onsemi-MGP7N60ED

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MOTOROLA  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MGP7N60ED/D  
Designer’s Data
 
Sheet  
Insulated Gate Bipolar
T
r
ansistor  
MGP7N60ED  
with Anti-Parallel Diode  
N–Channel Enhancement–Mode Silicon Gate  
IGBT & DIODE IN TO–220  
7.0 A @ 90
°
C  
This Insulated Gate Bipolar Transistor (IGBT) is co–packaged  
with a soft recovery ultra–fast rectifier and uses an advanced  
termination scheme to provide an enhanced and reliable high  
voltage–blocking capability. Its new 600 V IGBT technology is  
specifically suited for applications requiring both a high tempera-  
ture short circuit capability and a low V

CE(on)

. It also provides fast  
switching characteristics and results in efficient operation at high  
frequencies. Co–packaged IGB
T
s
s
ave space, reduce assembly  
time and cost. This new E–series introduces an energy efficient,  
ESD protected, and short circuit rugged device.  
10 A @ 25
°
C  
600 VOLTS  
SHORT CIRCUIT RATED  
LOW ON–VOLTAGE  
•
•
•
•
•
Industry Standard TO–220 Package  
C
High Speed: E

off

= 70
m
J/A typical at 125
°
C  
High Voltage Short Circuit Capability – 10
m
s minimum at 125
°
C, 400 V  
Low On–Voltage 2.0 V typical at 5.0 A, 125
°
C  
Soft Recovery Free Wheeling Diode  
is Included in the Package  
Robust High Voltage
T
e
rmination  
G
C
E
G
•
•
ESD Protection Gate–Emitter Zener Diodes  
CASE 221A–09  
STYLE 9  
TO–220AB  
E
MAXIMUM RATINGS
(T =
 
25
°
C unless otherwise noted)  
J
Rating  
Symbol  
Value  
600  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
Collector–Emitter Voltage  
V
CES  
CGR  
Collector–Gate Voltage (R
 
= 1.0 M
Ω
)  
V
600  
GE  
Gate–Emitter Voltage — Continuous  
V
GE  
±
20  
Collector Current — Continuous @ T
 
= 25
°
C  
I
I
10  
7.0  
14  
C
C25  
— Continuous @ T
 
= 90
°
C  
— Repetitive Pulsed Current (1)  
C
C90  
I
Apk  
CM  
T
o
tal Power Dissipation @ T
 
= 25
°
C  
P
D
81  
Watts  
C
Derate above 25
°
C  
0.65  
W/
°
C  
Operating and Storage Junction
T
e
mperature Range  
Short Circuit Withstand Time  
T , T  
–55 to 150  
10  
°
C  
m
s  
J
stg  
t
sc  
(V =
 
400 Vdc, V
 
= 15 Vdc, T
 
= 125
°
C, R
 
= 20
Ω
)  
CC  
GE  
J
G
Thermal Resistance — Junction to Case – IGBT  
R
R
R
1.5  
2.7  
65  
°
C/W  
°
C  
θ
θ
JC  
JC  
JA  
— Junction to Case – Diode  
— Junction to Ambient  
θ
Maximum Lead
T
e
mperature for Soldering Purposes, 1/8
″
from case for 5 seconds  
Mounting
T
o
rque, 6–32 or M3 screw  
T
260  
L
10 lbf
S
in (1.13 N
S
m)  
(1) Pulse
 
width is limited by maximum junction temperature. Repetitive rating.  
Designer’s Data for “Worst Case” Conditions
— The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
Designer’s is
 
a trademark of Motorola, Inc.  
REV 2  
Motorola, Inc. 1998  

MGP7N60ED  
ELECTRICAL CHARACTERISTICS
(T =
 
25
°
C unless otherwise noted)  
J
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector–to–Emitter Breakdown Voltage  
V
Vdc  
(BR)CES  
(V =
 
0 Vdc, I
 
= 25
µ
Adc)  
T
e
mperature Coefficient (Positive)  
600  
—
—
870  
—
—
GE  
C
mV/
°
C  
µ
Adc  
Zero Gate Voltage Collector Current  
I
CES  
GES  
(V =
 
600 Vdc, V
 
= 0 Vdc)  
—
—
—
—
10  
200  
CE  
GE  
(V =
 
600 Vdc, V
 
= 0 Vdc, T
 
= 125
°
C)  
CE  
GE  
J
Gate–Body Leakage Current (V
 
=
±
20 Vdc, V
 
= 0 Vdc)  
I
—
—
50  
m
Adc  
GE  
CE  
ON CHARACTERISTICS (1)  
Collector–to–Emitter On–State Voltage  
(V =
 
15 Vdc, I
 
= 2.5 Adc)  
V
CE(on)  
Vdc  
—
—
—
1.6  
1.5  
2.0  
1.9  
—
2.4  
GE  
C
(V =
 
15 Vdc, I
 
= 2.5 Adc, T
 
= 125
°
C)  
GE  
C
J
(V =
 
15 Vdc, I
 
= 5.0 Adc)  
GE  
C
Gate Threshold Voltage  
(V =
 
V ,
 
I =
 
1.0 mAdc)  
Threshold
T
e
mperature Coefficient (Negative)  
V
GE(th)  
Vdc  
4.0  
—
6.0  
10  
8.0  
—
CE  
GE  
C
mV/
°
C  
Forward Transconductance (V
 
= 10 Vdc, I
 
= 5.0 Adc)  
g
fe  
—
2.5  
—
Mhos  
CE  
C
DYNAMIC CHARACTERISTICS  
Input Capacitance  
Output Capacitance  
C
—
—
—
610  
60  
—
—
—
pF  
ns  
ies  
(V =
 
25 Vdc, V
 
= 0 Vdc,  
CE  
GE  
C
oes  
f = 1.0 MHz)  
Transfer Capacitance  
C
10  
res  
SWITCHING CHARACTERISTICS (1)  
Turn–On Delay Time  
t
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
22  
24  
—
—
—
—
340  
—
—
—
—
—
—
—
—
—
—
—
—
d(on)  
Rise Time  
t
r
Turn–Off Delay Time  
Fall Time  
t
64  
(V =
 
360 Vdc, I
 
= 5.0 Adc,  
d(off)  
CC  
C
V
GE  
= 15 Vdc, L = 300
m
H,  
t
196  
200  
71  
f
R
= 20
Ω
)  
G
Energy losses include “tail”  
m
J  
Turn–Off Switching Loss  
Turn–On Switching Loss  
T
o
tal Switching Loss  
Turn–On Delay Time  
Rise Time  
E
E
off  
on  
E
271  
31  
ts  
t
t
ns  
d(on)  
t
24  
r
Turn–Off Delay Time  
Fall Time  
195  
220  
350  
135  
485  
27.2  
7.0  
13.7  
(V =
 
360 Vdc, I
 
= 5.0 Adc,  
d(off)  
CC  
C
V
GE  
= 15 Vdc, L = 300
m
H,  
t
f
R
= 20
Ω,
T =
 
125
°
C)  
J
G
Energy losses include “tail”  
m
J  
Turn–Off Switching Loss  
Turn–On Switching Loss  
T
o
tal Switching Loss  
Gate Charge  
E
E
off  
on  
E
ts  
Q
Q
Q
nC  
T
1
2
(V =
 
360 Vdc, I
 
= 5.0 Adc,  
CC  
C
V
GE  
= 15 Vdc)  
(1) Pulse
 
T
e
st: Pulse Width
≤
300
µ
s, Duty Cycle
≤
2%.  
2
Motorola IGBT Device Data  

MGP7N60ED  
DIODE CHARACTERISTICS  
Diode Forward Voltage Drop  
V
FEC  
Vdc  
(I =
 
2.3 Adc)  
—
—
—
1.7  
1.3  
2.0  
—
—
2.3  
EC  
(I =
 
2.3 Adc, T
 
= 125
°
C)  
EC  
J
(I =
 
4.6 Adc)  
EC  
Reverse Recovery Time  
t
—
—
—
—
—
—
—
—
40  
17  
—
—
—
—
—
—
—
—
ns  
rr  
(I =
 
4.6 Adc,  
F
t
t
a
b
V
R
= 360 Vdc,  
23  
dI /dt
 
= 200 A/
m
s)  
F
Reverse Recovery Stored Charge  
Reverse Recovery Time  
Q
60  
nC  
ns  
RR  
t
rr  
105  
36  
(I =
 
4.6 Adc,  
F
t
a
V
R
= 360 Vdc,  
dI /dt
 
= 200 A/
m
s,  
F
t
69  
b
T =
 
125
°
C)  
J
Reverse Recovery Stored Charge  
Q
247  
nC  
nH  
RR  
INTERNAL PACKAGE INDUCTANCE  
Internal Emitter Inductance  
L
E
(Measured from the emitter lead 0.25
″
from package to emitter bond pad)  
—
7.5  
—
20  
20  
15  
10  
17.5 V  
20 V  
17.5 V  
20 V  
15 V  
T =
 
125
°
C  
J
T =
 
25
°
C  
J
15 V  
15  
10  
12.5 V  
12.5 V  
V
GE  
= 10 V  
V
GE  
= 10 V  
5
0
5
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
Figure 1. Output Characteristics  
Figure 2. Output Characteristics  
12  
10  
8
2.2  
2.0  
1.8  
1.6  
1.4  
I =
 
5.0 A  
C
V
= 100 V  
5
m
S PULSE WIDTH  
CE  
3.75 A  
2.5 A  
6
T =
 
125
°
C  
J
4
25
°
C  
V
= 15 V  
80
m
S PULSE WIDTH  
GE  
2
0
1.2  
1.0  
5
6
7
8
9
10  
11  
12  
13  
-50 -25  
0
25  
50  
75  
100  
125  
150  
V
GE  
, GATE-TO-EMITTER VOLTAGE (VOLTS)  
T , JUNCTION TEMPERATURE (
°
C)  
J
Figure 3. Transfer Characteristics  
Figure 4. Collector–To–Emitter Saturation  
Voltage versus Junction Temperature  
Motorola IGBT Device Data  
3

MGP7N60ED  
1200  
20  
16  
12  
8
V
= 0 V  
GE  
T =
 
25
°
C  
J
1000  
800  
600  
400  
200  
QT  
Q2  
C
ies  
Q1  
C
oes  
T =
 
25
°
C  
J
I =
 
5.0 A  
4
0
C
C
res  
0
0
5
10  
15  
20  
25  
0
5
10  
15  
20  
25  
30  
35  
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
Q ,
 
TOTAL GATE CHARGE (nC)  
g
Figure 5. Capacitance Variation  
Figure 6. Gate–To–Emitter Voltage versus  
Total Charge  
0.6  
0.5  
0.4  
0.3  
0.2  
0.60  
0.55  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
T =
 
125
°
C  
V
V
= 360 V  
= 15 V  
I =
 
5.0 A  
C
J
CC  
I =
 
5.0 A  
C
V
DD  
GE  
= 360 V  
= 15 V  
GE  
V
R =
 
20
W  
G
3.75 A  
3.75 A  
2.5 A  
2.5 A  
0.1  
0
0.20  
0.15  
0
25  
50  
75  
100  
125  
150  
5
15  
25  
35  
45  
R ,
 
GATE RESISTANCE (OHMS)  
G
T , JUNCTION TEMPERATURE (
°
C)  
J
Figure 7. Total Energy Losses versus  
Gate Resistance  
Figure 8. Total Energy Losses versus  
Junction Temperature  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.5  
V
V
= 360 V  
= 15 V  
T =
 
125
°
C  
CC  
J
V
= 360 V  
= 15 V  
GE  
DD  
T =
 
125
°
C  
J
V
GE  
R =
 
20
W  
0.4  
0.3  
0.2  
I =
 
5.0 A  
C
G
3.75 A  
2.5 A  
0.1  
0
0.1  
0
0
1
2
3
4
5
6
7
8
10  
15  
20  
25  
30  
35  
40  
45  
50  
I ,
 
COLLECTOR CURRENT (AMPS)  
C
GATE RESISTANCE (OHMS)  
Figure 9. Total Energy Losses versus  
Collector Current  
Figure 10. Turn–Off Losses versus  
Gate Resistance  
4
Motorola IGBT Device Data  

MGP7N60ED  
0.5  
0.4  
0.3  
0.2  
0.6  
0.5  
0.4  
0.3  
0.2  
V
V
= 360 V  
= 15 V  
V
V
= 360 V  
= 15 V  
CC  
CC  
GE  
GE  
R =
 
20
W  
G
R =
 
20
W  
G
I =
 
5.0 A  
C
T =
 
125
°
C  
J
3.75 A  
2.5 A  
0.1  
0
0.1  
0
0
1
2
3
4
5
6
7
8
0
25  
50  
75  
100  
125  
150  
I ,
 
COLLECTOR CURRENT (AMPS)  
C
T , JUNCTION TEMPERATURE (
°
C)  
J
Figure 11. Turn–Off Losses versus  
Junction Temperature  
Figure 12. Turn–Off Losses versus  
Collector Current  
10  
100  
T =
 
125
°
C  
J
25
°
C  
10  
V
= 15 V  
= 20
W  
GE  
R
GE  
T =
 
125
°
C  
J
1
1
0.5  
1
1.5  
2
2.5  
3
1
10  
100  
1000  
V
FM  
, FORWARD VOLTAGE DROP (VOLTS)  
V
CE  
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
Figure 13. Forward Characteristics  
versus Current  
Figure 14. Reverse Biased Safe  
Operating Area  
Motorola IGBT Device Data  
5

MGP7N60ED  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING
 
AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
–T–  
2. CONTROLLING
 
DIMENSION: INCH.  
3. DIMENSION
 
Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
C
S
B
F
T
4
INCHES  
DIM MIN
 
MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.46  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
—  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.64  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
—  
A
K
Q
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.018  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
—  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.025  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
—  
1
2
3
U
H
G
H
J
Z
K
L
L
R
J
N
Q
R
S
T
V
G
D
U
V
Z
N
0.080  
2.04  
STYLE 9:  
PIN 1.
 
GATE  
CASE 221A–09  
TO–220AB  
ISSUE Z  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
Motorola reserves the right to make changes without further notice to any products herein.
 
Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation consequential or incidental damages.
 
“Typical” parameters which may be provided in Motorola  
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
 
All operating parameters, including “Typicals”  
must be validated for each customer application by customer’s technical experts.
 
Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola
 
products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
or death may occur.
 
Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
Mfax is a trademark of Motorola, Inc.  
How to reach us:  
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.
O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447  
JAPAN
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4–32–1 Nishi–Gotanda, Shagawa–ku,
T
o
kyo, Japan.
 
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a
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a
i Po, N.
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.
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MGP7N60ED/D  
◊