onsemi-KSC5024RTU

Part #onsemi-KSC5024RTU
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onsemi-KSC5024RTU
October 2008  
KSC5024  
NPN Silicon Transistor  
•
•
•
High Voltage and High Reliabilty  
High Speed Switching  
Wide SOA  
TO-3P  
1
1.Base 2.Collector 3.Emitter  
Absolute Maximum Ratings*  
T
= 25°C unless otherwise noted  
a
Symbol  
Parameter  
Ratings  
Units  
V
V

CBO  

V

CEO  

V

EBO  

I

C  

Collector-Base Voltage  
800  
Collector-Emitter Voltage  
Emitter- Base Voltage  
Collector Current (DC)  
Collector Current (Pulse)  
Base Current  
500  
V
7
V
10  
A
I

CP  

20  
A
I

B  

3
90  
A
P

C  

Collector Dissipation (T

C

=25
°
C)  
Junction Temperature  
W
°
C  
°
C  
T

J  

150  
T

STG  

Storage Temperature  
– 55 ~ 150  
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  
Electrical Characteristics*
T

a

=25
°
C unless otherwise noted  
Symbol  
BV

CBO  

Parameter  
Test Condition  
I

C

= 1mA, I

E

= 0  
I

C

= 5mA, I

B

= 0  
I

E

= 1mA, I

C

= 0  
Min.  
Typ.  
Max.  
Units  
Collector-Base Breakdown Voltage  
Collector-Emitter Breakdown Voltage  
Emitter-Base Breakdown Voltage  
Collector-Emitter Sustaining Voltage  
800  
500  
7
V
V
V
V
BV

CEO  

BV

EBO  

V

CEX

(sus)  
I

C

= 3.5A, I

B1

=-I

B2

=1.4A  
500  
L = 500
m
H, Clamped  
I

CBO  

I

EBO  

Collector Cut-off Current  
Emitter Cut-off Current  
DC Current Gain  
V

CB

= 500V, I

E

= 0  
V

EB

= 5V, I

C

= 0  
10  
10  
50  
m
A  
m
A  
h

FE1  

h

FE2  

V

CE

= 5V, I

C

= 0.8A  
V

CE

=5V, I

C

= 4A  
15  
8
V

CE

(Sat)  
V

BE

(Sat)  
C

ob  

Collector-Emitter Saturation Voltage  
Base-Emitter Saturation Voltage  
Output Capacitance  
I

C

= 4A, I

B

= 0.8A  
I

C

= 4A, I

B

= 0.8A  
1
V
V
1.5  
V

CB

= 10V, I

E

=0, f =  
1MHz  
120  
18  
pF  
f

T  

t

on  

t

s  

Current Gain Bandwidth Product  
Turn On Time  
V

CE

= 10V, I

C

=0.8A  
MHz  
m
s  
V

CC

= 200V  
I

C

= 5I

B1

=-2.5I

B2

=5A  
R

L

= 40
W  
0.5  
3
Storage Time  
m
s  
t

f  

Time Fall Time  
0.3  
m
s  
* Pulse Test: Pulse Width
£
300
m
s, Duty Cycle
£
2%  
© 2007 Fairchild Semiconductor Corporation  
KSC5024 Rev. 1.0.0  
1

Typical Characteristics  
12  
10  
8
1000  
100  
10  
V

CE

= 5V  
I

B

= 1.6A  
I

B

= 1.4A  
I

B

= 1.2A  
I

B

= 1A  
I

B

= 800mA  
I

B

= 600mA  
6
I

B

= 500mA  
I

B

= 400mA  
I

B

= 300mA  
I

B

= 200mA  
4
I

B

= 100mA  
I

B

= 50mA  
I

B

= 0  
2
0
1
0
2
4
6
8
10  
12  
0.01  
0.1  
1
10  
V

CE

[V], COLLECTOR-EMITTER VOLTAGE  
I

C

[A], COLLECTOR CURRENT  
Figure 1. Static Characteristic  
Figure 2. DC current Gain  
10  
4
3
2
1
0
V

CE

= 5V  
I

C

= 5 I

B  

V

BE

(sat)  
1
0.1  
V

CE

(sat)  
0.01  
0.01  
0.1  
1
10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
I

C

[A], COLLECTOR CURRENT  
V

BE

[V], BASE-EMITTER VOLTAGE  
Figure 3. Base-Emitter Saturation Voltage  
Collector-Emitter Saturation Voltage  
Figure 4. Base-Emitter On Voltage  
100  
10  
10  
I

C

=5.I

B  

50
m
s  
I

C

(max).(Pulse)  
I

C

(max)  
t

STG  

1
1
t

F  

t

ON  

0.1  
0.1  
0.01  
0.01  
0.1  
1
10  
100  
1000  
1
10  
V

CE

[V], COLLECTOR-EMITTER VOLTAGE  
I

C

[A], COLLECTOR CURRENT  
Figure 5. Switching Time  
Figure 6. Safe Operating Area  
© 2007 Fairchild Semiconductor Corporation  
KSC5024 Rev. 1.0.0  
2

Typical Characteristics
(Continued)  
100  
10  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1
0.1  
0.01  
10  
100  
1000  
10000  
0
25  
50  
75  
100  
125  
150  
175  
V

CE

[V], COLLECTOR-EMITTER VOLTAGE  
T

C

[

o

C], CASE TEMPERATURE  
Figure 1. Reverse Bias Safe Operating Area  
Figure 2. Power Derating  
© 2007 Fairchild Semiconductor Corporation  
KSC5024 Rev. 1.0.0  
3

Package Dimension (TO-3P)  
5.00  
4.60  
15.80  
15.40  
1.65  
1.45  
5.20  
4.80  
(R0.50)  
20.10  
19.70  
18.90  
18.50  
3.70  
3.30  
(1.85)  
2.20  
1.80  
2.60  
2.20  
20.30  
19.70  
3.20  
2.80  
1.20  
0.55  
0.80  
1
3
0.75  
0.55  
5.45  
5.45  
(R0.50)  
NOTES:  
A) THIS PACKAGE CONFORMS TO EIAJ  
SC-65 PACKAGING STANDARD.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONING AND TOLERANCING PER  
ASME14.5 1973.  
D) DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH, AND TIE BAR EXTRUSIONS.  
E) DRAWING FILE NAME: TO3P03AREV2.  
© 2007 Fairchild Semiconductor Corporation  
KSC5024 Rev. 1.0.0  
4

TRADEMARKS  
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and  
is not intended to be an exhaustive list of all such trademarks.  
ACEx

®  

Green FPS™  
Green FPS™ e-Series™  
GTO™  
i-Lo
™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Power247

®  

SuperSOT™-8  
SyncFET™  
Build it Now™  
CorePLUS™  
CROSSVOLT
™  
CTL™  
Current Transfer Logic™  
EcoSPARK

®  

POWEREDGE

®  

Power-SPM™  
PowerTrench

®  

Programmable Active Droop™  
QFET

®  

The Power Franchise

®  

TinyBoost™  
TinyBuck™  
TinyLogic

®  

TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
µSerDes™  
UHC

®  

QS™  
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
SMART START™  
SPM

®  

STEALTH™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
Fairchild

®  

Fairchild Semiconductor

®  

FACT Quiet Series™  
FACT

®  

MicroPak™  
MillerDrive™  
Motion-SPM™  
OPTOLOGIC

®  

FAST

®  

FastvCore™  
FPS™  
FRFET

®  

OPTOPLANAR

®  

®
UniFET™  
VCX™  
PDP-SPM™  
Power220

®  

Global Power Resource

SM  

DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF  
THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE  
UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF  
FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE  
PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life
 
support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in significant injury to the user.  
2.  
A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
This datasheet contains the design specifications for product development.  
Specifications may change in any manner without notice.  
Advance Information  
Formative or In Design  
This datasheet contains preliminary data; supplementary data will be pub-  
lished at a later date. Fairchild Semiconductor reserves the right to make  
changes at any time without notice to improve design.  
Preliminary  
First Production  
Full Production  
Not In Production  
This datasheet contains final specifications. Fairchild Semiconductor reserves  
the right to make changes at any time without notice to improve design.  
No Identification Needed  
Obsolete  
This datasheet contains specifications on a product that has been discontin-  
ued by Fairchild semiconductor. The datasheet is printed for reference infor-  
mation only.  
Rev. I31  
© 2008 Fairchild Semiconductor Corporation  
KSC5024 Rev. A1  
5