onsemi-ISL9V3040P3

Part #onsemi-ISL9V3040P3
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onsemi-ISL9V3040P3
DATA SHEET  
ECOSPARK

ꢀ

Ignition IGBT  
COLLECTOR  
300 mJ, 400
V
, N
−
Channel Ignition IGBT  
R
1
GATE  
ISL9V3040D3S,  
ISL9V3040S3S,  
ISL9V3040P3  
R
2
EMITTER  
General Description  
The ISL9V3040D3S, ISL9V3040S3S, and ISL9V3040P3 are the  
next generation ignition IGBTs that offer outstanding SCIS capability  
in the space saving D
−
Pak (TO
−
252), as well as the industry standard  
2
D
−
Pak (TO
−
263), and TO
−
262 and TO
−
220 plastic packages. This  
device is intended for use in automotive ignition circuits, specifically  
as a coil driver. Internal diodes provide voltage clamping without the  
need for external components.  
2
DPAK3  
CASE 369AS  
D PAK
−
3  
CASE 418AJ  
ECOS
P
A
RK devices can be custom made to specific clamp  
voltages. Contact your nearest
onsemi
sales office for more  
information.  
Formerly Developmental Type 49362.  
Features  
•
Space Saving D
−
Pak Package Availability  
TO
−
220
−
3LD  
CASE 340AT  
•
SCIS Energy = 300 mJ at T
 
= 25
°
C  
J
•
Logic Level Gate Drive  
•
AEC
−
Q101 Qualified and P
P
A
P Capable  
•
These are Pb
−
Free Devices  
MARKING DIAGRAMS  
AYWW  
XXX  
XXXXXG  
Applications  
•
Automotive Ignition Coil Driver Circuits  
•
Coil
−
On Plug Application  
AYWWZZ  
XXXXX  
A
= Assembly Location  
Y
=
Y
e
ar  
WW  
XXXX  
ZZ  
= Work Week  
= Device Code  
= Assembly Lot Number  
= Pb
−
Free Package  
G
ORDERING INFORMATION  
See detailed ordering and shipping information on page

of this data sheet.  
©
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
November, 2021
−
Rev. 4  
ISL9V3040P3/D  

ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3  
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
A
Symbol  
Parameter  
Collector to Emitter Breakdown Voltage (I
 
= 1 mA)  
Rating  
430  
Unit  
V
BV  
CER  
ECS  
C
BV  
Emitter to Collector Voltage
−
Reverse Battery Condition (I
 
= 10 mA)  
24  
V
C
E
At Starting T
 
= 25
°
C, I
 
= 14.2 A, L = 3.0 mHy  
SCIS  
300  
mJ  
mJ  
A
SCIS25  
J
E
At Starting T
 
= 150
°
C, I
 
= 10.6 A, L = 3.0 mHy  
SCIS  
170  
SCIS150  
J
I
Collector Current Continuous, At T
 
= 25
°
C, See Fig 9  
21  
C25  
C
I
Collector Current Continuous, At T
 
= 110
°
C, See Fig 9  
17  
A
C110  
C
V
GEM  
Gate to Emitter Voltage Continuous  
10  
V
P
D
Power Dissipation
T
o
tal T
 
= 25
°
C  
150  
W
C
Power Dissipation Derating T
 
> 25
°
C  
1.0  
W/
°
C  
°
C  
°
C  
°
C  
°
C  
kV  
C
T
J
Operating Junction
T
e
mperature Range  
−
40 to 175  
−
40 to 175  
300  
T
STG  
Storage Junction
T
e
mperature Range  
T
L
Max Lead
T
e
mp for Soldering (Leads at 1.6 mm from Case for 10 s)  
Max Lead
T
e
mp for Soldering (Package Body for 10 s)  
Electrostatic Discharge Voltage at 100 p
F
,
1
500
W
 
T
pkg  
260  
ESD  
4
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Units  
Thermal Resistance Junction Case  
R
1.0  
°
C/W  
q
JC  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
A
Symbol  
Parameter  
Test Conditions  
Min  
Typ.  
Max.  
Units  
OFF CHARACTERISTICS  
BV  
BV  
BV  
Collector to Emitter Breakdown  
Voltage  
I
= 2 mA, V
 
= 0
V
,  
GE  
G
370  
390  
30  
400  
430  
450  
−
V
CER  
C
R
= 1 k
W
, See Figure 15  
T =
 
−
40 to 150
°
C  
J
Collector to Emitter Breakdown  
Voltage  
I
= 10 mA, V  
G
= 0
V
,  
420  
V
V
CES  
C
GE  
R
= 0, See Figure 15  
T =
 
−
40 to 150
°
C  
J
Emitter to Collector Breakdown  
Voltage  
I
=
−
75 mA, V
 
= 0
V
,  
GE  
−
ECS  
C
T
= 25
°
C  
C
BV  
I
Gate to Emitter Breakdown Voltage  
Collector to Emitter Leakage Current  
I
=
2 mA  
12  
14  
−
V
GES  
GES  
V
R
= 250 V  
T
T
= 25
°
C  
−
−
25  
m
A  
CER  
CER  
C
= 1 k
W  
G
= 150
°
C  
−
−
1
mA  
mA  
C
I
Emitter to Collector Leakage Current  
V
= 24 V,  
T
T
= 25
°
C  
−
−
−
−
1
40  
−
ECS  
EC  
C
= 150
°
C  
C
R
R
Series Gate Resistance  
−
70  
−
W
W
1
2
Gate to Emitter Resistance  
10K  
26K  
ON CHARACTERISTICS  
V
V
V
Collector to Emitter Saturation  
Voltage  
I
= 6 A,  
GE  
T
= 25
°
C,  
−
−
−
1.25  
1.58  
1.90  
1.60  
1.80  
2.20  
V
V
V
CE(SAT)  
CE(SAT)  
CE(SAT)  
C
C
V
= 4 V  
Collector to Emitter Saturation  
Voltage  
I
= 10 A,  
T =
 
150
°
C,  
C
T =
 
150
°
C  
C
C
V
= 4.5 V  
GE  
Collector to Emitter Saturation  
Voltage  
I
= 15 A,  
C
V
= 4.5 V  
GE  
2

ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted) (continued)  
A
Symbol  
Parameter  
Test Conditions  
Min  
Typ.  
Max.  
Units  
DYNAMIC CHARACTERISTICS  
Q
Gate Charge  
I
= 10 A, V  
= 12
V
, V
 
= 5 V  
−
17  
−
nC  
V
G(ON)  
C
CE  
GE  
V
Gate to Emitter Threshold Voltage  
I
= 1.0 mA  
T
T
= 25
°
C  
1.3  
0.75  
−
−
−
2.2  
1.8  
−
GE(TH)  
C
C
V
= V  
GE  
CE  
= 150
°
C  
C
V
Gate to Emitter Plateau Voltage  
V
= 12 V, I
 
= 10 A  
3.0  
V
GEP  
CE  
C
SWITCHING CHARACTERISTICS  
t
Current Turn
−
On Delay  
Time
−
Resistive  
V
V
J
= 14
V
, R
 
= 1
W
,  
−
0.7  
4
m
s  
d(ON)R  
CE  
GE  
L
= 5
V
, R
 
= 1
k
W
,  
G
t
rR  
Current Rise Time
−
Resistive  
−
−
2.1  
4.8  
7
td  
Current Turn
−
Off Delay  
Time
−
Inductive  
V
CE  
V
GE  
= 300
V
, L =
5
00
m
H,  
15  
m
s  
(OFF)L  
= 5
V
, R
 
= 1
k
W
,  
G
J
t
fL  
Current Fall Time
−
Inductive  
−
−
2.8  
15  
SCIS  
Self Clamped Inductive Switching  
T =
 
25
°
C, L = 3.0 mH,  
−
300  
mJ  
J
V
GE  
= 5
V
, R
 
= 1
k
W
,  
G
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3

ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3  
TYPICAL CHARACTERISTICS  
Figure 2. Self Clamped Inductive Switching  
Figure 1. Self Clamped Inductive Switching  
Current vs. Time in Clamp  
Current vs. Inductance  
Figure 3. Collector to Emitter On
−
State Voltage  
Figure 4. Collector to Emitter On
−
State Voltage  
vs. Junction Temperature  
vs. Junction Temperature  
Figure 5. Collector to Emitter On
−
State Voltage  
Figure 6. Collector to Emitter On
−
State Voltage  
vs. Collector Current  
vs. Collector Current  
4

ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3  
TYPICAL CHARACTERISTICS
(continued)  
Figure 7. Collector to Emitter On
−
State Voltage  
Figure 8. Transfer Characteristics  
vs. Collector Current  
Figure 9. DC Collector Current vs. Case  
Temperature  
Figure 10. Threshold Voltage vs. Junction  
Temperature  
Figure 12. Switching Time vs. Junction  
Temperature  
Figure 11. Leakage Current vs. Junction  
Temperature  
5

ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3  
TYPICAL CHARACTERISTICS
(continued)  
Figure 13. Capacitance vs. Collector to Emitter Voltage  
Figure 14. Gate Charge  
Figure 15. Breakdown Voltage vs. Series Resistance  
Figure 16. IGBT Normalized Transient Thermal Impedance, Junction to Case  
6

ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3  
TEST CIRCUIT AND WAVEFORMS  
Figure 17. Inductive Switching Test Circuit  
Figure 18. t

ON

and t

OFF

Switching Test Circuit  
Figure 19. Energy Test Circuit  
Figure 20. Energy Waveforms  
7

ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3  
PACKAGE MARKING AND ORDERING INFORMATION  
†
Device  
Package  
Shipping  
ISL9V3040D3ST  
DPAK  
2500 Units/
T
a
pe & Reel  
800 Units/
T
a
pe & Reel  
50 Units/Tube  
(Pb
−
Free)  
ISL9V3040S3ST  
ISL9V3040P3  
D2PAK  
(Pb
−
Free)  
TO220  
(Pb
−
Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our
T
a
pe and Reel Packaging  
Specifications Brochure, BRD8011/D.  
ECOSPARK is a registered trademark of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates and/or subsidiaries in the United States  
and/or other countries.  
8

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO
−
220
−
3LD  
CASE 340AT  
ISSUE A  
DATE 03 OCT 2017  
Scale 1:1  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13818G  
TO
−
220
−
3LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2019  

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DPAK3 (TO
−
252 3 LD)  
CASE 369AS  
ISSUE A  
DATE 28 SEP 2022  
GENERIC  
MARKING DIAGRAM*  
XXXXXX  
XXXXXX  
AYWWZZ  
XXXX = Specific Device Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
A
Y
= Assembly Location  
=
Y
e
ar  
WW =
 
Work Week  
ZZ  
= Assembly Lot Code  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON13810G  
DPAK3 (TO
−
252 3 LD)  
PAGE 1 OF 1  
DESCRIPTION:  
onsemi
and  
are trademarks of Semiconductor Components Industries, LLC dba
onsemi
or its subsidiaries in the United States and/or other countries.
onsemi
reserves  
the right to make changes without further notice to any products herein.
onsemi
makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does
onsemi
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages.
onsemi
does not convey any license under its patent rights nor the rights of others.  
©
Semiconductor Components Industries, LLC, 2019  

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
D

2

PAK
−
3 (TO
−
263, 3
−
LEAD)  
CASE 418AJ  
ISSUE F  
DATE 11 MAR 2021  
SCALE 1:1  
XXXXXX = Specific Device Code  
A
= Assembly Location  
WL  
Y
= Wafer Lot  
=
Y
e
ar  
GENERIC MARKING DIAGRAMS*  
WW  
W
M
G
AKA  
= Work Week  
= Week Code (SSG)  
= Month Code (SSG)  
= Pb
−
Free Package  
= Polarity Indicator  
XX  
AYWW  
XXXXXXXXG  
AKA  
XXXXXXXXG  
AYWW  
XXXXXX  
XXYMW  
XXXXXXXXX  
AWLYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
IC  
Standard  
Rectifier  
SSG  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON56370E  
D

2

PAK
−
3 (TO
−
263, 3
−
LEAD)  
PAGE 1 OF 1  
DESCRIPTION:  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2018  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
and/or subsidiaries in the United States and/or other countries.
onsemi
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of
onsemi
’s product/patent coverage may be accessed at

.
onsemi
reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “as
−
is” and
onsemi
makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using
onsemi
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
onsemi
does not convey any license  
under any of its intellectual property rights nor the rights of others.
onsemi
products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use
onsemi
products for any such unintended or unauthorized application, Buyer shall indemnify and hold
onsemi
and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that
onsemi
was negligent regarding the design or manufacture of the part.
onsemi
is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMEN
T
:  
Email Requests to:

TECHNICAL SUPPORT  
North American Technical Support:  
Voice Mail: 1 800
−
282
−
9855
T
o
ll Free USA/Canada  
Phone: 011 421 33 790 2910  
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For additional information, please contact your local Sales Representative  
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