onsemi-J270

J270  

P-Channel Switch  

•

This device is designed for low level analog switching sample and hold  

circuits and chopper stabilized amplifiers.  

•

Sourced from process 88.  

TO-92  

1. Drain

 

2. Gate

 

3. Source  

1

Absolute Maximum Ratings*

T =25

°

C unless otherwise noted  

a

Symbol  

Parameter  

Ratings  

-30  

Units  

V

V

Drain-Gate Voltage  

Gate-Source Voltage  

Forward Gate Current  

V

V

DG  

GS  

30  

I

50  

mA  

°

C  

GF  

T , T  

Operating and Storage Junction

T

e

mperature Range  

-55 ~ 150  

J

STG  

* This ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  

NOTES:  

1) These

 

rating are based on a maximum junction temperature of 150 degrees C.  

2) These

 

are steady limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.  

Electrical Characteristics

T =25

°

C unless otherwise noted  

a

Symbol  

Parameter  

Test Condition  

Min.  

30  

Max.  

Units  

Off Characteristics  

V

Gate-Source Breakdwon Voltage  

Gate Reverse Current  

I

= -1.0

µ

A, V

 

= 0  

V

pA  

V

(BR)GSS  

GSS  

G

DS  

I

V

V

= -20

V

, V

 

= 0  

200  

2.0  

GS  

DS  

DS  

V

Gate-Source Cutoff Voltage  

= -15

V

, I

 

=

1

.0nA  

0.5  

GS(off)  

D

On Characteristics  

Zero-Gate Voltage Drain Current *  

Small Signal Characteristics  

I

V

= -15

V

, V

 

= 0  

-2.0  

6000  

-15  

mA  

DSS  

DS  

GS  

gfs  

Forward Transferconductance  

Common- Source Output Conductance  

V

V

= 0

V

, V

 

=

1

5

V

, f =

1

.0kHz  

15000  

200  

µ

mhos  

µ

mhos  

GS  

GS  

DS  

goss  

= 0

V

, V

 

=

1

5

V

, f =

1

.0kHz  

DS  

Thermal Characteristics

T =25

°

C unless otherwise noted  

A

Symbol  

Parameter  

Max.  

Units  

mW  

mW/

°

C  

P

T

o

tal Device Dissipation  

350  

2.8  

D

Derate above 25

°

C  

R

R

Thermal Resistance, Junction to Case  

Thermal Resistance, Junction to Ambient  

125  

357  

°

C/W  

θ

JC  

θ

JA  

°

C/W  

©2003 Fairchild Semiconductor Corporation  

Rev. A, July 2003  

Package Dimensions  

TO-92  

+0.25  

–0.15  

4.58  

0.46

±

0.10  

+0.10  

–0.05  

1.27TYP  

1.27TYP  

0.38  

[1.27

±

0.20  

]

[1.27

±

0.20

]  

3.60

±

0.20  

(R2.29)  

Dimensions in Millimeters  

©2003 Fairchild Semiconductor Corporation  

Rev. A, July 2003  

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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  

intended to be an exhaustive list of all such trademarks.  

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FACT™  

ImpliedDisconnect™ PACMAN™  

SPM™  

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CoolFET™  

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™ FRFET™  

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EcoSPARK™  

E

2

CMOS™  

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Across the board. Around the world.™  

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®  

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®  

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®  

SuperSOT™-3  

SuperSOT™-6  

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FASTr™  

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QS™  

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I

2

C™  

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®  

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®  

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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR  

CORPORATION.  

As used herein:  

1. Life support devices or systems are devices or systems  

which, (a) are intended for surgical implant into the body,  

or (b) support or sustain life, or (c) whose failure to perform  

when properly used in accordance with instructions for use  

provided in the labeling, can be reasonably expected to  

result in significant injury to the user.  

2. A critical component is any component of a life support  

device or system whose failure to perform can be  

reasonably expected to cause the failure of the life support  

device or system, or to affect its safety or effectiveness.  

PRODUCT STATUS DEFINITIONS  

Definition of Terms  

Datasheet Identification  

Product Status  

Definition  

Advance Information  

Formative or In  

Design  

This datasheet contains the design specifications for  

product development. Specifications may change in  

any manner without notice.  

Preliminary  

First Production  

This datasheet contains preliminary data, and  

supplementary data will be published at a later date.  

Fairchild Semiconductor reserves the right to make  

changes at any time without notice in order to improve  

design.  

No Identification Needed  

Obsolete  

Full Production  

This datasheet contains final specifications. Fairchild  

Semiconductor reserves the right to make changes at  

any time without notice in order to improve design.  

Not In Production  

This datasheet contains specifications on a product  

that has been discontinued by Fairchild semiconductor.  

The datasheet is printed for reference information only.  

©2003 Fairchild Semiconductor Corporation  

Rev. I3