onsemi-MGP4N60E

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onsemi-MGP4N60E
MOTOROLA  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MGP4N60E/D  
Designer’s Data
 
Sheet  
Insulated Gate Bipolar
T
r
ansistor  
MGP4N60E  
N–Channel Enhancement–Mode Silicon Gate  
This Insulated Gate Bipolar Transistor (IGBT) uses an advanced  
termination scheme to provide an enhanced and reliable high  
voltage–blocking capability. Its new 600 V IGBT technology is  
specifically suited for applications requiring both a high tempera-  
ture short circuit capability and a low V

CE(on)

. It also provides fast  
switching characteristics and results in efficient operation at high  
frequencies. This new E–series introduces an energy efficient,  
ESD protected, and short circuit rugged device.  
IGBT IN TO–220  
4.0 A @ 90
°
C  
6.0 A @ 25
°
C  
600 VOLTS  
SHORT CIRCUIT RATED  
LOW ON–VOLTAGE  
•
•
•
•
•
•
Industry Standard TO–220 Package  
High Speed: E

off

= 60
m
J/A typical at 125
°
C  
High Voltage Short Circuit Capability – 10
m
s minimum at 125
°
C, 400 V  
Low On–Voltage 2.0 V typical at 3.0 A, 125
°
C  
Robust High Voltage
T
e
rmination  
C
ESD Protection Gate–Emitter Zener Diodes  
G
C
E
G
CASE 221A–09  
STYLE 9  
TO–220AB  
E
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
J
Rating  
Symbol  
Value  
600  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
Collector–Emitter Voltage  
V
CES  
CGR  
Collector–Gate Voltage (R
 
= 1.0 M
Ω
)  
V
600  
GE  
Gate–Emitter Voltage — Continuous  
V
GE  
±
20  
Collector Current — Continuous @ T
 
= 25
°
C  
I
I
6.0  
4.0  
8.0  
C
C25  
— Continuous @ T
 
= 90
°
C  
— Repetitive Pulsed Current (1)  
C
C90  
I
Apk  
CM  
T
o
tal Power Dissipation @ T
 
= 25
°
C  
Derate above 25
°
C  
P
D
62.5  
0.51  
Watts  
W/
°
C  
C
Operating and Storage Junction
T
e
mperature Range  
Short Circuit Withstand Time  
T , T  
–55 to 150  
10  
°
C  
m
s  
J
stg  
t
sc  
(V =
 
400 Vdc, V
 
= 15 Vdc, T
 
= 125
°
C, R
 
= 20
Ω
)  
CC  
GE  
J
G
Thermal Resistance — Junction to Case – IGBT  
— Junction to Ambient  
R
R
2.0  
65  
°
C/W  
°
C  
θ
JC  
JA  
θ
Maximum Lead
T
e
mperature for Soldering Purposes, 1/8
″
from case for 5 seconds  
Mounting
T
o
rque, 6–32 or M3 screw  
T
260  
L
10 lbf
S
in (1.13 N
S
m)  
(1) Pulse
 
width is limited by maximum junction temperature. Repetitive rating.  
Designer’s Data for “Worst Case” Conditions
— The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
Designer’s is a trademark of Motorola, Inc.  
REV 2  
Motorola, Inc. 1997  

MGP4N60E  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
J
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector–to–Emitter Breakdown Voltage  
V
Vdc  
(BR)CES  
(V =
 
0 Vdc, I
 
= 250
µ
Adc)  
T
e
mperature Coefficient (Positive)  
600  
—
—
870  
—
—
GE  
C
mV/
°
C  
Vdc  
Emitter–to–Collector Breakdown Voltage (V
 
= 0 Vdc, I
 
= 100 mAdc)  
V
15  
—
—
GE  
EC  
(BR)ECS  
Zero Gate Voltage Collector Current  
(V =
 
600 Vdc, V
 
= 0 Vdc)  
I
µ
Adc  
CES  
—
—
—
—
10  
200  
CE  
GE  
(V =
 
600 Vdc, V
 
= 0 Vdc, T
 
= 125
°
C)  
CE  
GE  
J
Gate–Body Leakage Current (V
 
=
±
20 Vdc, V
 
= 0 Vdc)  
I
—
—
50  
m
Adc  
GE  
CE  
GES  
ON CHARACTERISTICS (1)  
Collector–to–Emitter On–State Voltage  
(V =
 
15 Vdc, I
 
= 1.5 Adc)  
V
CE(on)  
Vdc  
—
—
—
1.6  
1.5  
2.0  
1.9  
—
2.4  
GE  
C
(V =
 
15 Vdc, I
 
= 1.5 Adc, T
 
= 125
°
C)  
GE  
C
J
(V =
 
15 Vdc, I
 
= 3.0 Adc)  
GE  
C
Gate Threshold Voltage  
(V =
 
V ,
 
I =
 
1.0 mAdc)  
Threshold
T
e
mperature Coefficient (Negative)  
V
GE(th)  
Vdc  
4.0  
—
6.0  
10  
8.0  
—
CE  
GE  
C
mV/
°
C  
Forward Transconductance (V
 
= 10 Vdc, I
 
= 3.0 Adc)  
g
fe  
—
1.8  
—
Mhos  
CE  
C
DYNAMIC CHARACTERISTICS  
Input Capacitance  
Output Capacitance  
C
—
—
—
342  
40  
—
—
—
pF  
ns  
ies  
(V =
 
25 Vdc, V
 
= 0 Vdc,  
CE  
GE  
C
oes  
f = 1.0 MHz)  
Transfer Capacitance  
C
3.0  
res  
SWITCHING CHARACTERISTICS (1)  
Turn–On Delay Time  
t
—
—
—
—
—
—
—
—
—
—
—
—
—
34  
30  
—
—
d(on)  
Rise Time  
t
(V =
 
360 Vdc, I
 
= 3.0 Adc,  
r
CC  
C
V
GE  
= 15 Vdc, L = 300
m
H,  
Turn–Off Delay Time  
Fall Time  
t
36  
—
d(off)  
R
= 20
Ω
)  
G
Energy losses include “tail”  
t
216  
0.10  
33  
—
f
Turn–Off Switching Loss  
Turn–On Delay Time  
Rise Time  
E
0.15  
—
mJ  
ns  
off  
t
t
d(on)  
t
32  
—
(V =
 
360 Vdc, I
 
= 3.0 Adc,  
r
CC  
C
V
GE  
= 15 Vdc, L = 300
m
H,  
Turn–Off Delay Time  
Fall Time  
56  
—
d(off)  
R
= 20
Ω,
T =
 
125
°
C)  
J
G
Energy losses include “tail”  
t
340  
0.165  
18.1  
3.8  
7.8  
—
f
Turn–Off Switching Loss  
Gate Charge  
E
—
mJ  
nC  
off  
Q
Q
Q
—
T
1
2
(V =
 
360 Vdc, I
 
= 3.0 Adc,  
CC  
C
—
V
GE  
= 15 Vdc)  
—
INTERNAL PACKAGE INDUCTANCE  
Internal Emitter Inductance  
L
E
nH  
(Measured from the emitter lead 0.25
″
from package to emitter bond pad)  
—
7.5  
—
(1) Pulse
 
T
e
st: Pulse Width
≤
300
µ
s, Duty Cycle
≤
2%.  
2
Motorola IGBT Device Data  

MGP4N60E  
15  
12  
9
15  
12  
9
20 V  
20 V  
17.5 V  
15 V  
17.5 V  
T =
 
25
°
C  
J
T =
 
125
°
C  
J
15 V  
12.5 V  
= 10 V  
12.5 V  
6
6
V
= 10 V  
V
GE  
GE  
3
0
3
0
0
2
4
6
8
0
2
4
6
8
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
Figure 1. Output Characteristics  
Figure 2. Output Characteristics  
15  
12.5  
10  
I =
 
3.0 A  
C
V
= 100 V  
5
m
s PULSE WIDTH  
CE  
2.0  
1.8  
V
= 15 V  
80
m
s PULSE WIDTH  
GE  
2.0 A  
1.5 A  
7.5  
5.0  
1.6  
1.4  
T =
 
125
°
C  
J
2.5  
0
25
°
C  
5
7
9
11  
13  
15  
17  
-50 -25  
0
25  
50  
75  
100  
125  
150  
V
GE  
, GATE-TO-EMITTER VOLTAGE (VOLTS)  
T , JUNCTION TEMPERATURE (
°
C)  
J
Figure 3. Transfer Characteristics  
Figure 4. Collector–To–Emitter Saturation  
Voltage versus Junction Temperature  
800  
600  
400  
20  
16  
12  
8
T =
 
25
°
C  
J
V
GE  
= 0 V  
QT  
C
ies  
Q1  
Q2  
C
oes  
T =
 
25
°
C  
J
200  
0
V
CC  
I =
 
3.0 A  
= 300 V  
4
0
C
res  
C
0
5
10  
15  
20  
25  
0
5
10  
15  
20  
25  
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
Q ,
 
TOTAL GATE CHARGE (nC)  
g
Figure 5. Capacitance Variation  
Figure 6. Gate–To–Emitter Voltage versus  
Total Charge  
Motorola IGBT Device Data  
3

MGP4N60E  
0.20  
0.15  
0.10  
T =
 
125
°
C  
J
V
V
= 360 V  
= 15 V  
CC  
V
DD  
GE  
= 360 V  
= 15 V  
GE  
I =
 
3.0 A  
C
I =
 
3.0 A  
C
0.2  
V
R =
 
20
W  
G
2.0 A  
1.0 A  
2.0 A  
1.5 A  
0.1  
0.05  
0
0
5
15  
25  
35  
45  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
R ,
 
GATE RESISTANCE (OHMS)  
G
T , JUNCTION TEMPERATURE (
°
C)  
J
Figure 7. Turn–Off Losses versus  
Gate Resistance  
Figure 8. Turn–Off Losses versus  
Junction Temperature  
0.20  
0.15  
0.10  
10  
T =
 
125
°
C  
J
V
= 360 V  
= 15 V  
CC  
V
GE  
R =
 
20
W  
G
T =
 
125
°
C  
J
R
= 20
W  
= 15 V  
GE  
GE  
0.05  
0
V
1
0
1
2
3
1
10  
100  
1000  
I ,
 
COLLECTOR CURRENT (AMPS)  
C
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
Figure 9. Turn–Off Losses versus  
Collector Current  
Figure 10. Reverse Biased Safe  
Operating Area  
4
Motorola IGBT Device Data  

MGP4N60E  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING
 
AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
–T–  
2. CONTROLLING
 
DIMENSION: INCH.  
3. DIMENSION
 
Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
C
S
B
F
T
4
INCHES  
DIM MIN
 
MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.46  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
—  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
—  
A
K
Q
Z
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.018  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
—  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
—  
1
2
3
U
H
G
H
J
K
L
L
R
J
N
Q
R
S
T
V
G
D
U
V
Z
N
0.080  
2.04  
STYLE 9:  
PIN 1.
 
GATE  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
CASE 221A–09  
TO–220AB  
ISSUE Z  
Motorola IGBT Device Data  
5

MGP4N60E  
Motorola reserves the right to make changes without further notice to any products herein.
 
Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation consequential or incidental damages.
 
“Typical” parameters which may be provided in Motorola  
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
 
All operating parameters, including “Typicals”  
must be validated for each customer application by customer’s technical experts.
 
Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola
 
products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
or death may occur.
 
Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
Mfax is a trademark of Motorola, Inc.  
How to reach us:  
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.
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o
kyo, Japan.
 
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a
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.
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MGP4N60E/D  
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