Units
°C
/
W
°C
/
W
°C
/
W
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
1.71
0.5
3.31
—
θ
JC
θ
CS
62.5
62.5
θ
JA
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Electrical Characteristics
T =
25°C unless otherwise noted
C
Symbol
Parameter
Test Conditions
Min
T
y
p
Max
Units
Off Characteristics
BV
V
= 0
V
, I
=
2
50
µ
A
GS D
Drain-Source Breakdown Voltage
400
—
—
—
—
V
DSS
∆
BV
Breakdown Voltage
T
e
mperature
Coefficient
DSS
I
= 250
µ
A, Referenced to 25°C
0.54
V/°C
D
/
∆
T
J
I
V
V
V
V
= 400
V
, V
= 0 V
—
—
—
—
—
—
—
—
1
µ
A
µ
A
nA
nA
DSS
DS
GS
Zero Gate Voltage Drain Current
= 320
V
, T
=
1
25°C
10
DS
GS
GS
C
I
= 30
V
, V
= 0 V
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
100
-100
GSSF
DS
I
= -30
V
, V
= 0 V
GSSR
DS
On Characteristics
V
V
V
V
= V
, I
= 250
µ
A
Gate Threshold Voltage
2.0
—
—
4.0
1
V
Ω
S
GS(th)
DS
GS
DS
GS
D
R
Static Drain-Source
On-Resistance
DS(on)
= 10
V
, I
=
3
A
0.83
4.7
D
g
= 40 V, I
= 3A
(Note 4)
Forward Transconductance
—
—
FS
D
Dynamic Characteristics
C
C
C
Input Capacitance
—
—
—
480
80
625
105
20
pF
pF
pF
iss
V
= 25
V
, V
= 0 V,
GS
DS
Output Capacitance
oss
rss
f = 1.0 MHz
Reverse Transfer Capacitance
15
Switching Characteristics
t
t
t
t
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
T
o
tal Gate Charge
Gate-Source Charge
Gate-Drain Charge
—
—
—
—
—
—
—
13
65
21
38
16
2.3
8.2
35
140
55
85
20
—
ns
ns
d(on)
V
= 200
V
, I
=
6
A,
DD
D
r
R
= 25
Ω
G
ns
d(off)
f
(Note 4, 5)
(Note 4, 5)
ns
Q
Q
Q
nC
nC
nC
g
V
V
= 320
V
, I
=
6
A,
DS
D
= 10 V
gs
gd
GS
—
Drain-Source Diode Characteristics and Maximum Ratings
I
Maximum Continuous Drain-Source Diode Forward Current
—
—
—
—
—
—
—
6
24
1.4
—
A
A
S
I
Maximum Pulsed Drain-Source Diode Forward Current
SM
V
t
V
V
= 0
V
, I
= 6
A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
—
V
SD
GS
S
= 0
V
, I
= 6
A
,
230
1.7
ns
µ
C
rr
GS
S
dI /
dt = 100 A/
µ
s
(Note 4)
Q
Reverse Recovery Charge
—
F
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L =
13.7 mH, I
= 6 A, V
= 50V, R
= 25
Ω,
Starting T =
25°C
AS
DD
G
J
3. I
≤
6A, di/dt
≤
200A/
µ
s, V
≤
BV
Starting T =
25°C
SD
DD
DSS,
J
4. Pulse Test : Pulse width
≤
300
µ
s, Duty cycle
≤
2%
5. Essentially independent of operating temperature
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Typical Characteristics
V
G
S
Top :
15.
0
V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
10
1
10
1
Botto
m
:
5
.
0
V
150
o
C
10
0
25
o
C
-55
o
C
10
0
※
Notes :
※
Notes :
μ
-1
10
1. V
= 40V
2. 250
s Pulse Test
1. 250
s Pulse Test
2. T
C
= 25
DS
μ
℃
-1
10
-1
10
10
0
10
1
2
4
6
8
10
V
G
S
,
G
ate-Source Voltage [V]
V
D
S
,
D
rain-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
3.5
3.0
2.5
2.0
1.5
1.0
0.5
1
10
V
GS
= 10V
0
10
V
GS
= 20V
※
Notes :
℃
150
℃
25
1. V
= 0V
2. 250
s Pulse Test
GS
μ
※
℃
Note : T = 25
J
-1
10
0
5
10
15
20
0.2
0.4
0.6
0.8
1.0
1.2
1.4
I
D
, Drain Current [A]
V
S
D
,
S
ource-Drain voltage [V]
Figure 3. On-Resistance Variation
vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
1200
12
10
8
C
iss
=
C
g
s
+
C
g
d
(C
d
s
=
s
horted)
C
o
ss
=
C
d
s
+ C
gd
V
DS
= 80V
C
r
ss
= C
gd
1000
800
600
400
200
0
V
DS
= 200V
V
DS
= 320V
C
iss
C
6
oss
4
※
Note ;
1. V
G
S
= 0 V
2. f =
1
M
Hz
C
rss
2
※
Not
e
:
I
D
= 6A
0
-1
10
0
10
1
0
5
10
15
20
10
Q
G
, Total Gate Charge [nC]
V
D
S
,
D
rain-Source Voltage [V]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Typical Characteristics
(Continued)
1.2
1.1
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
※
N
otes :
0.9
1. V
G
S
= 0 V
※
Notes :
2. I
D
=
2
50
μ
A
1. V
G
S
= 10 V
2. I
D
= 3 A
0.8
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
T,
J
unction Temperature [
o
C
]
T,
J
unction Temperature [
o
C
]
J
J
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
10
2
Operation in This Area
is
L
i
m
i
ted by R
D
S(on)
10
2
10
1
10
0
Operation in This Area
is Limited by R
DS(on)
10
µ
s
10
µ
s
10
1
10
0
100
µ
s
100
µ
s
1
m
s
1
m
s
10 ms
100 ms
10 ms
100 ms
DC
DC
-1
10
-1
10
※
Notes :
※
Notes :
1. T
C
=
2
5
o
C
1. T
C
= 25
o
2. T
J
= 150
o
3. Single Pulse
C
2. T
= 150
o
C
3. Single Pulse
J
C
-2
-2
10
10
0
1
10
2
10
3
10
0
1
10
2
10
3
10
10
10
V
D
S
,
D
rain-Source Voltage [V]
V
D
S
,
D
rain-Source Voltage [V]
Figure 9-1. Maximum Safe Operating Area
for FQP6N40C
Figure 9-2. Maximum Safe Operating Area
for FQPF6N40C
6
5
4
3
2
1
0
25
50
75
100
125
150
℃
T
C
,
C
ase Temperature [
]
Figure 10. Maximum Drain Current
vs Case Temperature
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Typical Characteristics
(Continued)
1
0
0
D = 0
.
5
0
.
2
0
.
1
※
N o tes
1 .
Z
θ
J
C
(
t)
2 .
D
u
ty
F ac to r,
D = t
1
/t
2
3 .
T
J
M
T
C
P
D M
Z
θ
J
C
(
t)
:
℃
/W M
a x.
=
1 .7 1
0
.
0 5
1
0
–
1
–
=
*
0
.
0 2
0
.
0 1
P
DM
s in g le
p u ls e
t
1
t
2
1
0
–
2
1
0
–
5
1
0
–
4
1
0
–
3
1
0
–
2
1
0
–
1
1
0
0
1
0
1
t
1
, S
q u a
r
e
W a v e
P u ls e
D u ra tio n
[s e c ]
Figure 11-1. Transient Thermal Response Curve for FQP6N40C
D = 0
.
5
1
0
0
0
.
2
0
.
1
※
N
o
tes
1. Z
θ
(
t)
2. D
u
J
t
C
y
F
actor, D
=t
1
/
t
2
:
℃
/W M
ax.
=
3
.
3
1
0
.
0 5
3. T
J
M
–
T
C
=
P
D M
*
Z
θ
J
C
(
t)
1
0
–
1
0
.
0 2
0
.
0 1
P
DM
s in g le
p u ls e
t
1
t
2
1
0
–
2
1
0
–
5
1
0
–
4
1
0
–
3
1
0
–
2
1
0
–
1
1
0
0
1
0
1
t
1
, S
q u a
r
e
W a ve
P u lse
D u ra tio n
[se c ]
Figure 11-2. Transient Thermal Response Curve for FQPF6N40C
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Gate Charge Test Circuit & Waveform
V
GS
Same Type
50K
ꢀ
as DUT
Q
g
12V
200nF
10V
300nF
V
DS
V
GS
Q
gs
Q
gd
DUT
3mA
Charge
Resistive Switching Test Circuit & Waveforms
R
L
V
DS
90%
V
DS
V
DD
V
GS
R
G
10%
V
GS
DUT
10V
t
d(on)
t
r
t
d(off)
t
f
t
on
t
off
Unclamped Inductive Switching Test Circuit & Waveforms
BV
DSS
——————–
BV
DSS
– V
DD
L
1
2
2
—-
E
AS
=
L
I
AS
V
DS
I
D
BV
DSS
I
AS
R
G
V
DD
I
D
(t)
V
DD
V
DS
(t)
DUT
10V
t
p
t
p
Time
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Peak Diode Recovery dv/dt Test Circuit & Waveforms
+
DUT
V
DS
_
I
SD
L
Driver
R
G
Same Type
as DUT
V
DD
V
GS
• dv/dt controlled by
R
G
• I
SD
controlled by pulse period
Gate Pulse Width
————————–
V
GS
D =
Gate Pulse Period
10V
( Driver )
I
FM
, Body Diode Forward Current
I
SD
di/dt
( DUT )
I
RM
Body Diode Reverse Current
Body Diode Recovery dv/dt
V
SD
V
DS
( DUT )
V
DD
Body Diode
Forward Voltage Drop
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Package Dimensions
TO-220
4.50
±
0.20
9.90
±
0.20
(8.70)
+0.10
–0.05
1.30
ø3.60
±
0.10
1.27
±
0.10
1.52
±
0.10
0.80
±
0.10
+0.10
–0.05
0.50
2.40
±
0.20
2.54TYP
2.54TYP
[2.54
±
0.20
]
[2.54
±
0.20
]
10.00
±
0.20
Dimensions in Millimeters
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
Package Dimensions
(Continued)
TO-220F
2.54
±
0.20
10.16
±
0.20
ø
3.18
±
0.10
(7.00)
(0.70)
(1.00×45
°
)
MAX1.47
0.80
±
0.10
#1
0.35
±
0.10
+0.10
–
0.05
0.50
2.76
±
0.20
2.54TYP
2.54TYP
[2.54
±
0.20
]
[2.54
±
0.20
]
9.40
±
0.20
Dimensions in Millimeters
©2003 Fairchild Semiconductor Corporation
Rev. A, May 2003
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
FACT™
ImpliedDisconnect™ PACMAN™
SPM™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOLT
™ FRFET™
DOME™
EcoSPARK™
E
2
CMOS™
EnSigna™
FACT Quiet series™
ISOPLANAR™
POP™
Stealth™
FAST
®
LittleFET™
MicroFET™
MicroPak™
Power247™
PowerTrench
®
QFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
FASTr™
GlobalOptoisolator™ MICROWIRE™
QS™
GTO™
HiSeC™
I
2
C™
MSX™
MSXPro™
OCX™
QT Optoelectronics™
TinyLogic
®
Quiet Series™
TruTranslation™
RapidConfigure™
RapidConnect™
UHC™
OCXPro™
OPTOLOGIC
®
OPTOPLANAR™
UltraFET
®
Across the board. Around the world.™
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®
VCX™
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2003 Fairchild Semiconductor Corporation
Rev. I2
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FQPF6N40C
400V N-Channel Advance Q-FET C-Series
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Contents
•
General description
•
Features
•
Qualification Support
Product Change Notices
(PCNs)
Datasheet
•
Product status/pricing/packaging
•
Order Samples
Download this
datasheet
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Sales support
Quality and reliability
Design center
General description
These N-Channel enhancement mode power field effect transistors are
produced using Fairchild’s proprietary, planar stripe, DMOS technology.
This advanced technology has been especially tailored to minimize on-state
resistance, provide superior switching performance, and withstand high
energy pulse in the avalanche and commutation mode. These devices are
well suited for high efficiency switched mode power supplies, electronic
lamp ballasts based on half bridge topology.
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Features
z
6A, 400V, R
= 1.0 @V
= 10 V
DS(on) GS
z
z
z
z
z
Low gate charge ( typical 16 nC)
Low Crss ( typical 15 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
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Product status/pricing/packaging
Product
Product status
Pb-free Status
Pricing*
Package type
Leads
Packing method
Package Marking Convention**
Line 1:
(Fairchild logo)
$Y
&
(Asm. Plant Code)
Z
& (4-Digit
Date Code)
4
FQPF6N40C
Full Production
Full Production
$0.86
$0.87
TO-220F
TO-220F
3
3
RAIL
RAIL
Line 2: FQPF Line 3: 6N40C
Line 1:
(Fairchild logo)
$Y
& (Asm.
Plant Code)
Z
FQPF6N40CT
& (4-Digit
Date Code)
4
* Fairchild 1,000 piece Budgetary Pricing
** A sample button will appear if the part is available through Fairchild’s on-line samples program. If there is no sample button, please
contact a
to obtain samples
Indicates product with Pb-free second-level interconnect. For more information
click here.
Package marking information for product FQPF6N40C is available.
Click here for more information
.
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Qualification Support
Click on a product for detailed qualification data
Product
FQPF6N40C
FQPF6N40CT
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