onsemi-IRFU220BTU
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November 2001
IRFR220B / IRFU220B
200V N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switching DC/DC converters,
switch mode power supplies, DC-AC converters for
uninterrupted power supply and motor control.
•
•
•
•
•
•
4.6A, 200V, R
= 0.8
Ω
@V =
10 V
DS(on) GS
Low gate charge ( typical 12 nC)
Low Crss ( typical
10 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
!
D
●
◀
▲
●
●
G
!
I-PAK
IRFU Series
D-PAK
IRFR Series
G
S
G D S
!
S
Absolute Maximum Ratings
T =
25°C unless otherwise noted
C
Symbol
Parameter
IRFR220B / IRFU220B
Units
V
V
I
Drain-Source Voltage
200
4.6
DSS
– Continuous (T
= 25°C)
Drain Current
A
D
C
– Continuous (T
= 100°C)
2.9
A
C
I
(Note 1)
Drain Current
– Pulsed
18
A
DM
V
E
I
Gate-Source Voltage
±
30
65
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
4.6
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
4.0
mJ
V/ns
W
AR
dv/dt
5.5
Power Dissipation (T
= 25°C) *
2.5
P
A
D
Power Dissipation (T
= 25°C)
40
W
C
– Derate above 25°C
Operating and Storage
T
e
mperature Range
0.32
-55 to +150
W/°C
°C
T , T
J
stg
Maximum lead temperature for soldering purposes,
T
300
°C
L
1/8
”
from case for 5 seconds
Thermal Characteristics
Symbol
Parameter
Typ
—
Max
3.14
50
Units
°C
/
W
°C
/
W
°C
/
W
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient *
Thermal Resistance, Junction-to-Ambient
θ
JC
θ
JA
θ
JA
—
—
110
* When mounted on the minimum pad size recommended (PCB Mount)
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
Electrical Characteristics
T =
25°C unless otherwise noted
C
Symbol
Parameter
Test Conditions
Min
T
y
p
Max
Units
Off Characteristics
BV
V
= 0
V
, I
=
2
50
µ
A
GS D
Drain-Source Breakdown Voltage
200
—
—
—
—
V
DSS
∆
BV
Breakdown Voltage
T
e
mperature
Coefficient
DSS
I
= 250
µ
A, Referenced to 25°C
0.2
V/°C
D
/
∆
T
J
I
V
V
V
V
= 200
V
, V
= 0 V
—
—
—
—
—
—
—
—
10
100
100
-100
µ
A
µ
A
nA
nA
DSS
DS
GS
Zero Gate Voltage Drain Current
= 160
V
, T
=
1
25°C
DS
GS
GS
C
I
= 30
V
, V
= 0 V
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
GSSF
DS
I
= -30
V
, V
= 0 V
GSSR
DS
On Characteristics
V
V
V
V
= V
, I
= 250
µ
A
Gate Threshold Voltage
2.0
—
—
4.0
0.8
—
V
Ω
S
GS(th)
DS
GS
DS
GS
D
R
Static Drain-Source
On-Resistance
DS(on)
= 10
V
, I
=
2
.3 A
0.65
3.7
D
g
= 40
V
, I
=
2
.3 A
(Note 4)
Forward Transconductance
—
FS
D
Dynamic Characteristics
C
C
C
Input Capacitance
—
—
—
300
50
390
65
pF
pF
pF
iss
V
= 25
V
, V
= 0 V,
GS
DS
Output Capacitance
oss
rss
f = 1.0 MHz
Reverse Transfer Capacitance
10
13
Switching Characteristics
t
t
t
t
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
T
o
tal Gate Charge
Gate-Source Charge
Gate-Drain Charge
—
—
—
—
—
—
—
6.8
45
24
100
70
90
16
—
ns
ns
d(on)
V
= 100
V
, I
=
5
.0 A,
DD
D
r
R
= 25
Ω
G
30
ns
d(off)
f
(Note 4, 5)
(Note 4, 5)
40
ns
Q
Q
Q
12
nC
nC
nC
g
V
V
= 160
V
, I
=
5
.0 A,
DS
D
2.0
5.5
= 10 V
gs
gd
GS
—
Drain-Source Diode Characteristics and Maximum Ratings
I
Maximum Continuous Drain-Source Diode Forward Current
—
—
—
—
—
—
—
4.6
18
1.5
—
A
A
S
I
Maximum Pulsed Drain-Source Diode Forward Current
SM
V
t
V
V
= 0
V
, I
=
4
.6 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
—
V
SD
GS
S
= 0
V
, I
=
5
.0 A,
130
0.58
ns
µ
C
rr
GS
S
(Note 4)
dI /
dt = 100 A/
µ
s
Q
Reverse Recovery Charge
—
F
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 4.6mH, I
= 4.6A, V
= 50V, R
= 25
Ω,
Starting T =
25°C
AS
DD
G
J
3. I
≤
5.0A, di/dt
≤
300A/
µ
s, V
≤
BV Starting
T =
25°C
SD
DD
DSS, J
4. Pulse Test : Pulse width
≤
300
µ
s, Duty cycle
≤
2%
5. Essentially independent of operating temperature
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
Typical Characteristics
V
G
S
Top :
15.
0
V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
1
10
10
1
Botto
m
:
5
.
0
V
150
o
C
0
10
10
0
25
o
C
-55
o
C
※
※
Notes :
Notes :
μ
1. V
= 40V
1. 250
s Pulse Test
DS
μ
-1
10
℃
2. 250
s Pulse Test
2. T
C
=
2
5
-1
10
-1
10
0
10
1
10
2
4
6
8
10
V
G
S
,
G
ate-Source Voltage [V]
V
D
S
,
D
rain-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
4.0
3.2
2.4
1.6
0.8
0.0
10
1
V
GS
= 10V
V
GS
= 20V
10
0
℃
150
℃
25
※
Notes :
1. V
= 0V
GS
μ
2. 250
s Pulse Test
※
℃
Note : T = 25
J
-1
10
0
3
6
9
12
15
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
I
D
,
D
rain Current [A]
V
S
D
,
S
ource-Drain voltage [V]
Figure 3. On-Resistance Variation
vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
800
600
400
200
0
12
10
8
C
iss
=
C
g
s
+
C
g
d
(C
d
s
= shorted)
C
o
ss
=
C
d
s
+ C
gd
V
DS
= 40V
V
DS
= 100V
C
r
ss
=
C
g
d
V
DS
= 160V
C
iss
C
6
oss
4
C
rss
※
Notes :
1. V
G
S
= 0 V
2. f = 1 MHz
2
※
Not
e
:
I
D
=
5
.0 A
12
0
-1
10
10
0
10
1
0
2
4
6
8
10
14
Q
G
, Total Gate Charge [nC]
V
D
S
,
D
rain-Source Voltage [V]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
Typical Characteristics
(Continued)
1.2
1.1
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
※
N
otes :
0.9
1. V
G
S
= 0 V
※
Notes :
2. I
D
=
2
50
μ
A
1. V
G
S
= 10 V
2. I
D
= 2.5 A
0.8
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
T
J
, Junction Temperature [
o
C
]
T,
J
unction Temperature [
o
C
]
J
Figure 7. Breakdown Voltage Variation
vs Temperature
Figure 8. On-Resistance Variation
vs Temperature
10
2
5
4
3
2
1
0
Operation in This Area
is Limited by R
D
S(on)
10
1
10
0
100
µ
s
1
m
s
10 ms
DC
-1
10
※
Notes :
1. T
C
=
2
5
o
C
2. T = 150
o
C
J
3. Single Pulse
-2
10
10
10
1
10
2
0
25
50
75
100
125
150
℃
T
C
,
C
ase Temperature [
]
V
D
S
,
D
rain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
D = 0 .5
※
N
o
t
e
s
1. Z
θ
(
t)
2. D
u
J
t
C
y
F
actor, D
=t
1
/t
2
3. T
J
M
T
C
P
D M
Z
θ
J
C
(
t)
:
1 0
0
℃
/W M
a
x.
=
3.14
0
.
2
–
=
*
0
.
1
0
.
0 5
P
DM
0
.
0 2
1 0
-1
0
.
0 1
t
1
sin g le
p u lse
t
2
1
0
-5
1
0
-4
1
0
-3
1
0
-2
1
0
-1
1
0
0
1
0
1
t
1
, S
q
u a re
W ave
P u lse
D u ra tion
[se c]
Figure 11. Transient Thermal Response Curve
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
Gate Charge Test Circuit & Waveform
V
GS
Same Type
50K
ꢀ
as DUT
Q
g
12V
200nF
10V
300nF
V
DS
V
GS
Q
gs
Q
gd
DUT
3mA
Charge
Resistive Switching Test Circuit & Waveforms
R
L
V
DS
90%
V
DS
V
DD
V
GS
R
G
10%
V
GS
DUT
10V
t
d(on)
t
r
t
d(off)
t
f
t
on
t
off
Unclamped Inductive Switching Test Circuit & Waveforms
BV
DSS
——————–
BV
DSS
– V
DD
L
1
2
2
—-
E
AS
=
L I
AS
V
DS
I
D
BV
DSS
I
AS
R
G
V
DD
I
D
(t)
V
DD
V
DS
(t)
DUT
10V
t
p
t
p
Time
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
Peak Diode Recovery dv/dt Test Circuit & Waveforms
+
DUT
V
DS
_
I
SD
L
Driver
R
G
Same Type
as DUT
V
DD
V
GS
• dv/dt controlled by
R
G
• I
SD
controlled by pulse period
Gate Pulse Width
————————–
V
GS
D =
Gate Pulse Period
10V
( Driver )
I
FM
, Body Diode Forward Current
I
SD
di/dt
( DUT )
I
RM
Body Diode Reverse Current
Body Diode Recovery dv/dt
V
SD
V
DS
( DUT )
V
DD
Body Diode
Forward Voltage Drop
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
Package Dimensions
D-PAK
6.60
±
0.20
5.34
±
0.30
2.30
±
0.10
0.50
±
0.10
(0.50)
(4.34)
(0.50)
MAX0.96
0.76
±
0.10
0.50
±
0.10
1.02
±
0.20
2.30
±
0.20
2.30TYP
2.30TYP
[2.30
±
0.20]
[2.30
±
0.20]
6.60
±
0.20
(5.34)
(5.04)
(1.50)
(2XR0.25)
0.76
±
0.10
Dimensions in Millimeters
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
Package Dimensions
(Continued)
I-PAK
2.30
±
0.20
0.50
±
0.10
6.60
±
0.20
5.34
±
0.20
(0.50)
(4.34)
(0.50)
MAX0.96
0.76
±
0.10
0.50
±
0.10
2.30TYP
2.30TYP
[2.30
±
0.20]
[2.30
±
0.20]
Dimensions in Millimeters
©2001 Fairchild Semiconductor Corporation
Rev. B, November 2001
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
FAST
®
FASTr™
FRFET™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
SMART START™
STAR*POWER™
Stealth™
VCX™
CROSSVOLT
™
DenseTrench™
DOME™
EcoSPARK™
E
2
CMOS™
EnSigna™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
POP™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TruTranslation™
TinyLogic™
Power247™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SLIENT SWITCHER
®
FACT™
FACT Quiet Series™
UHC™
UltraFET
®
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2001 Fairchild Semiconductor Corporation
Rev. H4
