onsemi-J109

Part #onsemi-J109
Download 
onsemi-J109
N-Channel JFET  
J109, MMBFJ108  
Features  
•
This Device is Designed for Digital Switching Applications where  
V
e
ry Low On Resistance is Mandatory  
•
Sourced from Process 58  
•
These are Pb
−
Free Devices  
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise specified)

A
Symbol  
Parameter  
Drain
−
Gate Voltage  
Value  
25  
Unit  
V
V
V
DG  
GS  
GF  
Gate
−
Source Voltage  
−
25  
V
1
I
Forward Gate Current  
10  
mA  
°
C  
TO
−
92 3 4.825×4.76  
T , T  
Operating and Storage Junction  
T
e
mperature Range  
−
55 to 150  
J
STG  
CASE 135AN  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. These
 
ratings are based on a maximum junction temperature of 150
°
C.  
2. These
 
are steady
−
state limits. ON Semiconductor should be consulted on  
applications involving pulsed or low
−
duty
−
cycle operations.  
1
THERMAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise specified)  
A
TO
−
92 3 4.83×4.76  
LEADFORMED  
CASE 135AR  
Max  
J109  
MMBFJ108  
Symbol  
Parameter  
Unit  
mW  
P
D
T
o
tal Device Dissipation  
Derate Above 25
°
C  
625  
5.0  
350  
2.8  
−
3
mW/
°
C  
°
C/W  
1
R
Thermal Resistance,  
Junction
−
to
−
Case  
125  
q
JC  
JA  
2
SOT
−
23/SUPERSOT
t
−
23,  
R
Thermal Resistance,  
Junction
−
to
−
Ambient  
200  
357  
°
C/W  
q
3 LEAD, 1.4×2.9  
CASE 527AG  
3. PCB
 
size: FR
−
4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch)  
with minimum land pattern size.  
1. Drain, 2. Source, 3. Gate  
4. Device
 
mounted on FR
−
4 PCB 36 mm x 18 mm x 1.5 mm; mounting pad for  
2
the collector lead minimum 6 cm
 
.  
MARKING DIAGRAM  
$Y&Z&3&K  
J109  
$Y&Z&3  
J109  
&Y  
I8 &G  
J109  
J109
−
D26Z  
MMBFJ108  
J109, I8
 
= Specific Device Code  
$Y  
&Y  
&G  
&Z  
&3  
&K  
= ON Semiconductor Logo  
=
Y
ear Coding  
= Weekly Date Code  
= Assembly Plant Code  
= Date Code Format  
= Lot Run Traceability Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page

this data sheet.  
©
Semiconductor Components Industries, LLC, 2002  
1
Publication Order Number:  
December, 2020
−
Rev. 4  
J109/D  
 

J109, MMBFJ108  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
J
Symbol  
Parameter  
Test Condition  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
V
Gate
−
Source Breakdown Voltage  
I
=
−
10
m
A, V
 
= 0  
−
25  
−
−
V
(BR)GSS  
G
DS  
I
Gate Reverse Current  
V
V
V
=
−
15
V
, V
 
= 0  
−
3.0  
−
200  
−
10.0  
−
6.0  
nA  
GSS  
GS  
GS  
DS  
DS  
=
−
15
V
, V
 
=
0
, T
 
= 100
°
C  
−
DS  
A
V
(off)  
Gate
−
Source Cut
−
Off Voltage  
= 15 V, I
 
= 10 nA  
MMBFJ108  
J109  
−
3.0  
−
2.0  
V
GS  
D
ON CHARACTERISTICS  
I
V
V
= 15
V
, V
 
= 0  
MMBFJ108  
J109  
80  
40  
−
−
−
mA  
DSS  
DS  
GS  
r
(on)  
Drain
−
Source On Resistance  
≤
0.1
V
, V
 
= 0  
MMBFJ108  
J109  
8.0  
12  
W
DS  
DS  
GS  
−
SMALL SIGNAL CHARACTERISTICS  
C (on)  
dg  
C (off)  
sg  
Drain
−
Gate & Source
−
Gate On Capacitance  
V
DS  
= 0, V
 
= 0, f = 1.0 MHz  
−
85  
pF  
GS  
C (off)  
dg  
C (off)  
sg  
Drain
−
Gate Off Capacitance  
Source
−
Gate Off Capacitance  
V
V
= 0, V
 
=
−
10
V
, f =
1
.0 MHz  
−
−
15  
15  
pF  
pF  
DS  
GS  
= 0, V
 
=
−
10
V
, f =
1
.0 MHz  
DS  
GS  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
5. Pulse
 
test: pulse width
≤
300
m
s, duty cycle
≤
2%.  
TYPICAL PERFORMANCE CHARACTERISTICS  
300  
V
= 10 mV  
GS  
Unit with Typical  
V
= 500 mV  
= 1.0 V  
GS  
V
(off) =
−
7.8 V  
GS  
V
V
V
V
T
A
= 25
°
C  
GS  
GS  
GS  
GS  
250  
200  
150  
100  
50  
= 1.5 V  
= 2.0 V  
= 2.5 V  
= 3.0 V  
V
GS  
V
= 3.5 V  
= 4.0 V  
= 4.5 V  
GS  
V
GS  
GS  
V
V
= 5.0 V  
GS  
V
= 5.5 V  
GS  
V
= 6.5 V  
GS  
V
V
= 6.0 V  
= 7.0 V  
GS  
GS  
0
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
V
DS  
, DRAIN SOURCE VOLTAGE (V)  
Figure 1. Common Drain
−
Source, MMBFJ108  
2
 

J109, MMBFJ108  
TYPICAL PERFORMANCE CHARACTERISTICS
(continued)  
200  
180  
160  
140  
120  
100  
80  
V
=
−
0.01 V  
GS  
−
0.5 V  
−
1.0 V  
−
1.5 V  
−
2.0 V  
−
2.5 V  
−
3.5 V  
60  
40  
Unit with Typical  
VGS(off) =
−
4.8 V  
20  
T
A
= 25
°
C  
0
0
2
4
6
8
10  
12  
14  
16  
V
DS  
, DRAIN SOURCE VOLTAGE (V)  
Figure 2. Common Drain
−
Source,MMBFJ108, J109  
250  
200  
150  
100  
50  
Unit with Typical  
VGS(off) =
−
2.9 V  
T
A
= 25
°
C  
V
=
−
0.1 V  
GS  
−
0.5 V  
−
1.0 V  
−
1.5 V  
−
2.0 V  
3
0
0
1
2
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
V
DS  
, DRAIN SOURCE VOLTAGE (V)  
Figure 3. Common Drain
−
Source, J109  
3

J109, MMBFJ108  
TYPICAL PERFORMANCE CHARACTERISTICS
(continued)  
1000  
100  
10  
1
V
V
V
= 0 PULSED  
= 5 V  
V
I
V
= 100 mV  
= 100 mA  
GS  
GS  
DS  
D
@ V
 
= 15
V
, I
 
=
1
0 nA  
@ V
 
= 15
V
, I
 
=
1
0 nA  
GS(off)  
DS  
D
GS(off)  
DS  
D
100  
10  
−
1  
−
1  
−
10  
100  
25  
−
10  
V
, GATE CUTOFF VOLTAGE (V)  
V
, GATE CUTOFF VOLTAGE (V)  
GS(off)  
GS(off)  
Figure 4. Drain ON Resistance  
Figure 5. Drain Current vs.  
Gate
−
Source Cut
−
Off Voltage  
100  
50  
10  
8
V
= 10 V  
T =
 
25
°
C  
A
DG  
BW = 6.0 Hz @ f = 10 Hz, 100 Hz  
V
V
= 1.5 V  
=
−
12 V  
DD  
= 0.21 @ f
≥
1.0 kHz  
GS  
6
I
D
= 30 mA  
10  
5
4
I
D
= 10 mA  
I
D
= 1.0 mA  
I
= 10 mA  
D
2
1
0
0.01  
0.03  
0.1  
0.5  
1
2
10  
0
−
2  
−
4  
−
6  
−
8  
−
10  
f, FREQUENCY (Hz)  
V
GS(off)  
, GATE CUTOFF VOLTAGE (V)  
Figure 6. Noise Voltage vs. Frequency  
Figure 7. Switching Turn
−
On Time vs.  
Gate
−
Source Cut
−
Off Voltage  
100  
50  
40  
30  
20  
10  
0
VGS = 0 V  
V
V
=
−
8.5 V  
=
−
5.5 V  
GS(off)  
GS(off)  
T
A
= 125
°
C  
25
°
C  
VGS(off) =
−
2.9 V  
V
=
−
3.5 V  
10  
GS(off)  
−
55
°
C  
VGS(off) =
−
4.0 V  
T
= 25
°
C  
= 1.5 V  
=
−
12 V  
A
V
V
DD  
GS  
1
1
10  
100  
0
5
10  
15  
20  
I ,
 
DRAIN CURRENT (mA)  
D
I ,
 
DRAIN CURRENT (mA)  
D
Figure 8. Switching Turn
−
On Time vs. Drain Current  
Figure 9. On Resistance vs. Drain Current  
4

J109, MMBFJ108  
TYPICAL PERFORMANCE CHARACTERISTICS
(continued)  
1000  
100  
10  
100  
T
= 25
°
C  
T
= 25
°
C  
A
A
f = 1.0 kHz  
V
V
f = 1.0 kHz  
VGS(off) =
−
4.0 V  
= 10 V  
GS  
GS(off)  
=
−
3.0 V @ V
 
= 15
V
, I
 
=
1
0 nA  
DS  
D
10  
1
0,1  
1
0,1  
1
10  
0,1  
1
10  
I ,
 
DRAIN CURRENT (mA)  
D
I ,
 
DRAIN CURRENT (mA)  
D
Figure 10. Output Conductance vs. Drain Current  
Figure 11. Output Conductance vs. Drain Current  
700  
600  
TO
−
92  
500  
SUPERSOT
−
3  
400  
300  
200  
100  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
T,
A
MBIENT TEMPERATURE (
°
C)  
Figure 12. Power Dissipation vs. Ambient Temperature  
ORDERING INFORMATION  
†
Part Number  
Top Mark  
Package  
Shipping  
J109  
J109  
TO
−
92 3L  
(Pb
−
Free)  
10000 Units / Bulk  
2000 /
T
a
pe & Reel  
3000 /
T
a
pe & Reel  
J109
−
D26Z  
J109  
I8  
TO
−
92 3L  
(Pb
−
Free)  
MMBFJ108  
SSOT 3L  
(Pb
−
Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our
T
a
pe and Reel Packaging  
Specifications Brochure, BRD8011/D.  
SUPERSOT is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
5

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO
−
92 3 4.825×4.76  
CASE 135AN  
ISSUE O  
DATE 31 JUL 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13880G  
TO
−
92 3 4.825X4.76  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2019  

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO
−
92 3 4.83×4.76 LEADFORMED  
CASE 135AR  
ISSUE O  
DATE 30 SEP 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13879G  
TO
−
92 3 4.83X4.76 LEADFORMED  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2019  

MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOT
−
23/SUPERSOT
t
−
23, 3 LEAD, 1.4×2.9  
CASE 527AG  
ISSUE A  
DATE 09 DEC 2019  
GENERIC  
MARKING DIAGRAM*  
*This information is generic. Please refer to  
XXX =
 
Specific Device Code  
device data sheet for actual part marking.  
Pb
−
Free indicator, “G” or microdot “
G
”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
M
= Month Code  
XXXM
G  
G
= Pb
−
Free Package  
G
(Note: Microdot may be in either location)  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions
 
are uncontrolled
 
except when stamped
 
“CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON34319E  
SOT
−
23/SUPERSOT
−
23, 3 LEAD, 1.4X2.9  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
©
Semiconductor Components Industries, LLC, 2019  

onsemi
,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “
onsemi
” or its affiliates  
and/or subsidiaries in the United States and/or other countries.
onsemi
owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of
onsemi’s
product/patent coverage may be accessed at

.
onsemi
reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “as
−
is” and
onsemi
makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using
onsemi
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by
onsemi
. “Typical” parameters which may be provided in
onsemi
data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
onsemi
does not convey any license  
under any of its intellectual property rights nor the rights of others.
onsemi
products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use
onsemi
products for any such unintended or unauthorized application, Buyer shall indemnify and hold
onsemi
and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that
onsemi
was negligent regarding the design or manufacture of the part.
onsemi
is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMEN
T
:  
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TECHNICAL SUPPORT  
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−
282
−
9855
T
o
ll Free USA/Canada  
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